CN106087013B - It is provided with the diamond wire electroplating bath and diamond wire production system of sand leakage avoiding device - Google Patents
It is provided with the diamond wire electroplating bath and diamond wire production system of sand leakage avoiding device Download PDFInfo
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- CN106087013B CN106087013B CN201610684928.5A CN201610684928A CN106087013B CN 106087013 B CN106087013 B CN 106087013B CN 201610684928 A CN201610684928 A CN 201610684928A CN 106087013 B CN106087013 B CN 106087013B
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- electroplating bath
- sand leakage
- diamond wire
- leakage avoiding
- sand
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- 238000009713 electroplating Methods 0.000 title claims abstract description 127
- 239000004576 sand Substances 0.000 title claims abstract description 94
- 239000010432 diamond Substances 0.000 title claims abstract description 46
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 14
- 241000606750 Actinobacillus Species 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 56
- 239000007789 gas Substances 0.000 claims description 34
- 230000005484 gravity Effects 0.000 claims description 18
- 238000009423 ventilation Methods 0.000 claims description 15
- 230000002411 adverse Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 239000002585 base Substances 0.000 description 23
- 230000000694 effects Effects 0.000 description 7
- 238000003756 stirring Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 101100493711 Caenorhabditis elegans bath-41 gene Proteins 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 238000010921 in-depth analysis Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to technical field of plating equipment, specifically discloses a kind of diamond wire electroplating bath and diamond wire production system with sand leakage avoiding device, including electroplating bath, sand leakage avoiding device, the first supercharging device, wherein：Plating trench bottom has incoming line；Sand leakage avoiding device is sealedly attached to electroplating bath bottom；First supercharging device connecting anti-leak sand device.The invention also discloses a kind of diamond wire production system using above-mentioned electroplating bath, including actinobacillus device, base line pretreatment unit, take-up and the foregoing diamond wire electroplating bath with sand leakage avoiding device, the defects of accumulator tank need to be set instant invention overcomes conventional plating cells bottom, realize that equipment arrangement space is small, can effectively prevent electroplating bath bottom line inlet leakage in electroplating process.
Description
Technical field
The invention belongs to technical field of plating equipment, and in particular to a kind of diamond wire plating for being provided with sand leakage avoiding device
Groove and diamond wire production system.
Background technology
With the development, ceramics, silicon, jewel etc. that sci-tech product makes rapid progress, especially high rigidity, high value, broken
Various brittle crystal materials demand amounts increasingly increase.The processing methods such as traditional sawing exist cutting efficiency is low, kerf loss is big,
The defects of of poor quality, therefore, the diamond wire of concretion abrasive, arise at the historic moment.
Diamond wire is that the bortz powder of high rigidity, high-wearing feature is fixedly arranged on metal base line, for cutting various gold
Category and nonmetallic materials.The upper sand device of diamond wire mainly has at home at present：Early stage sand buring method, horizontal winding roll-type, it is vertical
Upper sand equipment.First two method easily causes sand inequality on diamond wire, and electroplate liquid is difficult to reclaim, therefore vertical upper sand equipment is more
Tool advantage, but vertical upper sand equipment equally exists some problems, such as：Electroplate the easy depositing diamond micro mist of trench bottom, closure plating
Trench bottom exports, and in the past using mechanical agitation, adds additional electroplating bath size, and complicated, if electroplate liquid diamond
Micro mist skewness will directly affect the upper sand effect of diamond base line；Electroplate liquid can be flowed out by electroplating bath bottom line inlet, with
Toward generally electroplate liquid accumulator tank is set in outlet bottom, the arrangement space of equipment adds additional.
The present invention conducts in-depth analysis to electroplating bath and leak-proof device, it is desirable to provide a kind of sand leakage avoiding device of being provided with
Electroplating bath and the diamond wire production system using the electroplating bath.
The content of the invention
It is an object of the invention to provide a kind of arrangement space it is small, can effectively prevent the gold of electroplating bath bottom line inlet leakage
Hard rock line electroplating bath and the diamond wire production system using the electroplating bath.
To achieve the above object, the present invention provides following technical scheme：
A kind of diamond wire electroplating bath for being provided with sand leakage avoiding device, including electroplating bath, sand leakage avoiding device, the first supercharging dress
Put, wherein：
Plating trench bottom has incoming line；
Sand leakage avoiding device is sealedly attached to electroplating bath bottom, is made for realizing in electroplating process by gases at high pressure or liquid
Pressure is more than electroplating bath bottom hydraulic pressure in sand leakage avoiding device, prevents that electroplate liquid flows out from incoming line in electroplating bath；
First supercharging device connecting anti-leak sand device, in electroplating process for sand leakage avoiding device provide gases at high pressure or
Liquid.
Further, sand leakage avoiding device includes housing and core body, wherein：
Housing seal is connected to electroplating bath bottom, for placing core body；Housing bottom center has an entrance hole, side wall one
Side has a perforate, for being connected by pipeline with the first supercharging device；
Core body is located in housing, and core body is bonded with plating trench bottom and housing respectively up and down, and there is 2- left and right with inner walls
10mm gaps, for realizing the regulation of core body left and right directions.
Further, core body is provided with circular passage, duct, pod apertures, wherein：
Circular passage is opened up along core body outer rim, and circular passage by housing sidewall perforate and pipeline and the first supercharging while filled
Connection is put, for forming passage for gases at high pressure or liquid；
Duct is taper groove shape, and its lower port diameter is 0.2~0.5 times of back cut diameter, is opened in core-center portion, is used
In convergence gases at high pressure or liquid,；
Pod apertures are arranged between circular passage and duct, and for connecting circular passage and duct, water conservancy diversion number of perforations is 2~
8.
Further, first pressure sensor is provided with duct, plating trench bottom is provided with second pressure sensor, its
In：
First pressure sensor is used to monitor duct inner high voltage gas or liquid pressure；
Second pressure sensor is used to monitor electroplating bath bottom liquid pressure.
Further, the first supercharging device includes the first gravity circulation cabinet, and the first gravity circulation cabinet is connected anti-by pipeline
Sand leakage device, highly higher than electroplating bath, for being embodied as the high pressure that sand leakage avoiding device provides pressure and is higher than electroplating bath bottom hydraulic pressure
Liquid.
Further, the first supercharging device can also include compressor, and compressor is used by pipeline connecting anti-leak sand device
In providing gases at high pressure into sand leakage avoiding device.
Further, plating trench bottom also has at least one blow valve port, and blow valve port is tangentially-arranged along electroplating bath inwall, outside
Portion is connected with the second supercharging device.
Further, the second supercharging device includes the second gravity circulation cabinet, and the second gravity circulation cabinet is blown by pipeline connection
Mouth is swept, highly higher than electroplating bath.
Further, the second supercharging device can also include ventilation blower and non-return valve, wherein：
Ventilation blower is connected by pipeline with blow valve port, for providing gases at high pressure for blow valve port；
Non-return valve is arranged on the pipeline between ventilation blower and blow valve port, for preventing electroplating bath after ventilation blower is stopped
Middle electroplate liquid adverse current enters ventilation blower.
The diamond wire production system of the present invention is achieved through the following technical solutions：
A kind of diamond wire production system of sand leakage avoiding, including the above-mentioned electroplating bath and unwrapping wire for being provided with sand leakage avoiding device
Device, base line pretreatment unit, take-up, wherein：
Actinobacillus device leading-out terminal connection base line pretreatment unit end of incoming cables；
Base line pretreatment unit leading-out terminal connection electroplating bath end of incoming cables；
Electroplating bath leading-out terminal connection take-up end of incoming cables.
Beneficial effects of the present invention have：
(1) plating trench bottom is provided with sand leakage avoiding device, and sand leakage avoiding device is connected with supercharging device, can pass through increasing
Press fitting is set to sand leakage avoiding device and provides gases at high pressure or liquid, and realizing effectively prevents electroplate liquid from being leaked from electroplating bath cabling in the raised floor mouth
Go out；
(2) sand leakage avoiding device of the present invention is formed by being sealedly connected on the housing of plating trench bottom and the core body of enclosure interior,
The method for setting accumulator tank in plating trench bottom relative to prior art, reduces electroplating bath integral arrangement space；
Brief description of the drawings
Fig. 1 is that a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device provided in an embodiment of the present invention faces section
Figure；
Fig. 2 is second of structure elevation cross-sectional view of sand leakage avoiding device provided in an embodiment of the present invention；
Fig. 3 is sand leakage avoiding device top plan view provided in an embodiment of the present invention；
Fig. 4 is that the first supercharging device provided in an embodiment of the present invention is connected when being the first gravity circulation cabinet with sand leakage avoiding device
Schematic diagram；
Fig. 5 is when the first supercharging device provided in an embodiment of the present invention is compressor and sand leakage avoiding device connection diagram；
Fig. 6 is the elevation cross-sectional view that electroplating bath provided in an embodiment of the present invention increases blow valve port and the second supercharging device；
Fig. 7 is that electroplating bath provided in an embodiment of the present invention is provided with two blow valve port top plan views；
Fig. 8 is when the second supercharging device provided in an embodiment of the present invention is the second gravity circulation cabinet and blow valve port connection signal
Figure；
Fig. 9 is when the second supercharging device provided in an embodiment of the present invention is compressor and non-return valve and blow valve port connection signal
Figure；
Figure 10 is diamond wire production system schematic diagram provided in an embodiment of the present invention；
Wherein：1 electroplating bath, 2 incoming lines, 3 dashpots, 4 sand leakage avoiding devices, 5 first supercharging devices, 6 pipelines, 7 blow valve ports,
8 first pressure sensors, 9 pressure gauges, 10 second supercharging devices, 11 second pressure sensors, 12 actinobacillus devices, 13 base lines are located in advance
Reason device, 14 are provided with the electroplating bath of sand leakage avoiding device, 15 take-ups, 41 housings, 42 entrance holes, 43 core bodys, 431 annulars and led to
Road, 432 ducts, 433 pod apertures, 44 perforates, 51 first gravity circulation cabinets, 52 compressors, 101 second gravity circulation cabinets, 102 lead to
Blower fan, 103 non-return valves.
Embodiment
Below in conjunction with the accompanying drawing in the present invention, the technical scheme in the embodiment of the present invention is carried out it is clear, completely retouch
State, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based on the present invention
In embodiment, all other reality that those skilled in the art is obtained on the premise of creative work is not made
Example is applied, belongs to protection scope of the present invention.
As described in Figure 1, a kind of electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, including electroplating bath 1, leakproof
Sand device 4, the first supercharging device 5, wherein：The bottom of electroplating bath 1 is provided with incoming line 2；Sand leakage avoiding device 4 is sealedly attached to plating
The bottom of groove 1, pressure in sand leakage avoiding device 4 is set to be more than the bottom of electroplating bath 1 by gases at high pressure or liquid for realizing in electroplating process
Portion's hydraulic pressure, so as to prevent that electroplate liquid flows out from incoming line 2 in electroplating bath 1, sand leakage avoiding device 4 can use welding or blind threaded
The mode of connection is sealedly attached to the bottom of electroplating bath 1, and the present invention is not limited specific sealed connection mode, as long as it can realize
The mode of sealed connection, within the scope of the present invention；The connecting anti-leak sand device 4 of first supercharging device 5, for electroplating
During for sand leakage avoiding device 4 provide gases at high pressure or liquid；The setting of the above-mentioned supercharging device 5 of sand leakage avoiding device 4 and first,
The setting of the bottom accumulator tank equipment of electroplating bath 1 in the prior art is eliminated, reduces the equipment arrangement space of electroplating bath 1, it is effectively anti-
The only bottom line inlet leakage of electroplating bath 1.
Further, as shown in figure 1, a kind of electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, in addition to
The dashpot 3 on the top of electroplating bath 1 is arranged at, for providing the electroplate liquid of abundance for electroplating bath 1, is normally carried out electroplating reaction.
As shown in Figure 1 to Figure 3, sand leakage avoiding device 4 includes housing 41 and core body 43, wherein：Housing 41 passes through welding or blind
Hole seal with screwed joint is connected to the bottom of electroplating bath 1, for placing core body 43；The bottom centre of housing 41 is provided with an entrance hole
42, the center of entrance hole 42 is with the center of 1 bottom line inlet of electroplating bath 2 on same vertical line；The side wall of housing 41 is opened while being provided with one
Hole 44, for being connected by pipeline 6 with the first supercharging device 5；Core body 43 is located in housing 41, core body about 43 respectively with plating
The bottom of groove 1 and housing 41 are bonded, there is gap left and right with the inwall of housing 41, for realizing regulation of the core body 43 in left and right directions, when
Base line shifts when encountering the outlet of 43 central duct of core body 432 times, the stress of core body 43, it is inclined that left and right can occur in housing 41
Move, core body 43 is separated with base line, so as to avoid having an impact to sand effect on base line.
Further, as shown in Figure 1, 2, the gap of core body 43 or so and the inwall of housing 41 is 2-10mm, as core body 43 is left
The right and gap of housing 41 is 5mm；Prevent that gap is too small, the left and right adjusting DeGrain of core body 43, gap is excessive, easily leaks air
Or the phenomenon of leakage.
Further, as shown in figure 3, core body 43 is provided with circular passage 431, duct 432, pod apertures 433, core body is adding
When work goes out constructed above, can use casting or turning method, wherein：Circular passage 431 opens up along the outer rim of core body 43, and annular is logical
The one side of road 431 is connected by the side-wall hole 44 of housing 41 and pipeline 6 with the first supercharging device 5, for for gases at high pressure or liquid
Passage is formed, when high-voltage power supply enters from side-wall hole 44, flows through circular passage 431, realization is taken advantage of a situation in one direction in the annular
Flowed in passage 431 and flow into pod apertures 433 again；Duct 432 is taper groove shape, the central part of core body 43 is opened in, for converging
Gases at high pressure or liquid；Pod apertures 433 are between circular passage 431 and duct 432, for connecting the circular passage 431
With duct 432, gases at high pressure or liquid is converged in from circular passage 431 through pod apertures 433 in duct 432, make in duct 432
High pressure is formed, prevents electroplate liquid from being spilt from the bottom line inlet 2 of electroplating bath 1；As shown in Figure 1, 2, pod apertures 433 can be level side
To that can also be that oblique duct upper outlet goes out to tilt, increase it and ability is converged in gases at high pressure or liquid.
Further, the upper outlet diameter of duct 432 is identical with electroplating bath 1 bottom line inlet, 2 diameters, and lower outlet diameter is upper
0.2~0.5 times of outlet diameter, following outlet diameter is 0.35 times of upper outlet diameter, for making gases at high pressure or liquid more
Easily moved to upper outlet, reduce the spilling from lower outlet.
Further, pod apertures 433 be 2~8, as described in Figure 3, as pod apertures be 4, along the even circumferential cloth of core body 43
Put, for realizing that gases at high pressure or liquid uniformly converge to central duct 432, the setting of the number of pod apertures 433 can be realized pair
The convergence effect of gases at high pressure or liquid, and the bulk strength of core body 43 is not destroyed.
Further, as shown in figure 3, first pressure sensor 8 is provided with the duct 432 of core body 43, for monitoring duct
432 inner high voltage gases or liquid pressure.
Further, as shown in Figure 1, 2, the bottom of electroplating bath 1 is provided with second pressure sensor 11, for monitoring electroplating bath
1 bottom liquid pressure；The setting of above-mentioned first pressure sensor 8 and second pressure sensor 11, can remind observer constantly
Duct 432 and the base pressure of electroplating bath 1, when plating is carried out, the pressure value of first pressure sensor 8 should be kept to be more than second constantly
The pressure value of pressure sensor 11, so as to ensure sand leakage avoiding.
As shown in figure 4, a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, the first supercharging
Device 5 is the first gravity circulation cabinet 51, and the first gravity circulation cabinet 101 is by the connecting anti-leak sand device 4 of pipeline 6, highly higher than electricity
Coating bath 1, for being embodied as the highly pressurised liquid that sand leakage avoiding device 4 provides pressure and is higher than the bottom hydraulic pressure of electroplating bath 1, so as to realize leakproof
Sand effect；Pressure gauge 9 is additionally provided with pipeline 6, for measuring gas or liquid pressure in pipeline 6.
As shown in figure 5, a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, the first supercharging
Device can also be compressor 52, and compressor 52 is by the connecting anti-leak sand device 4 of pipeline 6, for being provided into sand leakage avoiding device 4
Gases at high pressure, realize that air pressure is more than the bottom hydraulic pressure of electroplating bath 1 in duct, so as to realize sand leakage avoiding effect；It is additionally provided with pipeline 6
Pressure gauge 9, for measuring gas or liquid pressure in pipeline 6.
As shown in fig. 6, a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, the electroplating bath
1 bottom is additionally provided with least one blow valve port 7, and blow valve port 7 is tangentially-arranged along the inwall of electroplating bath 1, and outside is connected with by pipeline 6
Second supercharging device 10；Blow valve port 7 electroplating bath, 1 wall is tangentially-arranged, is advantageous to be passed through gases at high pressure or liquid into electroplating bath 1
When, electroplate liquid in electroplating bath 1 is formed eddy flow, strengthen stirring action, prevent diadust in the bottom deposit of electroplating bath 1, and
Blow valve port 7 reduces the arrangement of mechanical structure in electroplating bath 1 relative to tradition machinery stirring, so as to reduce the size of electroplating bath 1.
Further, as shown in fig. 7, blow valve port 7 is two, and the distribution that is centrosymmetric in the bottom of electroplating bath 1；Blow valve port
7 is symmetrical, is advantageous to carry out uniform stirring to electroplate liquid, realizes and uniformly go up sand to base line.
As shown in figure 8, a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, the second supercharging
Device 10 includes the second gravity circulation cabinet 101, and the second gravity circulation cabinet 101 connects blow valve port 7 by pipeline 6, highly higher than electricity
The top dashpot 3 of coating bath 1, less than the first gravity circulation cabinet 51；The setting of second gravity circulation cabinet 101 and its height, Neng Gouwei
Blow valve port 7 provides highly pressurised liquid, so as to play the stirring action to electroplate liquid, meanwhile, its hydraulic pressure is less than liquid in duct 432 again
Pressure, so as to ensure the technique effect of sand leakage avoiding；Pressure gauge 9 is additionally provided with pipeline 6, for measuring gas or liquid in pipeline 6
Pressure.
As shown in figure 9, a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device of the embodiment of the present invention, the second supercharging
Device 10 can also include ventilation blower 102 and non-return valve 103, wherein：Ventilation blower 102 is connected by pipeline 6 with blow valve port 7, is used
In for blow valve port 7 provide gases at high pressure；Non-return valve 103 is arranged on the pipeline 6 between ventilation blower 102 and blow valve port 7, for preventing
Electroplate liquid adverse current enters ventilation blower 103 in electroplating bath 1 after only ventilation blower 102 is stopped；Pressure gauge 9 is additionally provided with pipeline 6, is used
In measuring gas or liquid pressure in pipeline 6.
The embodiment of the present invention it is a kind of be provided with sand leakage avoiding device diamond wire electroplating bath specific works when, first by gold
Hard rock line base line sequentially passes through the bottom incoming hole 42 of housing 41 from bottom to top, the central duct 432 of core body 43, the bottom of electroplating bath 1 are entered
Line mouth 2, finally enter in electroplating bath 1；Then the first supercharging device 5 is opened, makes gases at high pressure or liquid logical along the annular of core body 43
Road 431 flows into pod apertures 433 and finally converged in the duct 432 at the center of core body 43, and electroplate liquid is injected into electroplating bath 1, realizes
To preventing electroplate liquid from being spilt from the bottom line inlet 2 of electroplating bath 1 on base line while sand；Meanwhile in electroplating process, to prevent Buddha's warrior attendant
Stone micro mist is deposited on the bottom of electroplating bath 1, and the bottom purge mouth 7 of electroplating bath 1 is connected with the second supercharging device 10, opens the second supercharging dress
10 are put, gases at high pressure or liquid are blown into the bottom liquid of electroplating bath 1, plays the purging effect to diadust；Electroplated
Cheng Zhong, by observing first pressure sensor 8 and the numerical value of 1 bottom second pressure sensor of electroplating bath 11 in the duct 432 of core body 43,
Moment keeps pressure in the duct 432 of core body 43 to be more than the base pressure of electroplating bath 1, so as to ensure the leakage of electroplate liquid in electroplating process
Go out, complete whole electroplating process.
As shown in Figure 10, the diamond wire line production system of a kind of sand leakage avoiding of the embodiment of the present invention, the system include above-mentioned
The diamond wire electroplating bath 14 and actinobacillus device 12, base line pretreatment unit 13, take-up 15 of sand leakage avoiding device are provided with,
Wherein：The end of incoming cables of the leading-out terminal of actinobacillus device 12 connection base line pretreatment unit 13；In the connection of the leading-out terminal of base line pretreatment unit 13
State the end of incoming cables of electroplating bath 14；The above-mentioned leading-out terminal of electroplating bath 14 connection take-up 15 end of incoming cables.
A kind of diamond wire production system course of work of sand leakage avoiding of the embodiment of the present invention is as follows：(1) base line passes through unwrapping wire
The leading-out terminal of device 12 is exported to base line pretreatment unit 13；(2) base line enters pre- place by the end of incoming cables of base line pretreatment unit 13
Device 13 is managed, the surface cleaning steps such as pickling, washing, alkali cleaning, washing are carried out wherein, then from the leading-out terminal of pretreatment unit 13
Output；(3) base line after pretreatment is by being provided with the entrance hole 42 of 1 lower case of electroplating bath 41, the core body of sand leakage avoiding device 4
43 ducts, the incoming line 2 of electroplating bath 1 enter electroplating bath 1, the upper sand to base line are completed wherein, then in the form of diamond wire
Exported from the leading-out terminal of electroplating bath 1；(4) finally, the diamond wire of sand in the presence of take-up 10, is sequentially centered around in completion
On its take-up roller, the production of whole diamond wire is completed.
It is above-mentioned that the present invention is further described by specific embodiment, it is understood that, specifically retouch here
State, should not be construed as the restriction to the spirit and scope of the invention, one of ordinary skilled in the art is reading this specification
The various modifications made afterwards to above-described embodiment, belong to the scope that the present invention is protected.
Claims (10)
1. a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device, it is characterised in that filled including electroplating bath (1), sand leakage avoiding
(4), the first supercharging device (5) are put, wherein：
Electroplating bath (1) bottom has incoming line (2)；
The sand leakage avoiding device (4) is sealedly attached to electroplating bath (1) bottom, for realizing in electroplating process by gases at high pressure or
Liquid makes pressure in sand leakage avoiding device (4) be more than electroplating bath (1) bottom hydraulic pressure, prevents in electroplating bath (1) electroplate liquid from incoming line
(2) flow out；
First supercharging device (5) the connecting anti-leak sand device (4), for being that sand leakage avoiding device (4) provides in electroplating process
Gases at high pressure or liquid.
2. a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device according to claim 1, it is characterised in that described anti-
Sand leakage device (4) includes housing (41) and core body (43), wherein：
The housing (41) is sealedly connected on electroplating bath (1) bottom, for placing core body (43)；Housing (41) bottom centre has
One entrance hole (42), side wall is while have a perforate (44), for being connected by pipeline (6) with the first supercharging device (5)；
The core body (43) is located in housing (41), and core body (43) is bonded with electroplating bath (1) bottom and housing (41) respectively up and down,
There are 2-10mm gaps left and right with housing (41) inwall, for realizing the regulation of core body (43) left and right directions.
A kind of 3. diamond wire electroplating bath for being provided with sand leakage avoiding device according to claim 2, it is characterised in that the core
Body (43) is provided with circular passage (431), duct (432), pod apertures (433), wherein：
The circular passage (431) opens up along core body (43) outer rim, and circular passage (431) are while pass through housing (41) side-wall hole
(44) and pipeline (6) is connected with the first supercharging device (5), for forming passage for gases at high pressure or liquid；
The duct (432) is taper groove shape, and its lower port diameter is 0.2~0.5 times of back cut diameter, is opened in core body (43)
Central part, for converging gases at high pressure or liquid；
The pod apertures (433) are arranged between circular passage (431) and duct (432), for connecting the circular passage
(431) and duct (432), the water conservancy diversion number of perforations are 2~8.
A kind of 4. diamond wire electroplating bath for being provided with sand leakage avoiding device according to claim 3, it is characterised in that the hole
First pressure sensor (8) is provided with road (432), the plating trench bottom is provided with second pressure sensor, wherein：
First pressure sensor is used to monitor duct (432) inner high voltage gas or liquid pressure；
Second pressure sensor is used to monitor electroplating bath (1) bottom liquid pressure.
5. according to a kind of any one of claim 1-4 diamond wire electroplating baths for being provided with sand leakage avoiding device, its feature exists
In first supercharging device (5) includes the first gravity circulation cabinet (51), and the first gravity circulation cabinet (101) passes through pipeline
(6) connecting anti-leak sand device (4), highly higher than electroplating bath (1), pressure is provided higher than electricity for being embodied as sand leakage avoiding device (4)
The highly pressurised liquid of coating bath (1) bottom hydraulic pressure.
6. according to a kind of any one of claim 1-4 diamond wire electroplating baths for being provided with sand leakage avoiding device, its feature exists
In first supercharging device (5) includes compressor (52), and the compressor (52) passes through pipeline (6) connecting anti-leak sand device
(4), for providing gases at high pressure into sand leakage avoiding device (4).
7. according to a kind of any one of claim 1-4 diamond wire electroplating baths for being provided with sand leakage avoiding device, its feature exists
Also there is at least one blow valve port (7) in, electroplating bath (1) bottom, the blow valve port (7) is tangential along electroplating bath (1) inwall
Set, be externally connected to the second supercharging device (10).
8. a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device according to claim 7, it is characterised in that described
Two supercharging devices (10) include the second gravity circulation cabinet (101), and the second gravity circulation cabinet (101) is connected by pipeline and purged
Mouth (7), highly higher than electroplating bath (1).
9. a kind of diamond wire electroplating bath for being provided with sand leakage avoiding device according to claim 8, it is characterised in that described
Two supercharging devices (10) include ventilation blower (102) and non-return valve (103), wherein：
The ventilation blower (102) is connected by pipeline (6) with blow valve port (7), for providing gases at high pressure for blow valve port (7)；
The non-return valve (103) is arranged on the pipeline (6) between ventilation blower (102) and blow valve port (7), for preventing ventilation blower
(102) electroplate liquid adverse current enters ventilation blower (102) in electroplating bath (1) after being stopped.
10. the diamond wire production system of a kind of sand leakage avoiding, it is characterised in that the system is included as claim 1-9 is any
The electroplating bath (14) for being provided with sand leakage avoiding device and actinobacillus device (12), base line pretreatment unit (13), take-up described in
Device (15), wherein：
Actinobacillus device (12) leading-out terminal connects base line pretreatment unit (13) end of incoming cables；
Base line pretreatment unit (13) leading-out terminal connects electroplating bath (14) end of incoming cables；
Electroplating bath (14) leading-out terminal connects take-up (15) end of incoming cables.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610684928.5A CN106087013B (en) | 2016-08-17 | 2016-08-17 | It is provided with the diamond wire electroplating bath and diamond wire production system of sand leakage avoiding device |
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| CN201610684928.5A CN106087013B (en) | 2016-08-17 | 2016-08-17 | It is provided with the diamond wire electroplating bath and diamond wire production system of sand leakage avoiding device |
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| CN106087013B true CN106087013B (en) | 2017-12-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107119307A (en) * | 2017-05-18 | 2017-09-01 | 杨凌美畅新材料有限公司 | A kind of electroplated diamond Wiring technology groove baffle plate |
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| CN106087013A (en) | 2016-11-09 |
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Effective date of registration: 20190515 Address after: 300450 Tianjin Binhai New Area, No. 303, 3rd Gate, No. 2 Building, Minjiang Li, Guangzhou Dao Patentee after: Zhang Shijun Address before: 300385 factory 5, cedar Avenue, Xiqing District, Tianjin Patentee before: Hua Yuxin materials technology (Tianjin) Co.,Ltd. |
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