TWI460432B - - Google Patents

Info

Publication number: TWI460432B
Authority: TW; Taiwan

Application number

TW102126339A

Other versions

TW201504631A (zh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-07-23

Filing date

2013-07-23

Publication date

2014-11-11

2013-07-23 Application filed filed Critical

2013-07-23 Priority to TW102126339A priority Critical patent/TW201504631A/zh

2014-06-19 Priority to CN201410275427.2A priority patent/CN104345186B/zh

2014-07-22 Priority to JP2014148870A priority patent/JP2015021973A/ja

2014-07-23 Priority to US14/338,797 priority patent/US9535093B2/en

2014-11-11 Application granted granted Critical

2014-11-11 Publication of TWI460432B publication Critical patent/TWI460432B/zh

2015-02-01 Publication of TW201504631A publication Critical patent/TW201504631A/zh

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Measuring Leads Or Probes (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Testing Of Individual Semiconductor Devices (AREA)

TW102126339A 2013-07-23 2013-07-23 光電元件檢測用之高頻探針卡 TW201504631A (zh)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
TW102126339A TW201504631A (zh)	2013-07-23	2013-07-23	光電元件檢測用之高頻探針卡
CN201410275427.2A CN104345186B (zh)	2013-07-23	2014-06-19	光电元件检测用的高频探针卡
JP2014148870A JP2015021973A (ja)	2013-07-23	2014-07-22	光電子ユニット測定用高周波プローブカード
US14/338,797 US9535093B2 (en)	2013-07-23	2014-07-23	High frequency probe card for probing photoelectric device

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW102126339A TW201504631A (zh)	2013-07-23	2013-07-23	光電元件檢測用之高頻探針卡

Publications (2)

Publication Number	Publication Date
TWI460432B true TWI460432B (zh)	2014-11-11
TW201504631A TW201504631A (zh)	2015-02-01

Family

ID=52388375

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW102126339A TW201504631A (zh)	2013-07-23	2013-07-23	光電元件檢測用之高頻探針卡

Country Status (4)

Country	Link
US (1)	US9535093B2 (zh)
JP (1)	JP2015021973A (zh)
CN (1)	CN104345186B (zh)
TW (1)	TW201504631A (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI564568B (zh) *	2015-03-26	2017-01-01		Use a coaxial pin with a cantilever probe card
TWI541512B (zh) *	2015-05-29	2016-07-11		Use a probe card with a coaxial pin
TWI606241B (zh) *	2015-09-16	2017-11-21	Mpi Corp	Probe card with bypass line
US10663486B2 (en) *	2017-02-06	2020-05-26	International Business Machines Corporation	Portable electrical noise probe structure
CN108872651B (zh) *	2017-05-08	2021-05-07	旺矽科技股份有限公司	探针卡
TWI661206B (zh) *	2018-01-19	2019-06-01	新加坡商美亞國際電子有限公司	測試用電路板
CN110716122B (zh) *	2018-07-13	2021-09-28	中华精测科技股份有限公司	高频探针卡装置及其信号传输模块
JP6756946B1 (ja) *	2018-11-27	2020-09-16	日本発條株式会社	プローブユニット
TW202035995A (zh) *	2019-03-18	2020-10-01	旺矽科技股份有限公司	探針裝置
TWI679424B (zh) *	2019-03-29	2019-12-11	矽品精密工業股份有限公司	檢測裝置及其製法
US11346860B2 (en) *	2019-08-15	2022-05-31	Mpi Corporation	Probe head for high frequency signal test and medium or low frequency signal test at the same time
CN112611916A (zh) *	2019-10-04	2021-04-06	旺矽科技股份有限公司	用于电路板阻抗测试的可调式探针装置
CN112710878B (zh) *	2019-10-24	2024-02-27	台湾中华精测科技股份有限公司	可拆式高频测试装置及其垂直式探针头
CN114354990B (zh) *	2020-10-14	2024-04-09	旺矽科技股份有限公司	整合不同电性测试的探针卡
CN113848351B (zh) *	2021-08-16	2023-07-25	昆山德普福电子科技有限公司	高频探测组件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6856362B2 (en) *	1992-03-12	2005-02-15	Hitachi, Ltd.	Structure of liquid crystal display device for easy assembly and disassembly
TW200829922A (en) *	2007-01-08	2008-07-16	Microelectonics Technology Inc	High frequency probe
US20090181560A1 (en) *	2000-09-08	2009-07-16	Gabe Cherian	S&p3 cww2 connectors with wipe
US20110254565A1 (en) *	2009-12-31	2011-10-20	Mapper Lithography Ip B.V.	Capacitive sensing system with differential pairs
CN102473684A (zh) *	2009-07-30	2012-05-23	米辑电子股份有限公司	***级封装
CN102759701A (zh) *	2011-04-28	2012-10-31	旺矽科技股份有限公司	整合式高速测试模块

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0650991A (ja) *	1992-07-31	1994-02-25	Toho Denshi Kk	プローブ装置
JP2790074B2 (ja) *	1995-03-31	1998-08-27	日本電気株式会社	プローブ装置
JP4060984B2 (ja) *	1999-04-07	2008-03-12	株式会社日本マイクロニクス	プローブカード
TW459405B (en) *	2000-10-17	2001-10-11	Advanced Epitaxy Technology In	Manufacturing method of III-nitride device
TWI321820B (en) *	2006-08-25	2010-03-11	Star Techn Inc	Integrated circuits probing apparatus having a temperature-adjusting mechanism
KR101277471B1 (ko) *	2006-11-15	2013-06-20	재팬 일렉트로닉 메트리얼스 코오포레이숀	광 디바이스용 검사장치
US7595651B2 (en) *	2007-02-13	2009-09-29	Mpi Corporation	Cantilever-type probe card for high frequency application
CN101788573A (zh) *	2009-01-23	2010-07-28	京元电子股份有限公司	探针卡
CN103543304B (zh) *	2012-07-13	2016-05-18	旺矽科技股份有限公司	高频探针卡

2013
- 2013-07-23 TW TW102126339A patent/TW201504631A/zh not_active IP Right Cessation
2014
- 2014-06-19 CN CN201410275427.2A patent/CN104345186B/zh not_active Expired - Fee Related
- 2014-07-22 JP JP2014148870A patent/JP2015021973A/ja active Pending
- 2014-07-23 US US14/338,797 patent/US9535093B2/en not_active Expired - Fee Related

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6856362B2 (en) *	1992-03-12	2005-02-15	Hitachi, Ltd.	Structure of liquid crystal display device for easy assembly and disassembly
US7359024B2 (en) *	1992-03-12	2008-04-15	Hitachi, Ltd.	Structure of liquid crystal display device for easy assembly and disassembly
US20090181560A1 (en) *	2000-09-08	2009-07-16	Gabe Cherian	S&p3 cww2 connectors with wipe
TW200829922A (en) *	2007-01-08	2008-07-16	Microelectonics Technology Inc	High frequency probe
CN102473684A (zh) *	2009-07-30	2012-05-23	米辑电子股份有限公司	***级封装
US20110254565A1 (en) *	2009-12-31	2011-10-20	Mapper Lithography Ip B.V.	Capacitive sensing system with differential pairs
CN102759701A (zh) *	2011-04-28	2012-10-31	旺矽科技股份有限公司	整合式高速测试模块

Also Published As

Publication number	Publication date
CN104345186B (zh)	2017-07-14
US9535093B2 (en)	2017-01-03
JP2015021973A (ja)	2015-02-02
CN104345186A (zh)	2015-02-11
US20150028911A1 (en)	2015-01-29
TW201504631A (zh)	2015-02-01

Legal Events

Date	Code	Title	Description
2021-08-11	MM4A	Annulment or lapse of patent due to non-payment of fees

Publication	Publication Date	Title
AP2016009275A0 (zh)	2016-06-30
BR112016014561A2 (zh)	2017-08-08
BR112015007533A2 (zh)	2017-08-22
BR112014019326A2 (zh)	2017-06-20
BR112014020341A2 (zh)	2017-06-20
BR112014018480A2 (zh)	2017-06-20
BR112014017855A2 (zh)	2017-06-20
BR112014021878A2 (zh)	2017-06-20
BR112016007978A2 (zh)	2017-08-01
BR112014018468A2 (zh)	2017-06-20
BR112014017901A2 (zh)	2017-06-20
BR112016013701A2 (zh)	2017-08-08
TWI460432B (zh)	2014-11-11
BR112014018207A2 (zh)	2017-06-20
BR112016012206A2 (zh)	2017-08-08
BR112016010084A2 (zh)	2017-08-01
BR112014019204A2 (zh)	2017-06-20
BR112016006305A2 (zh)	2017-09-05
BR112015015948A2 (zh)	2017-08-15
BR112014018483A2 (zh)	2017-06-20
BR112014017794A2 (zh)	2017-06-20
BR112016010767A2 (zh)	2017-08-08
BR112015030894A2 (zh)	2017-07-25
BR112015015312A2 (zh)	2017-08-15
BR112014018353A2 (zh)	2017-06-20