TWI433206B - Fit the device - Google Patents

Fit the device Download PDF

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Publication number
TWI433206B
TWI433206B TW095115078A TW95115078A TWI433206B TW I433206 B TWI433206 B TW I433206B TW 095115078 A TW095115078 A TW 095115078A TW 95115078 A TW95115078 A TW 95115078A TW I433206 B TWI433206 B TW I433206B
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
bonding
wafer
sheet
roller
Prior art date
Application number
TW095115078A
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English (en)
Other versions
TW200727329A (en
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200727329A publication Critical patent/TW200727329A/zh
Application granted granted Critical
Publication of TWI433206B publication Critical patent/TWI433206B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0095—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using a provisional carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5092—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the tape handling mechanisms, e.g. using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/526—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by printing or by transfer from the surfaces of elements carrying the adhesive, e.g. using brushes, pads, rollers, stencils or silk screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7861—In-line machines, i.e. feeding, joining and discharging are in one production line
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7861—In-line machines, i.e. feeding, joining and discharging are in one production line
    • B29C65/7867—In-line machines, i.e. feeding, joining and discharging are in one production line using carriers, provided with holding means, said carriers moving in a closed path
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8223—Worm or spindle mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/824—Actuating mechanisms
    • B29C66/8242—Pneumatic or hydraulic drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8341—Roller, cylinder or drum types; Band or belt types; Ball types
    • B29C66/83411—Roller, cylinder or drum types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L24/27—Manufacturing methods
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4825—Pressure sensitive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01004—Beryllium [Be]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Description

貼合裝置
本發明係有關貼合裝置，更詳細來說，係有關將黏著薄片貼合於半導體晶圓等板狀構件時，而可將黏著薄片高精確度地貼合在板狀構件之特定位置的，貼合裝置。
將形成有電路面之半導體晶圓(以下簡稱「晶圓」)單片化為晶片之後，進行有撿料各晶片而黏著於導線框(片接)者。此片接在晶圓處理工程中，可藉由預先貼合片接用感熱黏著性黏著薄片來進行。
作為上述黏著薄片之貼合型態，有使用將帶狀黏著薄片暫時黏著於帶狀剝除薄片之原材，將從上述剝除薄片剝除之黏著薄片貼合於晶圓之後，沿著晶圓外周切割的情況(參考專利文件1)；和將預先設置有對應晶圓外型之平面形狀的薄片，從剝除薄片剝除而貼合於晶圓的情況(參考專利文件2)。
[專利文件1]日本特開2003－257898號公報[專利文件2]日本特開平7－195527號公報
然而專利文件1之構造中，黏著薄片貼合後的外周切割，其外周切割裝置對貼合裝置來說是必要裝置，除了使裝置複雜化之外，還會因為外周切割裝置與支撐晶圓之貼合用桌台的位置誤差等，會導致損傷晶圓外周等不良情況。
另一方面，將預先形成為對應晶圓形狀之薄片貼合於晶圓時，因為陸續送出原材之際的位置偏移，會使黏著薄片無法貼合在晶圓之特定位置，而產生以在橫方向位置偏移之狀態來貼合的問題。這點，專利文件2提案有在原材陸續送出時，即使產生薄片之位置性偏移，也可修正該偏移而將黏著薄片貼合於晶圓特定位置的構造。
然而專利文件2所揭示之裝置中，在檢測黏著薄片之偏移時，係採用暫時停止原材之陸續送出而用攝像手段攝像的方式；這會導致無法進行連續處理，大幅降低處理能力的不良情況。而且前提是使用用以攝像的攝影機等，控制該等之裝置構造也相當高價，而有成本面較不經濟的不良情況。
發明目的
本發明係著眼於此種不良狀況而提案者，其目的，係提供一種貼合裝置，其即使在原材之陸續送出中，黏著薄片在與陸續送出方向正交之方向產生位置偏移，也能藉由修正該偏移量，將黏著薄片貼合在板狀構件的特定位置。
又，本發明之其他目的，係提供一種貼合裝置，其作為將預先切斷為對應晶圓外型之平面形狀之黏著薄片，加以貼合的方式，可以不需要外周切割裝置。
本發明更其他之目的，係提供一種貼合裝置，其可不傷害黏著薄片表面來貼合。
為了達成上述目的，本發明係一種貼合裝置，係具備支撐板狀構件的貼合用桌台，和使對應板狀構件之平面形狀黏著薄片，在陸續送出暫時黏著有剝除薄片之原材之過程中，剝除上述黏著薄片而貼合於上述板狀構件上的貼合單元；其採用一種構造，具備配置在上述原材之陸續送出路徑上，同時檢測與上述黏著薄片之陸續送出方向正交之橫方向偏移量的檢測手段；和以檢測手段檢測出上述黏著薄片之位置偏移時，修正該位置偏移的偏移量修正裝置；上述檢測手段，係不停止上述原材之陸續送出動作，而檢測偏移量。
又，本發明係一種貼合裝置，係具備支撐半導體晶圓的貼合用桌台，和使對應半導體晶圓之平面形狀黏著薄片，在陸續送出暫時黏著有剝除薄片之原材之過程中，剝除上述黏著薄片而貼合於上述半導體晶圓上的貼合單元；其採用一種構造，具備配置在上述原材之陸續送出路徑上，同時檢測與上述黏著薄片之陸續送出方向正交之橫方向偏移量的檢測手段；和以檢測手段檢測出上述黏著薄片之位置偏移時，修正該位置偏移的偏移量修正裝置；上述檢測手段，係不停止上述原材之陸續送出動作，而檢測偏移量。
更且本發明係一種貼合裝置，係具備支撐板狀構件的貼合用桌台，和使對應板狀構件之平面形狀黏著薄片，在陸續送出暫時黏著有剝除薄片之原材之過程中，剝除上述黏著薄片而貼合於上述板狀構件上的貼合單元；其採用一種構造，上述貼合單元，係一邊同時進行上述黏著薄片之陸續送出、和黏著薄片之按壓、和黏著薄片從剝除薄片之剝除，一邊貼合於上述板狀構件。
又，本發明係一種貼合裝置，係具備支撐板狀構件的貼合用桌台，和使對應板狀構件之平面形狀黏著薄片，在陸續送出暫時黏著有剝除薄片之原材之過程中，剝除上述黏著薄片而貼合於上述板狀構件上的貼合單元；其採用一種構造，上述貼合單元，係從將上述黏著薄片陸續送出到面臨上述板狀構件之位置的狀態，到一邊同時進行上述黏著薄片之捲取、和黏著薄片之按壓、和黏著薄片從剝除薄片之剝除，並一邊貼合於上述板狀構件。
也可以採用一種構造，其中，可同時進行上述黏著薄片之陸續送出或捲取、和黏著薄片之押壓的貼合裝置，更包含配置在上述原材之陸續送出路徑上，同時檢測與上述黏著薄片之陸續送出方向正交之橫方向偏移量的檢測手段；和以檢測手段檢測出上述黏著薄片之位置偏移時，修正該位置偏移的偏移量修正裝置；上述檢測手段，係不停止上述原材之陸續送出動作，而檢測偏移量。
本發明係採用一種構造，其中上述黏著薄片成為略圓形，上述檢測手段則檢測沿著上述陸續送出方向之黏著薄片的弦長，來特定上述偏移量。
更且本發明之檢測手段，係對於基準中心線，在橫方向兩側以等間隔來配置。
又，上述黏著薄片，可以用片接用感熱黏著性黏著薄片作為對象。
若依本發明，因為是使用將對應板狀構件之形狀之黏著薄片，暫時黏著於剝除薄片的原材者，故可以不需要沿著板狀構件外周切割的裝置。
又因為在檢測被陸續送出之黏著薄片的位置偏移時，不會停止原材之陸續送出動作，故比起間斷陸續送出的情況，可以大幅提高黏著薄片的貼合處理效率。
又，檢測出位置偏移時之修正，係調整支撐板狀構件之桌台之位置的構造，換言之，只要依據原材之陸續送出路徑誤差，使桌台側往橫方相位移對應偏移量的份量，就已經足夠，故可以極為簡單的構成修正位置偏移之機構。
更且上述貼合單元，係設置為同時進行上述黏著薄片之送出或捲取、和黏著薄片之按壓、和黏著薄片從剝除薄片之剝除的構造；故對於黏著薄片之按壓力，係經由黏著薄片來被賦予，不會傷害黏著薄片表面，就可將該黏著薄片貼合於板狀構件。
以下，參考圖示說明本發明之實施方式。
第1圖中，表示本實施方式之晶圓處理裝置其整體構造的概略俯視圖。此圖中，晶圓處理裝置10係在作為板狀構件之晶圓W其電路面的相反面(以下稱為「晶圓W之背面」)，貼合有片接用感熱黏著性之黏著薄片S1(以下稱為「黏著薄片S1」)之後，在該黏著薄片S1側經由切割膠帶，對環框RF鑲嵌晶圓W，而構成處理此一連串工程的裝置。
上述晶圓處理裝置10，係具備收容晶圓W之匣11；和將從此匣11取出之晶圓W，加以吸附搬運的機器人12；和對貼合於上述晶圓W之電路面側之未圖示保護膠帶，進行紫外線照射的紫外線照射單元13；和進行晶圓W之定位的對準裝置14；和在對準處理後之晶圓W背面，貼合上述黏著薄片S1的貼合裝置15；和包含對貼合黏著薄片S1後之晶圓W，經由切割膠帶將晶圓W鑲嵌於環框RF之膠帶貼合單元16，以及剝除保護膠帶之膠帶剝除單元17的，鑲嵌裝置18；和將剝除了保護膠帶之晶圓W加以收容的，儲藏器19，來構成。
上述貼合裝置15以外之構造或裝置，亦即上述匣11、機器人12、紫外線照射單元13、對準裝置14、鑲嵌裝置18及儲藏器19，係與本申請人所申請之日本特願2004－133069號實質相同。因此以下，針對上述貼合裝置15來說明。
上述貼合裝置15，係如第2圖及第3圖所示，具備接收紫外線照射後之晶圓W，而支撐該晶圓W的移放用桌台20；和被移放有此移放用桌台20上之晶圓W的，貼合用桌台21；和吸附移放用桌台20上之晶圓W，移放到貼合桌台21的移放裝置22；和在被移放到貼合桌台21之晶圓W背面側(上面側)，貼合黏著薄片S1的貼合單元24；和將經由該貼合單元24所貼合之黏著薄片S1加以加熱，而完全黏著於晶圓W的黏著用桌台26，來構成。
移放用桌台20係設置為可升降，同時經由移動裝置30，設置為在可接收上個工程中之晶圓W的位置，和貼合用桌台21上方之間來回移動。此移動裝置30，係具備一對軌這31、31；和被此等軌道31導引，在該軌道31上移動之滑動板32；和配置在該滑動板32上的升降裝置33(參考第2圖)；和在螺合於固定在滑動板32之螺帽34之狀態下，加以貫通的球螺絲軸35；和旋轉驅動該球螺絲軸35的馬達M1(參考第1圖)，來構成。針對螺絲軸35，馬達M1之相反側係被軸承36可旋轉地支撐，藉此，馬達M1在正反轉驅動時，移放用桌台20可以沿著軌道31、31在X方向來回移動。
上述貼合用桌台21，上面係形成為吸附面；是在經由未圖示之保護膠帶吸附晶圓W之電路側面的狀態下，藉由上述貼合單元24，用以對其背面(上面)貼合黏著薄片S1的桌台；內裝有用以將晶圓W加熱到一定溫度之加熱器，來構成。此貼合用桌台21，係由側面看略L字形之升降托架40所支撐的基座桌台21A；和在該基座桌台21A上，被支撐為可沿著Y方向移動的吸附桌台21B，所構成。
上述貼合用桌台21，係設置為可藉由升降裝置42升降。此升降裝置42，係由安裝於升降托架40背面側的螺帽43；和連結於升降托架40兩側的，一對升降側板45；和將此升降側板45在上下方向導引的，一對站立軌道46；和在上下方向貫通上述螺帽43，並延伸的球螺絲軸47；和分別固定於此球螺絲軸47下端，與配置在站立軌道46下端附近之馬達M2之輸出軸的，滑輪48、49；和掛在此等滑輪48、49而旋轉的皮帶50，來構成。貼合用桌台21，係藉由球螺絲軸47隨著上述馬達M2驅動的旋轉，而可在第3圖所示之迴避位置，和第4圖所示之貼合位置之間升降。
構成貼合桌台21之基座桌台21A及吸附桌台21B之間，如第2圖概略所示，配置有偏移量修正裝置51。此偏移量修正裝置51，係由可使吸附板21B在Y方向移動的單軸機器人所構成。
上述貼合單元24，係由支撐在板狀框F內之薄片陸續送出部54，和與此一併設置之貼合輥移動裝置52來構成。亦即貼合單元24，係包含可將對帶狀剝除薄片PS暫時黏著帶狀黏著薄片材LS之捲軸狀原材L，可陸續送出地加以支撐的支撐輥55；和經由未圖示之馬達來旋轉，並具備成為對應晶圓W之外型地，對黏著薄片材LS形成切痕，來形成貼合用黏著薄片S1之切割刃56A的，片切輥56；和將形成黏著薄片S1後之外周側，捲取回收為多餘黏著薄片S2的回收輥57；和與此回收輥57一併設置，確保緩衝範圍的張力輥(Dancer Roller)58；和配置在通過該張力輥58位置後之原材陸續送出路徑上，檢測黏著薄片S1之位置的檢測手段60；和一邊將黏著薄片S1對晶圓W按壓，一邊貼合的貼合輥61；和經由未圖示之馬達來旋轉，將貼合黏著薄片S1後之剝除薄片PS，以特定張力來捲取的捲取輥63。
支撐輥55和片切輥56之間，係配置有以未圖示之轉矩馬達所驅動之驅動輥65，和夾輥65N，以及導引輥66；片切輥56之外周側，係對峙配置有追隨驅動於該片切輥56的平壓輥(Platen Roller)68。平壓輥68與回收輥57之間，配置有導引輥69、以未圖示之轉矩馬達所驅動之驅動輥70與夾輥(Nip Roller)70N，以及經由未圖示之馬達而旋轉的驅動輥71。驅動輥71係配置有壓輥(Pinch Roller)72，對原材L賦予陸續送出力，同時使回收輥57經常碰觸此壓輥72地來設置，使該回收輥57藉由摩擦力來持續旋轉，而設置為可捲取回收多餘黏著薄片S2。又驅動輥65、70，係在對黏著薄片材LS形成切痕時，不使黏著薄片S1伸展或彎曲地，設定為一邊進行同時控制兩支輥的二軸張力控制，一邊陸續送出。
又，張力輥58與貼和輥61之間，配置有以未圖示之轉矩馬達所驅動之驅動輥74與夾輥74N，導引輥75、76，以及拉輥(Tension Roller)77；更且在貼合輥61與捲取輥63之間，配置有導引輥79，及以未圖示之轉矩馬達所驅動之驅動輥80與夾輥80N。另外驅動輥74、80，係在將黏著薄片S1貼合於晶圓W時，不使黏著薄片S1伸展或彎曲地，設定為和前述相同之一邊進行同時控制兩支輥的二軸張力控制，一邊陸續送出。
上述檢測手段60，係由從框F面突出之棒狀支撐構件82，和安裝在此支撐構件82長邊方向兩個場所的一對感測器83A、83B，所構成。感測器83A、83B，係如第5圖所示，對沿著陸續送出方向之基準中心線CL，配置在左右等間隔位置，構成為可檢測沿著上述基準中心線CL之黏著薄片S1的弦長a、b。在此所謂「基準中心線」，係針對與貼合用桌台21上之晶圓W中心的對應關係，意指必須通過暫時黏著於剝除薄片PS之黏著薄片S1之中心C的，設計上的中心線。從而，中心C沒有通過基準中心線CL上時，就會是黏著薄片S1在橫方向(第5圖中左右方向)之任一邊偏移而通過。因此如第5圖所示，假設中心C位於基準中心線CL左側來陸續送出時，黏著薄片S1會成為往左側偏移S份量的狀態。作為此偏移的檢測方法，在本實施方式中，可採用兩種方法。若更詳細敘述，則是依據感應器83A所檢測之弦長a的1/2，和預先決定之黏著薄片S1的半徑r，以三邊定理求出剩下一邊的長度，將該長度與設定長度A(感測器檢測位置與基準中心的距離)做比較，即可特定偏移量S。又作為其他方法，係依據感應器83B所檢測之弦長b的1/2，和半徑r，與上述一樣求出左側剩下一邊的長度，與上述求得之右側剩下一邊之長度取差值，而可將其一半特定為偏移量S。另外此等偏移量S，係成為一種構造，其藉由未圖示之控制裝置的程式來自動算出，使該控制裝置預先記憶偏移量S，在將該黏著薄片S1貼合於晶圓W之前，對上述偏移量修正裝置51之單軸機器人下指令，使吸附板21B往Y方向移動該偏移量S。
上述貼合輥移動裝置52，係由上述移放用桌台20中與軌道31平行，亦即延伸於X方向的單軸機器人85；和被此單軸機器人85支撐，於Y方向延伸的移動臂86；和支撐此移動臂86之反單軸機器人85端側地，延伸於X方向的軌道88；和設置於上述移動臂86之上面兩個場所的，一對上下動作缸89、89；和配置於移動臂86下面側，藉由上下動作缸89之活塞桿91(參考第4圖)之進退，而設置為可升降的門型框90；和被該門型框90可旋轉地支撐的貼合輥61，所構成；藉由使上述單軸機器人85動作，使移動臂86往X方向移動，可一邊將繞行在貼合輥61外周之黏著薄片S1按壓於晶圓W，一邊貼合。
上述門型框90之兩側，係固定有向著略垂直面內，成為板狀之托架92、92；該托架92在第2圖中右側的上下，係支撐有上述導引輥76、79。又，導引輥76之旋轉中心軸附近，係可搖動地裝配有略L型的搖動環94；其一端側支撐有上述拉輥77，另一方面其他端側，則連結於固定在上述移動臂86上面之汽缸96的活塞桿97。從而，藉由活塞桿97之進退，拉輥77係被設置為可以導引輥76之旋轉中心軸為旋轉中心來旋轉，藉此，可以對在導引輥76及貼合輥61之間的原材L賦予一定張力。
上述移放裝置22，係包含在下面側吸附晶圓W的板狀吸附板100；和設置在此吸附板100之上面側的，溫度調整單元101；和支撐吸附板100的臂102；和使吸附板100升降的Z軸缸103；和使Z軸缸103在Y方向移動的單軸機器人105，來構成。吸附板100，在吸附移放用桌台20上的晶圓W時，係將晶圓W加熱為用以暫時黏著的溫度，並將晶圓W移放到貼合用桌台21，在對該晶圓W貼合黏著薄片S1之後，將晶圓W移放到黏著用桌台26，在該黏著用桌台26，將完全黏著有黏著薄片S1之晶圓W，移放到鑲嵌裝置18。此時，移放裝置22，係藉由溫度調整單元101，在將晶圓W從移放用桌台20移放到貼合用桌台21的期間，或從貼合用桌台21移放到黏著用桌台26的期間，或從黏著用桌台26移放到鑲嵌裝置18等任一個工程中，都進行晶圓W的溫度調整，可以省去移放晶圓之後的溫度調整時間，或謀求縮短化。
上述黏著用桌台26，係經由未圖示之框，配置在貼合用桌台21的側邊上部。此黏著用桌台26，上面係構成吸附面，經由上述移放裝置22而從貼合用桌台21被移放晶圓W，加熱被暫時黏著有黏著薄片S1的晶圓W，而將該黏著薄片S1完全黏著於晶圓W。
在上述黏著用桌台26被完全黏著有黏著薄片S1的晶圓W，係再次經由上述移放裝置22來移放到鑲嵌裝置18側。該鑲嵌裝置18中，晶圓W會經由未圖示之切割膠帶，被鑲嵌於環框RF，從進行了該鑲嵌之後的晶圓W電路面，剝除保護薄片，而收容於儲藏器19。
其次，說明本實施方式中黏著薄片S1的貼合動作。
進行了紫外線照射處理及對準處理的晶圓W，若經由移放用桌台20被搬運到貼合用桌台21的上方位置，則移放裝置22之吸附板100會吸附晶圓W。之後，移放用桌台20會回到第2圖中實線位置，另一方面貼合用桌台21會上升到第4圖中實線所示位置，而將晶圓W移放到貼合用桌台21上。
另一方面，貼合單元24側，係進行原材L之陸續送出，一邊由驅動輥65、70來進行張力控制，一邊依序經由片切輥56，形成平面看去略圓形之黏著薄片S1之輪廓地，對黏著薄片材LS形成切痕。此切痕所產生之多餘黏著薄片S2，會申回收輥57來依序捲取回收，並藉由驅動輥71，陸續送出方向下游側會依序陸續送出對剝除薄片PS暫時黏著有黏著薄片S1之狀態的原材。在此如之前所述，檢測手段60係檢測黏著薄片S1對基準中心線CL的橫方向位置偏移，確定該偏移量S，而預先記憶於未圖示之控制裝置。
當確定了偏移量S之晶圓W進入貼合體制時，會依據預先記憶於未圖示控制裝置之該黏著薄片的偏移量S，在偏移量修正裝置51之單軸機器人，使吸附桌台21B對基準中心線CL，往Y方向僅移動對應該偏移量的份量。然後黏著薄片S1，係一邊受到貼合輥61之旋轉與按壓力，一邊依據與貼合用桌台21上之晶圓W的相對關係來被控制，同時藉由驅動輥74、80來做張力控制，從陸續送出方向端依序貼合於晶圓W背面。藉此，會以修正了位置偏移之狀態，將黏著薄片S1貼合於晶圓W背面。另外，移動之吸附桌台21B，係回到初期位置，亦即回到晶圓W中心一致於基準中心線CL的位置之後，將晶圓W交接給吸附板100。
移放裝置22之吸附板100所吸附的晶圓W，係被移放到黏著用板26並被完全黏著，更在鑲嵌裝置18中，進行對環框RF之鑲嵌後，剝除貼合於電路面之未圖示的保護膠帶。
其次，參考第6圖及第7圖，說明藉由貼合輥61將黏著薄片S1貼合於晶圓W的具體作用。
本發明中，如第6圖及第7圖所示，可採用兩種貼合型態；第6圖所示之型態，係表示所謂陸續送出同時貼合型態，第7圖則表示捲取同時貼合型態。
第6圖(A)~(D)所示之貼合型態中，黏著薄片S1之領先端SE會陸續送出到與晶圓W之圖中右端一致的位置(參考第6圖(A))。然後在此狀態下，貼合輥61經由上下動作缸89下降，使領先端SE碰觸晶圓W右端(參考第6圖(B))。其次，使貼合輥移動裝置52向著晶圓W之直徑方向相反側移動，一邊陸續送出黏著薄片S1，一邊使貼合輥61將黏著薄片S1按壓於晶圓W，來貼合(參考第6圖(D))。
又，第7圖(A)~(D)所示之貼合型態中，係使貼合輥移動裝置52動作，使貼合輥61之中心位於晶圓W在圖中左端的正上方，同時使黏著薄片S1之反領先端SE1成為一致於晶圓W之圖中左端的狀態，亦即到相對於晶圓W之位置為止，進行原材的陸續送出(參考第7圖(A))；此狀態下，係使貼合輥61下降，使晶圓W之反領先端SE1碰觸晶圓W左端(參考第7圖(B))。其次，藉由使貼合輥移動裝置52往晶圓W之直徑方向相反側移動，可一邊捲取黏著薄片S1，一邊使貼合輥61將黏著薄片S1按壓於晶圓W，來貼合(參考第7圖(C)、(D))。
從而，若依此種實施方式，則檢測手段60可檢測出陸續送出動作中之黏著薄片S1的位置偏移，故產生該位置偏移時，可藉由修正貼合用桌台21之位置來應對，而可不降低處理效率，連續將黏著薄片S1貼合於晶圓W。
又黏著薄片S1，係經由剝除薄片PS來受到按壓力而被貼合，故可防止直接接觸貼合輥61而造成的損傷等。
如以上所述，用以實施本發明之最佳構造、方法等，雖然以上述記載來揭示，但本發明並非限定於此。
亦即本發明主要對特定實施方式來圖示、說明，但只要不脫離本發明之技術思想及目的範圍，則從業者可對以上說明之實施方式，對形狀、位置或配置等，因應必要加上各種變更。
例如上述實施方式之貼合裝置16，係圖示、說明為將具有感熱黏著性之片接用黏著薄片S1，貼合於晶圓W的裝置；但是也可以是其他薄片，例如具有感壓黏著性的黏著薄片。又，亦可適用於將乾阻劑薄膜或保護膜形成用薄片，貼合於晶圓W的情況。
又上述實施方式中，說明了對晶圓W貼合黏著薄片S1的構造；但是對除了晶圓W以外之板狀構件貼合薄片、薄膜的構造，也可適用。
10．．．晶圓處理裝置
15．．．貼合裝置
21．．．貼合用桌台
24．．．貼合單元
51．．．偏移量修正裝置
60．．．檢測手段
L．．．原材
S1．．．黏著薄片(感熱黏著性之黏著薄片)
PS．．．剝除薄片
LS．．．黏著薄片材
W．．．半導體晶圓(板狀構件)
[第1圖]表示本實施方式之晶圓處理裝置其整體構造的概略俯視圖[第2圖]包含貼合裝置之第1圖的部分正面圖[第3圖]貼合裝置的概略立體圖[第4圖]表示貼合輥移動裝置在貼合黏著薄片之中途階段的概略立體圖[第5圖]表示檢測手段所形成之位置偏移檢測原理的說明圖[第6圖]表示陸續送出同時貼合動作的作用說明圖[第7圖]表示捲取同時貼合動作的作用說明圖
21．．．貼合用桌台
24．．．貼合單元
60．．．檢測手段
L．．．原材
S1．．．黏著薄片(感熱黏著性之黏著薄片)
PS．．．剝除薄片
LS．．．黏著薄片材
100．．．板狀吸附板
W．．．半導體晶圓(板狀構件)
101．．．溫度調整單元
102．．．臂
103．．．Z軸缸
105．．．單軸機器人
42．．．升降裝置
46．．．站立軌道
47．．．球螺絲軸
48，49．．．滑輪
50．．．皮帶
40．．．升降托架
45．．．升降側板
M2．．．馬達
52．．．貼合輥移動裝置
55．．．支撐輥
57．．．回收輥
56．．．片切輥
56A．．．切割刃
54．．．薄片陸續送出部
58．．．張力輥
63．．．捲取輥
61．．．貼合輥
22．．．移放裝置
20．．．吸附移放用桌台
21A．．．基座桌台
21B．．．吸附桌台
26．．．黏著用桌台
31．．．軌道
32．．．滑動板
34．．．螺帽
35．．．球螺絲軸
30．．．移動裝置
36．．．軸承
RF．．．環框
S2．．．薄片
F．．．板狀框
80．．．驅動輥
80N．．．夾輥
76．．．導引輥
96．．．汽缸
97．．．活塞桿
X．．．方向
Z．．．軸缸
Y．．．方向
90．．．門型框
91．．．活塞桿
92．．．托架
85．．．單軸機器人
86．．．移動臂
82．．．棒狀支撐構件
83A，83B．．．感測器
88．．．軌道
89．．．上下動作缸
74．．．驅動輥
74N．．．夾輥
70．．．驅動輥
71．．．驅動輥
72．．．壓輥
70N．．．夾輥
69．．．導引輥
68．．．平壓輥
66，79．．．導引輥
94．．．搖動環
75．．．導引輥
65．．．驅動輥
65N．．．夾輥
77．．．拉輥

Claims (5)

  1. 一種貼合裝置，係具備支撐板狀構件的貼合用桌台，和在陸續送出使對應板狀構件之略圓形的平面形狀黏著薄片暫時黏著在剝除薄片上之原材的過程中、剝除上述黏著薄片而貼合於上述板狀構件上的貼合單元；其特徵係：具備配置在上述原材之陸續送出路徑上，同時檢測與上述黏著薄片之陸續送出方向正交之橫方向偏移量的檢測手段；和以檢測手段檢測出上述黏著薄片之位置偏移時，修正該位置偏移的偏移量修正裝置；上述檢測手段，係不停止上述原材之陸續送出動作，而檢測沿著上述陸續送出方向的黏著薄片的弦長，來特定上述偏移量。
  2. 一種貼合裝置，係具備支撐半導體晶圓的貼合用桌台，和在陸續送出使對應半導體晶圓之略圓形的平面形狀黏著薄片暫時黏著在剝除薄片上之原材的過程中、剝除上述黏著薄片而貼合於上述半導體晶圓上的貼合單元；其特徵係：具備配置在上述原材之陸續送出路徑上，同時檢測與上述黏著薄片之陸續送出方向正交之橫方向偏移量的檢測手段；和以檢測手段檢測出上述黏著薄片之位置偏移時，對應該位置偏移調整前述貼合用桌台的位置的偏移量修正裝置；上述檢測手段，係不停止上述原材之陸續送出動作， 而檢測沿著上述陸續送出方向的黏著薄片的弦長，來特定上述偏移量。
  3. 如申請專利範圍第1項或第2項所記載之貼合裝置，其中：上述檢測手段，係對於沿著上述陸續送出方向之基準中心線，在橫方向兩側以等間隔來配置。
  4. 如申請專利範圍第1項或第2項所記載之貼合裝置，其中：上述黏著薄片，係晶粒結著(die bonding)用感熱黏著性黏著薄片。
  5. 如申請專利範圍第3項之貼合裝置，其中：上述黏著薄片，係晶粒結著(die bonding)用感熱黏著性黏著薄片。
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TW200727329A (en) 2007-07-16
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