TWI407294B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- TWI407294B TWI407294B TW96149355A TW96149355A TWI407294B TW I407294 B TWI407294 B TW I407294B TW 96149355 A TW96149355 A TW 96149355A TW 96149355 A TW96149355 A TW 96149355A TW I407294 B TWI407294 B TW I407294B
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- heat
- heat sink
- base
- heat pipe
- support member
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種散熱裝置，尤其涉及一種用於電子元件散熱之散熱裝置。 The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of an electronic component.
隨著電子資訊業不斷發展，電子元件(尤為中央處理器)運行頻率和速度在不斷提升。但是，高頻高速將使電子元件產生之熱量隨之增多，使得其溫度不斷升高，嚴重威脅著電子元件運行時之性能，為確保電子元件能正常運作，必須及時排出電子元件所產生之大量熱量。 As the electronic information industry continues to evolve, the frequency and speed of electronic components (especially central processing units) continue to increase. However, high-frequency high-speed will increase the amount of heat generated by electronic components, causing its temperature to rise, which seriously threatens the performance of electronic components during operation. To ensure the normal operation of electronic components, it is necessary to discharge a large amount of electronic components in time. Heat.
為此，業界通常使用一種包括一散熱器之散熱裝置固定在機箱電路板之電子元件上為其散熱。隨著機箱體積越來越小型化，機箱內留給散熱裝置之空間也越來越小，尤其是在筆記本電腦和平板電腦中，散熱裝置所占空間有限，結構上往往都是使用較長熱管將電子元件之熱量傳導至合適位置上之散熱器以使其滿足整體佈局需要。然而，這種具有較長熱管之散熱裝置安裝在機箱內後在運輸過程中或者在跌落測試中容易發生變形甚至損害，影響整個散熱裝置之散熱性能。 To this end, the industry generally uses a heat sink including a heat sink to fix heat on the electronic components of the chassis circuit board. As the size of the chassis becomes smaller and smaller, the space left in the chassis for the heat sink is getting smaller and smaller. Especially in notebook computers and tablet computers, the space occupied by the heat sink is limited, and the structure often uses a long heat pipe. The heat of the electronic components is conducted to a heat sink at a suitable location to meet the overall layout needs. However, such a heat sink having a long heat pipe is easily deformed or even damaged during transportation or during a drop test, and affects the heat dissipation performance of the entire heat sink.
有鑒於此，實有必要提供一種將很好地保護熱管之散熱裝置。 In view of this, it is necessary to provide a heat sink that will well protect the heat pipe.
一種散熱裝置，用於散發一電子元件產生之熱量，其包括一與該電子元件接觸之基座、一散熱器及連接該基座與散熱器之一熱管，該散熱器遠離該基座，該熱管包括一固定在基座上之吸熱段、一固定在該散熱器上之放熱段以及連接該吸熱段與該放熱段之連接段，一支撐件分別與該基座、散熱 器及熱管固定連接，該支撐件沿熱管軸向跟隨式延伸，該熱管焊接於該支撐件上，該支撐件靠近該散熱器之一端延伸一固定片，一固定件穿設該固定片並固定在散熱器上，該散熱器上設有二定位孔，該支撐件於該固定片兩側延伸有二定位片以穿設該定位孔。 A heat dissipating device for dissipating heat generated by an electronic component, comprising: a base in contact with the electronic component, a heat sink, and a heat pipe connecting the base and the heat sink, the heat sink being away from the base, the heat sink The heat pipe includes a heat absorption section fixed on the base, a heat release section fixed on the heat sink, and a connection section connecting the heat absorption section and the heat release section, and a support member and the base respectively And the heat pipe is fixedly connected, the support member extends along the axial direction of the heat pipe, and the heat pipe is welded to the support member. The support member extends a fixing piece near one end of the heat sink, and a fixing member passes through the fixing piece and is fixed. On the heat sink, the heat sink is provided with two positioning holes, and the support member has two positioning pieces extending on both sides of the fixing piece to penetrate the positioning holes.
與習知技術相比，由於該散熱裝置之支撐件很好地支撐保護熱管中部之連接段，加強了散熱裝置之強度，有效地保證散熱裝置之散熱性能之穩定性。 Compared with the prior art, since the support member of the heat dissipating device supports the connecting portion in the middle of the heat pipe well, the strength of the heat dissipating device is strengthened, and the stability of the heat dissipating performance of the heat dissipating device is effectively ensured.
10‧‧‧基座 10‧‧‧ Pedestal
11‧‧‧吸熱部 11‧‧‧Heat Absorption Department
13‧‧‧承載部 13‧‧‧Loading Department
20‧‧‧散熱器 20‧‧‧ radiator
23‧‧‧散熱鰭片 23‧‧‧ Heat sink fins
30‧‧‧第一熱管 30‧‧‧First heat pipe
31、41‧‧‧吸熱段 31, 41‧‧‧heat absorption section
35、45‧‧‧連接段 35, 45‧‧‧ Connection section
37、47‧‧‧放熱段 37, 47‧‧‧heating section
40‧‧‧第二熱管 40‧‧‧second heat pipe
50‧‧‧支撐件 50‧‧‧Support
51‧‧‧底板 51‧‧‧floor
52‧‧‧折邊 52‧‧‧Folding
53‧‧‧固定片 53‧‧‧Fixed tablets
54‧‧‧定位片 54‧‧‧ Positioning film
60‧‧‧固定件 60‧‧‧Fixed parts
110‧‧‧上表面 110‧‧‧ upper surface
115‧‧‧凹槽 115‧‧‧ Groove
118、530‧‧‧固定孔 118, 530‧‧‧ fixing holes
130‧‧‧方形槽 130‧‧‧ square slot
230‧‧‧通道 230‧‧‧ channel
235‧‧‧安裝孔 235‧‧‧ mounting holes
237‧‧‧定位孔 237‧‧‧Positioning holes
351、451‧‧‧第一彎折段 351, 451‧‧‧ first bend
352、452‧‧‧中間段 352, 452‧‧ ‧ middle section
353、453‧‧‧第二彎折段 353, 453‧‧‧ second bend
510‧‧‧延伸部 510‧‧‧Extension
511‧‧‧第一彎折部 511‧‧‧First bend
512‧‧‧中間部 512‧‧‧ middle part
513‧‧‧第二彎折部 513‧‧‧Second bend
540‧‧‧舌部 540‧‧ ‧Tongue
圖1係本發明散熱裝置之組裝圖。 1 is an assembled view of a heat sink of the present invention.
圖2係圖1散熱裝置之立體分解圖。 2 is an exploded perspective view of the heat sink of FIG. 1.
圖3係圖1散熱裝置中支撐件之立體圖。 Figure 3 is a perspective view of the support member of the heat sink of Figure 1.
請參閱圖1與圖2，本發明散熱裝置用於安裝於一電路板(圖未示)上之電子元件(圖未示)上對其進行散熱。該散熱裝置包括一基座10、一遠離基座10之散熱器20、連接散熱器20與基座10之第一熱管30與第二熱管40、及架設於基座10與散熱器20之間之一支撐件50。該支撐件50分別與基座10、散熱器20以及第一、第二熱管30、40固定連接。 Referring to FIG. 1 and FIG. 2, the heat dissipating device of the present invention is used for heat dissipation on an electronic component (not shown) mounted on a circuit board (not shown). The heat dissipating device includes a base 10, a heat sink 20 remote from the base 10, a first heat pipe 30 and a second heat pipe 40 connecting the heat sink 20 and the base 10, and being disposed between the base 10 and the heat sink 20. One of the supports 50. The support member 50 is fixedly coupled to the base 10, the heat sink 20, and the first and second heat pipes 30, 40, respectively.
該基座10由導熱性能良好之金屬板體製成，包括一呈矩形之吸熱部11及一自吸熱部11一端緣向外延伸之承載部13。該吸熱部11具有一上表面110及一與上表面110相對之平整下表面(圖未標)以貼合電子元件之頂面。吸熱部11上表面設有二平行相隔之凹槽115，以結合收容第一、第二熱管30、40。吸熱部11之四角落開設有固定孔118，以供螺釘(圖未示)穿設以將基座10固定在該電子元件所在電路板上。該承載部13上表面設有一方形槽 130以安置支撐件50一端。其中方形槽130比凹槽110深。 The susceptor 10 is made of a metal plate body having good thermal conductivity, and includes a rectangular heat absorbing portion 11 and a bearing portion 13 extending outward from one end edge of the heat absorbing portion 11. The heat absorbing portion 11 has an upper surface 110 and a flat lower surface (not labeled) opposite to the upper surface 110 to conform to the top surface of the electronic component. The upper surface of the heat absorbing portion 11 is provided with two parallel spaced grooves 115 for receiving the first and second heat pipes 30, 40 in combination. The four corners of the heat absorbing portion 11 are provided with fixing holes 118 for screwing (not shown) to fix the base 10 on the circuit board on which the electronic component is located. The upper surface of the bearing portion 13 is provided with a square groove 130 to position one end of the support member 50. The square groove 130 is deeper than the groove 110.
該散熱器20由複數散熱鰭片23並排組合而成。每一散熱鰭片23之上下邊緣同向彎折一折緣(圖未標)，以與相鄰之散熱鰭片23均勻間隔。該散熱器20中部設有二分隔之通道230，以收容該第一、第二熱管30、40。散熱器20最外側之散熱鰭片23上設有一圓形安裝孔235，該安裝孔235設置於該二通道230之間。該最外側之散熱鰭片23於二通道230下方各設有一狹長之定位孔237。該安裝孔235與二定位孔237用於配合安裝支撐件50。 The heat sink 20 is formed by combining a plurality of heat radiating fins 23 side by side. The upper edge of each of the heat dissipation fins 23 is bent in the same direction with a flange (not shown) to be evenly spaced from the adjacent heat dissipation fins 23. The middle portion of the heat sink 20 is provided with two spaced channels 230 for receiving the first and second heat pipes 30, 40. A circular mounting hole 235 is defined in the outermost radiating fin 23 of the heat sink 20, and the mounting hole 235 is disposed between the two channels 230. The outermost fins 23 are respectively provided with a narrow positioning hole 237 below the two channels 230. The mounting hole 235 and the two positioning holes 237 are used to fit the mounting support 50.
第一熱管30為扁平熱管，其包括一吸熱段31、一放熱段37及一連接吸熱段31與放熱段37之連接段35。該吸熱段31呈直線形，且容置於基座10之凹槽115中。該放熱段37亦呈直線形，收容於散熱器20之通道230中。該連接段35呈蜿蜒彎曲狀，包括一連接吸熱段31之第一彎折段351、一連接放熱段37之第二彎折段353以及連接第一彎折段351與第二彎折段353之中間段352。 The first heat pipe 30 is a flat heat pipe, and includes a heat absorbing section 31, a heat releasing section 37, and a connecting section 35 connecting the heat absorbing section 31 and the heat releasing section 37. The heat absorption section 31 is linear and received in the recess 115 of the base 10. The heat release section 37 is also linear and received in the passage 230 of the heat sink 20. The connecting portion 35 is curved in a meandering manner, and includes a first bending section 351 connecting the heat absorption section 31, a second bending section 353 connecting the heat releasing section 37, and connecting the first bending section 351 and the second bending section. The middle section 352 of 353.
第二熱管40為扁平熱管，其包括一吸熱段41、一放熱段47及一連接吸熱段41與放熱段47之連接段45。該吸熱段41與第一熱管之吸熱段31並排容置於基座10之凹槽115中。該放熱段47於第一熱管之放熱段47相隔收容於散熱器20之通道230中。該連接段45與第一熱管之連接段35並排，包括一連接吸熱段41之第一彎折段451、一連接放熱段47之第二彎折段453以及連接第一彎折段451與第二彎折段453之中間段452。 The second heat pipe 40 is a flat heat pipe, and includes a heat absorbing section 41, a heat releasing section 47, and a connecting section 45 connecting the heat absorbing section 41 and the heat releasing section 47. The heat absorption section 41 is accommodated in the groove 115 of the base 10 together with the heat absorption section 31 of the first heat pipe. The heat releasing section 47 is accommodated in the passage 230 of the heat sink 20 in the heat releasing section 47 of the first heat pipe. The connecting section 45 is juxtaposed with the connecting section 35 of the first heat pipe, and includes a first bending section 451 connecting the heat absorption section 41, a second bending section 453 connecting the heat releasing section 47, and connecting the first bending section 451 and the The middle section 452 of the second bent section 453.
請參閱圖3，該支撐件50由金屬材料製成，其包括一底板51。該底板51呈蜿蜒彎曲狀，沿第一、第二熱管30、40之軸向跟隨式延伸。該底板51包括依次連接之延伸部510、第一彎折部511、中間部512、第二彎折部513。其中第一彎折部511、中間部512、第二彎折部513分別對應安置第一、第二熱管30、40之連接段35、45。該底板51相對兩側邊緣分別垂直向上延伸一 折邊52，每一折邊52之高度與第一、第二熱管30、40之厚度大致相等。該底板51靠近第二彎折部513即靠近散熱器20之一端緣中部向上延伸一固定片53，該固定片53上設有一固定孔530，以對應散熱器20上之固定孔235。該底板51於固定片53兩側分別向上延伸一定位片54，該定位片54上折有一舌部540，該舌部540伸入散熱器20上之定位孔237以將支撐件50相對散熱器20定位。 Referring to FIG. 3, the support member 50 is made of a metal material and includes a bottom plate 51. The bottom plate 51 has a meandering shape and extends along the axial direction of the first and second heat pipes 30, 40. The bottom plate 51 includes an extending portion 510, a first bent portion 511, an intermediate portion 512, and a second bent portion 513 which are sequentially connected. The first bending portion 511, the intermediate portion 512, and the second bending portion 513 respectively correspond to the connecting portions 35, 45 of the first and second heat pipes 30, 40. The bottom plate 51 extends vertically upward from opposite side edges The flange 52 has a height equal to the thickness of the first and second heat pipes 30, 40. A fixing piece 53 is disposed on the bottom plate 51 adjacent to the second bending portion 513, that is, a central portion of the end edge of the heat sink 20. The fixing piece 53 is provided with a fixing hole 530 corresponding to the fixing hole 235 of the heat sink 20. The bottom plate 51 extends upwardly on the two sides of the fixing piece 53 to extend a positioning piece 54. The positioning piece 54 is folded with a tongue 540. The tongue 540 extends into the positioning hole 237 of the heat sink 20 to fix the supporting member 50 relative to the heat sink. 20 positioning.
請一併參考圖1與圖2，組裝時，將支撐件50之延伸部510焊接在基座10之承載部13之方形槽130上，使得底板51之上表面與基座10之凹槽115之最底面平齊；將支撐件50之定位片54***至散熱器20之定位孔237中，此時固定片53之固定孔530對應散熱器20上之固定孔235，再通過一固定件60如螺絲或者銷釘穿過固定孔530、235以將支撐件50與散熱器20之連接；最後，將第一、第二熱管30、40分別與基座10、支撐件50及散熱器20焊接固定，整個散熱裝置組裝完成。 Referring to FIG. 1 and FIG. 2 together, when assembled, the extension portion 510 of the support member 50 is welded to the square groove 130 of the bearing portion 13 of the base 10 such that the upper surface of the bottom plate 51 and the recess 115 of the base 10 are assembled. The bottom surface of the support member 50 is inserted into the positioning hole 237 of the heat sink 20. At this time, the fixing hole 530 of the fixing piece 53 corresponds to the fixing hole 235 of the heat sink 20, and then passes through a fixing member 60. For example, screws or pins pass through the fixing holes 530, 235 to connect the support member 50 with the heat sink 20; finally, the first and second heat pipes 30, 40 are respectively welded to the base 10, the support member 50 and the heat sink 20. The entire heat sink is assembled.
使用時，散熱裝置之第一、第二熱管30、40之吸熱段31、41固定在基座10上，放熱段37、47固定在散熱器20之通道230內，連接段35、45通過支撐件50之支撐得到較好之保護，大大增強了散熱裝置之強度，有效防止了第一、第二熱管30、40之變形受損，從而保證了整個散熱裝置之散熱性能之穩定性。 In use, the heat absorption sections 31, 41 of the first and second heat pipes 30, 40 of the heat sink are fixed on the base 10, and the heat release sections 37, 47 are fixed in the passage 230 of the heat sink 20, and the connection sections 35, 45 are supported. The support of the member 50 is better protected, the strength of the heat sink is greatly enhanced, and the deformation of the first and second heat pipes 30, 40 is effectively prevented, thereby ensuring the stability of the heat dissipation performance of the entire heat sink.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧基座 10‧‧‧ Pedestal
20‧‧‧散熱器 20‧‧‧ radiator
30‧‧‧第一熱管 30‧‧‧First heat pipe
40‧‧‧第二熱管 40‧‧‧second heat pipe
50‧‧‧支撐件 50‧‧‧Support
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96149355A TWI407294B (en) | 2007-12-21 | 2007-12-21 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96149355A TWI407294B (en) | 2007-12-21 | 2007-12-21 | Heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200928685A TW200928685A (en) | 2009-07-01 |
| TWI407294B true TWI407294B (en) | 2013-09-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96149355A TWI407294B (en) | 2007-12-21 | 2007-12-21 | Heat dissipation device |
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| Country | Link |
|---|---|
| TW (1) | TWI407294B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM244506U (en) * | 2002-08-13 | 2004-09-21 | First Int Computer Inc | Carrying structure of CPU heat sink |
| US6860321B2 (en) * | 2003-01-30 | 2005-03-01 | Molex Incorporated | Heat-dissipating device |
| TWM261009U (en) * | 2004-07-14 | 2005-04-01 | Thermaltake Technology Co Ltd | Heat dissipation component for installing in expansion slot |
| TW200738109A (en) * | 2006-03-17 | 2007-10-01 | Foxconn Tech Co Ltd | Thermal module |
-
2007
- 2007-12-21 TW TW96149355A patent/TWI407294B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM244506U (en) * | 2002-08-13 | 2004-09-21 | First Int Computer Inc | Carrying structure of CPU heat sink |
| US6860321B2 (en) * | 2003-01-30 | 2005-03-01 | Molex Incorporated | Heat-dissipating device |
| TWM261009U (en) * | 2004-07-14 | 2005-04-01 | Thermaltake Technology Co Ltd | Heat dissipation component for installing in expansion slot |
| TW200738109A (en) * | 2006-03-17 | 2007-10-01 | Foxconn Tech Co Ltd | Thermal module |
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| Publication number | Publication date |
|---|---|
| TW200928685A (en) | 2009-07-01 |
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