200928685 •九、發明說明： •【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤其涉及—種用於 電子元件散熱之散熱裝置。 ' 【先前技術】 隨著電子資訊業不斷發展，電子元件（尤為中 央處理器）運行頻率和速度在不斷提升。但是言 ❹頻高速將使電子元件產生之熱量隨之增多，=得= 溫度不斷升高，嚴重威脅著電子元件運行時之性 能，為確保電子元件能正常運作，必須及時排出 子元件所產生之大量熱量。 . 為此，業界通常使用一種包括一散熱器之散埶 ，置固定在機箱電路板之電子元件上為其散轨。隨 I機箱體積越來越小型化，機箱内留給散熱裝置之 空間也越來越小，尤其是在筆記本電腦和平板 Ο中，散熱裝置所占空間有限，結構上往往都是 較長熱管將電子元件之熱量傳導至合適位置上之 散熱器以使其滿足整體佈局需要。然而，這種且有 熱管'散熱裝置安裝在機箱内後在運輪過程 ，者在跌落測試中容易發生變形甚至損害，塑 整個散熱裝置之散熱性能。 【發明内容】 有鑒於此，實有必要提供一種將很好地保護熱 管之散熱裝置。 6 200928685 旦一種散熱裝置，用於散發一電子元件產生之熱 里，其包括一與該電子元件接觸之基座、一散熱器 及連接該基座與散熱器之一熱管，該散熱器遠離該 基座，該熱管包括一固定在基座上之吸熱段、一固 疋在該散熱器上之放熱段以及連接該吸熱段與該 放熱段之連接段，一支撐件分別與該基座、散熱哭 及熱管固定連接，該φ掩， 卜 支樓件沿熱管軸向跟隨式延200928685 • Nine, invention description: • Technical field to which the invention pertains The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device for heat dissipation of electronic components. [Prior Art] With the continuous development of the electronic information industry, the frequency and speed of electronic components (especially the central processor) are constantly increasing. However, the high speed of the frequency will increase the amount of heat generated by the electronic components, and the temperature will increase, which will seriously threaten the performance of the electronic components. To ensure the normal operation of the electronic components, the sub-components must be discharged in time. A lot of heat. To this end, the industry usually uses a heat sink that includes a heat sink that is attached to the electronic components of the chassis circuit board for its loose track. As the size of the I chassis becomes smaller and smaller, the space left in the chassis for the heat sink is getting smaller and smaller, especially in notebook computers and flatbeds. The space occupied by the heat sink is limited, and the structure is often a long heat pipe. The heat of the electronic components is conducted to the heat sink at a suitable location to meet the overall layout needs. However, this kind of heat pipe 'heat dissipation device is installed in the chassis and is in the process of the ship wheel. It is easy to be deformed or even damaged during the drop test, and the heat dissipation performance of the entire heat dissipation device is molded. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink that will well protect the heat pipe. 6 200928685 A heat dissipating device for dissipating heat generated by an electronic component, comprising: a base in contact with the electronic component; a heat sink; and a heat pipe connecting the base and the heat sink, the heat sink is away from the a susceptor, the heat pipe includes a heat absorbing section fixed on the pedestal, a heat releasing section fixed on the heat sink, and a connecting section connecting the heat absorbing section and the heat releasing section, and a supporting member and the pedestal respectively dissipating heat Crying and heat pipe fixed connection, the φ cover, the brace structure along the heat pipe axial follow-up
與習知技術相比，由 ., . _ y ^ 卜 由於該散熱裝置之支擇件復 好地支撐保護熱管中部 ^ ^ _ |之連接段，加強了散熱裝詈 之強度’有效地保證散刼 置 政熱裝置之散熱性能之穩定 【實施方式】 請參閱圖1與圖2， ^ 本發明散熱裝置用於安# 於一電路板（圖未示）{_ 文裒 —私為 之電子元件（圖未示）上 U對其進仃散熱。該散埶 ^上 ^ ^ 欣熟裝置包括一基座10、一、音 離基座10之散熱器2〇 遂 之第一熱管30盘第二劫連接散熱器20與基座10 與散熱器20之間之二熱管40、及架設於基座10 又樓件50。該支撐件50八 別與基座10、散埶卞分 '、，、 2〇以及第一、第二埶管m 40固定連接。 乐 …e 3〇、 該基座10由導熱 包括一呈矩形之吸熱部 向外延伸之承载部i 3。 性能良好之金屬板體製成， 11及一自吸熱部11 —端緣 該°及熱部11具有一上表面 7 200928685 .110及一與上表面110相對之平整下表面（圖未標） 以貼合電子元件之頂面。吸熱部11上表面設有二 平行相隔之凹槽115，以結合收容第一、第二熱管 30、40。吸熱部11之四角落開設有固定孔118， 以供螺釘（圖未示）穿設以將基座10固定在該電 子元件所在電路板上。該承載部13上表面設有一 方形槽130以安置支撐件50 —端。其中方形槽130 比凹槽110深。 ® 該散熱器20由複數散熱鰭片23並排組合而 成。每一散熱鰭片23之上下邊緣同向彎折一折緣 (圖未標），以與相鄰之散熱鰭片23均勻間隔。 該散熱器20中部設有二分隔之通道230，以收容 該第一、第二熱管30、40。散熱器20最外側之散 熱鰭片23上設有一圓形安裝孔235，該安裝孔235 設置於該二通道230之間。該最外側之散熱鰭片 0 23於二通道230下方各設有一狹長之定位孔237。 該安裝孔235與二定位孔237用於配合安裝支撐件 50 ° 第一熱管30為扁平熱管，其包括一吸熱段 31、一放熱段37及一連接吸熱段31與放熱段37 之連接段3 5。該吸熱段31呈直線形，且容置於基 座10之凹槽115中。該放熱段37亦呈直線形，收 容於散熱器20之通道23 0中。該連接段35呈蜿蜒 彎曲狀，包括一連接吸熱段31之第一彎折段3 5 1、 200928685 .一連接放熱段37之第二彎折段353以及連接第一 彎折段351與第二彎折段353之中間段352。 第二熱管40為扁平熱管’其包括一吸熱段 41、一放熱段47及一連接吸熱段41與玫熱段47 之連接段45。該吸熱段41與第一熱管之吸熱段31 並排容置於基座1〇之凹槽115中。該放熱段47於 第一熱管之放熱段47相隔收容於散熱器20之通道 230中。該連接段45與第一熱管之連接段35並排， ®包括一連接吸熱段41之第一彎折段451、一連接 放熱段47之第二彎折段453以及連接第一彎折段 451與第二彎折段453之中間段452。 請參閱圖3，該支撐件50由金屬材料製成， 其包括一底板51。該底板51呈婉蜒彎曲狀，沿第 一、第二熱管30、40之軸向跟隨式延伸。該底板 5 1包括依次連接之延伸部5 10、第一彎折部5 11、 ©中間部512、第二彎折部 513。其中第一彎折部 5 11、中間部5 12、第二彎折部5 1 3分別對應安置 第一、第二熱管30、40之連接段35、45。該底板 5 1相對兩侧邊緣分別垂直向上延伸一折邊5 2，每 一折邊52之高度與第一、第二熱管30、40之厚度 大致相等。該底板51靠近第二彎折部513即靠近 散熱器2〇之一端緣中部向上延伸一固定片53，該 固定片53上設有一固定孔530，以對應散熱器20 上之固定孔235 °該底板5 1於固定片53兩側分別 9 200928685 .向上延伸一定位片54，該定位片54上折有一舌部 540，該舌部540伸入散熱器20上之定位孔237以 暴 將支撐件50相對散熱器20定位。 請一併參考圖1與圖2，組裝時，將支撐件50 之延伸部510焊接在基座10之承.載部13之方形槽 130上，使得底板51之上表面與基座10之凹槽115 之最底面平齊；將支撐件50之定位片54***至散 熱器20之定位孔237中，此時固定片53之固定孔 530對應散熱器20上之固定孔235，再通過一固定 件60如螺絲或者銷釘穿過固定孔530、235以將支 撐件50與散熱器20之連接；最後，將第一、第二 熱管30、40分別與基座10、支撐件50及散熱器 20焊接固定，整個散熱裝置組裝完成。 使用時，散熱裝置之第一、第二熱管 30、40 之吸熱段31、41固定在基座10上，放熱段37、 © 47固定在散熱器20之通道230内，連接段35、45 通過支撐件50之支撐得到較好之保護，大大增強 了散熱裝置之強度，有效防止了第一、第二熱管 30、40之變形受損，從而保證了整個散熱裝置之 散熱性能之穩定性。 綜上所述，本發明符合發明專利要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 10 200928685 請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之組裝圖。 圖2係圖1散熱裝置之立體分解圖。 圖3係圖1散熱裝置中支撐件之立體圖。 【主要元件符號說明】Compared with the prior art, the support of the heat-dissipating device is supported by the support member of the heat-dissipating device to reinforce the connection section of the central heat pipe ^ ^ _ | Stabilization of the heat dissipation performance of the thermal device [Embodiment] Please refer to FIG. 1 and FIG. 2, ^ The heat dissipation device of the present invention is used for an electronic circuit board (not shown) {_文裒—Private electronic components (not shown) U is used to dissipate heat. The 埶 埶 ^ ^ ^ ^ ^ ^ ^ ^ 欣 欣 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The two heat pipes 40 are disposed between the base 10 and the floor 50. The support member 50 is fixedly coupled to the base 10, the divergent points ',, 2', and the first and second manifolds m 40. The base 10 is thermally conductive and includes a bearing portion i 3 extending outwardly from a rectangular heat absorbing portion. The metal plate body is made of good performance, 11 and a self-heat absorbing portion 11 - the end edge and the hot portion 11 has an upper surface 7 200928685 .110 and a flat lower surface (not shown) opposite to the upper surface 110 Fit the top surface of the electronic component. The upper surface of the heat absorbing portion 11 is provided with two parallel spaced grooves 115 for receiving the first and second heat pipes 30, 40 in combination. The four corners of the heat absorbing portion 11 are provided with fixing holes 118 for screwing (not shown) to fix the base 10 to the circuit board on which the electronic component is placed. The upper surface of the carrying portion 13 is provided with a square groove 130 for arranging the end of the support member 50. The square groove 130 is deeper than the groove 110. ® The heat sink 20 is a combination of a plurality of heat sink fins 23 side by side. The upper edge of each of the heat dissipation fins 23 is bent in the same direction with a flange (not shown) to be evenly spaced from the adjacent heat dissipation fins 23. The middle portion of the heat sink 20 is provided with two spaced channels 230 for receiving the first and second heat pipes 30, 40. A circular mounting hole 235 is defined in the outermost radiating fin 23 of the heat sink 20. The mounting hole 235 is disposed between the two channels 230. The outermost fins 0 23 are respectively provided with a narrow positioning hole 237 below the two channels 230. The mounting hole 235 and the two positioning holes 237 are used to fit the mounting member 50 °. The first heat pipe 30 is a flat heat pipe, and includes a heat absorbing section 31, a heat releasing section 37, and a connecting section 3 connecting the heat absorbing section 31 and the heat releasing section 37. 5. The endothermic section 31 is linear and is received in the recess 115 of the base 10. The exothermic section 37 is also linear and is received in the passage 30 0 of the heat sink 20. The connecting section 35 is curved in a meandering manner, and includes a first bending section 3 5 1 , 200928685 connecting the heat absorption section 31. A second bending section 353 connecting the heat releasing section 37 and connecting the first bending section 351 and the The middle section 352 of the two bent section 353. The second heat pipe 40 is a flat heat pipe 'which includes a heat absorbing section 41, a heat releasing section 47, and a connecting section 45 connecting the heat absorbing section 41 and the heat absorbing section 47. The heat absorbing section 41 is disposed side by side with the heat absorbing section 31 of the first heat pipe in the groove 115 of the susceptor 1 . The heat release section 47 is accommodated in the passage 230 of the heat sink 20 at a heat release section 47 of the first heat pipe. The connecting section 45 is arranged side by side with the connecting section 35 of the first heat pipe, and comprises a first bending section 451 connecting the heat absorption section 41, a second bending section 453 connecting the heat releasing section 47, and a connecting first bending section 451 and The middle section 452 of the second bent section 453. Referring to FIG. 3, the support member 50 is made of a metal material and includes a bottom plate 51. The bottom plate 51 has a meandering shape and follows in the axial direction of the first and second heat pipes 30, 40. The bottom plate 51 includes an extending portion 5 10, a first bent portion 5 11 , a middle portion 512, and a second bent portion 513 which are sequentially connected. The first bending portion 5 11 , the intermediate portion 5 12 , and the second bending portion 5 1 3 respectively correspond to the connecting portions 35 and 45 of the first and second heat pipes 30 and 40 . The bottom edges of the bottom plate 5 1 extend vertically upwards with a flange 5 2 , and the height of each of the flanges 52 is substantially equal to the thickness of the first and second heat pipes 30 and 40 . A fixing piece 53 is disposed on the bottom plate 51 adjacent to the second bending portion 513, that is, a middle end of the end surface of the heat sink 2, and the fixing piece 53 is provided with a fixing hole 530 corresponding to the fixing hole 235 of the heat sink 20. The bottom plate 51 is respectively extended on a side of the fixing piece 53 9 200928685 . A positioning piece 54 is extended upwardly. The positioning piece 54 is folded with a tongue 540. The tongue 540 extends into the positioning hole 237 of the heat sink 20 to violently support the supporting piece. 50 is positioned relative to the heat sink 20. Referring to FIG. 1 and FIG. 2 together, when assembled, the extension portion 510 of the support member 50 is welded to the square groove 130 of the carrier portion 13 of the base 10 such that the upper surface of the bottom plate 51 and the base 10 are concave. The bottom surface of the groove 115 is flush; the positioning piece 54 of the support member 50 is inserted into the positioning hole 237 of the heat sink 20. At this time, the fixing hole 530 of the fixing piece 53 corresponds to the fixing hole 235 of the heat sink 20, and is fixed by a fixing. A member 60 such as a screw or a pin passes through the fixing holes 530, 235 to connect the support member 50 with the heat sink 20; finally, the first and second heat pipes 30, 40 are respectively coupled to the base 10, the support member 50, and the heat sink 20. The welding is fixed and the entire heat sink is assembled. In use, the heat absorption sections 31, 41 of the first and second heat pipes 30, 40 of the heat sink are fixed on the base 10, and the heat release sections 37, © 47 are fixed in the passage 230 of the heat sink 20, and the connection sections 35, 45 are passed. The support of the support member 50 is better protected, the strength of the heat dissipation device is greatly enhanced, and the deformation of the first and second heat pipes 30 and 40 is effectively prevented, thereby ensuring the stability of the heat dissipation performance of the entire heat dissipation device. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. The above is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the following modifications and variations in the spirit of the present invention. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an assembled view of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Figure 3 is a perspective view of the support member of the heat sink of Figure 1. [Main component symbol description]
基 座 10 吸 執 部 11 上 表 面 110 凹 槽 115 固 定 孔 118、 530承 載 部 13 方 形 槽 130 散 孰 t 器 20 散 熱 籍 片 23 通 道 230 安 裝 孔 235 定 位 孔 237 第 _ _ 敎 管 30 吸 执 段 31、 41 連 接 段 35 > 45 第 一 彎 折 段 351 、451 中 間 段 352、 452第 二 彎 折 段 353 、453 放 熱 段 31、 47 第 二 轨 管 40 支 撐 件 50 底 板 51 延 伸 部 510 第 一 彎 折 部 511 中 間 部 512 第 二 彎 折 部 513 折 邊 52 固 定 片 53 定 位 片 54 舌 部 540 固 定 件 60 11Base 10 Suction part 11 Upper surface 110 Groove 115 Fixing hole 118, 530 Bearing part 13 Square groove 130 Diverting device 20 Heat sink 23 Channel 230 Mounting hole 235 Positioning hole 237 No. _ _ 30 tube 30 Suction section 31, 41 connecting section 35 > 45 first bending section 351, 451 intermediate section 352, 452 second bending section 353, 453 heat releasing section 31, 47 second rail 40 support 50 bottom plate 51 extension 510 first Bending portion 511 Intermediate portion 512 Second bent portion 513 Folding 52 Fixing piece 53 Positioning piece 54 Tongue portion 540 Fixing member 60 11