TW200738109A - Thermal module - Google Patents

Thermal module

Info

Publication number
TW200738109A
TW200738109A TW095109219A TW95109219A TW200738109A TW 200738109 A TW200738109 A TW 200738109A TW 095109219 A TW095109219 A TW 095109219A TW 95109219 A TW95109219 A TW 95109219A TW 200738109 A TW200738109 A TW 200738109A
Authority
TW
Taiwan
Prior art keywords
thermal module
section
condensative
fins
heat pipe
Prior art date
Application number
TW095109219A
Other languages
Chinese (zh)
Other versions
TWI320301B (en
Inventor
Ching-Bai Hwang
Jing-Gong Meng
Jie-Bo Peng
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95109219A priority Critical patent/TWI320301B/en
Publication of TW200738109A publication Critical patent/TW200738109A/en
Application granted granted Critical
Publication of TWI320301B publication Critical patent/TWI320301B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A thermal module includes at least one heat pipe and fins. The heat pipe has an evaporative section for thermally connecting with a heat generating electronic component and a condensative section for connecting with the fins. The condensative section is curve-shaped. Accordingly, the thermal module has greater contact areas between the condensative section of the heat pipe and the fins which improves heat dissipation effect of the thermal module.
TW95109219A 2006-03-17 2006-03-17 Thermal module TWI320301B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95109219A TWI320301B (en) 2006-03-17 2006-03-17 Thermal module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95109219A TWI320301B (en) 2006-03-17 2006-03-17 Thermal module

Publications (2)

Publication Number Publication Date
TW200738109A true TW200738109A (en) 2007-10-01
TWI320301B TWI320301B (en) 2010-02-01

Family

ID=45073732

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95109219A TWI320301B (en) 2006-03-17 2006-03-17 Thermal module

Country Status (1)

Country Link
TW (1) TWI320301B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407294B (en) * 2007-12-21 2013-09-01 Foxconn Tech Co Ltd Heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407294B (en) * 2007-12-21 2013-09-01 Foxconn Tech Co Ltd Heat dissipation device

Also Published As

Publication number Publication date
TWI320301B (en) 2010-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees