TWM261009U

TWM261009U - Heat dissipation component for installing in expansion slot

Info

Publication number: TWM261009U
Application number: TW93211074U
Authority: TW
Inventors: Pei-Shi Lin
Original assignee: Thermaltake Technology Co Ltd
Priority date: 2004-07-14
Filing date: 2004-07-14
Publication date: 2005-04-01

Description

M261009M261009

、【新型所屬之技術領域】四、創作說明（1) 指-於一種可安裂於擴充槽之散熱構件，尤插片，二月、…、本體之一側鎖接有一固定插片，藉由該固〜二、本體安裝於電腦主機箱之擴充槽二者, L无刖技術】 $ ，著科技的日新月異，電腦已融入一般人不貝料管理、產品設計或娛樂休閒，都已大旦中，科技。由於雷腦卢梂钵疮必+怀閒都已大里運用電腦。:：中的晶片，…處理器或如顯示卡日曰片’便會因高頻率的振盪之處理極高，若X #工、*上叩座王开，皿現象，由於溫度绫：不知予適當的散熱’極容易造成晶片的損毁。 η ，目别的廠商便會於所需散熱的晶片上加穿喑埶 :片:風扇等散熱構件，然而這些散熱：政：子元件或門】丄且極為趨近電路板上的其它電往會屯積ί熱構件進行散熱時，熱能往機箱中的、、：产弁-相 …、法向外界散出，導致電腦主概度升兩，而影響到整體的散熱效能。复它電：各ΐ熱構件’於安裝上’因極為趨近電路板中之的正常運作，而顯現ΐ二響到其…-件或周邊設備新姑本案創作人有鑑於此，乃加予研究創新，才昌干屮接新穎可安裝於擴充槽之散熱構件。 #不出-種二、【新型内容】 M261009 四、創作說明（2) 本新型之目件，係包括：散體間穿置有導熱定插片，係固接插片體，以便固前文所述的體一側端面上設穿孔，以分別對孔，以藉螺絲鎖前文所述的散熱本體各鰭片導管者。前文所述的散熱本體各鰭片管’含有進水口源，而其出水口前文所述的液冷盒，該液冷係貼觸於熱源者前文所述的插片之插片體上經者。前文所述的本體係鎖接於該的旨在熱本體元件，於電腦接於該可安裝有複數應散熱固於該可安裝體間之提供一種 ’由複數並與熱源主機箱之散熱本體於擴充槽固定孔，本體於該散熱本體於擴充槽導熱元件可安裝鰭片體作導熱擴充槽者。之散熱且上述側端面之一側之散熱，係取於擴充槽所組成，性連接；上，固定構件，其固定插片上所設置者。構件，其自高導熱之散熱構於各鰭片以及，固插片含有中散熱本設有複數之固定中穿置於系數之熱 =裝於擴充槽之散熱構件，其中穿置於體間之導熱元件，係為液冷式之熱交換 ’令5玄進水口藉輪液管銜接至熱藉輸液官銜接至液壓泵者。可安裝於擴充槽之散熱構件，進一盒係與導熱元件及液壓泵連通，該液冷盒〇可安裝於擴充槽之散熱構件，其中該固定 ’ m有穿槽與通孔’以容許導熱元件穿於擴充槽之散熱構件，其中該散熱口疋插片上，且位於電腦主機箱外側者。[Technical Field to which the New Type belongs] 4. Creation Instructions (1) Refers to a heat-dissipating member that can be installed in an expansion slot, especially a tab. In February, ..., one side of the body is locked with a fixed tab. From this solid ~ Two, the body is installed in the expansion slot of the computer's main box, L Wuyi Technology] $, with the rapid development of technology, the computer has been integrated into ordinary people's management, product design or entertainment Technology. Because Lei Nao Lu Pi ulcer will + leisurely have been using computers. :: In the chip, ... the processor or if the video card is used, the processing will be extremely high due to high-frequency oscillation. If X # 工, * 上叩座王开, dish phenomenon, due to temperature 绫: I do not know Proper heat dissipation can easily cause chip damage. η, other manufacturers will add heat sinks to the chips that require heat dissipation: film: fans and other heat dissipation components, but these heat dissipation: government: sub-components or doors] and are very close to other electrical contacts on the circuit board When the thermal components are accumulated for heat dissipation, the heat energy is dissipated to the outside of the chassis to produce external phase, which causes the computer's profile to increase by two, which affects the overall cooling performance. Futa Electric: The thermal components 'on the installation' are very close to the normal operation of the circuit board, and they appear to be second to none ...-pieces or peripheral equipment. The creator of this case, in view of this, added Research and innovation, Caichang has connected new cooling components that can be installed in expansion slots. # 不出-种二, [new content] M261009 4. Creation instructions (2) The headpiece of the new model includes: a thermally conductive fixed insert is inserted between the loose bodies, and the fixed insert body is fixed in order to fix the previous description. A perforation is provided on the end surface of the body side to align the holes respectively to lock the finned ducts of the heat dissipation body described above by screws. Each of the finned tubes of the heat-dissipating body described above contains a water inlet source, and the liquid-cooled box described above at its water outlet, the liquid-cooling is attached to the insert body of the insert described above by the heat source. . The system described above is locked to the thermal body component, and the computer is connected to the installable body, and a plurality of heat sinks should be fixed between the installable body. Expansion slot fixing holes. The body can be installed on the heat dissipation element of the heat dissipation body in the expansion slot as a thermal expansion slot. The heat dissipation and the heat dissipation on one side of the above-mentioned side end faces are formed by the expansion slot and are connected sexually; the upper and the fixed members are arranged on the fixed inserts. The component, its heat dissipation structure is composed of fins, and the solid insert contains medium heat dissipation, which is provided with a plurality of fixed, fixed and inserted coefficients of heat = a heat dissipation component installed in the expansion slot, which is inserted between the body The heat-conducting element is a liquid-cooled type of heat exchange, so that the 5 Xuan water inlet is connected to the hydraulic pump by the liquid pipe of the wheel. The heat-dissipating member that can be installed in the expansion slot. A box is connected to the heat-conducting element and the hydraulic pump. The liquid-cooled box can be installed in the heat-dissipating member of the expansion slot. The fixing 'm has a slot and a through hole to allow the heat-conducting element. The heat dissipation member is worn on the expansion slot, wherein the heat dissipation port is on the insert piece and is located outside the computer main body case.

第6頁 M261009Page 6 M261009

四、創作說明（3) 藉由上述的構造以達成以下之創作目的： 1·可將散熱本體安置於遠離熱源遠端的電腦主機箱之擴充槽上，可避免所散熱之熱能影響其它電路板上3電子元件或裝置於電腦主機箱内其它周邊設備之正常運作。兀 2 ·可以藉由該固定插片，將散熱本體穩定地鎖接於電腦主機箱之外側’以將熱能擴散至電腦主機箱外，可有^避免習知散熱元件裝置於電腦主機箱内時，所造成熱能無法排放至電腦主機箱外，而使電腦主機箱内之溫度上升的缺點。 &4. Creation instructions (3) The above construction can be used to achieve the following creative purposes: 1. The heat sink can be placed on the expansion slot of the computer mainframe away from the remote end of the heat source, which can avoid the heat generated by the heat from affecting other circuit boards. The normal operation of the above 3 electronic components or devices in the computer peripheral box and other peripheral equipment. Wu 2 · The heat sink can be stably locked to the outside of the computer main box through the fixed insert to spread the heat energy outside the computer main box. It is possible to avoid the conventional heat dissipation components when installed in the computer main box. The disadvantage is that the thermal energy cannot be discharged to the outside of the computer mainframe, and the temperature inside the computer mainframe rises. &

3 ·構造簡單、組裝容易。本新型之可取實體，可由以下說明及所附各圖式，而得以明晰之。四、【實施方式】請參閱第一至六圖所示，本新型係有關於一種可安裝於擴充槽之散熱構件，係包括：一散熱本體（1〇)，由複數鰭片體（11)所組成，於各鰭片體（丨丨）間穿置有導熱元件 (1 2 )，並於該散熱本體（丨〇 )之一側端面（丨3)上，設有複數固定孔（131)者；以及一固定插片（2〇)，含有一插片體3 · Simple structure and easy assembly. The desirable entity of this new model can be made clear by the following description and the accompanying drawings. 4. Embodiments Please refer to the first to sixth figures. The present invention relates to a heat dissipation member that can be installed in an expansion slot. The heat dissipation member includes: a heat dissipation body (10), and a plurality of fin bodies (11). It consists of a heat conducting element (1 2) penetrated between each fin body (丨丨), and a plurality of fixing holes (131) are provided on one side end surface (丨 3) of the heat dissipation body (丨〇).者; and a fixed insert (20), containing an insert body

(21)，穿設有複數穿孔（211)，以分別對應散熱本體（1〇) 於側端面（13)上所設置之固定孔（131)，以藉螺絲（3〇)鎖口於4政熱本體（1 〇 )之一側，並於該插片體（21)之端緣徑向犬伸固定片（2 2)，以對應地鎖接於電腦主機箱（4 〇 )之擴充槽（4 1)上者。本新型所揭示之散熱本體（1 〇 )，係可如第一圖所示，(21), a plurality of perforations (211) are provided to correspond to the fixing holes (131) provided on the side end face (13) of the heat sink body (10), and the screws (30) are used to lock the four policies. One side of the main body (10) is heated, and the fixing piece (2 2) is radially extended at the end edge of the insert body (21) to be correspondingly locked to the expansion slot (40) of the computer main body (40). 4 1) The former. The heat-dissipating body (10) disclosed by the new model can be as shown in the first figure,

M261009 四、創作說明（4) 由複數呈薄片狀之鰭片體（1 1 )並列組成，於各韓片體（^ ^ ) 上’係牙&又有肷孔（111 )，以敌套導熱元件（1 2)穿置於内’使導熱元件（1 2 )之熱能可經熱傳遞作用，將熱能傳遞至各縛片體（11 )上’以將熱能擴散至外界；惟本新型對於散熱本體（1 0 )之型式並不自限，例如可取自其它習知之一體式散熱縮片等。如第一至四圖所示，本新型所揭示可安裝於擴充槽之散熱構件，其中穿置於散熱本體（10)各鰭片體間之導熱元件（12)，係為一液冷式之熱交換管（i2a)，含有一進水口（121)及一出水口（122)，令該進水口（121)銜接一輸液管（51)並與液冷盒（52)(Water Block)連通，而液冷盒 (52)則藉另一輸液管（53)連通至液壓泵（12〇)。導熱元件 (12)之出水口（122)則藉輸液管（54)銜接至液壓泵（120)。液冷盒（5 2 )與熱源（5 0 )接觸，以便吸收來自熱源（5 〇 )的執能。 … 藉該液壓泵（1 2 0 )使冷卻液循環地流經該散熱本體 (1 〇 )與熱源（5 0 )，以將冷卻液中所夾帶熱源（5 〇 )之熱能與散熱本體（10)之各鰭片體（11)產生熱交換，以使流入之高溫冷卻液降溫，呈一低溫之冷卻液後自出水口（丨2 2 )流出者；或者如第六圖所示，該導熱元件（丨2 )係可取自高導熱系數之熱導管（12b)，令該熱導管（i2b)之一端搭接於一熱源（5 0 )上，以將熱源（5 〇 )之熱能經傳遞作用，傳遞至散熱本體（10)的各鰭片體（11)，以藉各鰭片體（11)向外散熱者。M261009 Fourth, the creation description (4) consists of a plurality of thin fin bodies (1 1) juxtaposed on each of the Korean pieces (^ ^), with teeth & holes (111). The heat-conducting element (1 2) is placed inside so that the thermal energy of the heat-conducting element (1 2) can be transferred to each binding piece body (11) through heat transfer to diffuse the heat energy to the outside; The type of the heat-dissipating body (10) is not limited. For example, it can be taken from one of the conventional heat-dissipating heat-shrinking fins. As shown in the first to fourth figures, the heat-dissipating member disclosed in the present invention that can be installed in an expansion slot, wherein the heat-conducting element (12) inserted between the fin bodies of the heat-dissipating body (10) is a liquid-cooled type. The heat exchange tube (i2a) includes a water inlet (121) and a water outlet (122), so that the water inlet (121) is connected to an infusion tube (51) and communicates with a liquid cooling box (52) (Water Block). The liquid cooling box (52) is connected to the hydraulic pump (12) by another infusion pipe (53). The water outlet (122) of the heat conducting element (12) is connected to the hydraulic pump (120) through the infusion tube (54). The liquid cooling box (5 2) is in contact with a heat source (50) to absorb the power from the heat source (50). … By using the hydraulic pump (120) to circulate the cooling liquid through the cooling body (10) and the heat source (50) to circulate the heat energy of the heat source (50) contained in the cooling liquid and the cooling body (10) Each of the fin bodies (11) generates heat exchange to reduce the temperature of the incoming high-temperature coolant to a low-temperature coolant and flow out from the water outlet (丨 2 2); or as shown in the sixth figure, the heat conduction The element (丨 2) can be taken from a heat pipe (12b) with a high thermal conductivity, and one end of the heat pipe (i2b) is overlapped with a heat source (50) to transfer the heat energy of the heat source (50). The function is transmitted to each fin body (11) of the heat dissipation body (10), so that each fin body (11) can dissipate heat to the outside.

M261009M261009

本新型所揭示之固定插r , # 士 _ » ,備片（20)，係可由金屬板材一體沖壓成型’其中於该插片體(21)上，猶穿設有穿槽⑴2) 與通孔（213) ’上以容許導熱元件（12)穿經者。上述之固定插片（20)，於該插片體（21)所徑向穿設有至少一固定孔（221)，)係機箱⑽之擴充槽⑷）上者。精螺絲(23)鎖固於電腦主本新型於應用日寺，係可如第一、二、五圖所示，藉由螺絲（23)穿經固定插片（2〇)之固定片（22)上的固定孔 (221)後，跨接的鎖固於電腦主機箱（4〇)之擴充槽（4ι)The fixed insert r disclosed in the new model, # 士 _ », and the spare piece (20) are formed by integrally punching and forming a sheet metal sheet. 'The insert body (21) is provided with a through slot) 2) and a through hole. (213) 'on to allow the thermally conductive element (12) to pass through. The above-mentioned fixed insert (20) is provided with at least one fixing hole (221) in the radial direction of the insert body (21), which is an expansion slot ⑽ of the chassis ⑽). The fine screw (23) is locked to the computer host. This new model is used in the application of the temple. As shown in the first, second, and fifth figures, the screw (23) passes through the fixing piece (22) of the fixed insert (20). ) On the expansion slot (4ι) of the main computer case (4〇)

上，再將散熱本體（10)以螺絲（3〇)穿經固定插片（2〇)之插片體（21)上的穿孔（211)後，鎖固於該散熱本體（1〇)之固疋孔（1 3 1)中，使忒政熱本體（1 〇)可以穩固地隨該固定插片（20)，安裝於電腦主機箱之擴充槽上；上述之安裝過程中，組裝者可依據所需，如第四、五圖所示，將該散埶本體（1(0安裝於位於電腦主機箱（40)之外側，即該散熱本體 (10)係穿出擴充槽（41)，而突出、裸露於電腦主機箱（4〇) 外，使散熱本體（1 〇)上的熱能，散熱於電腦主機箱（4 〇)外之空間’·或者，本新型於安裝時，如第六圖所示，組裝者可將散熱本體（10)鎖接於固定插片（20)之插片體（21)^於電腦主機箱（4 0)内側面上，使安裝後，該散熱本體（丨〇)位於電腦主機箱（5 〇 )中者。本新型所揭示可安裝於擴充槽之散熱構件，其中導熱元件（12)所銜接之熱源（5〇)，係可為主機板***處理器、 (CPU)或其它介面卡〔如顯示卡〕或電源供應器内之晶片Then, pass the heat sink body (10) through the hole (211) on the insert body (21) of the fixed insert (20) with screws (30), and then lock the heat sink body (10). In the fixing hole (1 3 1), the main body (10) of the Zhengzheng heat can be stably installed on the expansion slot of the computer main box with the fixed insert (20); during the above installation process, the assembler can According to the requirements, as shown in the fourth and fifth figures, the scattered body (1 (0 is installed on the outside of the computer main body box (40), that is, the heat dissipation body (10) passes through the expansion slot (41), And protruding and exposed outside the computer main box (40), so that the thermal energy on the heat sink body (10) can be radiated to the space outside the computer main box (40) 'Or, when the new model is installed, such as the sixth As shown in the figure, the assembler can lock the heat dissipation body (10) to the insert body (21) of the fixed insert (20) ^ on the inside surface of the computer main body box (40), so that after installation, the heat dissipation body (丨〇) is located in the computer main box (50). The heat-dissipating member that can be installed in the expansion slot disclosed in the new model, wherein the heat source (5) connected to the heat-conducting element (12) It can be a central processing unit, (CPU) or other interface card (such as a graphics card) on the motherboard or a chip in the power supply.

M261009 四、創作說明（6) 體，本新型本新型徵乃在於， (20)，藉該上，而具有 1 ·可將散熱擴充槽上子元件或作。 2.可以藉由於電腦主可有效避成熱能無溫度上升 3 ·構造簡單本創作與範疇下，並不限至其應用範圍者。所揭示可安裝於擴充槽之散埶該散熱本體（10)之一側鎖接牛，"主要特叫項接有一固定插只固定插片（2 0 )可鎖固於雷日w 只u %寬腦主機箱之擴充槽以下之優點，而顯豆新鍺仏，、兄糟只八啊顆創作性及實用性：本體（10)安置於遠離教源请 π雒备糾私為也退端之電腦主機箱的 :可避免所散熱之熱能影響其它電路板上的電疋裝置於電腦主機箱内其它周邊設備之正常運該固定插片（20)，將散熱本體（1〇)穩定地鎖接機箱之外側，以將熱能擴散至電腦主機箱外，免習知散熱元件裝置於電腦主機箱内時，所造法排放至電腦主機箱外，而使電腦主機箱内之的缺點。、組裝容易。所揭示之結構、形狀，可於不違本創作之精神予以修飾應用，本新型並不予自限。M261009 Fourth, the creation description (6) style, the new style The new style features are (20), which can be used to have 1 · Can be used to add heat sink expansion sub-components or work. 2. It can be avoided because the computer owner can effectively avoid the formation of thermal energy without temperature rise. 3 · Simple structure The creation and category are not limited to those who apply it. It is disclosed that one side of the heat sink body (10) that can be installed in the expansion slot is locked on the side. "The main special item is connected with a fixed plug and fixed tab (20), which can be locked in thunder and w The advantages of the wide-brain mainframe expansion slot are as follows, but the new germanium plutonium is only 8 pieces of creativity and practicality: The main body (10) is placed far away from the teaching source. The end of the computer main box: It can prevent the heat from the heat from affecting the electrical equipment on other circuit boards and other peripheral equipment in the computer main box. The fixed insert (20) can be used to stabilize the heat dissipation body (10). The outer side of the chassis is locked to spread the heat energy to the outside of the main computer case. When the heat dissipating component is installed in the main computer case, the method is discharged to the outside of the main computer case. Easy to assemble. The disclosed structure and shape can be modified and applied without departing from the spirit of the creation, and the new model is not self-limiting.

M261009 單說明】第一圖：係本新型之立體組裝示意新型之立體示意圖。新型所應用之散熱系圖式簡單說明五、【圖式簡第二圖：係本第三圖：係本第四圖··係本第五圖··係第第六圖：係本第七圖：係本圖。【元件符號簡 (1 〇)散熱本體 (1 2 )導熱元件 (1 2 0 )液壓泵 (13)端面 (2 1)插片體 (2 1 3 )通孔 (2 3 )螺絲 (41)擴充槽 (5 2 )液冷盒統示意圖。新型安裝於電腦主機箱上之示意圖。四圖之5 — 5方向剖視示意圖。新型另一安裝方式實施例示意圖。新型以熱導管為導熱元件之散熱系統的示意單說明】 (11)鰭片體 (12a)熱交換管 (1 2 1)進水口 (1 3 1)固定孔 (2 11)穿孔 (22)固定片 (3 0 )螺絲 (5 0 )熱源 (53)輸液管圖。 (111)嵌孔 (12b)熱導管 (122)出水口 (2 0 )固定插片 (212)穿槽 (221)固定孔 (4 0 )電腦主機箱 (5 1 )輸液管 (54)輸液管M261009 single description] The first picture: is the three-dimensional assembly diagram of the new model. A brief description of the new type of heat dissipation system is used. V. [Simplified diagrams: The second diagram: The third diagram: The fourth diagram ... The fifth diagram ... The sixth diagram: The seventh diagram. Figure: This figure. [Simplified component symbol (1 〇) heat dissipation body (1 2) heat conductive component (1 2 0) hydraulic pump (13) end face (2 1) insert body (2 1 3) through hole (2 3) screw (41) expansion The schematic diagram of the tank (5 2) liquid cooling box. Schematic diagram of the new type installed on the computer main box. The schematic diagram of the cross section 5-5 of the four pictures. Schematic illustration of another embodiment of the new installation method. Schematic description of the new type of heat dissipation system using heat pipes as heat conduction components] (11) Fin body (12a) Heat exchange tube (1 2 1) Water inlet (1 3 1) Fixing hole (2 11) Perforation (22) Fixing Sheet (30) screw (50) heat source (53) infusion tube diagram. (111) Embedded hole (12b) Heat pipe (122) Water outlet (2 0) Fixing insert (212) Passage slot (221) Fixing hole (4 0) Computer main box (5 1) Infusion tube (54) Infusion tube

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Claims

M261009 五 1 申請專利範圍一種可安裝於擴充槽之散熱構件散熱本體’由複數縛片體所組成導熱元件’並與熱源作導熱性連固疋插片’係固接於電腦主機箱含有插片體’以便固接於該散熱 2 ·如中請專利範圍第1項所述的γ 件，其中散熱本體一側端面ρ < 固定插片設有複數穿孔而以面上所設置之固定孔’以藉：絲側者。 3.如申請專利範圍第1項所述的可件i其中穿置於散熱本體各鰭片自南導熱系數之熱導管者。 4·如申請專利範圍第1項所述的可件，其中穿置於散熱、—A , …、令體各鰭片亡二式之熱交換管，含有進水口糟輸液官銜接至熱源，泵者。而其出水 5. :申請專利範圍第4項所述的可件，進一步包含液冷盒， I 泵連通，該液冷盒# 、之、〇 , . ^ ^ 1糸貼觸於妖湄 6. 如申請專利範圍第i 二原件，其中該固定插片、、可田月之插片體μ 以容許導熱元件穿經者。上，係包括：，於各鰭片體間穿置有接；以及之擴充槽上，固定插片本體者。安裝於擴有複數固對應散熱鎖固於該散熱本體之一充槽之散熱構定孔，且上述本體於該側端安裝於擴體間之導安裝於擴體間之導及出水口口精輸液安裝於擴盒係與導者。安裝於擴 ’穿設有充槽之散熱構熱元件，係取充槽之散熱構熱元件，係為，令該進水口管銜接至液壓充槽之散熱構熱元件及液壓充槽之散熱構穿槽與通孔，M261009 May 1 Patent Application Scope A heat-dissipating body which can be installed in an expansion slot. The heat-dissipating body 'consists of a plurality of heat-dissipating bodies' and is thermally conductive with a heat source. The body 'in order to be fixed to the heat sink 2 · The gamma member as described in item 1 of the patent scope, wherein the end face of the heat sink body ρ < the fixing insert is provided with a plurality of perforations and the fixing holes provided on the face' To borrow: silk side. 3. The component i according to item 1 of the scope of the patent application, wherein the heat pipe having a thermal conductivity coefficient from the south of each fin of the heat sink body is inserted. 4. The component as described in item 1 of the scope of patent application, which is placed in a heat-exchanging tube of type A, ..., which causes the fins of the body to die, and contains a water inlet and a transfusion officer connected to a heat source, a pump By. And its effluent 5 .: The optional component described in item 4 of the scope of patent application, further including a liquid cooling box, I pump communication, the liquid cooling box # 、之、〇,. ^ ^ 1 糸 is in contact with the demon Mae 6. For example, the second original of the scope of the patent application, where the fixed insert, the insertable body μ of Tianyue, allows the thermally conductive element to pass through. The upper part includes: a connector is inserted between the fin bodies; and an expansion slot is used to fix the insert body. It is installed on a heat dissipation structure hole with a plurality of solid expansion holes corresponding to the heat dissipation lock on one of the cooling body of the heat dissipation body, and the body is installed at the side end of the guide between the expansion bodies, and the guide and the water outlet of the expansion body are fine. The infusion is installed in the expansion box and the guide. Installed in the expansion of the heat sink structure of the heat sink, the heat sink structure of the heat sink is to make the inlet pipe connected to the heat sink structure of the hydraulic tank and the heat sink structure of the hydraulic tank Troughs and through holes,

M261009 五、申請專利範圍 7. 如申請專利範圍第1項所述的可安裝於擴充槽之散熱構件，其中該散熱本體係鎖接於該固定插片上，且位於電腦主機箱外側者。 8. 如申請專利範圍第1項所述的可安裝於擴充槽之散熱構件，其中該散熱本體係鎖接於該固定插片上，且位於電腦主機箱内側者。M261009 5. Scope of patent application 7. The heat dissipation component that can be installed in the expansion slot as described in item 1 of the scope of patent application, wherein the heat dissipation system is locked to the fixed insert and is located outside the computer main box. 8. The heat-dissipating component that can be installed in the expansion slot as described in item 1 of the scope of patent application, wherein the heat-dissipating system is locked to the fixed insert and is located inside the computer main box.

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