TWI406108B - 顯影裝置及顯影方法 - Google Patents

顯影裝置及顯影方法 Download PDF

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Publication number
TWI406108B
TWI406108B TW098104482A TW98104482A TWI406108B TW I406108 B TWI406108 B TW I406108B TW 098104482 A TW098104482 A TW 098104482A TW 98104482 A TW98104482 A TW 98104482A TW I406108 B TWI406108 B TW I406108B
Authority
TW
Taiwan
Prior art keywords
substrate
developer
rotation speed
liquid layer
center portion
Prior art date
Application number
TW098104482A
Other languages
English (en)
Chinese (zh)
Other versions
TW200943000A (en
Inventor
Akihiro Hisai
Masahiko Harumoto
Minoru Sugiyama
Takuya Kuroda
Masanori Imamura
Original Assignee
Sokudo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41359504&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI406108(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2008076564A external-priority patent/JP5317504B2/ja
Priority claimed from JP2008076565A external-priority patent/JP5323374B2/ja
Priority claimed from JP2008076566A external-priority patent/JP5308045B2/ja
Application filed by Sokudo Co Ltd filed Critical Sokudo Co Ltd
Publication of TW200943000A publication Critical patent/TW200943000A/zh
Application granted granted Critical
Publication of TWI406108B publication Critical patent/TWI406108B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW098104482A 2008-03-24 2009-02-12 顯影裝置及顯影方法 TWI406108B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008076564A JP5317504B2 (ja) 2008-03-24 2008-03-24 現像装置および現像方法
JP2008076565A JP5323374B2 (ja) 2008-03-24 2008-03-24 現像装置および現像方法
JP2008076566A JP5308045B2 (ja) 2008-03-24 2008-03-24 現像方法

Publications (2)

Publication Number Publication Date
TW200943000A TW200943000A (en) 2009-10-16
TWI406108B true TWI406108B (zh) 2013-08-21

Family

ID=41359504

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102122944A TWI559101B (zh) 2008-03-24 2009-02-12 顯影裝置及顯影方法
TW098104482A TWI406108B (zh) 2008-03-24 2009-02-12 顯影裝置及顯影方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102122944A TWI559101B (zh) 2008-03-24 2009-02-12 顯影裝置及顯影方法

Country Status (2)

Country Link
KR (1) KR101075287B1 (ko)
TW (2) TWI559101B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6545464B2 (ja) 2015-01-07 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス 現像方法
CN109932874A (zh) * 2019-04-25 2019-06-25 北京中科飞鸿科技有限公司 一种提高声表面波器件显影一致性的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260278A (ja) * 1996-03-25 1997-10-03 Sony Corp レジスト現像方法およびレジスト現像装置
JP2006203041A (ja) * 2005-01-21 2006-08-03 Seiko Epson Corp 半導体装置の製造方法及びスピン塗布装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3605545B2 (ja) * 1999-06-09 2004-12-22 東京エレクトロン株式会社 現像処理方法および現像処理装置
JP3362781B2 (ja) * 2000-02-03 2003-01-07 日本電気株式会社 現像処理方法および装置、現像制御装置、情報記憶媒体
JP4369325B2 (ja) * 2003-12-26 2009-11-18 東京エレクトロン株式会社 現像装置及び現像処理方法
JP4342957B2 (ja) * 2004-01-07 2009-10-14 Ｎｅｃエレクトロニクス株式会社 半導体デバイス製造プロセスにおける現像処理方法およびこれを実施する現像処理装置
JP2006210886A (ja) * 2004-12-28 2006-08-10 Tokyo Electron Ltd 現像処理方法及び現像処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260278A (ja) * 1996-03-25 1997-10-03 Sony Corp レジスト現像方法およびレジスト現像装置
JP2006203041A (ja) * 2005-01-21 2006-08-03 Seiko Epson Corp 半導体装置の製造方法及びスピン塗布装置

Also Published As

Publication number Publication date
TWI559101B (zh) 2016-11-21
TW201341982A (zh) 2013-10-16
KR101075287B1 (ko) 2011-10-19
TW200943000A (en) 2009-10-16
KR20090101816A (ko) 2009-09-29

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