TW200943000A - Developing apparatus and developing method - Google Patents

Developing apparatus and developing method

Info

Publication number
TW200943000A
TW200943000A TW098104482A TW98104482A TW200943000A TW 200943000 A TW200943000 A TW 200943000A TW 098104482 A TW098104482 A TW 098104482A TW 98104482 A TW98104482 A TW 98104482A TW 200943000 A TW200943000 A TW 200943000A
Authority
TW
Taiwan
Prior art keywords
developer
substrate
developing
central part
moving
Prior art date
Application number
TW098104482A
Other languages
Chinese (zh)
Other versions
TWI406108B (en
Inventor
Akihiro Hisai
Masahiko Harumoto
Minoru Sugiyama
Takuya Kuroda
Masanori Imamura
Original Assignee
Sokudo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41359504&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200943000(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP2008076564A external-priority patent/JP5317504B2/en
Priority claimed from JP2008076565A external-priority patent/JP5323374B2/en
Priority claimed from JP2008076566A external-priority patent/JP5308045B2/en
Application filed by Sokudo Co Ltd filed Critical Sokudo Co Ltd
Publication of TW200943000A publication Critical patent/TW200943000A/en
Application granted granted Critical
Publication of TWI406108B publication Critical patent/TWI406108B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

A developer nozzle starts to eject developer when it is located above a central part of a substrate. Then, the developer nozzle keeps ejecting developer as moving from the top of the central part to the top of an edge part of the substrate. Thereby, the substrate is entirely and sufficiently provided with developer. Further, the rotation speed of the substrate is decreased and the developer nozzle is forced to keep ejecting developer as moving from the top of an edge part to the top of the central part of the substrate. In this condition, the amount of developer that is ejected out of the substrate is reduced so that the provided developer will be maintained on the substrate. As a result, a developer layer is formed on the substrate.
TW098104482A 2008-03-24 2009-02-12 Developing apparatus and developing method TWI406108B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008076564A JP5317504B2 (en) 2008-03-24 2008-03-24 Developing apparatus and developing method
JP2008076565A JP5323374B2 (en) 2008-03-24 2008-03-24 Developing apparatus and developing method
JP2008076566A JP5308045B2 (en) 2008-03-24 2008-03-24 Development method

Publications (2)

Publication Number Publication Date
TW200943000A true TW200943000A (en) 2009-10-16
TWI406108B TWI406108B (en) 2013-08-21

Family

ID=41359504

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102122944A TWI559101B (en) 2008-03-24 2009-02-12 Developing apparatus and developing method
TW098104482A TWI406108B (en) 2008-03-24 2009-02-12 Developing apparatus and developing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102122944A TWI559101B (en) 2008-03-24 2009-02-12 Developing apparatus and developing method

Country Status (2)

Country Link
KR (1) KR101075287B1 (en)
TW (2) TWI559101B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6545464B2 (en) 2015-01-07 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス Development method
CN109932874A (en) * 2019-04-25 2019-06-25 北京中科飞鸿科技有限公司 A method of improving SAW device development consistency

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260278A (en) * 1996-03-25 1997-10-03 Sony Corp Resist developing method and resist developing equipment
JP3605545B2 (en) * 1999-06-09 2004-12-22 東京エレクトロン株式会社 Development processing method and development processing apparatus
JP3362781B2 (en) * 2000-02-03 2003-01-07 日本電気株式会社 Development processing method and apparatus, development control device, information storage medium
JP4369325B2 (en) * 2003-12-26 2009-11-18 東京エレクトロン株式会社 Development device and development processing method
JP4342957B2 (en) * 2004-01-07 2009-10-14 Ｎｅｃエレクトロニクス株式会社 Development processing method in semiconductor device manufacturing process and development processing apparatus implementing the same
JP2006210886A (en) * 2004-12-28 2006-08-10 Tokyo Electron Ltd Development processing method and development processor
JP2006203041A (en) * 2005-01-21 2006-08-03 Seiko Epson Corp Method for manufacturing semiconductor device and spin coating device

Also Published As

Publication number Publication date
TWI559101B (en) 2016-11-21
TW201341982A (en) 2013-10-16
TWI406108B (en) 2013-08-21
KR101075287B1 (en) 2011-10-19
KR20090101816A (en) 2009-09-29

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