TWI403830B - Apparatus and method for repairing a mask - Google Patents
Apparatus and method for repairing a mask Download PDFInfo
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- TWI403830B TWI403830B TW098109125A TW98109125A TWI403830B TW I403830 B TWI403830 B TW I403830B TW 098109125 A TW098109125 A TW 098109125A TW 98109125 A TW98109125 A TW 98109125A TW I403830 B TWI403830 B TW I403830B
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- foreign matter
- reticle
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- laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
Abstract
Description
本發明係有關於一種光罩修復裝置及方法。更詳細而言，本發明係有關於一種對形成有預定圖案之半導體或平板顯示器製造用光罩上之異物照射雷射，並以針挖掘而加以去除的光罩修復裝置及方法。The present invention relates to a reticle repair apparatus and method. More specifically, the present invention relates to a reticle repair apparatus and method for irradiating a foreign object on a photomask for manufacturing a semiconductor or flat panel display having a predetermined pattern, and removing the laser by digging.
最近，對半導體之研究係朝追求高積體化及高功能之方向進行，以在短時間內處理更多資料。又，對平板顯示器之研究亦朝追求高解析度之方向進行。Recently, research in semiconductors has been pursued in the direction of high integration and high functionality to process more information in a short period of time. Moreover, the research on flat panel displays is also in the direction of pursuing high resolution.
為製造半導體及平板顯示器，須完成成膜、圖案形成、金屬配線形成等一連串之單位步驟。In order to manufacture semiconductors and flat panel displays, a series of unit steps such as film formation, pattern formation, and metal wiring formation are required.
圖案形成步驟包含照像蝕刻步驟，照像蝕刻步驟則包含洗淨步驟、表面處理步驟、光阻膜形成步驟、排列/曝光步驟、顯影步驟及檢查步驟等一連串過程。The pattern forming step includes a photo etching step, and the photo etching step includes a series of processes such as a cleaning step, a surface treatment step, a photoresist film forming step, an alignment/exposure step, a development step, and an inspection step.
另，圖案形成步驟中為形成正確之圖案，必須使用與圖案之原始版相當之光罩。在圖案形成過程中，光罩將因各種原因而殘留異物(微粒、有機物、光阻劑殘留物)。In addition, in order to form a correct pattern in the pattern forming step, it is necessary to use a photomask equivalent to the original version of the pattern. During the pattern formation process, the photomask will leave foreign matter (particles, organic matter, photoresist residue) for various reasons.
尤其，構成半導體及平板顯示器之元件與配線極為細小，故在異物附著於光罩上之狀態下形成圖案，將妨礙正常元件及配線之形成。因而，將導致半導體及平板顯示器之瑕疵，故避免光罩附著異物，甚為重要。In particular, since the elements and wirings constituting the semiconductor and the flat panel display are extremely small, a pattern is formed in a state in which foreign matter adheres to the photomask, which hinders the formation of normal elements and wiring. Therefore, it will cause defects in semiconductors and flat panel displays, so it is important to avoid foreign matter attached to the mask.
迄今，為去除光罩上之異物，雖使用利用化學藥品之方法，但此時所使用之藥品之處理過程，則有發生汙染之問題。Heretofore, in order to remove foreign matter on the mask, a chemical-based method has been used, but the treatment process of the medicine used at this time has a problem of contamination.
為解決上述問題，專利文獻1中已揭露一種「利用雷射之基板表面之異物去除方法」。依據該方法，朝基板表面噴射預定之反應氣體以去除基板表面之異物後，可對異物照射雷射而去除異物。然而，上述方式則有某些異物即便照射雷射亦無法完全去除，而殘留於光罩上造成2次汙染之問題。In order to solve the above problem, Patent Document 1 discloses a "foreign material removal method using a laser substrate surface". According to this method, after a predetermined reaction gas is ejected toward the surface of the substrate to remove foreign matter on the surface of the substrate, the foreign matter can be irradiated with a laser to remove the foreign matter. However, in the above manner, some foreign matter cannot be completely removed even if it is irradiated with a laser, and remains on the reticle to cause two problems of contamination.
【專利文獻1】韓國專利公開第2000-0036020號公報(2000.06.26)[Patent Document 1] Korean Patent Publication No. 2000-0036020 (2000.06.26)
因此，為解決前述習知技術之問題而設計之本發明，即以提供一種對形成有預定圖案之半導體或平板顯示器製造用光罩上之異物照射雷射，並以針進行挖掘而加以去除，藉此，可更有效率地去除異物之光罩修復裝置及方法為目的。Therefore, the present invention has been devised to solve the problems of the prior art described above, that is, to provide a laser for irradiating a foreign object on a photomask for manufacturing a semiconductor or flat panel display having a predetermined pattern, and removing it by digging with a needle. Thereby, the reticle repair apparatus and method for removing foreign matter more efficiently are aimed.
為達成前述目的，本發明之光罩修復裝置係去除形成有預定圖案之半導體或平板顯示器製造用光罩上之異物而修復光罩者，其特徵在於包含有：雷射部，係對前述異物照射雷射以去除前述異物者；及，針部，係對前述異物施加物理力以去除前述異物者。In order to achieve the above object, the reticle repairing apparatus of the present invention is a method of repairing a reticle by removing a foreign matter on a reticle for manufacturing a semiconductor or flat panel display in which a predetermined pattern is formed, and is characterized in that: the laser portion is included, and the foreign matter is attached The laser is irradiated to remove the foreign matter; and the needle portion is a physical force applied to the foreign matter to remove the foreign matter.
本發明之光罩修復裝置可更進一步包含光學部，使前述雷射部所放出之雷射到達前述異物之。The reticle repair apparatus of the present invention may further include an optical portion that causes the laser emitted from the laser portion to reach the foreign matter.
前述針部之材質可包含鎢。The material of the needle portion may include tungsten.
前述針部可連結於馬達，使前述針部對前述異物施加物理力。The needle portion may be coupled to the motor, and the needle portion may apply a physical force to the foreign matter.
前述針部可藉挖掘(digging)動作而去除前述異物。The needle portion can remove the foreign matter by a digging operation.
前述針部附近可設有具備吸入前述異物、噴出前述異物之功能中之至少其中一種功能的空氣部。An air portion having at least one of a function of sucking the foreign matter and discharging the foreign matter may be provided in the vicinity of the needle portion.
前述空氣部可更進一步具有分別吸入及噴出在前述針部之前述異物去除過程中附著於針上之異物之功能。The air portion may further have a function of sucking and ejecting foreign matter attached to the needle during the removal of the foreign matter in the needle portion.
本發明之光罩修復裝置可更進一步包含去除在利用前述針部之異物去除過程中附著於前述針部之異物的刷部。The reticle repair apparatus of the present invention may further include a brush portion that removes foreign matter adhering to the needle portion during the foreign matter removal process using the needle portion.
又，為達成前述目的，本發明之光罩修復方法係去除形成有預定圖案之半導體或平板顯示器製造用光罩上之異物而修復光罩者，其特徵在於包含以下二階段：雷射照射階段，對前述異物照射雷射以去除前述異物；及，物理力施加階段，對前述異物施加物理力以去除前述異物。Further, in order to achieve the above object, the reticle repairing method of the present invention is a method of repairing a reticle by removing foreign matter on a reticle for manufacturing a semiconductor or flat panel display having a predetermined pattern, and is characterized by comprising the following two stages: a laser irradiation stage And irradiating a laser to the foreign matter to remove the foreign matter; and, in a physical force application phase, applying a physical force to the foreign matter to remove the foreign matter.
本發明之光罩修復方法可更進一步包含吸入前述異物階段及噴出前述異物階段中之至少一階段。The reticle repairing method of the present invention may further comprise at least one of a phase of inhaling the foreign matter and a step of ejecting the foreign matter.
依據本發明，對形成有預定圖案之半導體或平板顯示器製造用光罩上之異物照射雷射，並以針挖掘異物而加以去除，藉此，具有更有效率地修復光罩之效果。According to the present invention, the foreign matter on the reticle for manufacturing a semiconductor or flat panel display in which a predetermined pattern is formed is irradiated with a laser, and the foreign matter is excavated by the needle to remove the foreign matter, whereby the effect of repairing the reticle more efficiently is obtained.
第1圖係顯示本發明一實施例之光罩修復裝置100之構造之立體圖。Fig. 1 is a perspective view showing the configuration of a reticle repair apparatus 100 according to an embodiment of the present invention.
第2圖係顯示本發明一實施例之光罩修復裝置100之殘留物去除部200之構造之立體圖。Fig. 2 is a perspective view showing the structure of the residue removing unit 200 of the reticle repair apparatus 100 according to the embodiment of the present invention.
第3圖係顯示本發明一實施例之光罩修復裝置100之殘留物去除部200之構造之立體圖。Fig. 3 is a perspective view showing the structure of the residue removing unit 200 of the reticle repair apparatus 100 according to the embodiment of the present invention.
第4圖係顯示本發明一實施例之光罩修復裝置100之針部300及空氣部400之構造之分解立體圖。Fig. 4 is an exploded perspective view showing the structure of the needle portion 300 and the air portion 400 of the reticle repair apparatus 100 according to the embodiment of the present invention.
以下，參照附圖而詳細說明本發明之實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第1圖係顯示設有本發明一實施例之光罩修復裝置100之狀態之立體圖。如第1圖所示，光罩修復裝置100構成包含載台110、X軸及Y軸移動部120、130、平台140、光罩裝設框150及修復部200等。Fig. 1 is a perspective view showing a state in which a reticle repair apparatus 100 according to an embodiment of the present invention is provided. As shown in FIG. 1, the mask repairing apparatus 100 includes a stage 110, X-axis and Y-axis moving parts 120 and 130, a stage 140, a mask mounting frame 150, a repairing part 200, and the like.
首先，稱為高架(gantry)之載台110設於已對地面固設之機架構造物上而可預防來自外部之振動及衝擊所造成之影響。載台110之上面則為進行可靠性更高之修復步驟而製成可正確形成水平面。First, a gantry-loaded stage 110 is provided on a frame structure that has been fixed to the ground to prevent vibration and impact from the outside. The upper surface of the stage 110 is made to perform a more reliable repair step to form a correctly formed horizontal surface.
載台110之上面之上側及下側之兩端設有形成直線狀之一對包含X軸軌道之可相互連動之X軸移動部120。X軸移動部120則可藉未圖示之馬達之驅動力沿兩X軸軌道而移動。又，載台110上面亦設有包含Y軸支持台之Y軸移動部130。X軸移動部120之兩軌道連設有形成直線狀之Y軸支持台之兩端，Y軸移動部130之Y軸支持台則設成可藉X軸移動部120之動作而於載台110之上部沿長向(X軸)移動。Both ends of the upper side and the lower side of the upper surface of the stage 110 are provided with X-axis moving portions 120 which are linearly connected to each other and include X-axis tracks. The X-axis moving unit 120 is movable along the two X-axis rails by a driving force of a motor (not shown). Further, a Y-axis moving portion 130 including a Y-axis support table is also provided on the upper surface of the stage 110. The two rails of the X-axis moving portion 120 are connected to both ends of the linear Y-axis support table, and the Y-axis support table of the Y-axis moving portion 130 is set to be movable by the X-axis moving portion 120 on the stage 110. The upper part moves in the long direction (X axis).
Y軸移動部130設有可藉受未圖示之馬達之驅動力而動作之Y軸移動部130而沿Y軸支持台朝短向(Y軸)移動之殘留物去除部200。The Y-axis moving unit 130 is provided with a residue removing unit 200 that can move in the short direction (Y-axis) along the Y-axis support unit by the Y-axis moving unit 130 that is operated by a driving force of a motor (not shown).
載台110上設有可載置光罩裝設框150之平台140。平台140則宜與殘留物去除部200間隔預定距離而設置，以避免妨礙設於Y軸移動部130之殘留物去除部200之動作。The stage 110 is provided with a platform 140 on which the reticle mounting frame 150 can be placed. The stage 140 is preferably provided at a predetermined distance from the residue removing unit 200 to prevent the movement of the residue removing unit 200 provided in the Y-axis moving unit 130.
光罩裝設框150上可設置作為修復對象之光罩(未圖示)。A photomask (not shown) as a repair target can be disposed on the mask mounting frame 150.
第2至3圖係顯示光罩修復裝置100所包含之修復部200之構造者。The second to third figures show the constructor of the repairing portion 200 included in the reticle repair apparatus 100.
首先，修復部200可包含可照射雷射之雷射部210。First, the repairing portion 200 can include a laser portion 210 that can illuminate the laser.
雷射部210負責對異物照射雷射束，以去除存在光罩上之異物。為適用於去除異物，雷射部210所放出之雷射束之波長及輸出範圍可作各種變更。雷射部210所放出之雷射束係脈衝雷射束或連續雷射束。The laser portion 210 is responsible for illuminating the foreign matter with a laser beam to remove foreign matter present on the reticle. In order to be suitable for removing foreign matter, the wavelength and output range of the laser beam emitted from the laser unit 210 can be variously changed. The laser beam emitted by the laser portion 210 is a pulsed laser beam or a continuous laser beam.
為使雷射部210所放出之雷射束可有效聚焦於異物上，可於雷射部210與異物之間設置光學系統220。光學系統220則可包含分光鏡(beam splitter)、透鏡、濾光鏡、光閘等。另，光學系統220可包含可觀測光罩及異物之去除可否等之物鏡部222。In order to allow the laser beam emitted from the laser portion 210 to be effectively focused on the foreign matter, the optical system 220 may be disposed between the laser portion 210 and the foreign matter. The optical system 220 can then include a beam splitter, a lens, a filter, a shutter, and the like. In addition, the optical system 220 may include an objective lens portion 222 that can observe the reticle and the removal of foreign matter.
雷射部210所放出之雷射束一旦照射光罩上之異物，則異物將燃燒，故可去除異物。此時，為促進上述之燃燒過程，可將受雷射束照射之異物周圍形成預定之輔助氣體環境，因此雷射部210可更進一步包含輔助氣體供給部(未圖示)。When the laser beam emitted from the laser unit 210 illuminates the foreign matter on the mask, the foreign matter will burn, so that the foreign matter can be removed. At this time, in order to promote the above-described combustion process, a predetermined auxiliary gas atmosphere can be formed around the foreign matter irradiated by the laser beam, and therefore the laser portion 210 can further include an assist gas supply portion (not shown).
又，修復部200可包含針部300及空氣部400。Further, the repairing unit 200 may include the needle portion 300 and the air portion 400.
針部300及空氣部400則負責去除雷射部210亦無法完全去除之異物(諸如異物因雷射而燃燒後殘留之氣體等，以下稱為「殘留物」)。The needle portion 300 and the air portion 400 are responsible for removing foreign matter that cannot be completely removed by the laser portion 210 (such as a gas remaining after the foreign matter is burned by a laser, hereinafter referred to as "residue").
第4圖係顯示本發明一實施例之光罩修復裝置100之針部300及空氣部400之構造之分解立體圖。Fig. 4 is an exploded perspective view showing the structure of the needle portion 300 and the air portion 400 of the reticle repair apparatus 100 according to the embodiment of the present invention.
針部300構成包含針310、用以固定上述針310之固定塊312、314、316及可精密控制針310之動作之第1調處器320。The needle portion 300 constitutes a first positioner 320 including a needle 310, fixing blocks 312, 314, and 316 for fixing the needle 310, and an operation for precisely controlling the needle 310.
針310之尖端形成有尖銳部。針310之中間部則依預定之傾斜度而折曲。針310雖宜以鎢等剛性較高之材質製作，但本發明非必限定如此。The tip of the needle 310 is formed with a sharp portion. The middle portion of the needle 310 is bent at a predetermined inclination. The needle 310 is preferably made of a material having high rigidity such as tungsten, but the present invention is not necessarily limited thereto.
針310宜於針310之尖銳部朝向預定方向之狀態下位於於平板狀之第1固定塊312之一側中心。對第1固定塊312之上部則結合「」形狀之第2固定塊314，該第2固定塊314則與第3固定塊316結合而使針310完全固定。The needle 310 is preferably located at the center of one side of the flat first fixing block 312 in a state where the sharp portion of the needle 310 faces the predetermined direction. The upper part of the first fixed block 312 is combined with " The second fixed block 314 of the shape is joined to the third fixed block 316 to completely fix the needle 310.
針310宜經可朝X、Y、Z軸方向移動之第1調處器320而固定於裝配座230上。The needle 310 is preferably fixed to the mount 230 via a first handler 320 that is movable in the X, Y, and Z axis directions.
針部300負責對照射雷射束後未完全去除之光罩上之殘留物經針310而予以施加物理力以去除殘留物。此時，針310宜藉挖掘殘留物、即所謂挖掘(digging)動作方式，而去除殘留物。The needle portion 300 is responsible for applying a physical force to the residue on the reticle that has not been completely removed after the irradiation of the laser beam through the needle 310 to remove the residue. At this time, the needle 310 is preferably removed by excavating the residue, that is, a digging operation mode.
針310朝應去除之殘留物接近之動作，與針310藉挖掘動作方式去除殘留物之動作，可藉設於針部300上側之X軸驅動馬達M1、Y軸驅動馬達M2、Z軸驅動馬達M3所提供之驅動力而達成。The operation of removing the residue from the needle 310 toward the residue to be removed, and the operation of removing the residue by the digging operation of the needle 310, can be performed by the X-axis driving motor M1 on the upper side of the needle portion 300, the Y-axis driving motor M2, and the Z-axis driving motor. The driving force provided by M3 was achieved.
於第1調處器320可設置連結於該第1調處器320之可於針310之精密調整及更換時使針310微進之X軸微米滑台322、Y軸微米滑台324及Z軸微米滑台326。此時，X軸、Y軸及Z軸微米滑台322、324、326宜藉手動方式精密控制針310之動作。The first interpolator 320 can be provided with an X-axis micro-slide 322, a Y-axis micro-slide 324 and a Z-axis micron coupled to the first interpolator 320 for fine adjustment and replacement of the needle 310. Slide table 326. At this time, the X-axis, Y-axis, and Z-axis micro-slides 322, 324, and 326 should be precisely controlled by the manual operation of the needle 310.
空氣部400負責去除利用針部300亦無法完全去除之殘留物。The air portion 400 is responsible for removing residues that cannot be completely removed by the needle portion 300.
空氣部400構成包含空氣管410、可固定上述空氣管410之輔助裝配座420、422及可精密控制空氣管410之動作之第2調處器430。The air unit 400 constitutes a second handler 430 including an air tube 410, an auxiliary mounts 420 and 422 that can fix the air tube 410, and an operation that can precisely control the air tube 410.
空氣管410可吸入殘留物或對殘留物噴出空氣，以去除光罩上之殘留物。因此，空氣管410之一端設有空氣供給端子412。空氣供給端子412則與用於吸入殘留物之真空泵(未圖示)及用於對殘留物供給空氣之空氣貯藏部(未圖示)相連結。空氣供給端子412之一側宜設有用以調節對空氣管410供給之空氣壓力之空氣速度控制機414。The air tube 410 can inhale the residue or eject air to the residue to remove the residue on the reticle. Therefore, one end of the air tube 410 is provided with an air supply terminal 412. The air supply terminal 412 is connected to a vacuum pump (not shown) for sucking the residue and an air storage unit (not shown) for supplying air to the residue. One side of the air supply terminal 412 is preferably provided with an air speed controller 414 for regulating the air pressure supplied to the air tube 410.
空氣管410係藉輔助裝配座420、422而固定於裝配座230上。此時，輔助裝配座422可朝預定方向折曲而形成，以使空氣管410易於接近殘留物。The air tube 410 is secured to the mount 230 by the auxiliary mounts 420, 422. At this time, the auxiliary mount 422 can be formed by being bent in a predetermined direction to make the air tube 410 easy to access the residue.
使空氣管410接近應去除之殘留物之動作，可藉設於空氣部400上側之X軸驅動馬達M1、Y軸驅動馬達M2、Z軸驅動馬達M3所提供之驅動力而達成。The operation of bringing the air tube 410 close to the residue to be removed can be achieved by the driving force provided by the X-axis drive motor M1, the Y-axis drive motor M2, and the Z-axis drive motor M3 on the upper side of the air portion 400.
於第2調處器430可設置連結於該第2調處器430之可於空氣管410之精密調整及更換時使空氣管410微進之X軸微米滑台432、Y軸微米滑台434及Z軸微米滑台436。此時，X軸、Y軸及Z軸微米滑台432、434、436宜採手動方式精密控制空氣管410之動作。第2圖之(c)及第4圖中，Y軸微米滑台434因其設置位置之故，已省略其圖示，以為參考。The second adjuster 430 can be provided with an X-axis micro slide table 432, a Y-axis micro slide table 434 and a Z connected to the second adjuster 430 to finely adjust the air tube 410 during the precise adjustment and replacement of the air tube 410. Axial micron slide 436. At this time, the X-axis, Y-axis, and Z-axis micro-slides 432, 434, and 436 should be manually controlled to precisely control the operation of the air tube 410. In the drawings (c) and 4 of the second drawing, the Y-axis micro-slide table 434 has been omitted from the drawings for its reference position.
另，空氣部400不僅負責去除針部300未能去除之光罩上之殘留物，並可去除在去除針部300之殘留物過程中附著於針310表面之殘留物。亦即，在去除殘留物之過程中附著於針310表面上之殘留物，在去除光罩上之殘留物時可能造成光罩之2次汙染，故須周期性地清潔針310之表面。此時，可使空氣部400之空氣管410接近針310而吸入針310上之殘留物，或朝殘留物噴出空氣而清潔針310。In addition, the air portion 400 is not only responsible for removing the residue on the reticle that the needle portion 300 has not removed, but also removing the residue adhering to the surface of the needle 310 during the removal of the residue of the needle portion 300. That is, the residue adhering to the surface of the needle 310 during the removal of the residue may cause secondary contamination of the mask when the residue on the mask is removed, so the surface of the needle 310 must be periodically cleaned. At this time, the air tube 410 of the air portion 400 can be brought close to the needle 310 to suck the residue on the needle 310, or the air can be ejected toward the residue to clean the needle 310.
又，一如前述，即便利用空氣部400亦無法完全去除之針310上之殘留物，可利用設於光罩修復裝置100之預定位置上之未圖示之刷子加以去除。亦即，使針310與刷子接觸而刷去針310上之殘留物，即可去除殘留物。此時，刷子宜使用抗靜電(anti-static)刷子。Further, as described above, the residue on the needle 310 which cannot be completely removed by the air portion 400 can be removed by a brush (not shown) provided at a predetermined position of the mask repairing device 100. That is, the residue can be removed by bringing the needle 310 into contact with the brush and brushing off the residue on the needle 310. At this time, the brush should use an anti-static brush.
另，藉針部300與空氣部400去除殘留物時，殘留物可能飛散至光罩周邊而造成光罩修復裝置100及周邊無塵室之環境之2次汙染。為避免發生2次汙染，可於光罩下側即載台110上設置黏墊(sticky pad)(未圖示)，以使殘留物去除過程中飛散之殘留物易於回收。上述黏墊宜亦設於刷子周邊。Further, when the residue is removed by the needle portion 300 and the air portion 400, the residue may be scattered to the periphery of the mask to cause secondary contamination of the environment of the mask repairing device 100 and the surrounding clean room. In order to avoid secondary pollution, a sticky pad (not shown) may be provided on the underside of the mask, that is, the stage 110, so that the residue scattered during the residue removal process can be easily recovered. The above-mentioned adhesive pad should also be provided around the brush.
以下，參照圖示說明本發明之光罩修復裝置之動作如下。Hereinafter, the operation of the photomask repairing apparatus of the present invention will be described below with reference to the drawings.
首先，使修復對象(即已受異物汙染者)之光罩位於光罩修復裝置100之平台140上。First, the reticle of the repair object (i.e., the person who has been contaminated by foreign matter) is placed on the platform 140 of the reticle repair apparatus 100.
然後，利用配設於光罩修復裝置100內之觀測機構(諸如相機)(未圖示)而於光罩上掌握異物之位置，並使X軸移動部120與Y軸移動部130動作而使雷射部210位於異物之上側。Then, the position of the foreign matter is grasped on the reticle by an observation mechanism (such as a camera) (not shown) disposed in the reticle repair apparatus 100, and the X-axis moving unit 120 and the Y-axis moving unit 130 are operated to cause the X-axis moving unit 120 and the Y-axis moving unit 130 to operate. The laser portion 210 is located on the upper side of the foreign matter.
接著，使雷射部210動作而朝異物照射雷射束。此時，係利用分光鏡、透鏡、濾光鏡等光學系統220而使雷射束聚焦於異物上而進行照射。對異物照射雷射束，即可燃燒異物而於光罩上加以去除。Next, the laser unit 210 is operated to irradiate the foreign matter with the laser beam. At this time, the laser beam 220 such as a beam splitter, a lens, or a filter is used to focus the laser beam on the foreign matter to perform irradiation. When the foreign matter is irradiated to the laser beam, the foreign matter can be burned and removed on the reticle.
另，雖可藉燃燒方式而去除異物之大部分，但亦可能因材質不同而無法以雷射束燃燒異物，或因不完全燃燒而無法完全去除異物。且，視情況不同，亦可能因雷射束之產熱而使無法去除之異物熔附於光罩上而無法自光罩加以完全去除。In addition, although most of the foreign matter can be removed by the combustion method, it is also possible that the foreign matter cannot be burned by the laser beam due to the different materials, or the foreign matter cannot be completely removed due to incomplete combustion. Moreover, depending on the situation, foreign matter that cannot be removed may be fused to the reticle due to the heat generated by the laser beam, and may not be completely removed from the reticle.
如上所述，利用雷射束之燃燒方式亦無法自光罩上去除之異物，尤其因不完全燃燒而殘留之殘留物，可藉以下方式加以去除。As described above, the foreign matter which cannot be removed from the reticle by the burning method of the laser beam, especially the residue remaining due to incomplete combustion, can be removed in the following manner.
首先，使X軸、Y軸、Z軸驅動馬達M1、M2、M3動作而使構成針部300之針310之尖銳部接近光罩上之殘留物後，再使針310之尖銳部接觸殘留物。First, the X-axis, Y-axis, and Z-axis drive motors M1, M2, and M3 are operated to bring the sharp portion of the needle 310 constituting the needle portion 300 close to the residue on the mask, and then the sharp portion of the needle 310 is brought into contact with the residue. .
其次，在針3101之尖銳部接觸殘留物之狀態下，繼續使X軸、Y軸、Z軸驅動馬達M1、M2、M3朝X、Y、Z方向動作，藉將經由針310之物理力傳至殘留物，即可去除光罩上之殘留物。此時，宜藉X軸、Y軸、Z軸驅動馬達M1、M2、M3之適當動作，而採用由針310挖掘殘留物之所謂挖掘方式去除殘留物。上述過程中，一旦針310之尖銳部接觸光罩表面，可能發生光罩之損傷，故可更進一步於針部300設置可檢知尖銳部位置之感測器(未圖示)。Next, in a state where the sharp portion of the needle 3101 contacts the residue, the X-axis, the Y-axis, and the Z-axis drive motors M1, M2, and M3 are continuously moved in the X, Y, and Z directions, and the physical force transmitted through the needle 310 is transmitted. To the residue, the residue on the reticle can be removed. At this time, it is preferable to drive the motors M1, M2, and M3 by the appropriate operations of the X-axis, the Y-axis, and the Z-axis, and remove the residue by a so-called excavation method in which the residue is excavated by the needle 310. In the above process, once the sharp portion of the needle 310 contacts the surface of the mask, damage to the mask may occur, so that the needle portion 300 may be further provided with a sensor (not shown) that can detect the position of the sharp portion.
又，針部300亦無法自光罩上去除之殘留物，則可藉以下方式加以去除。Further, the needle portion 300 cannot be removed from the photomask, and can be removed in the following manner.
首先，使X軸、Y軸、Z軸驅動馬達M1、M2、M3動作而使空氣部400之空氣管410移動而接近殘留物。First, the X-axis, Y-axis, and Z-axis drive motors M1, M2, and M3 are operated to move the air tube 410 of the air portion 400 to approach the residue.
其次，利用真空而經空氣管410吸入殘留物，即可去除光罩上之殘留物。同時，經空氣管410而朝殘留物噴出高壓空氣，則可去除光罩上之殘留物。此時，可經與真空泵(未圖示)及空氣供給部(未圖示)連結之空氣供給端子412而對空氣管410供給真空及空氣。又，對空氣管410供給之空氣壓力則可利用空氣速度控制機414而加以控制，此則可預防過度之空氣壓力造成光罩損傷。Secondly, the residue on the reticle can be removed by vacuuming the residue through the air tube 410. At the same time, high-pressure air is ejected toward the residue through the air tube 410, and the residue on the mask can be removed. At this time, vacuum and air can be supplied to the air tube 410 via the air supply terminal 412 connected to a vacuum pump (not shown) and an air supply unit (not shown). Further, the air pressure supplied to the air tube 410 can be controlled by the air speed controller 414, which prevents excessive air pressure from causing damage to the mask.
空氣部400可更進一步具備吸入在針部300之殘留物去除過程中附著於針310表面之殘留物，或對殘留物噴出空氣以去除上述殘留物之功能。如此，則可預防針310上之殘留物造成光罩之2次汙染。又，針310上之殘留物可利用設於光罩修復裝置100之預定位置上之刷子(未圖示)而更進一步加以去除。The air portion 400 may further have a function of sucking the residue adhering to the surface of the needle 310 during the removal of the residue of the needle portion 300, or discharging the air to the residue to remove the residue. In this way, it is possible to prevent the residue on the needle 310 from causing secondary contamination of the mask. Further, the residue on the needle 310 can be further removed by a brush (not shown) provided at a predetermined position of the mask repairing device 100.
本實施例中，已就依序使用雷射部210、針部300及空氣部400而去除光罩上之異物進行說明，但本發明並不受限於此。舉例言之，可視需要而就雷射部210、針部300、空氣部400之動作順序進行各種變更。又，可視需要而僅使用針部300與空氣部400之其中之一。又，亦可視需要而使針部300與空氣部400同時動作而去除光罩上之異物。In the present embodiment, the laser portion 210, the needle portion 300, and the air portion 400 are sequentially used to remove the foreign matter on the mask, but the present invention is not limited thereto. For example, the order of operation of the laser unit 210, the needle unit 300, and the air unit 400 can be variously changed as needed. Further, only one of the needle portion 300 and the air portion 400 may be used as needed. Further, the needle portion 300 and the air portion 400 may be simultaneously operated as needed to remove foreign matter on the mask.
如上所述，本發明之光罩修復裝置及方法具有可對半導體或平板顯示器製造用光罩上之異物照射雷射，並以針挖掘異物而加以去除，而更有效率地修復光罩之優點。因此，本發明之產業上利用性可謂極高。As described above, the reticle repair apparatus and method of the present invention has the advantages of illuminating a foreign object on a reticle for manufacturing a semiconductor or flat panel display, and removing the foreign matter by a needle, thereby more effectively repairing the reticle. . Therefore, the industrial applicability of the present invention is extremely high.
另，以上雖已藉較佳實施例說明本發明，但在不逸脫本發明要旨之範圍內，可對照本技術範疇之技術而進行多種變形實施。因此，本發明之技術範圍並不限於上述之實施例，而應基於申請專利範圍之記載及與其相當之技術而加以界定。In the above, the present invention has been described by way of a preferred embodiment, and various modifications can be made without departing from the spirit and scope of the invention. Therefore, the technical scope of the present invention is not limited to the above-described embodiments, but should be defined based on the description of the scope of the patent application and the technology equivalent thereto.
100．．．光罩修復裝置100. . . Photomask repairing device
110．．．載台110. . . Loading platform
120．．．X軸移動部120. . . X-axis moving part
130．．．Y軸移動部130. . . Y-axis moving part
140．．．平台140. . . platform
150．．．光罩裝設框150. . . Photomask mounting frame
200．．．修復部200. . . Repair department
200．．．殘留物去除部200. . . Residue removal
210．．．雷射部210. . . Laser department
220．．．光學系統220. . . Optical system
222．．．物鏡部222. . . Objective lens
230．．．裝配座230. . . Mounting seat
300．．．針部300. . . Needle
310．．．針310. . . needle
312．．．第1固定塊312. . . First fixed block
314．．．第2固定塊314. . . Second fixed block
316．．．第3固定塊316. . . Third fixed block
320．．．第1調處器320. . . 1st adjuster
322．．．X軸微米滑台322. . . X-axis micro slide
324．．．Y軸微米滑台324. . . Y-axis micro slide
326．．．Z軸微米滑台326. . . Z-axis micro slide
400．．．空氣部400. . . Air department
410．．．空氣管410. . . oxygen tube
412．．．空氣供給端子412. . . Air supply terminal
414．．．空氣速度控制機414. . . Air speed controller
420、422．．．輔助裝配座420, 422. . . Auxiliary assembly
430．．．第2調處器430. . . 2nd adjuster
432．．．X軸微米滑台432. . . X-axis micro slide
434．．．Y軸微米滑台434. . . Y-axis micro slide
436．．．X軸微米滑台436. . . X-axis micro slide
M1．．．X軸驅動馬達M1. . . X-axis drive motor
M2．．．Y軸驅動馬達M2. . . Y-axis drive motor
M3．．．Z軸驅動馬達M3. . . Z-axis drive motor
第1圖係顯示本發明一實施例之光罩修復裝置100之構造之立體圖。Fig. 1 is a perspective view showing the configuration of a reticle repair apparatus 100 according to an embodiment of the present invention.
第2圖係顯示本發明一實施例之光罩修復裝置100之殘留物去除部200之構造之立體圖。Fig. 2 is a perspective view showing the structure of the residue removing unit 200 of the reticle repair apparatus 100 according to the embodiment of the present invention.
第3圖係顯示本發明一實施例之光罩修復裝置100之殘留物去除部200之構造之立體圖。Fig. 3 is a perspective view showing the structure of the residue removing unit 200 of the reticle repair apparatus 100 according to the embodiment of the present invention.
第4圖係顯示本發明一實施例之光罩修復裝置100之針部300及空氣部400之構造之分解立體圖。Fig. 4 is an exploded perspective view showing the structure of the needle portion 300 and the air portion 400 of the reticle repair apparatus 100 according to the embodiment of the present invention.
200．．．修復部200. . . Repair department
200．．．殘留物去除部200. . . Residue removal
210．．．雷射部210. . . Laser department
220．．．光學系統220. . . Optical system
230．．．裝配座230. . . Mounting seat
300．．．針部300. . . Needle
310．．．針310. . . needle
320．．．第1調處器320. . . 1st adjuster
322．．．X軸微米滑台322. . . X-axis micro slide
324．．．Y軸微米滑台324. . . Y-axis micro slide
326．．．Z軸微米滑台326. . . Z-axis micro slide
400．．．空氣部400. . . Air department
436．．．X軸微米滑台436. . . X-axis micro slide
M1．．．X軸驅動馬達M1. . . X-axis drive motor
M2．．．Y軸驅動馬達M2. . . Y-axis drive motor
M3．．．Z軸驅動馬達M3. . . Z-axis drive motor
Claims (9)
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| KR1020080094937A KR101053450B1 (en) | 2008-09-26 | 2008-09-26 | Mask repair apparatus and method |
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| TWI461838B (en) * | 2010-04-16 | 2014-11-21 | Cowindst Co Ltd | Method and system for repairing halftone mask |
| CN105506548B (en) | 2016-03-01 | 2018-05-25 | 京东方科技集团股份有限公司 | A kind of mask plate prosthetic device, restorative procedure and deposition system |
| KR101856653B1 (en) | 2016-10-17 | 2018-06-20 | 주식회사 이오테크닉스 | Module for using the pressure of air masses to fix the mask |
| CN112764309A (en) * | 2021-02-07 | 2021-05-07 | 泉芯集成电路制造(济南)有限公司 | Photomask defect removing method and device |
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| US5634230A (en) * | 1994-12-27 | 1997-06-03 | Siemens Aktiengesellschaft | Apparatus and method for cleaning photomasks |
| US20040175631A1 (en) * | 2002-10-21 | 2004-09-09 | Nanoink, Inc. | Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrications |
| US20050110985A1 (en) * | 2002-11-12 | 2005-05-26 | David Yogev | Advanced mask cleaning and handling |
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| JP2005005291A (en) * | 2003-06-09 | 2005-01-06 | Matsushita Electric Ind Co Ltd | Optical lithography system and method for removing particle in optical lithography system |
| KR20050055465A (en) * | 2003-12-08 | 2005-06-13 | 주식회사 하이닉스반도체 | Method for removing foreign material according to the manufacure of semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634230A (en) * | 1994-12-27 | 1997-06-03 | Siemens Aktiengesellschaft | Apparatus and method for cleaning photomasks |
| US20040175631A1 (en) * | 2002-10-21 | 2004-09-09 | Nanoink, Inc. | Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrications |
| US20050110985A1 (en) * | 2002-11-12 | 2005-05-26 | David Yogev | Advanced mask cleaning and handling |
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