TWI402635B - 顯影裝置 - Google Patents

顯影裝置 Download PDF

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Publication number
TWI402635B
TWI402635B TW97139884A TW97139884A TWI402635B TW I402635 B TWI402635 B TW I402635B TW 97139884 A TW97139884 A TW 97139884A TW 97139884 A TW97139884 A TW 97139884A TW I402635 B TWI402635 B TW I402635B
Authority
TW
Taiwan
Prior art keywords
substrate
developer
discharge ports
developing
control unit
Prior art date
Application number
TW97139884A
Other languages
English (en)
Chinese (zh)
Other versions
TW200933313A (en
Inventor
Harumoto Masahiko
Yamaguchi Akira
Hisai Akihiro
Sugiyama Minoru
Kuroda Takuya
Original Assignee
Sokudo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40563633&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI402635(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sokudo Co Ltd filed Critical Sokudo Co Ltd
Publication of TW200933313A publication Critical patent/TW200933313A/zh
Application granted granted Critical
Publication of TWI402635B publication Critical patent/TWI402635B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
TW97139884A 2007-10-18 2008-10-17 顯影裝置 TWI402635B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007271366A JP5449662B2 (ja) 2007-10-18 2007-10-18 現像装置

Publications (2)

Publication Number Publication Date
TW200933313A TW200933313A (en) 2009-08-01
TWI402635B true TWI402635B (zh) 2013-07-21

Family

ID=40563633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97139884A TWI402635B (zh) 2007-10-18 2008-10-17 顯影裝置

Country Status (5)

Country Link
US (3) US20090103960A1 (ja)
JP (1) JP5449662B2 (ja)
KR (2) KR20090039605A (ja)
CN (1) CN101414132B (ja)
TW (1) TWI402635B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5449662B2 (ja) 2007-10-18 2014-03-19 株式会社Ｓｏｋｕｄｏ 現像装置
CN101907834B (zh) * 2009-06-03 2011-12-21 沈阳芯源微电子设备有限公司 真空显影机构
CN102645854A (zh) * 2011-04-20 2012-08-22 京东方科技集团股份有限公司 显影液喷淋***及方法、基板产品
CN103630959A (zh) * 2013-03-05 2014-03-12 苏州秀诺光电科技有限公司 一种全息光栅的显影方法及其专用设备
JP6390732B2 (ja) * 2013-08-05 2018-09-19 東京エレクトロン株式会社 処理液供給装置
JP6221954B2 (ja) * 2013-08-05 2017-11-01 東京エレクトロン株式会社 現像方法、現像装置及び記憶媒体
CN103424997B (zh) * 2013-08-30 2016-05-18 中国电子科技集团公司第二十六研究所 光刻工艺的显影方法
KR20150064430A (ko) * 2013-12-03 2015-06-11 삼성전자주식회사 스핀 코팅 장치 및 스핀 코팅 방법
JP6093321B2 (ja) * 2014-03-17 2017-03-08 東京エレクトロン株式会社 塗布装置、塗布方法及び記録媒体
JP6545464B2 (ja) * 2015-01-07 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス 現像方法
US10332761B2 (en) 2015-02-18 2019-06-25 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP6504540B2 (ja) * 2015-02-25 2019-04-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6432941B2 (ja) * 2015-02-25 2018-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6509583B2 (ja) * 2015-02-25 2019-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置
KR102000019B1 (ko) * 2017-04-28 2019-07-18 세메스 주식회사 액 공급 유닛, 기판 처리 장치, 기판 처리 방법
CN112612188A (zh) * 2020-12-17 2021-04-06 泉芯集成电路制造(济南)有限公司 一种显影装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962070A (en) * 1997-09-25 1999-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
JP2005210059A (ja) * 2003-12-26 2005-08-04 Tokyo Electron Ltd 現像装置及び現像処理方法

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JPH1111603A (ja) 1997-06-12 1999-01-19 Tomy & Brain Corp キッチン流し台における生ゴミ処理装置
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JP3605545B2 (ja) * 1999-06-09 2004-12-22 東京エレクトロン株式会社 現像処理方法および現像処理装置
TW505822B (en) 1999-06-09 2002-10-11 Tokyo Electron Ltd Developing method and developing apparatus
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JP4537109B2 (ja) * 2004-04-16 2010-09-01 東京エレクトロン株式会社 現像処理装置および現像処理方法
JP4464763B2 (ja) 2004-08-20 2010-05-19 東京エレクトロン株式会社 現像装置及び現像方法
JP4494332B2 (ja) * 2005-11-29 2010-06-30 東京エレクトロン株式会社 リンス処理方法、現像処理装置、および制御プログラム
JP5449662B2 (ja) 2007-10-18 2014-03-19 株式会社Ｓｏｋｕｄｏ 現像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962070A (en) * 1997-09-25 1999-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
JP2005210059A (ja) * 2003-12-26 2005-08-04 Tokyo Electron Ltd 現像装置及び現像処理方法

Also Published As

Publication number Publication date
KR101213284B1 (ko) 2012-12-20
US8956695B2 (en) 2015-02-17
US20150104747A1 (en) 2015-04-16
CN101414132B (zh) 2012-01-11
US20120122038A1 (en) 2012-05-17
KR20110102261A (ko) 2011-09-16
KR20090039605A (ko) 2009-04-22
JP5449662B2 (ja) 2014-03-19
US20090103960A1 (en) 2009-04-23
TW200933313A (en) 2009-08-01
CN101414132A (zh) 2009-04-22
JP2009099851A (ja) 2009-05-07
US9581907B2 (en) 2017-02-28

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