TWI400733B - 固態電解電容器 - Google Patents
固態電解電容器 Download PDFInfo
- Publication number
- TWI400733B TWI400733B TW096148578A TW96148578A TWI400733B TW I400733 B TWI400733 B TW I400733B TW 096148578 A TW096148578 A TW 096148578A TW 96148578 A TW96148578 A TW 96148578A TW I400733 B TWI400733 B TW I400733B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- solid electrolytic
- electrolytic capacitor
- anode
- cathode
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims description 49
- 239000007787 solid Substances 0.000 title claims description 26
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000011888 foil Substances 0.000 description 4
- 239000007784 solid electrolyte Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical class CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920000414 polyfuran Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007127611A JP4895035B2 (ja) | 2007-05-14 | 2007-05-14 | 固体電解コンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200845066A TW200845066A (en) | 2008-11-16 |
TWI400733B true TWI400733B (zh) | 2013-07-01 |
Family
ID=40027245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096148578A TWI400733B (zh) | 2007-05-14 | 2007-12-19 | 固態電解電容器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080285209A1 (ja) |
JP (1) | JP4895035B2 (ja) |
CN (1) | CN101308729B (ja) |
TW (1) | TWI400733B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8199462B2 (en) * | 2008-09-08 | 2012-06-12 | Avx Corporation | Solid electrolytic capacitor for embedding into a circuit board |
JP5450001B2 (ja) * | 2009-11-27 | 2014-03-26 | 三洋電機株式会社 | 電解コンデンサの製造方法 |
US8514550B2 (en) * | 2011-03-11 | 2013-08-20 | Avx Corporation | Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive |
US9545008B1 (en) | 2016-03-24 | 2017-01-10 | Avx Corporation | Solid electrolytic capacitor for embedding into a circuit board |
JP7178609B2 (ja) * | 2018-11-30 | 2022-11-28 | パナソニックIpマネジメント株式会社 | 電解コンデンサ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0267625U (ja) * | 1988-11-09 | 1990-05-22 | ||
JP2004071745A (ja) * | 2002-08-05 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6027177B2 (ja) * | 1980-04-02 | 1985-06-27 | 松下電器産業株式会社 | チップ状固体電解コンデンサおよびその製造方法 |
US4541034A (en) * | 1984-04-26 | 1985-09-10 | At&T Technologies, Inc. | Electrical terminal and method of securing same in circuit substrate thru-hole |
JP3129033B2 (ja) * | 1993-06-16 | 2001-01-29 | 昭和電工株式会社 | チップ状固体電解コンデンサ |
JP3238803B2 (ja) * | 1993-08-24 | 2001-12-17 | ローム株式会社 | 面実装型有極性電子部品の基板実装構造 |
US6449140B1 (en) * | 2000-07-07 | 2002-09-10 | Showa Denko K.K. | Solid electrolytic capacitor element and method for producing the same |
JP2002305363A (ja) * | 2001-04-09 | 2002-10-18 | Matsushita Electric Ind Co Ltd | 表面実装型電子部品 |
KR100466071B1 (ko) * | 2002-05-22 | 2005-01-13 | 삼성전기주식회사 | 고체전해 콘덴서 |
JP2004247594A (ja) * | 2003-02-14 | 2004-09-02 | Nec Tokin Corp | チップ型コンデンサ及びその製造方法並びにモールド金型 |
US7542267B2 (en) * | 2006-11-06 | 2009-06-02 | Nec Tokin Corporation | Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method |
-
2007
- 2007-05-14 JP JP2007127611A patent/JP4895035B2/ja not_active Expired - Fee Related
- 2007-12-19 TW TW096148578A patent/TWI400733B/zh not_active IP Right Cessation
- 2007-12-26 CN CN2007101943718A patent/CN101308729B/zh not_active Expired - Fee Related
-
2008
- 2008-05-09 US US12/118,096 patent/US20080285209A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0267625U (ja) * | 1988-11-09 | 1990-05-22 | ||
JP2004071745A (ja) * | 2002-08-05 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ |
Also Published As
Publication number | Publication date |
---|---|
TW200845066A (en) | 2008-11-16 |
JP2008283094A (ja) | 2008-11-20 |
CN101308729B (zh) | 2012-07-04 |
US20080285209A1 (en) | 2008-11-20 |
CN101308729A (zh) | 2008-11-19 |
JP4895035B2 (ja) | 2012-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |