TWI386768B - Substrate process system and group management system - Google Patents

Substrate process system and group management system Download PDF

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TWI386768B
TWI386768B TW097110462A TW97110462A TWI386768B TW I386768 B TWI386768 B TW I386768B TW 097110462 A TW097110462 A TW 097110462A TW 97110462 A TW97110462 A TW 97110462A TW I386768 B TWI386768 B TW I386768B
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substrate processing
information
configuration
management
management device
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TW200848964A (en
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Kazuhide Asai
Hiroyuki Iwakura
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Hitachi Int Electric Inc
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description

基板處理系統以及群組管理系統Substrate processing system and group management system

本發明係關於處理半導體基板或玻璃基板等的基板處理系統以及群組管理系統。The present invention relates to a substrate processing system and a group management system for processing a semiconductor substrate, a glass substrate, and the like.

這種基板處理系統中包含在基板上施行處理的複數個基板處理裝置、進行該複數個基板處理裝置之運作狀態的監視以及生產履歷等的儲存的群組管理裝置。藉由使用這種群組管理裝置，能謀求半導體生產的效率提升。Such a substrate processing system includes a plurality of substrate processing apparatuses that perform processing on a substrate, a group management apparatus that performs storage of monitoring the operation state of the plurality of substrate processing apparatuses, and production history. By using such a group management device, the efficiency of semiconductor production can be improved.

不過，在以往的基板處理系統中，與群組管理裝置連接的基板處理裝置之數量方面設定有上限，基板處理裝置的數量超過此上限值的情況下，必須採取使基板處理系統本身二分化的構成。另外，在即使基板處理裝置之數量為例如1台而也超過上限值的情況下，因為需要新的1式群組管理裝置，所以對終端使用者而言，在成本方面的負擔會突然增大。此外，在變更基板處理裝置的連接構成時，大多會需要資料的轉移、系統參數之調整等的時間。However, in the conventional substrate processing system, when the number of substrate processing apparatuses connected to the group management apparatus is set to an upper limit, and the number of substrate processing apparatuses exceeds the upper limit value, it is necessary to take the substrate processing system itself into two. Composition. In addition, even if the number of substrate processing apparatuses exceeds the upper limit value, for example, since a new type 1 group management apparatus is required, the burden on the terminal is suddenly increased for the terminal user. Big. Further, when changing the connection configuration of the substrate processing apparatus, time such as transfer of data and adjustment of system parameters are often required.

本發明之目的在於提供基板處理系統以及群組管理系統，其即使在連接之基板處理裝置的數量增大時，也不會增加群組管理裝置，且能夠和多數基板處理裝置進行連接。An object of the present invention is to provide a substrate processing system and a group management system which can be connected to a plurality of substrate processing apparatuses without increasing the group management apparatus even when the number of connected substrate processing apparatuses is increased.

為了達成上述目的，本發明的基板處理系統係具有： 處理基板的複數個基板處理裝置；以及連接於前述基板處理裝置的群組管理系統，而前述群組管理系統係具有：構成資訊記憶裝置，其記憶有定義連接構成的構成資訊；複數個通信裝置，其根據前述構成資訊，在與前述複數個基板處理裝置之至少任意一個之間進行通信；以及裝置資訊儲存裝置，其儲存基板處理裝置之相關資訊，該基板處理裝置係根據前述構成資訊而連接於前述複數個通信裝置之任一個，且在和前述通信裝置之間進行通信。In order to achieve the above object, the substrate processing system of the present invention has: a plurality of substrate processing apparatuses for processing a substrate; and a group management system connected to the substrate processing apparatus, wherein the group management system includes: an information storage device that stores constituent information defining a connection configuration; and a plurality of communication devices And communicating with at least one of the plurality of substrate processing apparatuses according to the configuration information; and the device information storage device storing information related to the substrate processing apparatus, wherein the substrate processing apparatus is connected according to the composition information Any of the plurality of communication devices, and communicating with the communication device.

另外，本發明的群組管理系統係連接於處理基板的複數個基板處理裝置的群組管理系統，且具有：構成資訊記憶裝置，其記憶有定義前述基板處理系統內之連接構成的構成資訊；複數個通信裝置，其根據前述構成資訊，在與前述複數個基板處理裝置之至少任意一個之間進行通信；以及裝置資訊儲存裝置，其儲存基板處理裝置之相關資訊，該基板處理裝置係根據記憶於前述構成資訊記憶裝置之構成資訊而連接於前述複數個通信裝置之任一個，且在和前述通信裝置之間進行通信。Further, the group management system of the present invention is connected to a group management system of a plurality of substrate processing apparatuses for processing a substrate, and has a configuration information storage device that stores configuration information defining a connection configuration in the substrate processing system; a plurality of communication devices that communicate with at least one of the plurality of substrate processing devices based on the configuration information; and device information storage devices that store information related to the substrate processing device, the substrate processing device being memory based The configuration information of the information memory device is connected to any one of the plurality of communication devices, and communicates with the communication device.

藉由本發明的基板處理系統，因為具有：構成資訊記憶裝置，其管理本系統全體的連接構成；通信裝置，其與基板處理裝置進行通信；以及裝置資訊儲存裝置，其儲存有從基板處理裝置介由該通信裝置發送的資訊，所以即使在連接之基板處理裝置的數量增大時，也不會增加群組管理裝置，且能夠和多數基板處理裝置進行連接。The substrate processing system of the present invention has a configuration in which the information storage device is configured to manage the entire connection of the system, a communication device that communicates with the substrate processing device, and a device information storage device that stores the slave substrate processing device. Since the information transmitted by the communication device is increased, the group management device is not added and the connection with a plurality of substrate processing devices can be performed even when the number of connected substrate processing devices is increased.

首先，根據第1圖至第2圖來說明本發明的背景。First, the background of the present invention will be described based on Figs. 1 to 2 .

第1圖係表示含有系統A和系統B之基板處理系統1的構成的圖。Fig. 1 is a view showing the configuration of a substrate processing system 1 including a system A and a system B.

如第1圖所示，基板處理系統1係具有複數個基板處理裝置10-1~10-n以及群組管理裝置100。基板處理裝置10-1~10-n以及群組管理裝置100係介由例如LAN、WAN等的網路12而連接。因此，資料係在基板處理裝置10-1~10-n以及群組管理裝置100之間，介由網路12而被發送及接收。此外，當未特別指定基板處理裝置10-1~10-n等之有複數構成部分的任一個而進行表示時，有時會僅略稱為基板處理裝置10等。As shown in FIG. 1, the substrate processing system 1 includes a plurality of substrate processing apparatuses 10-1 to 10-n and a group management apparatus 100. The substrate processing apparatuses 10-1 to 10-n and the group management apparatus 100 are connected via a network 12 such as a LAN or a WAN. Therefore, the data is transmitted and received between the substrate processing apparatuses 10-1 to 10-n and the group management apparatus 100 via the network 12. In addition, when the substrate processing apparatuses 10-1 to 10-n are not specifically designated as having any of the plurality of components, the substrate processing apparatus 10 or the like may be simply referred to.

基板處理裝置10係根據製程配方(process recipe)等來實行基板的處理。具體而言，在製程配方中記載有用於處理基板的順序，基板處理裝置10係根據此順序來進行裝置內之構成要件的控制。另外，基板處理裝置10係介由網路12而對群組管理裝置發送包含溫度資訊、壓力資訊、故障資訊等的裝置本身之運轉狀態的相關資料。The substrate processing apparatus 10 performs processing of a substrate in accordance with a process recipe or the like. Specifically, the order of processing the substrate is described in the process recipe, and the substrate processing apparatus 10 performs control of constituent elements in the apparatus in accordance with the order. Further, the substrate processing apparatus 10 transmits the related information of the operation state of the apparatus itself including the temperature information, the pressure information, the failure information, and the like to the group management apparatus via the network 12.

基板處理裝置10，作為一例，係構成為半導體裝置(IC)的製造方法之實施處理裝置的半導體製造裝置。此外，在以下的說明中，則描述採用作為基板處理裝置而在基板上進行氧化、擴散處理和CVD處理等的縱型裝置之實施例。The substrate processing apparatus 10 is, for example, a semiconductor manufacturing apparatus that implements a processing apparatus of a semiconductor device (IC) manufacturing method. Further, in the following description, an embodiment in which a vertical device which performs oxidation, diffusion treatment, CVD treatment, or the like on a substrate as a substrate processing apparatus will be described.

群組管理裝置100係接收從基板處理裝置10發送之與基板處理裝置10的運轉狀態相關的資料，並進行儲存以及 畫面的表示。另外，群組管理裝置100係對基板處理裝置10發送和製程配方等之基板處理裝置10相關的資料。The group management device 100 receives the data related to the operation state of the substrate processing device 10 transmitted from the substrate processing device 10, and stores the data. The representation of the picture. Further, the group management device 100 transmits the material related to the substrate processing apparatus 10 such as the process recipe to the substrate processing apparatus 10.

在群組管理裝置100中預先設定可連接之基板處理裝置10的數量最大值。在基板處理裝置10的數量超過該最大值的時候，追加第2台群組管理裝置100，系統本身被分割。The maximum number of connectable substrate processing apparatuses 10 is set in advance in the group management apparatus 100. When the number of the substrate processing apparatuses 10 exceeds the maximum value, the second group management apparatus 100 is added, and the system itself is divided.

如第1圖所示，在系統A以及系統B中分別包含群組管理裝置100以及基板處理裝置10。系統A中包含1台群組管理裝置100-1以及N1台基板處理裝置10-1~10-N1，系統B中包含1台群組管理裝置100-2以及N2台基板處理裝置10-(N1+1)~10-(N1+N2)。例如，可連接於1個群組管理裝置100的基板處理裝置10之數量最大值為32的時候，在系統A以及系統B中則包含最大32台基板處理裝置10。基板處理裝置10的數量例如是64的時候，如這般，系統A以及系統B分別必須包含32台基板處理裝置10。此外，系統A以及系統B等被包含於基板處理系統1中的系統也稱為子系統。As shown in FIG. 1, the group management device 100 and the substrate processing device 10 are included in the system A and the system B, respectively. The system A includes one group management device 100-1 and N1 substrate processing devices 10-1 to 10-N1, and the system B includes one group management device 100-2 and N2 substrate processing device 10-(N1). +1)~10-(N1+N2). For example, when the maximum number of substrate processing apparatuses 10 connectable to one group management apparatus 100 is 32, the system A and the system B include a maximum of 32 substrate processing apparatuses 10. When the number of the substrate processing apparatuses 10 is, for example, 64, as described above, the system A and the system B must respectively include 32 substrate processing apparatuses 10. Further, the system included in the substrate processing system 1 such as the system A and the system B is also referred to as a subsystem.

複數個子系統被包含於基板處理系統1的時候，基板處理裝置10係在與包含該基板處理裝置10之子系統相同的子系統中包含的基板處理裝置10之間，能進行資料的接收及發送。因此，資料介由群組管理裝置100而被容易地複製到其他基板處理裝置10。另一方面，基板處理裝置10係在與包含該基板處理裝置10之子系統不同的子系統中包含的基板處理裝置10之間，無法進行資料的接收及發 送。因此，使用者在不同的子系統所包含之基板處理裝置10之間複製資料時，無法容易地進行複製資料。因此，例如，在系統A的基板處理裝置10中，進行配方‘的變更時，使此變更反映在系統B的基板處理裝置10上，變成很麻煩，而可能招致基板處理系統1之運轉率下降。When a plurality of subsystems are included in the substrate processing system 1, the substrate processing apparatus 10 can receive and transmit data between the substrate processing apparatuses 10 included in the same subsystem as the subsystem including the substrate processing apparatus 10. Therefore, the data is easily copied to the other substrate processing apparatus 10 via the group management apparatus 100. On the other hand, the substrate processing apparatus 10 is incapable of receiving and transmitting data between the substrate processing apparatuses 10 included in the subsystem different from the subsystem including the substrate processing apparatus 10. give away. Therefore, when the user copies data between the substrate processing apparatuses 10 included in different subsystems, the data cannot be easily copied. Therefore, for example, when the recipe ' is changed in the substrate processing apparatus 10 of the system A, it is troublesome to reflect this change on the substrate processing apparatus 10 of the system B, which may cause the operation rate of the substrate processing system 1 to decrease. .

另外，群組管理裝置100係將該群組管理裝置100之子系統中所包含的基板處理裝置10之一覽顯示於畫面上。群組管理裝置100無法將不同的子系統中包含之基板處理裝置10作為一覽而顯示於畫面上。因此，因為無法同時閱覽基板處理系統1所包含之全部基板處理裝置10的相關資訊，所以使用者很難掌握系統全體的運轉率。另外，使用者不易進行基板處理系統1中包含之基板處理裝置10的比較。Further, the group management device 100 displays a list of the substrate processing apparatuses 10 included in the subsystem of the group management device 100 on the screen. The group management device 100 cannot display the substrate processing device 10 included in the different subsystems as a list on the screen. Therefore, since it is impossible to simultaneously view the related information of all the substrate processing apparatuses 10 included in the substrate processing system 1, it is difficult for the user to grasp the operation rate of the entire system. Further, it is difficult for the user to compare the substrate processing apparatus 10 included in the substrate processing system 1.

此外，使用者有時在變更基板處理系統1之構成的情況下，負擔會變重。例如，在子系統中包含之基板處理裝置10的數量為前述最大值之構成中，增設1台基板處理裝置10時，必須增設1台群組管理裝置100。因此，使用者必須籌措龐大的裝置增設費用。Further, when the user changes the configuration of the substrate processing system 1, the user may become heavier. For example, in the configuration in which the number of the substrate processing apparatuses 10 included in the subsystem is the maximum value, when one substrate processing apparatus 10 is added, one group management apparatus 100 must be added. Therefore, users must raise huge equipment to add costs.

另外，例如在基板處理裝置10被移設至現在所被包含之子系統不同的子系統時，在這些子系統的群組管理裝置100之間，必須轉移資料。Further, for example, when the substrate processing apparatus 10 is moved to a subsystem different from the subsystem currently included, data must be transferred between the group management apparatuses 100 of these subsystems.

第2圖係說明在不同的子系統之間的基板處理裝置10之轉移的圖。Figure 2 is a diagram illustrating the transfer of substrate processing apparatus 10 between different subsystems.

如第2圖所示，基板處理裝置10從系統A移設至系統 B的時候，該基板處理裝置10的相關資料必須從系統A的群組管理裝置100-1轉移到系統B的群組管理裝置100-2。在群組管理裝置100-2中預先記憶有系統B之基板處理裝置10的相關構成資訊。除了這構成資訊以外，基板處理裝置10-k之相關構成資訊必須於群組管理裝置100-2重新製作，並儲存於硬碟機(HDD)等。另外，因為構成資訊被反映在群組管理裝置100起動時，所以群組管理裝置100-2必須再起動。因此，構成變更作業所需要的時間就是被記憶於群組管理裝置100-2的構成資訊之變更作業和群組管理裝置100-2之再起動所需要的時間。As shown in FIG. 2, the substrate processing apparatus 10 is transferred from the system A to the system. At time B, the related material of the substrate processing apparatus 10 must be transferred from the group management apparatus 100-1 of the system A to the group management apparatus 100-2 of the system B. The related configuration information of the substrate processing apparatus 10 of the system B is previously stored in the group management apparatus 100-2. In addition to this configuration information, the related constituent information of the substrate processing apparatus 10-k must be newly created by the group management apparatus 100-2 and stored in a hard disk drive (HDD) or the like. Further, since the composition information is reflected when the group management device 100 is activated, the group management device 100-2 must be restarted. Therefore, the time required to constitute the change operation is the time required to change the configuration information stored in the group management device 100-2 and the restart of the group management device 100-2.

群組管理裝置100係將含有子系統中包含的基板處理裝置10之相關例如裝置固有參數的裝置資訊或履歷資料(logging data)等之在基板處理時所產生的資料，儲存於該群組管理裝置100的硬碟機(HDD)中。所以，此被儲存的資料在基板處理裝置10轉移到不同的子系統時，會被儲存在轉移目標之子系統所包含的群組管理裝置100之HDD中。此外，在移設基板處理裝置10的時候，系統參數的調整以及動作確認也需要時間。此外，系統參數是定義基板處理系統1或者子系統的構成的參數，亦即指定基板處理裝置10的連接裝置、連接數等。The group management device 100 stores the data generated during the substrate processing, such as device information or log data of the substrate processing device 10 included in the subsystem, for example, device-specific parameters, in the group management. In the hard disk drive (HDD) of the device 100. Therefore, when the substrate processing device 10 is transferred to a different subsystem, the stored data is stored in the HDD of the group management device 100 included in the subsystem of the transfer destination. Further, when the substrate processing apparatus 10 is transferred, it takes time to adjust the system parameters and confirm the operation. Further, the system parameter is a parameter defining the configuration of the substrate processing system 1 or the subsystem, that is, the connection device of the substrate processing apparatus 10, the number of connections, and the like.

接著，說明本發明之實施形態的基板處理系統2。Next, a substrate processing system 2 according to an embodiment of the present invention will be described.

第3圖係表示本發明之實施形態的基板處理系統2之構成的圖。Fig. 3 is a view showing the configuration of a substrate processing system 2 according to an embodiment of the present invention.

如第3圖所示，基板處理系統2係具有複數個基板處 理裝置10-1~10-n、作為顯示手段以及指示手段的終端裝置6以及群組管理系統7。群組管理系統7中，包含作為記憶構成資訊之構成資訊記憶裝置的1個構成管理裝置3、作為通信裝置之1個以上的連接管理裝置4、以及作為儲存基板處理裝置10之相關資訊的裝置資訊儲存裝置之1個以上的資料管理裝置5。基板處理裝置10、構成管理裝置3、連接管理裝置4、資料管理裝置5以及終端裝置6係介由網路12而連接。此外，在基板處理系統2中，基板處理裝置10、構成管理裝置3、連接管理裝置4、資料管理裝置5以及終端裝置6的各個都被稱為硬體。另外，有時分別將構成管理裝置3、連接管理裝置4、資料管理裝置5略稱為GDB、EDS、EDB。As shown in FIG. 3, the substrate processing system 2 has a plurality of substrates The device 10-1 to 10-n, the terminal device 6 as a display means and an instruction means, and the group management system 7. The group management system 7 includes one configuration management device 3 constituting the information storage device as the memory configuration information, one or more connection management devices 4 as the communication device, and devices as the related information for storing the substrate processing device 10. One or more data management devices 5 of the information storage device. The substrate processing apparatus 10, the configuration management apparatus 3, the connection management apparatus 4, the material management apparatus 5, and the terminal apparatus 6 are connected via the network 12. Further, in the substrate processing system 2, each of the substrate processing apparatus 10, the configuration management apparatus 3, the connection management apparatus 4, the material management apparatus 5, and the terminal apparatus 6 is referred to as a hardware. Further, the configuration management device 3, the connection management device 4, and the material management device 5 may be referred to as GDB, EDS, and EDB, respectively.

在群組管理系統7中，構成管理裝置(GDB)3係記憶基板處理系統2的構成資訊。在構成資訊中包含各硬體的名稱、各硬體的連接構成等。構成資訊係被用來辨識連接管理裝置4等之其他硬體與自身作用及其他硬體的相關。另外，構成管理裝置3係存放基板處理系統2全體共有的資訊(共有資訊)。共有資訊係在基板處理裝置10中發生之發生頻率少的資訊或者是突發性發生的資訊，例如是基板處理裝置10之故障資訊和事件資訊等。In the group management system 7, the configuration management device (GDB) 3 is the configuration information of the memory substrate processing system 2. The composition information includes the name of each hardware, the connection structure of each hardware, and the like. The composition information is used to identify the relationship between other hardware such as the connection management device 4 and its own functions and other hardware. Further, the configuration management device 3 stores information (common information) shared by the entire substrate processing system 2. The shared information is information that occurs at a low frequency of occurrence in the substrate processing apparatus 10 or information that is suddenly generated, and is, for example, failure information and event information of the substrate processing apparatus 10.

連接管理裝置(EDS)4係根據記憶在構成管理裝置3的構成資訊而在與複數個基板處理裝置10之至少任一個之間進行通信。連接管理裝置4係接收來自基板處理裝置10的資訊，依照來自其他硬體的要求，對該硬體發送基板處 理裝置10的相關資訊。連接管理裝置4從構成管理裝置3接受已更新構成資訊的要旨通知時，根據已更新的構成資訊，而在複數個基板處理裝置10以及資料管理裝置5之至少任一個之間確立連接。The connection management device (EDS) 4 communicates with at least one of the plurality of substrate processing apparatuses 10 based on the configuration information constituting the management device 3. The connection management device 4 receives the information from the substrate processing device 10, and transmits the substrate to the hardware in accordance with requirements from other hardware. Information about the device 10. When the connection management device 4 receives the notification of the updated configuration information from the configuration management device 3, the connection management device 4 establishes a connection between at least one of the plurality of substrate processing devices 10 and the data management device 5 based on the updated configuration information.

資料管理裝置(EDB)5係根據記憶於構成管理裝置3的構成資訊而連接於複數個連接管理裝置4的任一個。資料管理裝置5係儲存與此連接之連接管理裝置4之間進行通信的基板處理裝置10的相關資訊。資料管理裝置5係介由連接管理裝置4來取得並蓄積來自基板處理裝置10發送的資料(事件資訊以及製程資訊)。該資訊相較於構成管理裝置3中蓄積的資訊，是發生頻率高且含有多數資料的資訊，例如是基板處理裝置10的溫度資訊、壓力資訊。The data management device (EDB) 5 is connected to any one of the plurality of connection management devices 4 based on the configuration information stored in the configuration management device 3. The data management device 5 stores information on the substrate processing device 10 that communicates with the connection management device 4 connected thereto. The data management device 5 acquires and accumulates data (event information and process information) transmitted from the substrate processing device 10 via the connection management device 4. This information is information that is high in frequency and contains a large amount of information compared to the information accumulated in the configuration management device 3, and is, for example, temperature information and pressure information of the substrate processing apparatus 10.

終端裝置6係在畫面上顯示被各硬體所蓄積的資訊，且構成對使用者進行資訊之提供的介面。更具體而言，終端裝置6係介由鍵盤或滑鼠等來接受使用者的要求，並判定該要求之相關資訊是否為任一硬體所蓄積之資訊，根據此判定結果，從對象的硬體取得資訊，在畫面上顯示該資訊。The terminal device 6 displays information accumulated by each hardware on the screen, and constitutes an interface for providing information to the user. More specifically, the terminal device 6 accepts the user's request via a keyboard or a mouse, and determines whether the related information of the request is information accumulated by any hardware, and based on the determination result, the object is hard. The body gets the information and displays the information on the screen.

此外，爾後詳細描述構成管理裝置3中所記憶的構成資訊以及在硬體上動作的程式。Further, the configuration information constituting the memory device 3 and the program operating on the hardware will be described in detail later.

接著，說明基板處理裝置10的詳細構成。Next, the detailed configuration of the substrate processing apparatus 10 will be described.

第4圖係表示本發明之實施形態的基板處理裝置10的立體圖。另外，第5圖係表示第4圖所示之基板處理裝置10之側面透視圖。Fig. 4 is a perspective view showing a substrate processing apparatus 10 according to an embodiment of the present invention. In addition, Fig. 5 is a side perspective view showing the substrate processing apparatus 10 shown in Fig. 4.

如第4圖以及第5圖所示，作為已收納由矽等所組成的晶圓(基板)200的晶圓載體，採用環架(基板收容器，以下稱為長型筒(pod))110的本發明之實施形態的基板處理裝置10係具備筐體111。在筐體111的正面壁111a之正面前方部係開設作為設置成可維護之開口部的正面維護口103，且分別建構有開閉此正面維護口103的正面維護門104、104。As shown in FIG. 4 and FIG. 5, a wafer carrier (a substrate receiving container, hereinafter referred to as a long pod) 110 is used as a wafer carrier that accommodates a wafer (substrate) 200 composed of a crucible or the like. The substrate processing apparatus 10 according to the embodiment of the present invention includes a housing 111. A front maintenance port 103 as an openable portion provided in the front side of the front wall 111a of the casing 111 is provided, and front maintenance doors 104 and 104 for opening and closing the front maintenance port 103 are respectively constructed.

在筐體111的正面壁111a上，長型筒搬入搬出口(基板收容器搬入搬出口)112被開設為連通筐體111內外，長型筒搬入搬出口112係藉由前窗板(基板收容器搬入搬出口開閉機構)113而開閉。在長型筒搬入搬出口112正面前方側上設置有載入埠(基板收容器接收台)114，載入埠114係構成為載置長型筒110並進行對位。長型筒110係藉由工程內搬送裝置(未圖示)而被搬入至載入埠114上，並且，從載入埠114上被搬出。In the front wall 111a of the casing 111, the long cylinder loading/unloading port (substrate receiving container loading and unloading port) 112 is opened to communicate with the inside and outside of the casing 111, and the long cylinder loading and unloading port 112 is closed by the front window panel. The container is moved into and out of the opening and closing mechanism 113 to open and close. A loading cassette (substrate receiving unit) 114 is provided on the front side of the front side of the long cylinder loading/unloading port 112, and the loading cassette 114 is configured to mount the long cylinder 110 and perform alignment. The elongated cylinder 110 is carried into the loading cassette 114 by an in-project conveying device (not shown), and is carried out from the loading cassette 114.

在筐體111內之前後方向的略中央部之上部係設置有旋轉式長型筒棚(基板收容器載置棚)105，旋轉式長型筒棚105係構成為保管複數個長型筒110。亦即，旋轉式長型筒棚105係具備：被垂直立設且在水平面內間歇旋轉的支柱116；以及在支柱116之上中下段的各位置上被支撐為放射狀的複數張棚板(基板收容器載置台)117，複數張棚板117係構成為將長型筒110以分別載置複數個的狀態下來進行保持。A rotatable long tubular shed (substrate receiving shed) 105 is provided in an upper portion of the casing 111 in a slightly central portion in the front-rear direction, and the rotary long-sleeve 105 is configured to store a plurality of elongated cylinders 110. . That is, the rotary elongated can 105 has a support 116 that is vertically erected and intermittently rotated in a horizontal plane, and a plurality of slabs that are radially supported at various positions in the lower middle section of the support 116 ( The substrate storage racks 117 and the plurality of sheds 117 are configured to hold the long cylinders 110 in a plurality of states.

在筐體111內的載入埠114與旋轉式長型筒棚105之 間設置有長型筒搬送裝置(基板收容器搬送裝置)118，長型筒搬送裝置118係由保持著長型筒110而可升降的長型筒升降梯(基板收容器升降機構)118a及作為搬送機構之長型筒搬送機構(基板收容器搬送機構)118b所構成，長型筒搬送裝置118係構成為藉由長型筒升降梯118a與長型筒搬送機構118b的連續動作，在載入埠114、旋轉式長型筒棚105、長型筒開啟機(基板收容器蓋體開閉機構)121之間搬送長型筒110。Loading raft 114 in the housing 111 and the rotary long can 105 A long cylinder conveying device (substrate container conveying device) 118 is provided, and the long cylinder conveying device 118 is a long cylinder lifting platform (substrate receiving and lowering mechanism) 118a that can be raised and lowered while holding the elongated cylinder 110. The long cylinder transport mechanism (substrate container transport mechanism) 118b of the transport mechanism is configured, and the long cylinder transport device 118 is configured to be continuously loaded by the long cylinder lift 118a and the long cylinder transport mechanism 118b. The long cylinder 110 is conveyed between the crucible 114, the rotary long cylinder 105, and the long cylinder opening machine (substrate receiving lid opening and closing mechanism) 121.

在筐體111內之前後方向的略中央部的下部，副筐體119係被構築為涵蓋後端。在副筐體119的正面壁119a上，開設了一對晶圓搬入搬出口(基板搬入搬出口)120，其在垂直方向上並列成上下二段，用以對副筐體119進行晶圓200的搬入搬出，在上下段的搬入搬出口120、120上，分別設置一對長型筒開啟機121、121。長型筒開啟機121係具備載置長型筒110的載置台122、122及裝卸長型筒110之帽蓋(蓋體)的帽蓋裝卸機構(蓋體裝卸機構)123、123。長型筒開啟機121係構成為：利用帽蓋裝卸能機構123來裝卸載置於載置台122的長型筒110之帽蓋，藉以開閉長型筒110之晶圓出入口。In the lower portion of the casing 111 in the slightly central portion in the front-rear direction, the sub-housing 119 is constructed to cover the rear end. A pair of wafer loading/unloading ports (substrate loading/unloading ports) 120 are formed in the front wall 119a of the sub-casing 119, and are vertically arranged in the vertical direction to perform the wafer 200 on the sub-casing 119. In the loading and unloading ports 120 and 120 of the upper and lower stages, a pair of elongated cylinder openers 121 and 121 are provided. The long cylinder opener 121 includes cap mounting mechanisms (cover attachment mechanisms) 123 and 123 for placing the mounting tables 122 and 122 of the elongated cylinder 110 and the caps (covers) for attaching and detaching the elongated cylinders 110. The long cylinder opener 121 is configured such that the cap attachment/detachment mechanism 123 is used to attach and detach the cap of the elongated cylinder 110 placed on the mounting table 122, thereby opening and closing the wafer inlet and outlet of the elongated cylinder 110.

副筐體119係構成移載室124，其流體地與長型筒搬送裝置118和旋轉式長型筒棚105的設置空間隔絕。在移載室124的前側區域上設置晶圓移載機構(基板移載機構)125，晶圓移載機構125由以下所構成為：可使晶圓200在水平方向上轉動或者直行運動的晶圓移載裝置(基板移 載裝置)125a、以及用以使晶圓移載裝置125a升降的晶圓移載裝置升降梯(基板移載裝置升降機構)125b。如第4圖模式地表示，晶圓移載裝置升降梯125b係被設置在耐壓筐體111右側端部和副筐體119之移載室124前方區域右端部之間。構成為藉由這些晶圓移載裝置升降梯125b及晶圓移載裝置125a的連續動作，以晶圓移載裝置125a的箝夾(基板保持體)125c作為晶圓200的載置部，對晶舟(基板保持具)217裝填(charging)以及卸下(discharging)晶圓200。The sub-cassette 119 constitutes a transfer chamber 124 that is fluidly isolated from the installation space of the elongated cylinder transfer device 118 and the rotary elongated can 105. A wafer transfer mechanism (substrate transfer mechanism) 125 is disposed on a front side region of the transfer chamber 124. The wafer transfer mechanism 125 is configured as follows: a crystal that can rotate the wafer 200 in a horizontal direction or move straight. Circular transfer device The carrier device 125a and the wafer transfer device lift (substrate transfer device elevating mechanism) 125b for moving the wafer transfer device 125a up and down. As schematically shown in Fig. 4, the wafer transfer device lifter 125b is disposed between the right end portion of the pressure resistant casing 111 and the right end portion of the front region of the transfer chamber 124 of the sub-chamber 119. By the continuous operation of the wafer transfer device lift 125b and the wafer transfer device 125a, the clamp (substrate holder) 125c of the wafer transfer device 125a is used as the mounting portion of the wafer 200, The wafer boat (substrate holder) 217 is loading and discharging the wafer 200.

在移載室124的後側區域上構成收容晶舟217並使之待機的待機部126。在待機部126上方設有處理爐202。處理爐202下端部係構成為藉由爐口窗板(爐口開閉機構)147而開閉。A standby portion 126 that accommodates the wafer boat 217 and stands by is formed in the rear side region of the transfer chamber 124. A processing furnace 202 is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace opening window (furnace opening and closing mechanism) 147.

如第4圖模式地表示，在耐壓筐體111右側端部和副筐體119的待機部126右端部之間，設置用以使晶舟217升降的晶舟升降梯(基板保持具升降機構)115。在作為與晶舟升降梯115之升降台連結之連結具的臂部128上，水平地安裝作為蓋體的密封帽蓋219，密封帽蓋219之構成係垂直地支撐晶舟217，且可堵塞處理爐202下端部。晶舟217之構成係具備複數根保持構件，在使複數片(例如50~125片左右)晶圓200中心對齊並在垂直方向上整齊排列的狀態下，分別保持為水平。As shown in Fig. 4, a boat lift (a substrate holder elevating mechanism for lifting and lowering the boat 217) is provided between the right end portion of the pressure resistant casing 111 and the right end portion of the standby portion 126 of the sub-chamber 119. ) 115. A seal cap 219 as a cover is horizontally mounted on the arm portion 128 as a joint to the lift platform of the boat elevator 115. The seal cap 219 is configured to vertically support the boat 217 and is closable. The lower end of the furnace 202 is treated. The configuration of the wafer boat 217 includes a plurality of holding members, and is held horizontally in a state in which a plurality of wafers (for example, about 50 to 125 wafers) 200 are aligned in the center and aligned in the vertical direction.

如第4圖模式地表示，在移載室124之晶圓移載裝置升降梯125b側以及晶舟升降梯115側之相反側的左側端部上設置有清潔單元134，其係由供給已乾淨化的空氣或者惰 性氣體的清潔空氣133的供給風扇以及防塵濾器所構成，在晶圓移載裝置125a和清潔單元134之間，雖未圖示，但設置有凹口對準裝置135，其作為整合晶圓之圓周方向之位置的基板整合裝置。As schematically shown in FIG. 4, a cleaning unit 134 is provided on the left end portion of the wafer transfer device lift 125b side of the transfer chamber 124 and the opposite side of the boat lift 115 side, and the supply is cleaned. Air or inert A supply fan and a dust filter for the clean air 133 of the gas are disposed between the wafer transfer device 125a and the cleaning unit 134, although not shown, but a notch alignment device 135 is provided as an integrated wafer. Substrate integration device in the circumferential direction.

從清潔單元134吹出的清潔空氣133在流通於凹口對準裝置135及晶圓移載裝置125a、位於待機部126的晶舟217以後，被未圖示的導管所吸入，或者被排出至筐體111外部，或者是在清潔單元134之吸入側的一次側(供給側)進行循環，再次藉由清潔單元134，而被吹出至移載室124內。The cleaning air 133 blown out from the cleaning unit 134 flows through the notch aligning device 135, the wafer transfer device 125a, and the wafer boat 217 located in the standby unit 126, and is sucked by a duct (not shown) or discharged to the basket. The outside of the body 111 or the primary side (supply side) on the suction side of the cleaning unit 134 is circulated, and is again blown out into the transfer chamber 124 by the cleaning unit 134.

接著，說明設在基板處理裝置10內，進行基板處理裝置10內之各裝置的控制的製程模組控制器(PMC)14。Next, a process module controller (PMC) 14 provided in the substrate processing apparatus 10 and controlling each device in the substrate processing apparatus 10 will be described.

第6圖係表示以PMC14為中心的基板處理裝置10的功能構成。Fig. 6 is a view showing the functional configuration of the substrate processing apparatus 10 centering on the PMC 14.

如第6圖所示，PMC14係具有：CPU140；ROM142；RAM144；記憶資料的硬碟機(HDD)158；輸入輸出介面(IF)146，在與顯示器等之顯示裝置以及包含鍵盤等之輸入裝置的輸入裝置147之間進行資料之收發；通信控制部156，其介由網路12而在與其它硬體(連接管理裝置4等)之間控制資料通信；以及I/O控制部148，其進行溫度控制部150、氣體控制部152、壓力控制部154以及溫度控制部150等的I/O控制。這些構成要件係介由匯流排160而相互連接，資料在構成要件之間介由匯流排160而進行輸入輸出。As shown in FIG. 6, the PMC 14 has a CPU 140, a ROM 142, a RAM 144, a hard disk drive (HDD) 158 for storing data, an input/output interface (IF) 146, a display device such as a display, and an input device including a keyboard. The input device 147 performs data transmission and reception; the communication control unit 156 controls data communication with other hardware (connection management device 4, etc.) via the network 12; and an I/O control unit 148. I/O control of the temperature control unit 150, the gas control unit 152, the pressure control unit 154, and the temperature control unit 150 is performed. These constituent elements are connected to each other via the bus bar 160, and data is input and output between the constituent elements via the bus bar 160.

在PMC14中，CPU140根據既定的配方來處理基板。具體而言，CPU140係對溫度控制部150、氣體控制部152以及壓力控制部154等輸出控制資料(控制指示)。在ROM142、RAM144以及HDD158中儲存有序列程式、由輸入輸出IF 146所輸入的資料、介由通信控制部156所輸入的資料等。In the PMC 14, the CPU 140 processes the substrate in accordance with a predetermined recipe. Specifically, the CPU 140 outputs control data (control instruction) to the temperature control unit 150, the gas control unit 152, the pressure control unit 154, and the like. The ROM 142, the RAM 144, and the HDD 158 store a sequence program, data input by the input/output IF 146, data input via the communication control unit 156, and the like.

溫度控制部150係藉由在上述處理爐202外周部設置的加熱器338來控制該處理室202內的溫度。氣體控制部152係根據來自在處理爐202之氣體配管340上設置的MFC(質流控制器)342的輸出值，來控制供給於處理爐202內的反應氣體之供給量。壓力控制部154係根據設置在處理爐202之排氣配管344的壓力感測器346之輸出值來進行閥348的開閉，藉以控制處理室202內的壓力。搬送控制部159係控制長型筒開啟機121、晶舟升降梯115，晶圓移載機構125等的搬送系統。如同這般，溫度控制部150等的控制控制器係根據來自CPU140的控制指示來進行基板處理裝置10之各部分(加熱器338、MFC342以及閥348等)的控制。The temperature control unit 150 controls the temperature in the processing chamber 202 by the heater 338 provided on the outer peripheral portion of the processing furnace 202. The gas control unit 152 controls the supply amount of the reaction gas supplied into the processing furnace 202 based on the output value of the MFC (mass flow controller) 342 provided in the gas pipe 340 of the processing furnace 202. The pressure control unit 154 opens and closes the valve 348 based on the output value of the pressure sensor 346 provided in the exhaust pipe 344 of the processing furnace 202, thereby controlling the pressure in the processing chamber 202. The conveyance control unit 159 controls a conveyance system such as the long cylinder opener 121, the boat elevator 115, and the wafer transfer mechanism 125. As described above, the control controller of the temperature control unit 150 or the like performs control of each part (the heater 338, the MFC 342, the valve 348, and the like) of the substrate processing apparatus 10 in accordance with a control instruction from the CPU 140.

因此，CPU140起動序列程式，按照該序列程式來叫入並實行配方的指令，藉以逐步實行設定控制參數之目標值等的步驟，介由I/O控制部148、149，對溫度控制部150、氣體控制部152、壓力控制部154以及搬送控制部159發送用以處理基板的控制指示。溫度控制部150等的控制控制器係按照控制指示來進行基板處理裝置10內之各部分(加 熱器338、MFC342以及閥348等)的控制。藉此，進行晶圓200的處理。Therefore, the CPU 140 starts the sequence program, and calls the recipe command in accordance with the sequence program, thereby stepping through the steps of setting the target value of the control parameter, etc., and the temperature control unit 150 via the I/O control units 148 and 149. The gas control unit 152, the pressure control unit 154, and the transport control unit 159 transmit control instructions for processing the substrate. The control controller of the temperature control unit 150 or the like performs each part in the substrate processing apparatus 10 in accordance with the control instruction (plus Control of heater 338, MFC 342, valve 348, etc.). Thereby, the processing of the wafer 200 is performed.

CPU140係介由通信控制部156，對連接管理裝置4發送溫度資訊、壓力資訊等基板處理裝置10之狀態的相關資料。此外，CPU140係同樣地對連接管理裝置4發送在基板處理裝置10中發生之事件及故障的相關資訊、以及製程資訊。The CPU 140 transmits the related information of the state of the substrate processing apparatus 10 such as temperature information and pressure information to the connection management device 4 via the communication control unit 156. Further, the CPU 140 similarly transmits information related to events and failures occurring in the substrate processing apparatus 10 to the connection management device 4, and process information.

第7圖係表示終端裝置6之硬體構成的圖。Fig. 7 is a view showing the hardware configuration of the terminal device 6.

如第7圖所示，終端裝置6係具有：控制裝置16，含有CPU18以及記憶體20等；通信介面(IF)22，介由網路12而和外部的硬體進行資料之發送及接收；硬碟機等的記憶裝置26；以及顯示/輸入裝置24，其包含液晶顯示器等的顯示裝置以及鍵盤以及滑鼠的指示裝置。此外，構成管理裝置3、連接管理裝置4、資料管理裝置5係具有上述的通信IF 22、控制裝置16，且根據需求而連接於顯示/輸入裝置24。如同這般，在構成管理裝置3等中安裝有例如後述的構成管理程式30等。As shown in FIG. 7, the terminal device 6 includes a control device 16 including a CPU 18 and a memory 20, and the like; a communication interface (IF) 22 for transmitting and receiving data to and from an external hardware via the network 12; A memory device 26 such as a hard disk drive; and a display/input device 24 including a display device such as a liquid crystal display, a keyboard, and a pointing device for a mouse. Further, the configuration management device 3, the connection management device 4, and the material management device 5 have the above-described communication IF 22 and control device 16, and are connected to the display/input device 24 as needed. In the configuration management device 3 or the like, for example, a configuration management program 30 and the like which will be described later are attached.

接著，說明在本發明之實施形態的基板處理系統2中互相進行通信的硬體。Next, hardware that communicates with each other in the substrate processing system 2 according to the embodiment of the present invention will be described.

第8圖係說明在基板處理系統2中進行互相通信之硬體以及連接數的圖。圖中所示之數字係表示可連接的硬體上限值。在此，n1~n6是1以上之整數，亦即，預定值。Fig. 8 is a view for explaining the hardware and the number of connections for communicating with each other in the substrate processing system 2. The numbers shown in the figures represent the upper hardware limits that can be connected. Here, n1 to n6 are integers of 1 or more, that is, predetermined values.

如第8圖所示，構成管理裝置3係在將上限值設為n1的複數個連接管理裝置4之間進行通信。連接管理裝置4 係在將上限值設為n2的複數個資料管理裝置5、將上限值設為n3的複數個基板處理裝置10以及將上限值設為n4的複數個終端裝置6之間進行通信。基板處理裝置10以及資料管理裝置5係在與複數個連接管理裝置4當中預定之1台連接管理裝置4之間進行通信。另外，複數個終端裝置6係在1台構成管理裝置3以及將上限值設為n5的複數個連接管理裝置4之間進行通信。As shown in Fig. 8, the configuration management device 3 performs communication between a plurality of connection management devices 4 having an upper limit value of n1. Connection management device 4 The plurality of data management apparatuses 5 having the upper limit value of n2, the plurality of substrate processing apparatuses 10 having the upper limit value of n3, and the plurality of terminal apparatuses 6 having the upper limit value of n4 are communicated. The substrate processing apparatus 10 and the material management apparatus 5 communicate with each of a predetermined number of connection management apparatuses 4 among a plurality of connection management apparatuses 4. Further, a plurality of terminal devices 6 communicate between one configuration management device 3 and a plurality of connection management devices 4 having an upper limit value of n5.

第9圖係例示各硬體、和記載與在該各硬體之間進行通信的硬體連接之上限值(連接最大數)的上限值參數表的圖。Fig. 9 is a view showing each hardware and an upper limit parameter table in which the upper limit value (maximum number of connections) of the hardware connection communication with each of the hardwares is described.

如第9圖所例示，在上限值參數表中，包含各個硬體可和其他硬體連接的最大值。上限值參數表係被記憶於構成管理裝置3，介由連接於構成管理裝置3的顯示/輸入裝置24而被編輯。換言之，上限值參數表中包含的最大值是可由使用者變更的值。此外，亦可將介由終端裝置6之顯示/輸入裝置24而輸入之資料介由網路12而發送至構成管理裝置3，藉以變更上限值參數表。另外，上限值參數表亦可被包含於構成資訊。As exemplified in FIG. 9, the upper limit parameter table includes the maximum value that each hardware can be connected to other hardware. The upper limit parameter table is stored in the configuration management device 3 and edited via the display/input device 24 connected to the configuration management device 3. In other words, the maximum value included in the upper limit parameter table is a value that can be changed by the user. Further, the data input via the display/input device 24 of the terminal device 6 may be transmitted to the configuration management device 3 via the network 12, thereby changing the upper limit parameter table. In addition, the upper limit parameter table may also be included in the composition information.

例如，在基板處理系統2中，構成管理裝置3係與最大8台連接管理裝置4連接並進行通信。連接管理裝置4的各個係與1台構成管理裝置3、最大8台資料管理裝置5、最大32台基板處理裝置10連接並進行通信。另外，資料管理裝置5的各個係與1台連接管理裝置4連接並進行通信。For example, in the substrate processing system 2, the configuration management device 3 is connected to and communicates with a maximum of eight connection management devices 4. Each of the connection management devices 4 is connected to and communicates with one configuration management device 3, a maximum of eight data management devices 5, and a maximum of 32 substrate processing devices 10. Further, each of the data management devices 5 is connected to one connection management device 4 and communicates.

藉由構成管理裝置3所記憶之構成資訊來管理各個硬體的連接關係。The connection relationship of the respective hardware is managed by the constituent information stored in the management device 3.

第10圖係例示記憶於構成管理裝置3之構成資訊的圖。Fig. 10 is a view exemplifying the composition information stored in the configuration management device 3.

如第10圖所例示，以XML(Extensible Markup Language)形式來記載構成資訊。在構成資訊中，圖中的箭頭A所示之區域中，記載著構成管理裝置3的設定(種類別、名稱、位址(位置資訊))，圖中的箭頭B所示之區域中，記載著連接管理裝置4的設定(種類別、名稱、位址(位置資訊))，圖中的箭頭C所示之區域中，記載著資料管理裝置5的設定(種類別、名稱、位址(位置資訊))。另外，圖中的箭頭D所示之區域中，記載著基板處理裝置10與群組管理系統7的連接構成之設定(種類別(type)、名稱、位址(位置資訊))。As illustrated in FIG. 10, the composition information is described in the form of XML (Extensible Markup Language). In the configuration information, the setting (the type, the name, and the address (position information)) constituting the management device 3 is described in the area indicated by the arrow A in the figure, and the area indicated by the arrow B in the figure is described. The setting (type, name, address (location information)) of the connection management device 4, and the area indicated by the arrow C in the figure, the setting of the material management device 5 (type, name, address (position) News)). In the area indicated by the arrow D in the figure, the setting (type, name, address (position information)) of the connection configuration of the substrate processing apparatus 10 and the group management system 7 is described.

在本例中，「nodes」標識符係表示記載有構成管理裝置3、連接管理裝置4以及資料管理裝置5之設定資訊的情形。「node」標識符係表示各個硬體的設定資訊，該標識符之「node_type」係表示該硬體的種類別。例如，「GDB」係表示該硬體是構成管理裝置3，「EDS」係表示該硬體是連接管理裝置4，「EDB」係表示該硬體是管理資料裝置5。另外，該標識符的「node_id」係用於在該種類別中唯一識別硬體的識別元。另外，「node_name」標識符係表示該硬體的名稱。「ip_addr」標識符係表示設定在該硬體的ip位址。In this example, the "nodes" identifier indicates a case where the setting information constituting the management device 3, the connection management device 4, and the material management device 5 is described. The "node" identifier indicates setting information of each hardware, and the "node_type" of the identifier indicates the type of the hardware. For example, "GDB" indicates that the hardware is the configuration management device 3, "EDS" indicates that the hardware is the connection management device 4, and "EDB" indicates that the hardware is the management data device 5. In addition, the "node_id" of the identifier is used to uniquely identify the identifier of the hardware in the category. In addition, the "node_name" identifier indicates the name of the hardware. The "ip_addr" identifier indicates the IP address set in the hardware.

因此，箭頭A所表示的區域中係記載著：該硬體的種類別是構成管理裝置3(GDB)，該硬體的名稱是「GDB」，設定於該硬體的ip位址是192.168.11.1。另外，箭頭B所示的區域中係記載著：該硬體的種類別是連接管理裝置4(EDS)，連接管理裝置4之識別元是「1」，該硬體的名稱是「EDS#2」，設定於該硬體的ip位址是192.168.11.2。另外，箭頭C所示的區域中係記載著：該硬體的種類別是資料管理裝置5(EDB)，資料管理裝置5之識別元是「1」，該硬體的名稱是「EDB#2」，設定於該硬體的ip位址是192.168.11.10。Therefore, the area indicated by the arrow A indicates that the type of the hardware is the configuration management device 3 (GDB), the name of the hardware is "GDB", and the IP address set to the hardware is 192.168. 11.1. Further, in the area indicated by the arrow B, it is described that the type of the hardware is the connection management device 4 (EDS), the identification element of the connection management device 4 is "1", and the name of the hardware is "EDS#2". The IP address set for this hardware is 192.168.11.2. Further, in the area indicated by the arrow C, it is described that the type of the hardware is the data management device 5 (EDB), the identification element of the data management device 5 is "1", and the name of the hardware is "EDB#2". The IP address set for this hardware is 192.168.11.10.

此外，在本例中，「eq」標識符係表示基板處理裝置10的設定資訊，該標識符的「eq_type」係表示該基板處理裝置10的種類別。「eq_name」標識符係表示該基板處理裝置10的名稱。另外，「eds_name」標識符係表示連接該基板處理裝置10並進行通信的連接管理裝置4之名稱，「edb_name」標識符係表示連接於以「eds_name」所示之連接管理裝置4並蓄積該基板處理裝置10之相關資訊的資料管理裝置5之名稱。在此，「eds_name」標識符以及「edb_name」標識符所表示的名稱係上述的「node_name」標識符所表示的名稱。另外，「eq_addr」標識符係表示設定於該基板處理裝置10的ip位址。Further, in the present example, the "eq" identifier indicates setting information of the substrate processing apparatus 10, and "eq_type" of the identifier indicates the type of the substrate processing apparatus 10. The "eq_name" identifier indicates the name of the substrate processing apparatus 10. Further, the "eds_name" identifier indicates the name of the connection management device 4 that is connected to the substrate processing apparatus 10 and communicates, and the "edb_name" identifier indicates that the connection management device 4 indicated by "eds_name" is connected and the substrate is accumulated. The name of the material management device 5 that processes the related information of the device 10. Here, the names indicated by the "eds_name" identifier and the "edb_name" identifier are the names indicated by the "node_name" identifier described above. Further, the "eq_addr" identifier indicates an ip address set in the substrate processing apparatus 10.

因此，在本例中，則記載了基板處理裝置10之種類別是「systeml」，該硬體的名稱是「裝置1」，該基板處理裝置10係連接於將名稱設為「EDS#2」的連接管理裝置4， 並在與該連接管理裝置4之間進行通信，將名稱設為「EDB#1」的資料管理裝置5係連接於該連接管理裝置4，該基板處理裝置10的相關資訊係被蓄積於該資料管理裝置5。Therefore, in this example, it is described that the type of the substrate processing apparatus 10 is "systeml", the name of the hardware is "device 1", and the substrate processing apparatus 10 is connected to the name "EDS#2". Connection management device 4, And communicating with the connection management device 4, the data management device 5 having the name "EDB#1" is connected to the connection management device 4, and the related information of the substrate processing device 10 is accumulated in the data. Management device 5.

此外，標識符的名稱、設定內容等並非侷限於本例。另外，構成資訊之記述形式方面，只要是將硬體之連接構成作為資料而記述的形式即可，並非限定於XML形式。另外，EDS、EDB也可以是複數。藉由未圖示的本文編輯軟體來編輯這種構成資訊。本文編輯軟體係在例如構成管理裝置3上動作，讀入在構成管理裝置3中記憶的構成資訊，並顯示於畫面上，且接受編輯內容。Further, the name of the identifier, the setting content, and the like are not limited to this example. In addition, the description form of the information is not limited to the XML format as long as it is a form in which the connection of the hardware is described as data. In addition, EDS and EDB can also be plural. This composition information is edited by a text editing software not shown. The editing software system operates, for example, on the configuration management device 3, reads the composition information stored in the configuration management device 3, displays it on the screen, and accepts the editing content.

第11圖係模式地例示根據構成資訊而構成之連接關係的圖。Fig. 11 is a view schematically showing a connection relationship formed based on constituent information.

如第11圖所例示，構成管理裝置3係與連接管理裝置4-1~4-n連接並進行通信。例如，連接管理裝置4-1係與構成管理裝置3、2台基板處理裝置10以及蓄積該2台基板處理裝置10之相關資訊的2台資料管理裝置5連接並進行通信。另外，例如，連接管理裝置4-2係與構成管理裝置3、1台基板處理裝置10以及1台資料管理裝置5連接並進行通信。As illustrated in Fig. 11, the configuration management device 3 is connected to and communicates with the connection management devices 4-1 to 4-n. For example, the connection management device 4-1 is connected to and communicates with the two data management devices 5 that constitute the management device 3, the two substrate processing devices 10, and the related information that accumulates the two substrate processing devices 10. Further, for example, the connection management device 4-2 is connected to and communicates with the configuration management device 3, the one substrate processing device 10, and the one data management device 5.

終端裝置6係與構成管理裝置3以及連接管理裝置4-1~4-n連接並進行通信。因此，終端裝置6係從與連接管理裝置4-1~4-n連接的資料管理裝置5取得與連接管理裝置4-1~4-n連接的基板處理裝置10之相關資訊，並在畫面上 顯示該資訊。因此，使用者介由終端裝置6來閱覽基板處理裝置10的相關資訊。此外，亦可終端裝置6取得並顯示構成資訊中包含的基板處理裝置10之相關資訊。The terminal device 6 is connected to and communicates with the configuration management device 3 and the connection management devices 4-1 to 4-n. Therefore, the terminal device 6 acquires information on the substrate processing device 10 connected to the connection management devices 4-1 to 4-n from the material management device 5 connected to the connection management devices 4-1 to 4-n, and displays them on the screen. Show this information. Therefore, the user views the related information of the substrate processing apparatus 10 via the terminal device 6. Further, the terminal device 6 may acquire and display related information of the substrate processing apparatus 10 included in the composition information.

本發明之實施形態的基板處理系統2中，基板處理裝置10的相關資訊，亦即使用者可閱覽的資訊係針對每個使用者而設定。In the substrate processing system 2 according to the embodiment of the present invention, information related to the substrate processing apparatus 10, that is, information that can be viewed by the user is set for each user.

如第12圖所示，在本例中，使用者能夠介由終端裝置6，來閱覽與連接管理裝置4-1連接之基板處理裝置10的相關資訊以及與連接管理裝置4-n連接之基板處理裝置10的相關資訊。這種閱覽權限係被記憶於構成管理裝置3。使用者在登入例如終端裝置6的時候，終端裝置6會確認在構成管理裝置3中記憶之閱覽權限。As shown in FIG. 12, in this example, the user can view the related information of the substrate processing apparatus 10 connected to the connection management apparatus 4-1 and the substrate connected to the connection management apparatus 4-n via the terminal device 6. Processing related information of the device 10. This viewing authority is stored in the composition management device 3. When the user logs in, for example, the terminal device 6, the terminal device 6 confirms the browsing authority stored in the configuration management device 3.

第12圖係表示針對每個使用者設定與基板處理裝置10相關之資訊的閱覽權限的基板處理裝置選擇畫面70的圖。Fig. 12 is a view showing a substrate processing apparatus selection screen 70 for setting the viewing authority of the information relating to the substrate processing apparatus 10 for each user.

如第12圖所示，基板處理裝置選擇畫面70中包含裝置一覽顯示區域72、可閱覽裝置顯示區域74、追加按鈕76以及刪除按鈕78。在裝置一覽顯示區域72中，顯示了例如基板處理系統2所包含的256台基板處理裝置10之一覽。在本例中，關於各個基板處理裝置10，則顯示了該基板處理裝置10的識別號碼、該基板處理裝置10的名稱、以及連接有該基板處理裝置10的連接管理裝置4之名稱(伺服器名稱)。As shown in FIG. 12, the substrate processing apparatus selection screen 70 includes a device list display area 72, a viewable device display area 74, an add button 76, and a delete button 78. In the device list display area 72, for example, a list of 256 substrate processing apparatuses 10 included in the substrate processing system 2 is displayed. In this example, the identification number of the substrate processing apparatus 10, the name of the substrate processing apparatus 10, and the name of the connection management apparatus 4 to which the substrate processing apparatus 10 is connected are displayed for each substrate processing apparatus 10 (server) name).

在可閱覽裝置顯示區域74中，顯示了基板處理系統2 所包含之基板處理裝置10，亦即成為對象且使用者可閱覽者的識別號碼、該基板處理裝置10的名稱、以及連接於該基板處理裝置10的連接管理裝置4之名稱。In the viewable device display area 74, the substrate processing system 2 is displayed The substrate processing apparatus 10 included, that is, the identification number of the user who can view the user, the name of the substrate processing apparatus 10, and the name of the connection management apparatus 4 connected to the substrate processing apparatus 10.

追加按鈕76係用以將在裝置一覽顯示區域72中選擇的基板處理裝置10追加至可閱覽裝置顯示區域74中的按鈕。當基板處理裝置10被追加至可閱覽裝置顯示區域74中時，使用者就變得可以閱覽該基板處理裝置10的相關資訊。刪除按鈕78係用以將在可閱覽裝置顯示區域74中選擇的基板處理裝置10從可閱覽裝置顯示區域74中刪除的按鈕。當從可閱覽裝置顯示區域74中刪除基板處理裝置10時，使用者就變得無法閱覽該基板處理裝置10的相關資訊。The additional button 76 is a button for adding the substrate processing apparatus 10 selected in the device list display area 72 to the viewable device display area 74. When the substrate processing apparatus 10 is added to the viewable device display area 74, the user can view the related information of the substrate processing apparatus 10. The delete button 78 is a button for deleting the substrate processing apparatus 10 selected in the viewable device display area 74 from the viewable device display area 74. When the substrate processing apparatus 10 is deleted from the viewable device display area 74, the user becomes unable to view the related information of the substrate processing apparatus 10.

基板處理裝置選擇畫面70係被顯示於構成管理裝置3的顯示/輸入裝置24，設定的內容被記憶於構成管理裝置3。此外，亦可基板處理裝置選擇畫面70係被顯示在終端裝置6之顯示/輸入裝置24，介由終端裝置6之顯示/輸入裝置24而輸入的資料介由網路12而被發送至構成管理裝置3，藉以設定閱覽權限。The substrate processing apparatus selection screen 70 is displayed on the display/input device 24 constituting the management device 3, and the contents of the settings are stored in the configuration management device 3. Further, the substrate processing device selection screen 70 may be displayed on the display/input device 24 of the terminal device 6, and the data input via the display/input device 24 of the terminal device 6 may be transmitted to the composition management via the network 12. Device 3, by which the viewing authority is set.

例如，在設定為使用者A能夠閱覽從第1號到第128號基板處理裝置10之相關資訊，使用者B能夠閱覽從第129號到第256號基板處理裝置10之相關資訊的情況下，使用者A登入於終端裝置6時，在256台基板處理裝置10當中，被賦予權限的128台基板處理裝置10之一覽會被顯示於畫面上。此外，雖未詳述，但使用者A、使用者B兩 者當然能夠閱覽同一基板處理裝置10的資訊。For example, when the user A can view the related information from the first to the 128th substrate processing apparatuses 10, and the user B can view the related information from the 129th to the 256th substrate processing apparatuses 10, When the user A logs in to the terminal device 6, a list of the 128 substrate processing apparatuses 10 to which the authority is given among the 256 substrate processing apparatuses 10 is displayed on the screen. In addition, although not detailed, user A and user B have two Of course, it is possible to view the information of the same substrate processing apparatus 10.

接著，根據第13圖至第16圖，來說明在本發明之實施形態的基板處理系統2中所包含之硬體上動作的程式。Next, a program for operating on the hardware included in the substrate processing system 2 according to the embodiment of the present invention will be described with reference to FIGS. 13 to 16.

第13圖係說明藉由構成管理裝置3而實行之構成管理程式30的功能構成圖。Fig. 13 is a view showing the functional configuration of the configuration management program 30 which is executed by the management device 3.

如第13圖所示，構成管理程式30係具有通信部300、構成資訊記憶部302、系統資訊記憶部304、權限記憶部306、構成資訊更新部308、構成資訊管理部310、系統資訊管理部312、權限設定部314以及權限管理部316。構成管理程式30係介由例如FD、CD或DVD等的記錄媒體28(第7圖)而被儲存於記憶裝置26並供給於構成管理裝置3，載入至記憶體20，且於在控制裝置16上動作且未圖示之OS上實行。此外，構成管理程式30亦可從連接於網路12的外部電腦介由通信IF22而供給至控制裝置16。另外，以後的程式也同樣地被供給於各個硬體而實行。As shown in FIG. 13, the configuration management program 30 includes a communication unit 300, a configuration information storage unit 302, a system information storage unit 304, an authority storage unit 306, a configuration information update unit 308, a configuration information management unit 310, and a system information management unit. 312. The authority setting unit 314 and the authority management unit 316. The configuration management program 30 is stored in the memory device 26 via a recording medium 28 (FIG. 7) such as FD, CD, or DVD, and is supplied to the configuration management device 3, loaded into the memory 20, and used in the control device. 16 is executed on an OS that is not shown. Further, the configuration management program 30 can be supplied from the external computer connected to the network 12 to the control device 16 via the communication IF 22. In addition, the subsequent programs are also supplied to each hardware in the same manner.

在構成管理程式30中，通信部300進行在和各硬體之間的通信所必需的通信處理。具體而言，通信部300係將藉由構成管理程式30之各構成要件所產生之資料變更為適合通信處理的形式，介由通信IF22而對網路12進行輸出。另外，通信部300係對其他構成要件輸出從網路12接受之既定形式的資料。In the configuration management program 30, the communication unit 300 performs communication processing necessary for communication with each hardware. Specifically, the communication unit 300 changes the data generated by each component constituting the management program 30 to a form suitable for communication processing, and outputs the network 12 via the communication IF 22. Further, the communication unit 300 outputs data of a predetermined form received from the network 12 to other components.

構成資訊記憶部302係記憶含有構成管理裝置3的基板處理系統2之構成資訊(第10圖)以及上限值參數表(第9圖)。藉由記憶體20及記憶裝置26之至少任一個來實現構 成資訊記憶部302。The constituent information storage unit 302 stores the configuration information (Fig. 10) and the upper limit parameter table (Fig. 9) of the substrate processing system 2 constituting the management device 3. The structure is implemented by at least one of the memory 20 and the memory device 26. The information storage unit 302 is formed.

系統資訊記憶部304係記憶在基板處理系統2中共有之例如故障資訊等的共有資訊。權限記憶部306係介由基板處理裝置選擇畫面70(第12圖)來記憶針對每個使用者而設定的閱覽權限。系統資訊記憶部304以及權限記憶部306係與構成資訊記憶部302同樣地被實現。The system information storage unit 304 stores common information such as failure information shared by the substrate processing system 2. The authority storage unit 306 stores the browsing authority set for each user via the substrate processing device selection screen 70 (Fig. 12). The system information storage unit 304 and the authority storage unit 306 are realized in the same manner as the configuration information storage unit 302.

構成資訊更新部308係接受介由構成管理裝置3或者終端裝置6之顯示/輸入裝置24所為之對於構成資訊的追加、刪除等的變更操作，根據此變更內容來更新構成資訊記憶部302所記憶之構成資訊。另外，構成資訊‘更新部308係同樣地接受對於上限值參數表的變更操作，根據此變更內容來更新構成資訊記憶部302所記憶之上限值參數表。The configuration information update unit 308 receives a change operation for adding, deleting, or the like of the configuration information by the display/input device 24 constituting the management device 3 or the terminal device 6, and updates the configuration information memory unit 302 based on the change content. Composition information. In addition, the configuration information "update unit 308 similarly accepts the change operation of the upper limit parameter table, and updates the upper limit parameter table stored in the configuration information storage unit 302 based on the changed content.

構成資訊管理部310係接受來自終端裝置6、連接管理裝置4等之其他硬體的構成資訊之參照要求，對要求源的硬體發送在構成資訊記憶部302中記憶的構成資訊。The configuration information management unit 310 receives the reference request for the configuration information of the other hardware from the terminal device 6, the connection management device 4, and the like, and transmits the configuration information stored in the configuration information storage unit 302 to the hardware of the request source.

系統資訊管理部312係從連接管理裝置4接受從基板處理裝置10對連接管理裝置4發送的共有資訊，並儲存於系統資訊記憶部304。The system information management unit 312 receives the shared information transmitted from the substrate processing device 10 to the connection management device 4 from the connection management device 4, and stores it in the system information storage unit 304.

權限設定部314係參照權限記憶部306所記憶的閱覽權限，並將基板處理裝置選擇畫面70顯示於顯示/輸入裝置24，接受介由該畫面而輸入之設定內容，並根據該設定內容，來更新權限記憶部306所記憶的閱覽權限。The authority setting unit 314 refers to the browsing authority stored in the authority storage unit 306, and displays the substrate processing device selection screen 70 on the display/input device 24, and receives the setting content input through the screen, and based on the setting content. The viewing authority stored in the permission storage unit 306 is updated.

權限管理部316係接受來自終端裝置6之閱覽權限的參照要求，對要求源的終端裝置6發送在權限記憶部306 中記憶的閱覽權限。The authority management unit 316 receives the reference request for the viewing authority from the terminal device 6, and transmits the request to the terminal device 6 of the request source to the authority storage unit 306. The reading rights of the memory.

第14圖係說明藉由連接管理裝置4而實行之連接管理程式40的功能構成圖。Fig. 14 is a view showing the functional configuration of the connection management program 40 executed by the connection management device 4.

如第14圖所示，連接管理程式40係具有通信部300、構成資訊記憶部302、構成資訊取得部400、連接確立部402、裝置資訊記憶部404以及裝置資訊管理部406。此外，第14圖所示的各構成中，和第13圖所示之構成實質相同者，則賦予相同的符號。As shown in FIG. 14, the connection management program 40 includes a communication unit 300, a configuration information storage unit 302, a configuration information acquisition unit 400, a connection establishment unit 402, a device information storage unit 404, and a device information management unit 406. In the respective configurations shown in Fig. 14, the same reference numerals are given to the same components as those shown in Fig. 13.

在連接管理程式40中，構成資訊取得部400係在連接管理裝置4起動以後，對構成管理裝置3要求構成資訊，接受從構成管理裝置3發送的構成資訊並儲存於構成資訊記憶部302。In the connection management program 40, after the connection management device 4 is activated, the configuration information acquisition unit 400 requests the configuration management device 3 to request information, and receives the configuration information transmitted from the configuration management device 3, and stores it in the configuration information storage unit 302.

連接確立部402係在藉由構成資訊取得部400而取得構成資訊時，根據構成資訊記憶部302所記憶的構成資訊，在基板處理裝置10以及資料管理裝置5之間確立連接。更具體而言，連接確立部402係根據構成資訊所記載之各硬體的名稱來辨識連接構成，在與該名稱的硬體之間確立連接。When the configuration information is acquired by the configuration information acquisition unit 400, the connection establishment unit 402 establishes a connection between the substrate processing device 10 and the material management device 5 based on the configuration information stored in the configuration information storage unit 302. More specifically, the connection establishing unit 402 recognizes the connection configuration based on the name of each hardware described in the configuration information, and establishes a connection with the hardware of the name.

裝置資訊記憶部404係記憶藉由與該連接管理裝置4連接之基板處理裝置10所發送之該基板處理裝置10的相關資訊。在此資訊中包括含有溫度資訊、壓力資訊、氣體流量資訊等的裝置本身之運轉狀態相關者。裝置資訊記憶部404係藉由記憶體20以及記憶裝置26之至少任一個來實現。The device information storage unit 404 stores information related to the substrate processing device 10 transmitted by the substrate processing device 10 connected to the connection management device 4. This information includes the operational status of the device itself containing temperature information, pressure information, gas flow information, and the like. The device information storage unit 404 is realized by at least one of the memory 20 and the memory device 26.

裝置資訊管理部406係接受藉由與該連接管理裝置4連接之基板處理裝置10發送的該基板處理裝置10之相關資訊，並儲存於裝置資訊記憶部404。裝置資訊管理部406係對構成管理裝置3發送在這種資訊當中故障資訊等之產生頻率少的資訊。此外，裝置資訊管理部406係對與該連接管理裝置4連接之資料管理裝置5發送溫度資訊、壓力資訊等之產生頻率高的資訊。另外，這種資訊亦可未被儲存於裝置資訊記憶部404，而是分別被發送至構成管理裝置3、資料管理裝置5。另外，以資訊從裝置資訊管理部406僅對構成管理裝置3直接發送的形態等之各種形態來加以實施。The device information management unit 406 receives information related to the substrate processing device 10 transmitted by the substrate processing device 10 connected to the connection management device 4, and stores the information in the device information storage unit 404. The device information management unit 406 transmits, to the configuration management device 3, information having a low frequency of occurrence of failure information or the like among such information. Further, the device information management unit 406 transmits information having a high frequency of occurrence of temperature information, pressure information, and the like to the material management device 5 connected to the connection management device 4. Further, such information may not be stored in the device information storage unit 404, but may be transmitted to the configuration management device 3 and the material management device 5, respectively. Further, the information slave device information management unit 406 performs only various forms such as a form directly transmitted by the configuration management device 3.

第15圖係說明藉由資料管理裝置5而實行之資料管理程式50的功能構成圖。Fig. 15 is a view showing the functional configuration of the material management program 50 executed by the material management device 5.

如第15圖所示，資料管理程式50係具有通信部300、構成資訊記憶部302、構成資訊取得部400、連接確立部402、資料資訊記憶部500以及資料資訊管理部502。此外，第15圖所示之各構成當中，與第13圖以及第14圖所示之構成實質相同者則賦予相同的符號。As shown in FIG. 15, the data management program 50 includes a communication unit 300, a configuration information storage unit 302, a configuration information acquisition unit 400, a connection establishment unit 402, a material information storage unit 500, and a material information management unit 502. In the respective configurations shown in Fig. 15, the same reference numerals are given to the same components as those shown in Figs. 13 and 14 .

在資料管理程式50中，資料資訊記憶部500係記憶與連接該資料管理裝置5之連接管理裝置4連接的基板處理裝置10之相關資訊。在該資訊中包含例如，溫度資訊、壓力資訊等。資料資訊記憶部500係藉由記憶體20以及記憶裝置26之至少任一個來實現。In the material management program 50, the material information storage unit 500 stores information on the substrate processing device 10 connected to the connection management device 4 connected to the data management device 5. The information includes, for example, temperature information, pressure information, and the like. The data information storage unit 500 is realized by at least one of the memory 20 and the memory device 26.

資料資訊管理部502係從連接管理裝置4接受從基板 處理裝置10對連接管理裝置4發送的資訊，並儲存於資料資訊記憶部500。The data information management unit 502 receives the slave substrate from the connection management device 4. The information transmitted by the processing device 10 to the connection management device 4 is stored in the material information storage unit 500.

第16圖係說明藉由終端裝置6而實行之終端程式60的功能構成圖。Fig. 16 is a view showing the functional configuration of the terminal program 60 executed by the terminal device 6.

如第16圖所示，終端程式60係具有通信部300、構成資訊記憶部302、構成資訊取得部400、連接確立部402、使用者介面(UI)部600以及權限取得部602。此外，第16圖所示之各構成當中，與第13圖以及第14圖所示之構成實質相同者則賦予相同的符號。As shown in FIG. 16, the terminal program 60 includes a communication unit 300, a configuration information storage unit 302, a configuration information acquisition unit 400, a connection establishment unit 402, a user interface (UI) unit 600, and an authority acquisition unit 602. In the respective configurations shown in Fig. 16, the same reference numerals are given to the same components as those shown in Figs. 13 and 14 .

在終端程式60中，UI部600係在顯示/輸入裝置24上顯示基板處理裝置選擇畫面70、用以更新構成資訊及上限值參數的畫面(未圖示)、顯示基板處理裝置10之相關資訊的畫面(未圖示)等。另外，UI部600係介由通信部300對其他硬體發送介由顯示/輸入裝置24而輸入的內容。In the terminal program 60, the UI unit 600 displays the substrate processing device selection screen 70, the screen for updating the configuration information and the upper limit parameter (not shown), and the display substrate processing device 10 on the display/input device 24. Information screen (not shown), etc. Further, the UI unit 600 transmits the content input via the display/input device 24 to the other hardware via the communication unit 300.

權限取得部602係在使用者登入於終端裝置6時，對構成管理裝置3要求該使用者的權限，接受從構成管理裝置3發送的權限，並對連接確立部402輸出。連接確立部402係在該使用者可連接的範圍內確立連接。When the user logs in to the terminal device 6, the authority acquisition unit 602 requests the management device 3 to request the authority of the user, and accepts the authority transmitted from the configuration management device 3, and outputs it to the connection establishment unit 402. The connection establishing unit 402 establishes a connection within a range in which the user can connect.

接著，說明本發明之實施形態的基板處理系統2的動作。Next, the operation of the substrate processing system 2 according to the embodiment of the present invention will be described.

第17圖係表示連接管理裝置4之起動時的動作(S10)的序列圖。Fig. 17 is a sequence diagram showing an operation (S10) at the time of activation of the connection management device 4.

如第17圖所示，連接管理裝置4被起動時，連接管理程式40在連接管理裝置4上運作，在步驟100(S100)中， 連接管理程式40之構成資訊取得部400係對構成管理裝置3要求發送構成資訊。在構成管理裝置3中，構成管理程式30之構成資訊管理部310接受此要求時，則對連接管理裝置4發送所記憶的構成資訊。在連接管理裝置4中，連接管理程式40之構成資訊取得部400係接受已發送的構成資訊，並儲存於構成資訊記憶部302。As shown in Fig. 17, when the connection management device 4 is activated, the connection management program 40 operates on the connection management device 4, and in step 100 (S100), The configuration information acquisition unit 400 of the connection management program 40 requests the configuration management device 3 to transmit the composition information. In the configuration management device 3, when the configuration information management unit 310 constituting the management program 30 accepts the request, the stored configuration information is transmitted to the connection management device 4. In the connection management device 4, the configuration information acquisition unit 400 of the connection management program 40 receives the transmitted configuration information and stores it in the configuration information storage unit 302.

在步驟102(S102)中，連接確立部402係參照所記憶的構成資訊，根據該構成資訊，辨識應確立連接之1台以上的基板處理裝置10，在與該基板處理裝置10之間確立連接。In step 102 (S102), the connection establishing unit 402 refers to the stored configuration information, and identifies one or more substrate processing apparatuses 10 to be connected based on the configuration information, and establishes a connection with the substrate processing apparatus 10. .

在步驟104(S104)中，連接確立部402係根據該構成資訊，辨識應確立連接之1台以上的資料管理裝置5，在與該資料管理裝置5之間確立連接。In step 104 (S104), the connection establishing unit 402 identifies one or more data management devices 5 to be connected based on the configuration information, and establishes a connection with the material management device 5.

此外，資料管理裝置5也是一樣進行在起動時確立連接的動作。Further, the data management device 5 also performs an operation of establishing a connection at the time of startup.

第18圖係表示與使用終端裝置6的基板處理裝置10相關之資訊的閱讀時之動作(S20)的序列圖。Fig. 18 is a sequence diagram showing an operation (S20) at the time of reading of information relating to the substrate processing apparatus 10 using the terminal device 6.

如第18圖所示，當使用者登入於終端裝置6時，在步驟200(S200)中，終端程式60之構成資訊取得部400係對構成管理裝置3要求發送構成資訊，並取得構成資訊。另外，權限取得部602係對構成管理裝置3要求發送該使用者的權限，並取得權限。As shown in FIG. 18, when the user logs in to the terminal device 6, in step 200 (S200), the configuration information acquisition unit 400 of the terminal program 60 requests the configuration management device 3 to transmit the composition information, and acquires the composition information. Further, the authority acquisition unit 602 requests the management device 3 to request the authority to transmit the user, and acquires the authority.

在步驟202(S202)中，連接確立部402係根據所記憶的構成資訊以及由權限取得部602取得的權限，來辨識應確 立連接之1台以上的連接管理裝置4，在與該連接管理裝置4之間確立連接。In step 202 (S202), the connection establishing unit 402 identifies the content based on the stored composition information and the authority acquired by the authority acquiring unit 602. One or more connection management devices 4 that are connected to each other establish a connection with the connection management device 4.

在步驟204(S204)中，連接確立部402係根據該構成資訊以及權限，來辨識應確立連接之1台以上的資料管理裝置5，並介由連接管理裝置4在與該資料管理裝置5之間確立連接。In step 204 (S204), the connection establishing unit 402 identifies one or more data management devices 5 to be connected based on the configuration information and the authority, and connects the data management device 5 to the data management device 5 via the connection management device 4. Establish a connection.

以此方式，在基板處理系統2中確立連接時，能夠接收或蓄積由基板處理裝置10所實行之基板處理的資訊。In this manner, when the connection is established in the substrate processing system 2, the information processed by the substrate processed by the substrate processing apparatus 10 can be received or accumulated.

接著，詳細說明基板處理裝置10的基板處理。Next, the substrate processing of the substrate processing apparatus 10 will be described in detail.

如第4圖以及第5圖所示，長型筒110被供給至載入埠114時，藉由前窗板113來使長型筒搬入搬出口112開放，載入埠114上的長型筒110係藉由長型筒搬送裝置118而從長型筒搬入搬出口112搬入至筐體111的內部。As shown in FIGS. 4 and 5, when the elongated cylinder 110 is supplied to the loading cassette 114, the long cylinder is moved into the outlet 112 by the front window 113, and the long cylinder loaded on the crucible 114 is loaded. The 110 is carried into the inside of the casing 111 from the long cylinder loading/unloading port 112 by the long cylinder conveying device 118.

藉由長型筒搬送裝置118來將被搬入的長型筒110自動地搬送並遞送至旋轉式長型筒棚105之指定的棚板117並暫時保管以後，從棚板117搬送並遞送至一方的長型筒開啟機121並暫時保管以後，或者從棚板117搬送至一方的長型筒開啟機121且移載於載置台122、或者被直接搬送至長型筒開啟機121且移載於載置台122。此時，長型筒開啟機121之晶圓搬入搬出口120係藉由帽蓋裝卸機構123而關閉，在移載室124中流通並充滿了清潔空氣133。例如，在移載室124中，則設定為由於充滿作為清潔空氣133的氮氣氣體，氧氣濃度在20ppm以下，遠遠低於筐體111之內部(大氣氣體)的氧氣濃度。The long cylinder 110 that has been carried in by the long cylinder conveyance device 118 is automatically conveyed and delivered to the designated shelf 117 of the rotary elongated can 105 and temporarily stored, and then transported from the shelf 117 and delivered to one side. After the long cylinder opener 121 is temporarily stored, it is transported from the shelf 117 to one of the long cylinder openers 121 and transferred to the mounting table 122, or directly transferred to the long cylinder opener 121 and transferred to The stage 122 is placed. At this time, the wafer loading/unloading port 120 of the long cylinder opener 121 is closed by the cap attaching and detaching mechanism 123, and flows through the transfer chamber 124 and is filled with the clean air 133. For example, in the transfer chamber 124, it is set to be filled with nitrogen gas as the clean air 133, and the oxygen concentration is 20 ppm or less, which is much lower than the oxygen concentration inside the casing 111 (atmospheric gas).

載置於載置台122的長型筒110方面，其開口側端面被按壓至副筐體119之正面壁119a的晶圓搬入搬出口120之開口緣邊部，同時其帽蓋會被帽蓋裝卸機構123所取下，而開放晶圓出入口。In the case of the elongated cylinder 110 placed on the mounting table 122, the opening-side end surface is pressed to the opening edge portion of the wafer loading/unloading port 120 of the front wall 119a of the sub-casing 119, and the cap is attached and detached by the cap. The mechanism 123 is removed and the wafer access is opened.

當藉由長型筒開啟機121使長型筒110開放時，晶圓200就會從長型筒110藉由晶圓移載裝置125a之箝夾125c並通過晶圓出入口而被拾取，藉由未圖示之凹口對準裝置135整合晶圓以後，搬入至位於移載室124之後方的待機部126，且被裝填(charging)於晶舟217。已將晶圓200傳遞至晶舟217的晶圓移載裝置125a會返回長型筒110，將接下來的晶圓200裝填於晶舟217。When the long cylinder 110 is opened by the long cylinder opener 121, the wafer 200 is picked up from the long cylinder 110 by the clamp 125c of the wafer transfer device 125a and through the wafer entrance and exit. After the notch alignment device 135 (not shown) integrates the wafer, it is carried into the standby unit 126 located behind the transfer chamber 124, and is loaded into the wafer boat 217. The wafer transfer device 125a that has transferred the wafer 200 to the wafer boat 217 returns to the elongated cylinder 110, and the subsequent wafer 200 is loaded into the wafer boat 217.

此一方(上段或者下段)的長型筒開啟機121之晶圓移載機構125對晶圓晶舟217的裝填作業當中，其他的長型筒110從旋轉式長型筒棚105藉由長型筒搬送裝置118而被搬送並移載於另一方(下段或者上段)的長型筒開啟機121，且藉由長型筒開啟機121而同時進行長型筒110的開啟作業。In the loading operation of the wafer transfer boat 125 by the wafer transfer mechanism 125 of the long cylinder opener 121 of the one side (upper or lower stage), the other long cylinders 110 are long from the rotary long cylinder 105. The tube transfer device 118 is transported and transferred to the other (lower or upper stage) long cylinder opener 121, and the long cylinder 110 is simultaneously opened by the long cylinder opener 121.

預定片數的晶圓200被裝填於晶舟217，藉由爐口窗板147而已關閉的處理爐202之下端部又藉由爐口窗板147而被開放。接著，密封帽蓋219由於晶舟升降梯115而上升，所以保持晶圓200群組的晶舟217會被搬入(loading)至處理爐202內。The predetermined number of wafers 200 are loaded into the wafer boat 217, and the lower end portion of the processing furnace 202, which has been closed by the furnace opening window 147, is opened by the furnace opening window 147. Next, the sealing cap 219 rises due to the boat elevator 115, so the boat 217 holding the group of wafers 200 is loaded into the processing furnace 202.

載入之後，於處理爐202，根據既定的配方，對晶圓200實施處理。處理之後，除了未圖示之凹口對準裝置135 的晶圓之整合步驟以外，概略以上述之相反順序，使晶圓200以及長型筒110被送出至筐體外部。After loading, in the processing furnace 202, the wafer 200 is processed according to a predetermined recipe. After the treatment, in addition to the notch alignment device 135 (not shown) In addition to the wafer integration step, the wafer 200 and the elongated cylinder 110 are sent out to the outside of the casing in the reverse order described above.

基板處理裝置10係在這種基板處理期間，對連接管理裝置4發送溫度資訊、壓力資訊等之基板處理裝置10的狀態之相關資料。此外，基板處理裝置10係對連接管理裝置4發送事件資訊、故障資訊以及履歷資訊。The substrate processing apparatus 10 transmits the related information of the state of the substrate processing apparatus 10 such as temperature information and pressure information to the connection management apparatus 4 during such substrate processing. Further, the substrate processing apparatus 10 transmits event information, failure information, and history information to the connection management device 4.

接著，說明將被編輯之構成資訊反映在基板處理系統2上的方法。Next, a method of reflecting the edited composition information on the substrate processing system 2 will be described.

第19圖係例示管理基板處理系統2之系統構成的系統管理畫面80的圖。Fig. 19 is a view showing a system management screen 80 of the system configuration of the management substrate processing system 2.

如第19圖所例示，系統管理畫面80中包含通知按鈕82、匯入按鈕84、回復(restore)按鈕86、節點按鈕88、使用者編輯按鈕90、群組編輯按鈕92、權限編輯按鈕94以及結束按鈕96。系統管理畫面80係被顯示於與構成管理裝置3連接的顯示/輸入裝置24，構成管理裝置3係接受介由系統管理畫面80並藉由例如滑鼠以及鍵盤等輸入的操作。As illustrated in FIG. 19, the system management screen 80 includes a notification button 82, a import button 84, a restore button 86, a node button 88, a user edit button 90, a group edit button 92, a rights edit button 94, and End button 96. The system management screen 80 is displayed on the display/input device 24 connected to the configuration management device 3. The configuration management device 3 receives an operation input via the system management screen 80 by, for example, a mouse and a keyboard.

在系統管理畫面80中，匯入按鈕84係在構成管理裝置3中使構成資訊處於可通知之狀態的按鈕。當按下匯入按鈕84時，構成資訊被更新為已編輯的內容，且被儲存於構成管理裝置3的記憶裝置26。通知按鈕82係用以根據構成資訊來變更連接構成的按鈕。當按下通知按鈕82時，對連接管理裝置4等之其他硬體發送構成資訊變更通知。關於匯入按鈕84以及通知按鈕82以外的按鈕，因為與本發 明沒有直接關係所以省略說明。In the system management screen 80, the import button 84 is a button constituting the management device 3 to make the configuration information in a state in which it can be notified. When the import button 84 is pressed, the composition information is updated to the edited content, and is stored in the memory device 26 constituting the management device 3. The notification button 82 is a button for changing the connection configuration based on the composition information. When the notification button 82 is pressed, the information change notification is transmitted to the other hardware of the connection management device 4 or the like. About the button other than the import button 84 and the notification button 82, because The explanation is omitted because there is no direct relationship.

此外，系統管理畫面80亦可被顯示於終端裝置6的顯示/輸入裝置24，介由終端裝置6的顯示/輸入裝置24而輸入之設定內容會介由網路12而發送至構成管理裝置3，藉以更新構成資訊。在此情況下，本文編輯軟體還會在終端裝置6上動作。Further, the system management screen 80 may be displayed on the display/input device 24 of the terminal device 6, and the setting contents input via the display/input device 24 of the terminal device 6 may be transmitted to the configuration management device 3 via the network 12. In order to update the composition information. In this case, the editing software herein also operates on the terminal device 6.

第20圖係說明在連接管理裝置4中發生故障時之切換動作的圖。Fig. 20 is a view for explaining a switching operation when a failure occurs in the connection management device 4.

如第20(A)圖所示，故障發生於連接管理裝置4-1的時候，作業者係在顯示/輸入裝置24中編輯構成管理裝置3所記憶的構成資訊，並介由系統管理畫面80使該被編輯的構成資訊反映在基板處理系統2上。因此，終端裝置6等係指示被變更之構成資訊的反映以及對連接管理裝置4的通知。As shown in Fig. 20(A), when the failure occurs in the connection management device 4-1, the operator edits the composition information stored in the configuration management device 3 in the display/input device 24, and passes the system management screen 80. The edited composition information is reflected on the substrate processing system 2. Therefore, the terminal device 6 or the like instructs the reflection of the changed configuration information and the notification to the connection management device 4.

在系統管理畫面80中按下通知按鈕82時，如第20(B)圖所示，從構成管理裝置3對連接管理裝置4-2發送構成資訊變更通知。連接管理裝置4-2接受構成資訊變更通知時，就從構成管理裝置3取得構成資訊，根據此構成資訊在基板處理裝置10以及資料管理裝置5之間確立連接。因此，曾連接於連接管理裝置4-1的基板處理裝置10以及資料管理裝置5係在與連接管理裝置4-2之間確立連接，與連接管理裝置4-2進行通信。When the notification button 82 is pressed on the system management screen 80, as shown in the 20th (B) diagram, the configuration management device 3 transmits a configuration information change notification to the connection management device 4-2. When receiving the configuration information change notification, the connection management device 4-2 acquires the configuration information from the configuration management device 3, and establishes a connection between the substrate processing device 10 and the material management device 5 based on the configuration information. Therefore, the substrate processing apparatus 10 and the material management apparatus 5 that have been connected to the connection management apparatus 4-1 establish a connection with the connection management apparatus 4-2 and communicate with the connection management apparatus 4-2.

第21圖係表示已更新構成資訊時之切換動作(S30)的序列圖。Fig. 21 is a sequence diagram showing the switching operation (S30) when the composition information has been updated.

如第21圖所示，在步驟300(S300)中，使用者係使用例如終端裝置6的顯示/輸入裝置24，在本文編輯軟體上，編輯構成管理裝置3所記憶的構成資訊。使用者按下系統管理畫面80之匯入按鈕84時，在構成管理裝置3上動作之構成管理程式30的構成資訊更新部308會使變更內容反映在構成資訊記憶部302上。As shown in Fig. 21, in step 300 (S300), the user edits the composition information stored in the configuration management device 3 on the editing software using the display/input device 24 of the terminal device 6, for example. When the user presses the import button 84 of the system management screen 80, the configuration information update unit 308 of the configuration management program 30 that operates on the configuration management device 3 reflects the changed content on the configuration information storage unit 302.

在步驟302(S302)中，使用者按下系統管理畫面80的通知按鈕82時，構成管理程式30之構成資訊管理部310係從終端裝置6接受構成資訊變更通知。When the user presses the notification button 82 of the system management screen 80 in step 302 (S302), the configuration information management unit 310 constituting the management program 30 receives the configuration information change notification from the terminal device 6.

在步驟304(S304)中，構成資訊管理部310係對連接管理裝置4發送構成資訊被變更之要旨的通知。In step 304 (S304), the configuration information management unit 310 transmits a notification to the connection management device 4 that the information is changed.

在步驟306(S306)中，在連接管理裝置4上動作的連接管理程式40之構成資訊取得部400係對構成管理裝置3要求發送構成資訊。在構成管理裝置3中，構成管理程式30之構成資訊管理部310接受此要求時，對連接管理裝置4發送所記憶的構成資訊。在連接管理裝置4中，連接管理程式40之構成資訊取得部400係接受被發送之構成資訊，並儲存於構成資訊記憶部302。In step 306 (S306), the configuration information acquisition unit 400 of the connection management program 40 operating on the connection management device 4 requests the configuration management device 3 to transmit the configuration information. In the configuration management device 3, when the configuration information management unit 310 constituting the management program 30 receives the request, the stored configuration information is transmitted to the connection management device 4. In the connection management device 4, the configuration information acquisition unit 400 of the connection management program 40 receives the transmitted configuration information and stores it in the configuration information storage unit 302.

在步驟308(S308)中，連接確立部402係參照所記憶的構成資訊，根據該構成資訊來辨識應確立連接之1台以上資料管理裝置5，在與該資料管理裝置5之間確立連接，並實行初始化處理。In step 308 (S308), the connection establishing unit 402 refers to the stored composition information, identifies one or more data management devices 5 to which the connection is to be established based on the configuration information, and establishes a connection with the data management device 5, And carry out initialization processing.

在步驟310(S310)中，連接確立部402係從資料管理裝置5接受初始化完畢通知。In step 310 (S310), the connection establishing unit 402 receives the initialization completion notification from the material management device 5.

在步驟312(S312)中，連接確立部402係參照所記憶的構成資訊，根據該構成資訊來辨識應確立連接之1台以上的基板處理裝置10，在與該基板處理裝置10之間確立連接。In step 312 (S312), the connection establishing unit 402 refers to the stored configuration information, and identifies one or more substrate processing apparatuses 10 to be connected based on the configuration information, and establishes a connection with the substrate processing apparatus 10. .

以此方式，在基板處理系統2中確立連接時，則藉由基板處理裝置10來實行基板處理。In this manner, when the connection is established in the substrate processing system 2, the substrate processing is performed by the substrate processing apparatus 10.

如同以上所說明，本發明的基板處理系統2係具有處理基板的複數個基板處理裝置10與連接於前述基板處理裝置10的群組管理系統7，前述群組管理系統7係具有：構成資訊記憶裝置(構成管理裝置3)，其記憶構成資訊；複數個通信裝置(連接管理裝置4)，其根據記憶於前述構成資訊記憶裝置的構成資訊，在與前述複數個基板處理裝置之至少任一個之間進行通信；以及裝置資訊儲存裝置(資料管理裝置5)，其儲存有根據記憶於前述構成資訊記憶裝置的構成資訊而連接於前述複數個通信裝置之任一個，且在與此通信裝置之間進行通信的基板處理裝置之相關資訊。因此，根據本發明，即使在連接之基板處理裝置的數量增大的時候，也不會增加群組管理裝置，且能夠進行和多數基板處理裝置的連接。另外，在追加基板處理裝置的時候，也因為不需要增加群組管理裝置，所以能實現低成本化。As described above, the substrate processing system 2 of the present invention has a plurality of substrate processing apparatuses 10 for processing substrates and a group management system 7 connected to the substrate processing apparatus 10, and the group management system 7 has: constitutes information memory. a device (constituting the management device 3) constituting information; a plurality of communication devices (connection management devices 4) constituting at least one of the plurality of substrate processing devices based on the configuration information stored in the information storage device And a device information storage device (data management device 5) storing any one of the plurality of communication devices based on the composition information stored in the information storage device, and between the communication devices Information about the substrate processing device that communicates. Therefore, according to the present invention, even when the number of connected substrate processing apparatuses is increased, the group management apparatus is not added, and connection with a plurality of substrate processing apparatuses can be performed. Further, when the substrate processing apparatus is added, since it is not necessary to add a group management apparatus, cost reduction can be achieved.

較合適為，在前述構成資訊中包含前述基板處理裝置、前述構成資訊記憶裝置、前述通信裝置以及前述裝置資訊儲存裝置之間的連接關係。藉由本發明，能輕易地進行連接之裝置的變更、擴張等，能縮短維護所需的時間。 藉此，能提升基板處理系統的運作率。Preferably, the configuration information includes a connection relationship between the substrate processing device, the configuration information storage device, the communication device, and the device information storage device. According to the present invention, it is possible to easily change or expand the connected device, and it is possible to shorten the time required for maintenance. Thereby, the operating rate of the substrate processing system can be improved.

在前述構成資訊中，包含前述構成管理裝置3、前述連接管理裝置4以及前述資料管理裝置5能分別互相連接的連接最大數，更具有設定此連接最大數的設定裝置。因此，藉由變更連接最大數，因為能增強基板處理系統2的硬體，所以能更簡易地進行構成變更。特別是，將來在硬體性能提升的時候，只需變更此參數，就能謀求系統全體規格的提升。另外，構成變更能用更低成本來實現。The configuration information includes the maximum number of connections that the configuration management device 3, the connection management device 4, and the data management device 5 can connect to each other, and the setting device that sets the maximum number of connections. Therefore, by changing the maximum number of connections, the hardware of the substrate processing system 2 can be enhanced, so that the configuration change can be made more easily. In particular, in the future, when the hardware performance is improved, it is only necessary to change this parameter to improve the overall specifications of the system. In addition, the configuration change can be realized at a lower cost.

構成資訊係因為在構成管理裝置3被集中管理，所以各個硬體能在起動時，藉由從構成管理裝置3取得構成資訊來辨識連接構成。因此，在各個硬體中，能使起動序列固定化。Since the configuration information is collectively managed by the configuration management device 3, each hardware can recognize the connection configuration by acquiring the configuration information from the configuration management device 3 at the time of startup. Therefore, in each hardware, the start sequence can be fixed.

另外，在構成資訊中，對各硬體賦予固有的名稱，藉由此名稱來定義連接形態。因此，對於構成變更，變得能僅以變更硬體之名稱來加以對應。藉此，在構成變更、硬體之交換作業等方面，能減輕作業所需的時間。In addition, in the composition information, each hardware is given a unique name, and the connection form is defined by the name. Therefore, the configuration change can be made to correspond only to the name of the changed hardware. Thereby, it is possible to reduce the time required for the work in terms of configuration change, hardware exchange work, and the like.

前述構成管理裝置3係儲存前述複數個基板處理裝置10的相關資訊，亦即與前述資料管理裝置5所儲存之資訊不同者。特別是，構成管理裝置3係儲存發生頻率少的資訊，資料管理裝置5係儲存發生頻率高的資訊。因此，即使在基板處理系統2全體之負擔增大的情況下，不需要重新修改系統全體構成，只要增設資料管理裝置5，就能提升基板處理系統2全體的性能。The configuration management device 3 stores the related information of the plurality of substrate processing apparatuses 10, that is, the information stored in the data management apparatus 5 is different. In particular, the configuration management device 3 stores information having a low frequency of occurrence, and the material management device 5 stores information having a high frequency of occurrence. Therefore, even when the burden on the entire substrate processing system 2 is increased, it is not necessary to re-modify the entire system configuration, and the performance of the entire substrate processing system 2 can be improved by adding the data management device 5.

例如，在基板處理裝置10產生更多該基板處理裝置10 的相關資訊，儲存該基板處理裝置10之相關資訊的資料管理裝置5之負擔增大的情況下，藉由使儲存該基板處理裝置10之相關資訊的資料管理裝置5的台數增加，能輕易地擴張系統，並減輕對資料管理裝置5的負擔。For example, more substrate processing apparatus 10 is generated in substrate processing apparatus 10. In the case where the burden of the data management device 5 storing the related information of the substrate processing apparatus 10 is increased, the number of the data management devices 5 storing the related information of the substrate processing apparatus 10 can be easily increased. The system is expanded and the burden on the data management device 5 is reduced.

另外，較合適為，更具有顯示裝置，用以顯示前述構成資訊所包含之前述基板處理裝置的相關資訊。在本發明的基板處理系統2中，使用終端裝置6而可閱覽基板處理裝置10之相關資訊的權限，係針對每個使用者而設定，且被記憶於構成管理裝置3。因此，即使是可從終端裝置6連接之基板處理裝置10的數量設有上限值(例如128台)的情況下，也藉由使用複數個使用者，而可閱覽超過上限值之台數的基板處理裝置10的相關資訊。較合適為，更具有指示裝置，用以指示被變更之前述構成資訊的反映以及對前述通信裝置的通知。Further, it is more preferable to have a display device for displaying information on the substrate processing device included in the composition information. In the substrate processing system 2 of the present invention, the authority for viewing the related information of the substrate processing apparatus 10 using the terminal device 6 is set for each user and is stored in the configuration management device 3. Therefore, even when the number of the substrate processing apparatuses 10 connectable from the terminal device 6 is set to an upper limit value (for example, 128 units), the number of the upper limit values can be viewed by using a plurality of users. Information about the substrate processing apparatus 10. More suitably, there is further indicating means for indicating a reflection of the changed composition information and a notification to the communication device.

此外，本發明的基板處理裝置10不僅是半導體製造裝置，還可適用於處理LCD裝置等之玻璃基板的裝置。另外，本發明的基板處理裝置10並不侷限於爐內的處理，可進行形成CVD、PVD、氧化膜、氮化膜的處理、以及包括形成含有金屬之膜的處理的成膜處理。另外，本發明的基板處理裝置10不僅是縱型裝置，也適用於單片裝置。Further, the substrate processing apparatus 10 of the present invention is not only a semiconductor manufacturing apparatus but also a device for processing a glass substrate such as an LCD device. Further, the substrate processing apparatus 10 of the present invention is not limited to the processing in the furnace, and can perform a film forming process of forming a CVD, a PVD, an oxide film, a nitride film, and a process including forming a film containing a metal. Further, the substrate processing apparatus 10 of the present invention is applicable not only to a vertical device but also to a single chip device.

2‧‧‧基板處理系統2‧‧‧Substrate processing system

3‧‧‧構成管理裝置3‧‧‧constituting management devices

4‧‧‧連接管理裝置4‧‧‧Connection management device

5‧‧‧資料管理裝置5‧‧‧Data management device

6‧‧‧終端裝置6‧‧‧ Terminal devices

7‧‧‧群組管理系統7‧‧‧Group Management System

10‧‧‧基板處理裝置10‧‧‧Substrate processing unit

12‧‧‧網路12‧‧‧Network

30‧‧‧構成管理程式30‧‧‧constituting a management program

40‧‧‧連接管理程式40‧‧‧Connection Manager

50‧‧‧資料管理程式50‧‧‧Data Management Program

60‧‧‧終端程式60‧‧‧ terminal program

300‧‧‧通信部300‧‧‧Communication Department

302‧‧‧構成資訊記憶部302‧‧‧ constitutes the information memory department

304‧‧‧系統資訊記憶部304‧‧‧System Information Memory Department

306‧‧‧權限記憶部306‧‧‧Permission Memory Department

308‧‧‧構成資訊更新部308‧‧‧ constitutes the Information Update Department

310‧‧‧構成資訊管理部310‧‧‧ constitutes the Information Management Department

312‧‧‧系統資訊管理部312‧‧‧System Information Management Department

314‧‧‧權限設定部314‧‧‧ Authority Setting Department

316‧‧‧權限管理部316‧‧‧ Authority Management Department

400‧‧‧構成資訊取得部400‧‧‧ constitutes the information acquisition department

402‧‧‧連接確立部402‧‧‧Connection Establishment Department

404‧‧‧裝置資訊記憶部404‧‧‧Device Information Memory Department

406‧‧‧裝置資訊管理部406‧‧‧Device Information Management Department

500‧‧‧資料資訊記憶部500‧‧‧Information and Information Memory Department

502‧‧‧資料資訊管理部502‧‧‧Information and Information Management Department

600‧‧‧UI部600‧‧‧UI Department

602‧‧‧權限取得部602‧‧‧Permissions Acquisition Department

第1圖係表示含有系統A和系統B的基板處理裝置1之構成的圖。Fig. 1 is a view showing the configuration of a substrate processing apparatus 1 including a system A and a system B.

第2圖係說明在不同的子系統之間轉移基板處理裝置 10的圖。Figure 2 illustrates the transfer of a substrate processing device between different subsystems. 10 map.

第3圖係表示本發明之實施形態的基板處理系統2之構成的圖。Fig. 3 is a view showing the configuration of a substrate processing system 2 according to an embodiment of the present invention.

第4圖係表示本發明之實施形態的基板處理裝置10的立體圖。Fig. 4 is a perspective view showing a substrate processing apparatus 10 according to an embodiment of the present invention.

第5圖係表示本發明之實施形態的基板處理裝置10之側面透視圖。Fig. 5 is a side perspective view showing the substrate processing apparatus 10 according to the embodiment of the present invention.

第6圖係表示以PMC14為中心的基板處理裝置10的功能構成。Fig. 6 is a view showing the functional configuration of the substrate processing apparatus 10 centering on the PMC 14.

第7圖係表示終端裝置6之硬體構成的圖。Fig. 7 is a view showing the hardware configuration of the terminal device 6.

第8圖係說明在基板處理系統2中進行互相通信之硬體以及連接數的圖。Fig. 8 is a view for explaining the hardware and the number of connections for communicating with each other in the substrate processing system 2.

第9圖係例示各硬體、和記載與在該各硬體之間進行通信的硬體連接之上限值的上限值參數表的圖。Fig. 9 is a view showing each hardware and an upper limit parameter table in which the upper limit value of the hardware connection for communication between the respective hardware is described.

第10圖係例示記憶於構成管理裝置3之構成資訊的圖。Fig. 10 is a view exemplifying the composition information stored in the configuration management device 3.

第11圖係模式地例示根據構成資訊而構成之連接關係的圖。Fig. 11 is a view schematically showing a connection relationship formed based on constituent information.

第12圖係表示針對每個使用者設定與基板處理裝置10相關之資訊的閱覽權限的基板處理裝置選擇畫面70的圖。Fig. 12 is a view showing a substrate processing apparatus selection screen 70 for setting the viewing authority of the information relating to the substrate processing apparatus 10 for each user.

第13圖係說明藉由構成管理裝置3而實行之構成管理程式30的功能構成圖。Fig. 13 is a view showing the functional configuration of the configuration management program 30 which is executed by the management device 3.

第14圖係說明藉由連接管理裝置4而實行之連接管理 程式40的功能構成圖。Figure 14 is a diagram showing connection management performed by the connection management device 4. The functional composition of the program 40 is shown.

第15圖係說明藉由資料管理裝置5而實行之資料管理程式50的功能構成圖。Fig. 15 is a view showing the functional configuration of the material management program 50 executed by the material management device 5.

第16圖係說明藉由終端裝置6而實行之終端程式60的功能構成圖。Fig. 16 is a view showing the functional configuration of the terminal program 60 executed by the terminal device 6.

第17圖係表示連接管理裝置4之起動時的動作(S10)的序列圖。Fig. 17 is a sequence diagram showing an operation (S10) at the time of activation of the connection management device 4.

第18圖係表示與使用終端裝置6的基板處理裝置10相關之資訊的閱讀時之動作(S20)的序列圖。Fig. 18 is a sequence diagram showing an operation (S20) at the time of reading of information relating to the substrate processing apparatus 10 using the terminal device 6.

第19圖係例示管理基板處理系統2之系統構成的系統管理畫面80的圖。Fig. 19 is a view showing a system management screen 80 of the system configuration of the management substrate processing system 2.

第20(A)、(B)圖係說明在連接管理裝置4中發生故障時之切換動作的圖。20(A) and (B) are diagrams for explaining a switching operation when a failure occurs in the connection management device 4.

第21圖係表示已更新構成資訊時之切換動作(S30)的序列圖。Fig. 21 is a sequence diagram showing the switching operation (S30) when the composition information has been updated.

2‧‧‧基板處理系統2‧‧‧Substrate processing system

3‧‧‧構成管理裝置3‧‧‧constituting management devices

4‧‧‧連接管理裝置4‧‧‧Connection management device

5‧‧‧資料管理裝置5‧‧‧Data management device

6‧‧‧終端裝置6‧‧‧ Terminal devices

7‧‧‧群組管理系統7‧‧‧Group Management System

10-1~10-n‧‧‧基板處理裝置10-1~10-n‧‧‧ substrate processing device

12‧‧‧網路12‧‧‧Network

Claims (8)

一種基板處理系統，其具有：複數個處理基板的基板處理裝置；以及連接於前述基板處理裝置的群組管理系統，而前述群組管理系統係具有：構成資訊記憶裝置，其記憶有定義連接構成的構成資訊；複數個通信裝置，其根據前述構成資訊，在與前述複數個基板處理裝置之至少任一個之間進行通信；以及裝置資訊儲存裝置，其儲存根據前述構成資訊而連接於前述複數個通信裝置之任一個，且在和前述通信裝置之間進行通信的基板處理裝置之相關資訊；其中，在前述構成資訊中包含前述構成資訊記憶裝置、前述通信裝置以及前述裝置資訊儲存裝置之每一者能互相連接的連接最大數目。 A substrate processing system comprising: a plurality of substrate processing apparatuses for processing substrates; and a group management system connected to the substrate processing apparatus, wherein the group management system has: an information storage device, wherein the memory has a defined connection structure Composition information; a plurality of communication devices that communicate with at least one of the plurality of substrate processing devices based on the composition information; and device information storage devices that are stored in the plurality of devices according to the composition information Any of the communication devices, and information related to the substrate processing device that communicates with the communication device; wherein the configuration information includes each of the information storage device, the communication device, and the device information storage device The maximum number of connections that can be connected to each other. 如申請專利範圍第1項的基板處理系統，其中，在前述構成資訊中包含前述基板處理裝置、前述構成資訊記憶裝置、前述通信裝置以及前述裝置資訊儲存裝置之間的連接關係。 The substrate processing system according to claim 1, wherein the configuration information includes a connection relationship between the substrate processing device, the configuration information storage device, the communication device, and the device information storage device. 如申請專利範圍第1或2項的基板處理系統，其中，前述構成資訊記憶裝置係儲存與前述複數個基板處理裝置 相關之資訊，亦即與儲存至前述裝置資訊儲存裝置的資訊相異的資訊。 The substrate processing system of claim 1 or 2, wherein the constituent information storage device stores and the plurality of substrate processing devices Relevant information, that is, information that is different from the information stored in the device information storage device. 如申請專利範圍第1或2項的基板處理系統，其中，更具有顯示裝置，其顯示與前述構成資訊所包含之前述基板處理裝置相關的資訊。 The substrate processing system according to claim 1 or 2, further comprising a display device that displays information related to the substrate processing device included in the configuration information. 如申請專利範圍第1或2項的基板處理系統，其中，更具有指示裝置，其指示已變更之前述構成資訊的反映以及對前述通信裝置的通知。 The substrate processing system according to claim 1 or 2, further comprising a pointing device that instructs the reflection of the changed configuration information and the notification to the communication device. 一種群組管理系統，其連接於複數個處理基板的基板處理裝置，且具有：構成資訊記憶裝置，其記憶有定義基板處理系統內之連接構成的構成資訊；複數個通信裝置，其根據前述構成資訊，在與前述複數個基板處理裝置之至少任一個之間進行通信；以及裝置資訊儲存裝置，其儲存根據記憶於前述構成資訊記憶裝置之構成資訊而連接於前述複數個通信裝置之任一個，且在和前述通信裝置之間進行通信的基板處理裝置之相關資訊；其中，在前述構成資訊中包含前述構成資訊記憶裝置、前述通信裝置以及前述裝置資訊儲存裝置之每一者能互相連接的連接最大數目。 A group management system connected to a plurality of substrate processing apparatuses for processing substrates, and having: an information storage device that stores configuration information defining a connection configuration in the substrate processing system; and a plurality of communication devices according to the foregoing configuration And communicating with at least one of the plurality of substrate processing devices; and storing the device information storage device connected to any one of the plurality of communication devices based on the composition information stored in the information storage device; And the related information of the substrate processing device that communicates with the communication device; wherein the configuration information includes the connection that each of the constituent information storage device, the communication device, and the device information storage device can be connected to each other The maximum number. 如申請專利範圍第6項的群組管理系統，其中，前述構成資訊係至少表示前述裝置資訊儲存裝置、前述構成資 訊記憶裝置、前述通信裝置以及前述基板處理裝置的連接關係。 The group management system of claim 6, wherein the composition information indicates at least the device information storage device and the foregoing component The connection relationship between the memory device, the communication device, and the substrate processing device. 如申請專利範圍第6或7項的群組管理系統，其中，前述構成資訊記憶裝置係儲存與前述複數個基板處理裝置相關之資訊，亦即與儲存至前述裝置資訊儲存裝置的資訊相異的資訊。 The group management system of claim 6 or 7, wherein the information storage device is configured to store information related to the plurality of substrate processing devices, that is, different from information stored in the device information storage device. News.
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