200848964 九、發明說明： 【發明所屬之技術領域】 本發明係關於處理半導體基板或玻璃基板等的基板處 理系統以及群組管理系統。 【先前技術】 這種基板處理系統中包含在基板上施行處理的複數個 基板處理裝置、進行該複數個基板處理裝置之運作狀態的 監視以及生產履歷等的儲存的群組管理裝置。藉由使用這 種群組管理裝置，能謀求半導體生產的效率提升。 【發明內容】 [本發明欲解決的課題] 不過，在以往的基板處理系統中，與群組管理裝置連 接的基板處理裝置之數量方面設定有上限，基板處理裝置 的數量超過此上限値的情況下，必須採取使基板處理系統 本身二分化的構成。另外，在即使基板處理裝置之數量爲 例如1台而也超過上限値的情況下，因爲需要新的1式群 組管理裝置，所以對終端使用者而言，在成本'方面的負擔 會突然增大。此外，在變更基板處理裝置的連接構成時， 大多會需要資料的轉移、系統參數之調整等的時間。 本發明之目的在於提供基板處理系統以及群組管理系 統’其即使在連接之基板處理裝置的數量增大時，也不會 增加群組管理裝置，且能夠和多數基板處理裝置進行連接。 [解決課題的方法] 爲了達成上述目的，本發明的基板處理系統係具有： 200848964 處理基板的複數個基板處理裝置；以及連接於 理裝置的群組管理系統，而前述群組管理系統 成資訊記憶裝置，其記憶有定義連接構成的構 數個通信裝置，其根據前述構成資訊，在與前 板處理裝置之至少任意一個之間進行通信；以 儲存裝置，其儲存基板處理裝置之相關資訊， 裝置係根據前述構成資訊而連接於前述複數個 任一個，且在和前述通信裝置之間進行通信。 另外，本發明的群組管理系統係連接於處 數個基板處理裝置的群組管理系統，且具有： 憶裝置，其記憶有定義前述基板處理系統內之 構成資訊；複數個通信裝置，其根據前述構成 前述複數個基板處理裝置之至少任意一個之間 以及裝置資訊儲存裝置，其儲存基板處理裝 訊’該基板處理裝置係根據記憶於前述構成資 之構成資訊而連接於前述複數個通信裝置之任 和前述通信裝置之間進行通信。 [發明效果] 藉由本發明的基板處理系統，因爲具有： 憶裝置，其管理本系統全體的連接構成；通信 基板處理裝置進行通信；以及裝置資訊儲存裝 有從基板處理裝置介由該通信裝置發送的資訊 在連接之基板處理裝置的數量增大時，也不會 理裝置，且能夠和多數基板處理裝置進行連接 前述基板處 係具有：構 成資訊；複 述複數個基 及裝置資訊 該基板處理 通信裝置之 理基板的複 構成資訊記 連接構成的 資訊，在與 進行通信； 置之相關資 訊記憶裝置 一個，且在 構成資訊記 裝置，其與 置，其儲存 ，所以即使 增加群組管 200848964 【實施方式】 首先，根據第1圖至第2圖來說明本發明ί 第1圖係表示含有系統Α和系統Β之基板 的構成的圖。 如第1圖所示，基板處理系統1係具有複 理裝置10-1〜10-n以及群組管理裝置100。基 10-1〜10-n以及群組管理裝置100係介由例如 等的網路1 2而連接。因此，資料係在基板處ί 〇 〜10-n以及群組管理裝置100之間，介由網路] 及接收。此外，當未特別指定基板處理裝置1 0 之有複數構成部分的任一個而進行表示時，有 爲基板處理裝置1 0等。 基板處理裝置10係根據製程配方（process 實行基板的處理。具體而言，在製程配方中記 理基板的順序，基板處理裝置1 0係根據此順序 內之構成要件的控制。另外，基板處理裝置1 0 ^ 12而對群組管理裝置發送包含溫度資訊、壓力 資訊等的裝置本身之運轉狀態的相關資料。 基板處理裝置1 0，作爲一例，係構成爲半導 的製造方法之實施處理裝置的半導體製造裝置 以下的說明中，則描述採用作爲基板處理裝置 進行氧化、擴散處理和CVD處理等的縱型裝置 群組管理裝置1 00係接收從基板處理裝置 基板處理裝置1 0的運轉狀態相關的資料，並進 I勺背景。 處理系統1 數個基板處 板處理裝置 LAN、WAN 里裝置10-1 L2而被發送 -1〜1 0 - η等 時會僅略稱 recipe)等來 載有用於處 來進行裝置 係介由網路 資訊、故障 :體裝置（1C) 。此外，在 而在基板上 之實施例。 10發送之與 行儲存以及 200848964 畫面的表示。另外，群組管理裝置1 〇 〇係對基板處理 10發送和製程配方等之基板處理裝置10相關的資料。 在群組管理裝置100中預先設定可連接之基板處 置10的數量最大値。在基板處理裝置1〇的數量超過 大値的時候，追加第2台群組管理裝置丨00，系統本身 割。 如第1圖所示，在系統Α以及系統Β中分別包含 管理裝置100以及基板處理裝置1 〇。系統A中包含1 ^ 組管理裝置100-1以及N1台基板處理裝置1〇_丨〜10_] 系統B中包含1台群組管理裝置100-2以及N2台基板 裝置10-(N1 + 1)〜10-(N1+N2)。例如，可連接於1個群 理裝置1 00的基板處理裝置1 0之數量最大値爲3 2的跨 在系統A以及系統B中則包含最大32台基板處理裝置 基板處理裝置1 0的數量例如是6 4的時候，如這般，系 以及系統B分別必須包含3 2台基板處理裝置1 〇。此 系統A以及系統B等被包含於基板處理系統1中的系 ( ^ 稱爲子系統。 複數個子系統被包含於基板處理系統1的時候， 處理裝置1 0係在與包含該基板處理裝置1 〇之子系統 的子系統中包含的基板處理裝置1 0之間，能進行資料 收及發送。因此，資料介由群組管理裝置1 〇〇而被容 複製到其他基板處理裝置1 0。另一方面，基板處理裝丨 係在與包含該基板處理裝置10之子系統不同的子系 包含的基板處理裝置1 0之間，無法進行資料的接收 裝置 理裝 該最 被分 群組 台群 ， 處理 組管 f候， 10° 統A 外， 統也 基板 相同 的接 易地 1 10 統中 及發 200848964 送。因此’使用者在不同的子系統所包含之基板處理裝置 1 〇之間複製資料時，無法容易地進行複製資料。因此，例 如，在系統A的基板處理裝置1 0中，進行配方的變更時， 使此變更反映在系統B的基板處理裝置1 0上，變成很麻 煩’而可能招致基板處理系統1之運轉率下降。 另外，群組管理裝置1 00係將該群組管理裝置1 〇〇之 子系統中所包含的基板處理裝置1 〇之一覽顯示於畫面 上。群組管理裝置1 00無法將不同的子系統中包含之基板 ^ 處理裝置1 〇作爲一覽而顯示於畫面上。因此，因爲無法同 時閱覽基板處理系統1所包含之全部基板處理裝置1 〇的相 關資訊，所以使用者很難掌握系統全體的運轉率。另外， 使用者不易進行基板處理系統1中包含之基板處理裝置1 〇 的比較。 此外，使用者有時在變更基板處理系統1之構成的情 況下，負擔會變重。例如，在子系統中包含之基板處理裝 置1 0的數量爲前述最大値之構成中，增設1台基板處理裝 I / 置10時，必須增設1台群組管理裝置1 00。因此，使用者 必須籌措龐大的裝置增設費用。 另外，例如在基板處理裝置1 0被移設至現在所被包含 之子系統不同的子系統時，在這些子系統的群組管理裝置 100之間，必須轉移資料。 第2圖係說明在不同的子系統之間的基板處理裝置1 0 之轉移的圖。 如第2圖所示，基板處理裝置1 0從系統A移設至系統 -10- 200848964 B的時候，該基板處理裝置1 〇的相關資料必須從 群組管理裝置100-1轉移到系統Β的群組管理裝^ 在群組管理裝置100-2中預先記憶有系統Β之基 置1 0的相關構成資訊。除了這構成資訊以外，基 置ΐθ-k之相關構成資訊必須於群組管理裝置100 作，並儲存於硬碟機（HDD)等。另外，因爲構成資 在群組管理裝置1 00起動時，所以群組管理裝置 須再起動。因此，構成變更作業所需要的時間就 (、 於群組管理裝置1 00-2的構成資訊之變更作業和 裝置100-2之再起動所需要的時間。 群組管理裝置1 00係將含有子系統中包含的 裝置1 0之相關例如裝置固有參數的裝置資訊或 (logging data)等之在基板處理時所產生的資料， 群組管理裝置100的硬碟機（HDD)中。所以，此被 料在基板處理裝置1 0轉移到不同的子系統時，會 轉移目標之子系統所包含的群組管理裝置1 〇〇之 1 ； 此外’在移設基板處理裝置1 〇的時候，系統參數 及動作確認也需要時間。此外，系統參數是定義 系統1或者子系統的構成的參數，亦即指定基板 1 〇的連接手段、連接數等。 接著’說明本發明之實施形態的基板處理系 第3圖係表示本發明之實施形態的基板處理 構成的圖。 如第3圖所示，基板處理系統2係具有複數 系統A的 i 100-2 。 板處理裝 板處理裝 -2重新製 訊被反映 100-2 必 是被記憶 群組管理 基板處理 履歷資料 儲存於該 儲存的資 被儲存在 HDD 中。 的調整以 基板處理 處理裝置 統2 ° 系統2之 個基板處 -11- 200848964 理裝置1 0 -1〜1 0 - η、作爲顯示手段以及指示手段的終端裝 置6以及群組管理系統7。群組管理系統7中，包含作爲記 憶構成資訊之構成資訊記憶裝置的1個構成管理裝置3、 作爲通信裝置之1個以上的連接管理裝置4、以及作爲儲 存基板處理裝置1 0之相關資訊的裝置資訊儲存裝置之1個 以上的資料管理裝置5。基板處理裝置1 〇、構成管理裝置 3、連接管理裝置4、資料管理裝置5以及終端裝置6係介 由網路1 2而連接。此外，在基板處理系統2中，基板處理 裝置10、構成管理裝置3、連接管理裝置4、資料管理裝置 5以及終端裝置6的各個都被稱爲硬體。另外，有時分別 將構成管理裝置3、連接管理裝置4、資料管理裝置5略稱 爲 GDB、EDS、EDB。 在群組管理系統7中，構成管理裝置（GDB)3係記憶基 板處理系統2的構成資訊。在構成資訊中包含各硬體的名 稱、各硬體的連接構成等。構成資訊係被用來辨識連接管 理裝置4等之其他硬體與自身作用及其他硬體的相關。另 外’構成管理裝置3係存放基板處理系統2全體共有的資 5只（共有資迅）。共有資訊係在基板處理裝置1〇中發生之發 生頻率少的資訊或者是突發性發生的資訊，例如是基板處 理裝置1 0之故障資訊和事件資訊等。 連接管理裝置（EDS)4係根據記憶在構成管理裝置3的 構成資訊而在與複數個基板處理裝置1 〇之至少任一個之 間進行通信。連接管理裝置4係接收來自基板處理裝置！ 〇 的資訊’依照來自其他硬體的要求，對該硬體發送基板處 200848964 理裝置1 0的相關資訊。連接管理裝置4從構成管理裝置3 接受已更新構成資訊的要旨通知時，根據已更新的構成資 訊，而在複數個基板處理裝置1 〇以及資料管理裝置5之至 少任一個之間確立連接。 資料管理裝置（EDB)5係根據記憶於構成管理裝置3的 構成資訊而連接於複數個連接管理裝置4的任一個。資料 管理裝置5係儲存與此連接之連接管理裝置4之間進行通 信的基板處理裝置1 0的相關資訊。資料管理裝置5係介由 連接管理裝置4來取得並蓄積來自基板處理裝置1〇發送的 資料（事件資訊以及製程資訊）。該資訊相較於構成管理裝 置3中蓄積的資訊，是發生頻率高且含有多數資料的資 訊，例如是基板處理裝置1 0的溫度資訊、壓力資訊。 終端裝置6係在畫面上顯示被各硬體所蓄積的資訊， 且構成對使用者進行資訊之提供的介面。更具體而言，終 端裝置6係介由鍵盤或滑鼠等來接受使用者的要求，並判 定該要求之相關資訊是否爲任一硬體所蓄積之資訊，根據 此判定結果，從對象的硬體取得資訊，在畫面上顯示該資 訊。 此外，爾後詳細描述構成管理裝置3中所記憶的構成 資訊以及在硬體上動作的程式。 接著，說明基板處理裝置1 0的詳細構成。 第4圖係表示本發明之實施形態的基板處理裝置丨〇的 立體圖。另外，第5圖係表示第4圖所示之基板處理裝置 1 0之側面透視圖。 200848964 如第4圖以及第5圖所示，作爲已收納由矽等所組成 的晶圓（基板）200的晶圓載體，採用環架（基板收容器，以 下稱爲長型同（pod))110的本發明之實施形態的基板處理裝 置10係具備筐體111。在筐體111的正面壁111a之正面前 方部係開設作爲設置成可維護之開口部的正面維護口 1 0 3 ’且分別建構有開閉此正面維護口 1 〇 3的正面維護門 104 、 104 ° 在筐體111的正面壁111a上，長型筒搬入搬出口（基 ( ' 板收容器搬入搬出口）1 1 2被開設爲連通筐體1 1 1內外，長 型筒搬入搬出口 112係藉由前窗板（基板收容器搬入搬出口 開閉機構）113而開閉。在長型筒搬入搬出口 112正面前方 側上設置有載入埠（基板收容器接收台）1 1 4，載入埠1 1 4係 構成爲載置長型筒110並進行對位。長型筒110係藉由工 程內搬送裝置（未圖示）而被搬入至載入璋114上，並且，從 載入埠1 1 4上被搬出。 在筐體111內之前後方向的略中央部之上部係設置有 ί ； 旋轉式長型筒棚（基板收容器載置棚）105，旋轉式長型筒棚 105係構成爲保管複數個長型筒11〇。亦即，旋轉式長型筒 棚1 05係具備：被垂直立設且在水平面內間歇旋轉的支柱 1 1 6 ;以及在支柱1 1 6之上中下段的各位置上被支撐爲放射 狀的複數張棚板（基板收容器載置台）1 1 7，複數張棚板1 1 7 係構成爲將長型筒1丨〇以分別載置複數個的狀態下來進行 保持。 在筐體1 1 1內的載入璋1 14與旋轉式長型筒棚1〇5之 -14- 200848964 間設置有長型筒搬送裝置（基板收容器搬送裝置）118，長型 筒搬送裝置118係由保持著長型筒11〇而可升降的長型筒 升降梯（基板收容器升降機構）11 8a及作爲搬送機構之長型 筒搬送機構（基板收容器搬送機構）1 1 8 b所構成，長型筒搬 送裝置118係構成爲藉由長型筒升降梯ii8a與長型筒搬送 機構1 1 8 b的連續動作，在載入埠1 1 4、旋轉式長型筒棚 1 05、長型筒開啓機（基板收容器蓋體開閉機構）1 2 1之間搬 送長型筒1 10。 ( 在筐體11 1內之前後方向的略中央部的下部，副筐體 119係被構築爲涵蓋後端。在副筐體119的正面壁119a上， 開設了 一對晶圓搬入搬出口（基板搬入搬出口）120，其在垂 直方向上並列成上下二段，用以對副筐體1 1 9進行晶圓200 的搬入搬出，在上下段的搬入搬出口 120、120上，分別設 置一對長型筒開啓機121、121。長型筒開啓機121係具備 載置長型筒110的載置台122、122及裝卸長型筒11〇之帽 盡（盖體）的帽室裝卸機構（室體裝卸機構）123、123。長型筒 開啓機1 2 1係構成爲：利用帽蓋裝卸能機構丨23來裝卸載 置於載置台122的長型筒110之帽蓋，藉以開閉長型筒110 之晶圓出入口。 副筐體119係構成移載室124,其流體地與長型筒搬送 裝置1 1 8和旋轉式長型筒棚1 05的設置空間隔絕。在移載 室1 2 4的前側區域上設置晶圓移載機構（基板移載機 構）1 25，晶圓移載機構125由以下所構成爲··可使晶圓200 在水平方向上轉動或者直行運動的晶圓移載裝置（基板移 -15- 200848964 載裝置）1 2 5 a、以及用以使晶圓移載裝置1 2 5 a升降的晶圓移 載裝置升降梯（基板移載裝置升降機構）125b。如第4圖模式 地表示，晶圓移載裝置升降梯1 2 5 b係被設置在耐壓筐體 1 1 1右側端部和副筐體1 1 9之移載室1 24前方區域右端部之 間。構成爲藉由這些晶圓移載裝置升降梯125b及晶圓移載 裝置125a的連續動作，以晶圓移載裝置125a的箝夾（基板 保持體）1 2 5 c作爲晶圓2 0 0的載置部，對晶舟（基板保持 具）217 裝塡（charging)以及卸下（discharging)晶圓 200。 f ’ 在移載室1 24的後側區域上構成收容晶舟2 1 7並使之 待機的待機部126。在待機部126上方設有處理爐202。處 理爐202下端部係構成爲藉由爐口窗板（爐口開閉機構） 147而開閉。 如第4圖模式地表示，在耐壓筐體1 1 1右側端部和副 筐體1 1 9的待機部1 26右端部之間，設置用以使晶舟2 1 7 升降的晶舟升降梯（基板保持具升降機構）1 1 5。在作爲與晶 舟升降梯1 1 5之升降台連結之連結具的臂部1 2 8上，水平 ( 地安裝作爲蓋體的密封帽蓋219,密封帽蓋219之構成係垂 直地支撐晶舟217，且可堵塞處理爐202下端部。晶舟217 之構成係具備複數根保持構件，在使複數片（例如50〜125 片左右）晶圓2 0 0中心對齊並在垂直方向上整齊排列的狀態 下，分別保持爲水平。 如第4圖模式地表示，在移載室124之晶圓移載裝置 升降梯1 25b側以及晶舟升降梯1 1 5側之相反側的左側端部 上設置有清潔單元1 3 4，其係由供給已乾淨化的空氣或者惰 -16- 200848964 性氣體的清潔空氣1 3 3的供給風扇以及防塵濾器所構成， 在晶圓移載裝置125a和清潔單元134之間，雖未圖示，但 設置有凹□對準裝置135,其作爲整合晶圓之圓周方向之位 置的基板整合裝置。 從清潔單元1 3 4吹出的清潔空氣1 3 3在流通於凹口對 準裝置135及晶圓移載裝置125a、位於待機部126的晶舟 2 1 7以後’被未圖示的導管所吸入，或者被排出至筐體1工！ 外部’或者是在清潔單元1 34之吸入側的一次側（供給側） 一 ^ 進行循環，再次藉由清潔單元134，而被吹出至移載室124 內。 接著’說明設在基板處理裝置1 〇內，進行基板處理裝 置10內之各裝置的控制的製程模組控制器（PMC)l 4。 第6圖係表示以P M C 1 4爲中心的基板處理裝置1 0的 功能構成。 如第6圖所示，PMC14係具有：CPU140; ROM142; RAM 144 ;記憶資料的硬碟機（HDD) 158 ;輸入輸出介面 ^ (IF)146，在與顯示器等之顯示裝置以及包含鍵盤等之輸入 裝置的輸入手段147之間進行資料之收發；通信控制部 156，其介由網路12而在與其它硬體（連接管理裝置4等） 之間控制資料通信；以及I/O控制部1 4 8，其進行溫度控制 部1 5 0、氣體控制部1 5 2、壓力控制部1 5 4以及溫度控制部 150等的I/O控制。這些構成要件係介由匯流排160而相互 連接，資料在構成要件之間介由匯流排160而進行輸入輸 出。 -17- 200848964 在PMC 14中，CPU 140根據既定的配方來處理基板。具 體而言，CPU 140係對溫度控制部150、氣體控制部152以 及壓力控制部 15 4等輸出控制資料（控制指示）。在 ROM142、RAM144以及HDD158中儲存有序列程式、由輸 入輸出IF 1 46所輸入的資料、介由通信控制部1 5 6所輸入 的資料等。 溫度控制部150係藉由在上述處理爐202外周部設置 的加熱器3 3 8來控制該處理室202內的溫度。氣體控制部 152係根據來自在處理爐202之氣體配管3 40上設置的 MFC(質流控制器）3 42的輸出値，來控制供給於處理爐202 內的反應氣體之供給量。壓力控制部1 54係根據設置在處 理爐202之排氣配管344的壓力感測器346之輸出値來進 行閥3 4 8的開閉，藉以控制處理室202內的壓力。搬送控 制部1 5 9係控制長型筒開啓機1 2 1、晶舟升降梯1 1 5，晶圓 移載機構125等的搬送系統。如同這般，溫度控制部150 等的控制控制器係根據來自CPU 1 40的控制指示來進行基 板處理裝置10之各部分（加熱器3 3 8、MFC 3 42以及閥348 等）的控制。 因此，CPU 140起動序列程式，按照該序列程式來叫入 並實行配方的指令，藉以逐步實行設定控制參數之目標値 等的步驟，介由I/O控制部148、149，對溫度控制部150、 氣體控制部152、壓力控制部154以及搬送控制部159發送 用以處理基板的控制指示。溫度控制部1 5 0等的控制控制 器係按照控制指示來進行基板處理裝置1 〇內之各部分（加 200848964 熱器3 3 8、MFC 3 42以及閥348等）的控制。藉此，進行晶圓 2 0 0的處理。 CPU 14 0係介由通信控制部156，對連接管理裝置4發 送溫度資訊、壓力資訊等基板處理裝置1 0之狀態的相關資 料。此外，CPU 140係同樣地對連接管理裝置4發送在基板 處理裝置1 0中發生之事件及故障的相關資訊、以及製程資 訊。 第7圖係表示終端裝置6之硬體構成的圖。 C 如第7圖所示，終端裝置6係具有：控制裝置16，含 有CPU18以及記憶體20等；通信介面（IF) 22，介由網路12 而和外部的硬體進行資料之發送及接收；硬碟機等的記憶 裝置26 ;以及顯示/輸入裝置24，其包含液晶顯示器等的 顯示裝置以及鍵盤以及滑鼠的指示裝置。此外，構成管理 裝置3、連接管理裝置4、資料管理裝置5係具有上述的通 信IF 22、控制裝置16，且根據需求而連接於顯示/輸入裝 置24。如同這般，在構成管理裝置3等中安裝有例如後述 ( 的構成管理程式3 0等。 接著，說明在本發明之實施形態的基板處理系統2中 互相進行通信的硬體。 第8圖係說明在基板處理系統2中進行互相通信之硬 體以及連接數的圖。圖中所示之數字係表示可連接的硬體 上吗値。在此，η 1〜n6是1以上之整數，亦即，預定値。 如第8圖所示，構成管理裝置3係在將上限値設爲n i 的複數個連接管理裝置4之間進行通信。連接管理裝置4 -19- 200848964 係在將上限値設爲n2的複數個資料管理裝置5、將上限値 設爲n3的複數個基板處理裝置1 0以及將上限値設爲n4的 複數個終端裝置6之間進行通信。基板處理裝置1 0以及資 料管理裝置5係在與複數個連接管理裝置4當中預定之1 台連接管理裝置4之間進行通信。另外，複數個終端裝置 6係在1台構成管理裝置3以及將上限値設爲n5的複數個 連接管理裝置4之間進行通信。 第9圖係例示各硬體、和記載與在該各硬體之間進行 f : 通信的硬體連接之上限値（連接最大數）的上限値參數表的 圖。 如第9圖所例示，在上限値參數表中，包含各個硬體 可和其他硬體連接的最大値。上限値參數表係被記憶於構 成管理裝置3，介由連接於構成管理裝置3的顯示/輸入 裝置2 4而被編輯。換言之，上限値參數表中包含的最大値 是可由使用者變更的値。此外，亦可將介由終端裝置6之 顯示/輸入裝置24而輸入之資料介由網路12而發送至構 1 成管理裝置3，藉以變更上限値參數表。另外，上限値參 數表亦可被包含於構成資訊。 例如，在基板處理系統2中，構成管理裝置3係與最 大8台連接管理裝置4連接並進行通信。連接管理裝置4 的各個係與1台構成管理裝置3、最大8台資料管理裝置5、 最大3 2台基板處理裝置1 〇連接並進行通信。另外，資料 管理裝置5的各個係與丨台連接管理裝置4連接並進行通 信。 -20 - 200848964 藉由構成管理裝置3所記憶之構成資訊來管理各個硬 體的連接關係。 第1 0圖係例示記憶於構成管理裝置3之構成資訊的 圖。 如第 10 圖所例示，以 XML(Extensible Markup Language)形式來記載構成資訊。在構成資訊中，圖中的箭 頭A所示之區域中，記載著構成管理裝置3的設定（種類 別、名稱、位址（位置資訊）），圖中的箭頭B所示之區域中， 記載著連接管理裝置4的設定（種類別、名稱、位址（位置 資訊）），圖中的箭頭C所示之區域中，記載著資料管理裝 置5的設定（種類別、名稱、位址（位置資訊））。另外，圖中 的箭頭D所示之區域中，記載著基板處理裝置1 〇與群組管 理系統7的連接構成之設定（種類別（type)、名稱、位址（位 置資訊））。 在本例中’「nodes」標識符係表不記載有構成管理裝 置3、連接管理裝置4以及資料管理裝置5之設定資訊的情 形。「η 〇 d e」標識符係表示各個硬體的設定資訊，該標識符 之「η 〇 d e _ t y p e」係表不該硬體的種類別。例如，「〇 d B」係 表示該硬體是構成管理裝置3，「EDS」係表示該硬體是連 接管理裝置4，「E D B」係表示該硬體是管理資料裝置5。 另外，該標識符的「η 〇 d e — i d」係用於在該種類別中唯一識 別硬體的識別元。另外，「η 〇 d e — n a m e」標識符係表示該硬 體的名稱。「i P _ a d d r」標識符係表示設定在該硬體的丨p位 址。 1 200848964 因此’箭頭A所表不的區域中係記載著：該硬體的種 類別是構成管理裝置3(GDB)，該硬體的名稱是「gDB」，設 定於該硬體的i P位址是1 9 2 . 1 6 8 .1 1 · 1。另外，箭頭B所示 的區域中係記載著：該硬體的種類別是連接管理裝置 4 (ED S)，連接管理裝置4之識別元是「1」，該硬體的名稱 是「EDS#2」，設定於該硬體的ip位址是192.168.11.2。另 外，箭頭C所示的區域中係記載著：該硬體的種類別是資 料管理裝置5(EDB)，資料管理裝置5之識別元是「1」，該 硬體的名稱是「EDB#2」，設定於該硬體的ip位址是 1 92.1 6 8.1 1. 1 0。 此外，在本例中，「e q」標識符係表示基板處理裝置1 〇 的設定資訊，該標識符的「eq_type」係表示該基板處理裝 置10的種類別。「eq_name」標識符係表示該基板處理裝置 10的名稱。另外，「eds_n a me」標識符係表示連接該基板處 理裝置 10並進行通信的連接管理裝置 4之名稱， 「edb_name」標識符係表示連接於以「eds__name」所示之 連接管理裝置4並蓄積該基板處理裝置1 0之相關資訊的資 料管理裝置 5之名稱。在此，「eds_name」標識符以及 「edb_name」標識符所表示的名稱係上述的「node_name」 標識符所表示的名稱。另外，「eq_ ad dr」標識符係表示設定 於該基板處理裝置1 〇的ip位址。 因此，在本例中，則記載了基板處理裝置1 〇之種類別 是「systeml」，該硬體的名稱是「裝置1」，該基板處理裝 置10係連接於將名稱設爲「EDS#2」的連接管理裝置4， -22 - 200848964 並在與該連接管理裝置4之間進行通信，將. 「EDB#1」的資料管理裝置5係連接於該連接管ί| 該基板處理裝置1 0的相關資訊係被蓄積於該資 置5。 此外，標識符的名稱、設定內容等並非侷限 另外，構成資訊之記述形式方面’只要是將硬體 成作爲資料而記述的形式即可，並非限定於XML 外，EDS、EDB也可以是複數。藉由未圖示的本文 f ' 來編輯這種構成資訊。本文編輯軟體係在例如構 置3上動作，讀入在構成管理裝置3中記憶的構 並顯示於畫面上，且接受編輯內容。 第1 1圖係模式地例示根據構成資訊而構成 係的圖。 如第1 1圖所例示，構成管理裝置3係與連接 4 -1〜4 - η連接並進行通信。例如，連接管理裝置 構成管理裝置3、2台基板處理裝置以及蓄積 ^ 板處理裝置1 0之相關資訊的2台資料管理裝置5 行通信。另外，例如，連接管理裝置4-2係與構 置3、1台基板處理裝置1 〇以及1台資料管理裝 並進行通信。 終端裝置6係與構成管理裝置3以及連接管芙 〜4 - η連接並進行通信。因此，終端裝置6係從與 裝置4 -1〜4 - η連接的資料管理裝置5取得與連接 4 -1〜4 - η連接的基板處理裝置1 0之相關資訊，並 δ稱設爲 1裝置4， 料管理裝 於本例。 之連接構 形式。另 編輯軟體 成管理裝 成資訊， 之連接關 管理裝置 4-1係與 該 2台基 連接並進 成管理裝 置5連接 1裝置4-1 連接管理 管理裝置 在畫面上 -23 - 200848964 處 示 裝 使 置 的 10 〇 認 置 的 裝 76 如 〇 處 及 服 ；2 顯示該資訊。因此，使用者介由終端裝置6來閱覽基板 理裝置1 0的相關資訊。此外，亦可終端裝置6取得並顯 構成資訊中包含的基板處理裝置1 〇之相關資訊。 本發明之實施形態的基板處理系統2中，基板處理 置1 0的相關資訊，亦即使用者可閱覽的資訊係針對每個 用者而設定。 如第1 2圖所示，在本例中，使用者能夠介由終端裝 6，來閱覽與連接管理裝置4-1連接之基板處理裝置1〇 ( ' 相關資訊以及與連接管理裝置4 - η連接之基板處理裝置 的相關資訊。追種閱覽權限係被記憶於構成管理裝置3 使用者在登入例如終端裝置6的時候，終端裝置6會確 ， 在構成管理裝置3中記憶之閱覽權限。 第1 2圖係表示針對每個使用者設定與基板處理裝 1 0相關之資訊的閱覽權限的基板處理裝置選擇畫面7 0 圖。 如第12圖所示，基板處理裝置選擇畫面70中包含 ^ f 置一覽顯示區域72、可閱覽裝置顯示區域74、追加按鈕 以及刪除按鈕78。在裝置一覽顯示區域72中，顯示了例 基板處理系統2所包含的2 5 6台基板處理裝置1 〇之一覽 在本例中，關於各個基板處理裝置1 〇，則顯示了該基板 理裝置1 0的識別號碼、該基板處理裝置1 〇的名稱、以 連接有該基板處理裝置1 0的連接管理裝置4之名稱（伺 器名稱）。 在可閱覽裝置顯示區域7 4中，顯示了基板處理系統 -24- 200848964 所包含之基板處理裝置10，亦即成爲對象且使用者可閱覽 者的識別號碼、該基板處理裝置1 0的名稱、以及連接於該 基板處理裝置10的連接管理裝置4之名稱。 追加按鈕76係用以將在裝置一覽顯示區域72中選擇 的基板處理裝置1 0追加至可閱覽裝置顯示區域74中的按 鈕。當基板處理裝置10被追加至可閱覽裝置顯示區域74 中時，使用者就變得可以閱覽該基板處理裝置丨〇的相關資 訊。刪除ί女紐78係用以將在可閱覽裝置顯示區域74中選 ι 擇的基板處理裝置1 0從可閱覽裝置顯示區域7 4中刪除的 按鈕。當從可閱覽裝置顯示區域7 4中刪除基板處理裝置1 〇 時，使用者就變得無法閱覽該基板處理裝置1 〇的相關資 訊。 基板處理裝置選擇畫面7 0係被顯示於構成管理裝置3 的顯示/輸入裝置2 4，設定的內容被記憶於構成管理裝置 3。此外，亦可基板處理裝置選擇畫面7 0係被顯示在終端 裝置6之顯示/輸入裝置24，介由終端裝置6之顯示/輸 ξ 、 I 入裝置24而輸入的資料介由網路12而被發送至構成管理 裝置3，藉以設定閱覽權限。 例如，在設定爲使用者Α能夠閱覽從第1號到第12 8 號基板處理裝置1 0之相關資訊，使用者B能夠閱覽從第 129號到第25 6號基板處理裝置10之相關資訊的情況下， 使用者A登入於終端裝置6時，在25 6台基板處理裝置10 當中，被賦予權限的1 28台基板處理裝置1 〇之一覽會被顯 示於畫面上。此外，雖未詳述，但使用者A、使用者B兩 -25- 200848964 者當然能夠閱覽同一基板處理裝置10的資訊。 接著，根據第13圖至第16圖’來說明在本發明之實 施形態的基板處理系統2中所包含之硬體上動作的程式。 第1 3圖係說明藉由構成管理裝置3而實行之構成管理 程式3 0的功能構成圖。 如第1 3圖所示，構成管理程式3 0係具有通信部3 0 0、 構成資訊記憶部3 02、系統資訊記憶部3 04、權限記憶部 306、構成資訊更新部308、構成資訊管理部3 10、系統資 Γ' 訊管理部3 1 2、權限設定部3 1 4以及權限管理部3 1 6。構成 管理程式30係介由例如FD、CD或DVD等的記錄媒體28(第 7圖）而被儲存於記憶裝置26並供給於構成管理裝置3，載 入至記憶體20，且於在控制裝置1 6上動作且未圖示之〇S 上實行。此外，構成管理程式3 0亦可從連接於網路1 2的 外部電腦介由通信IF22而供給至控制裝置1 6。另外，以後 的程式也同樣地被供給於各個硬體而實行。 在構成管理程式30中，通信部300進行在和各硬體之 r k 間的通信所必需的通信處理。具體而言，通信部3 00係將 藉由構成管理程式30之各構成要件所產生之資料變更爲 適合通信處理的形式，介由通信IF22而對網路12進行輸 出。另外，通信部3 0 0係對其他構成要件輸出從網路1 2接 受之既定形式的資料。 構成資訊記憶部302係記憶含有構成管理裝置3的基 板處理系統2之構成資訊（第10圖）以及上限値參數表（第9 圖）。藉由記憶體20及記憶裝置26之至少任一個來實現構 -26 - 200848964 成資訊記憶部3 02。 系統資訊記憶部304係記憶在基板處理系統2 之例如故障資訊等的共有資訊。權限記憶部306係 板處理裝置選擇畫面7 0 (第12圖）來記憶針對每個使 設定的閱覽權限。系統資訊記憶部3 〇4以及權限記憶 係與構成資訊記憶部3 02同樣地被實現。 構成資訊更新部3 0 8係接受介由構成管理裝置 終端裝置6之顯示/輸入裝置24所爲之對於構成資 ( 加、刪除等的變更操作，根據此變更內容來更新構 記憶部3 02所記憶之構成資訊。另外，構成資訊更新 係同樣地接受對於上限値參數表的變更操作，根據 內容來更新構成資訊記憶部3 02所記憶之上限値參_ 構成資訊管理部3 1 0係接受來自終端裝置6、連 裝置4等之其他硬體的構成資訊之參照要求，對要 硬體發送在構成資訊記憶部3 02中記憶的構成資訊 系統資訊管理部3 1 2係從連接管理裝置4接受 I ί V 處理裝置10對連接管理裝置4發送的共有資訊，並 系統資訊記憶部3 0 4。 權限設定部3 14係參照權限記憶部3 06所記憶 權限’並將基板處理裝置選擇畫面7 0顯示於顯示/ 置24，接受介由該畫面而輸入之設定內容，並根據 內容，來更新權限記憶部306所記憶的閱覽權限。 權限管理部3 1 6係接受來自終端裝置6之閱覽 參照要求，對要求源的終端裝置6發送在權限記憶 中共有 介由基 用者而 部3 06 3或者 訊的追 成資訊 部3 08 此變更 攻表。 接管理 求源的 〇 從基板 儲存於 的閱覽 輸入裝 該設定 權限的 部3 06 -27 - 200848964 中記憶的閱覽權限。 第1 4圖係說明藉由連接管理裝置4而實行之連接管理 程式4 0的功能構成圖。 如第1 4圖所示，連接管理程式4 0係具有通信部3 0 0、 構成資訊記憶部302、構成資訊取得部400、連接確立部 402、裝置資訊記憶部404以及裝置資訊管理部406。此外， 第14圖所示的各構成中，和第13圖所示之構成實質相同 者，則賦予相同的符號。 ( ' 在連接管理程式40中，構成資訊取得部400係在連接 管理裝置4起動以後，對構成管理裝置3要求構成資訊， 接受從構成管理裝置3發送的構成資訊並儲存於構成資訊 記憶部3 02。 連接確立部402係在藉由構成資訊取得部400而取得 構成資訊時，根據構成資訊記憶部3 02所記憶的構成資訊， 在基板處理裝置1 0以及資料管理裝置5之間確立連接。更 具體而言，連接確立部402係根據構成資訊所記載之各硬 r ,； 體的名稱來辨識連接構成，在與該名稱的硬體之間確立連 接。 裝置資訊記憶部404係記憶藉由與該連接管理裝置4 連接之基板處理裝置10所發送之該基板處理裝置1 〇的相 關資訊。在此資訊中包括含有溫度資訊、壓力資訊、氣體 流量資訊等的裝置本身之運轉狀態相關者。裝置資訊記憶 部404係藉由記憶體20以及記憶裝置26之至少任一個來 實現。 -28 - 200848964 裝置資訊管理部406係接受藉由與該連接管理裝置4 連接之基板處理裝置1 0發送的該基板處理裝置1 〇之相關 資訊，並儲存於裝置資訊記憶部404。裝置資訊管理部406 係對構成管理裝置3發送在這種資訊當中故障資訊等之產 生頻率少的資訊。此外，裝置資訊管理部406係對與該連 接管理裝置4連接之資料管理裝置5發送溫度資訊、壓力 資訊等之產生頻率高的資訊。另外，這種資訊亦可未被儲 存於裝置資訊記憶部404，而是分別被發送至構成管理裝置 3、資料管理裝置5。另外，以資訊從裝置資訊管理部406 僅對構成管理裝置3直接發送的形態等之各種形態來加以 實施。 第1 5圖係說明藉由資料管理裝置5而實行之資料管理 程式5 0的功能構成圖。 如第1 5圖所示，資料管理程式5 0係具有通信部3 00、 構成資訊記憶部3 0 2、構成資訊取得部4 0 0、連接確立部 402、資料資訊記憶部5 00以及資料資訊管理部5 02。此外’ 第15圖所示之各構成當中’與第13圖以及第14圖所示之 構成實質相同者則賦予相同的符號。 在資料管理程式50中，資料資訊記憶部500係記憶與 連接該資料管理裝置5之連接管理裝置4連接的基板處理 裝置1 0之相關資訊。在該資訊中包含例如’溫度資訊、壓 力資訊等。資料資訊記憶部5 0 0係藉由記憶體2 0以及記憶 裝置26之至少任一個來實現° 資料資訊管理部5 0 2係從連接管理裝置4接受從基板 -29 - 200848964 處理裝置1 0對連接管理裝置4發送的資訊， 資訊記憶部500。 第1 6圖係說明藉由終端裝置6而實行 的功能構成圖。 如第1 6圖所示，終端程式60係具有通j 資訊記憶部302、構成資訊取得部400、連g 使用者介面（UI)部600以及權限取得部602 圖所示之各構成當中，與第13圖以及第14 (' 實質相同者則賦予相同的符號。 在終端程式60中，UI部600係在顯示 上顯示基板處理裝置選擇畫面70、用以更新 限値參數的畫面（未圖示）、顯示基板處理裝f 訊的畫面（未圖示）等。另外，UI部600係介 對其他硬體發送介由顯示/輸入裝置24而_ 權限取得部602係在使用者登入於終端 構成管理裝置3要求該使用者的權限，接受 I 置3發送的權限，並對連接確立部402輸出 402係在該使用者可連接的範圍內確立連接 接著，說明本發明之實施形態的基板處 作。 第1 7圖係表示連接管理裝置4之起動 的序列圖。 如第1 7圖所示，連接管理裝置4被起動 程式40在連接管理裝置4上運作，在步驟 並儲存於資料 之終端程式60 言部3 00、構成 ^確立部402、 。此外，第16 圖所示之構成 /輸入裝置24 構成資訊及上 置1 0之相關資 ‘由通信部3 0 0 I入的內容。 裝置6時，對 從構成管理裝 。連接確立部 〇 理系統2的動 時的動作（S 1 0) 〖時，連接管理 100(S100)中， -30- 200848964 連接管理程式40之構成資訊取得部400係對構成管理裝置 3要求發送構成資訊。在構成管理裝置3中，構成管理程 式30之構成資訊管理部3 1 0接受此要求時，則對連接管理 裝置4發送所記憶的構成資訊。在連接管理裝置4中，連 接管理程式40之構成資訊取得部400係接受已發送的構成 資訊，並儲存於構成資訊記憶部3 02。 在步驟102 (S 102)中，連接確立部402係參照所記憶的 構成資訊，根據該構成資訊，辨識應確立連接之1台以上 的基板處理裝置1 〇，在與該基板處理裝置1 0之間確立連 接。 在步驟104 (S 104)中，連接確立部402係根據該構成資 訊，辨識應確立連接之1台以上的資料管理裝置5，在與 該資料管理裝置5之間確立連接。 此外，資料管理裝置5也是一樣進行在起動時確立連 接的動作。 第1 8圖係表示與使用終端裝置6的基板處理裝置！ 〇 相關之資訊的閱讀時之動作（S 20)的序列圖。 如第1 8圖所示，當使用者登入於終端裝置6時，在步 驟200 (S 200)中，終端程式60之構成資訊取得部400係對 構成管理裝置3要求發送構成資訊’並取得構成資訊。另 外，權限取得部602係對構成管理裝置3要求發送該使用 者的權限，並取得權限。 在步驟202 (S 202)中，連接確立部402係根據所記憶的 構成資訊以及由權限取得部602取得的權限，來辨識應確 200848964 裝 資 裝 確 接 :入 開 118 白 1 17 [筒 .方 S送 ί開 123 例 133 111 立連接之1台以上的連接管理裝置4，在與該連接管理 置4之間確立連接。 在步驟204(S 204)中，連接確立部402係根據該構成 訊以及權限，來辨識應確立連接之1台以上的資料管理 置5，並介由連接管理裝置4在與該資料管理裝置5之間 立連接。 以此方式，在基板處理系統2中確立連接時，能夠 收或蓄積由基板處理裝置1 0所實行之基板處理的資訊t ^ 接著，詳細說明基板處理裝置1 0的基板處理。 如第4圖以及第5圖所示，長型筒1 1 0被供給至載 埠114時，藉由前窗板113來使長型筒搬入搬出口 112 放，載入埠114上的長型筒11〇係藉由長型筒搬送裝置 而從長型筒搬入搬出口 112搬入至筐體111的內部。 藉由長型筒搬送裝置118來將被搬入的長型筒11〇 動地搬送並遞送至旋轉式長型筒棚1 〇 5之指定的棚板 並暫時保管以後，從棚板117搬送並遞送至一方的長型 ' 開啓機1 2 1並暫時保管以後，或者從棚板1 1 7搬送至一 的長型筒開啓機121且移載於載置台122、或者被直接搠 至長型筒開啓機121且移載於載置台122。此時，長型筒 啓機1 2 1之晶圓搬入搬出口 1 2 0係藉由帽蓋裝卸機構 而關閉，在移載室1 24中流通並充滿了清潔空氣1 3 3。 如’在移載室1 24中’則設定爲由於充滿作爲清潔空氣 的氮氣氣體，氧氣濃度在20ppm以下，遠遠低於箇體 之內部（大氣氣體）的氧氣濃度。 -32- 200848964 載置於載置台1 22的長型筒1 1 0方面，其開口側端面 被按壓至副筐體1 19之正面壁1 19a的晶圓搬入搬出口 120 之開口緣邊部，同時其帽蓋會被帽蓋裝卸機構1 23所取下， 而開放晶圓出入口。 當藉由長型筒開啓機1 2 1使長型筒1 1 〇開放時，晶圓 200就會從長型筒110藉由晶圓移載裝置125a之箝夾125c 並通過晶圓出入口而被拾取，藉由未圖示之凹口對準裝置 1 35整合晶圓以後，搬入至位於移載室1 24之後方的待機部 (! 126，且被裝塡（charging)於晶舟217。已將晶圓200傳遞至 晶舟217的晶圓移載裝置125a會返回長型筒1 10，將接下 來的晶圓200裝塡於晶舟217。 此一方（上段或者下段）的長型筒開啓機121之晶圓移 載機構1 25對晶圓晶舟2 1 7的裝塡作業當中，其他的長型 筒110從旋轉式長型筒棚105藉由長型筒搬送裝置1 18而 被搬送並移載於另一方（下段或者上段）的長型筒開啓機 1 2 1，且藉由長型筒開啓機1 2 1而同時進行長型筒1 1 〇的開 I 啓作業。 預定片數的晶圓2 0 0被裝塡於晶舟2 1 7，藉由爐口窗板 147而已關閉的處理爐202之下端部又藉由爐口窗板147 而被開放。接著’密封帽蓋2 1 9由於晶舟升降梯Π 5而上 升，所以保持晶圓200群組的晶舟217會被搬入（loading) 至處理爐202內。 載入之後，於處理爐202 ’根據既定的配方，對晶圓 200實施處理。處理之後’除了未圖示之凹口對準裝置135 -33 - 200848964 的晶圓之整合步驟以外，槪略以上述之相反順序， 200以及長型筒1 10被送出至筐體外部。 基板處理裝置1 0係在這種基板處理期間，對連 裝置4發送溫度資訊、壓力資訊等之基板處理裝置： 態之相關資料。此外，基板處理裝置1 0係對連接管 4發送事件資訊、故障資訊以及履歷資訊。 接著，說明將被編輯之構成資訊反映在基板處 2上的方法。 第1 9圖係例示管理基板處理系統2之系統構成 管理畫面8 0的圖。 如第1 9圖所例示，系統管理畫面8 0中包含通 82、匯入按鈕84、回復（restore)按鈕86、節點按鈕 用者編輯按鈕90、群組編輯按鈕92、權限編輯按截 及結束按鈕96。系統管理畫面80係被顯示於與構成 置3連接的顯示/輸入裝置24，構成管理裝置3係 由系統管理畫面8 0並藉由例如滑鼠以及鍵盤等輸 作。 在系統管理畫面80中，匯入按鈕84係在構成 置3中使構成資訊處於可通知之狀態的按鈕。當按 按鈕84時，構成資訊被更新爲已編輯的內容，且被 構成管理裝置3的記憶裝置2 6。通知按鈕8 2係用以 成資訊來變更連接構成的按鈕。當按下通知按鈕8 2 連接管理裝置4等之其他硬體發送構成資訊變更通 於匯入按鈕8 4以及通知按鈕8 2以外的按鈕，因爲 使晶圓 接管理 ί 0的狀 理裝置 理系統 的系統 知按鈕 88、使 :94以 管理裝 接受介 入的操 管理裝 下匯入 儲存於 根據構 時，對 知。關 與本發 -34 - 200848964 明沒有直接關係所以省略說明。 此外，系統管理畫面80亦可被顯示於終端裝置6的顯 示/輸入裝置24，介由終端裝置6的顯示/輸入裝置24 而輸入之設定內容會介由網路12而發送至構成管理裝置 3，藉以更新構成資訊。在此情況下，本文編輯軟體還會在 終端裝置6上動作。 第20圖係說明在連接管理裝置4中發生故障時之切換 動作的圖。 如第20(A)圖所示，故障發生於連接管理裝置4-1的時 候，作業者係在顯示/輸入裝置24中編輯構成管理裝置3 所記憶的構成資訊，並介由系統管理畫面8 0使該被編輯的 構成資訊反映在基板處理系統2上。因此，終端裝置6等 係指示被變更之構成資訊的反映以及對連接管理裝置4的 通知。 在系統管理畫面80中按下通知按鈕82時，如第20(B) 圖所示，從構成管理裝置3對連接管理裝置4-2發送構成 資訊變更通知。連接管理裝置4-2接受構成資訊變更通知 時，就從構成管理裝置3取得構成資訊，根據此構成資訊 在基板處理裝置1 〇以及資料管理裝置5之間確立連接。因 此，曾連接於連接管理裝置4 -1的基板處理裝置1 〇以及資 料管理裝置5係在與連接管理裝置4-2之間確立連接，與 連接管理裝置4-2進行通信。 第21圖係表示已更新構成資訊時之切換動作（S30)的 序列圖。 -35 - 200848964 如第21圖所示，在步驟300(S 3 00)中，使用者係使用 例如終端裝置6的顯示/輸入裝置24，在本文編輯軟體 上，編輯構成管理裝置3所記憶的構成資訊。使用者按下 系統管理畫面80之匯入按鈕84時，在構成管理裝置3上 動作之構成管理程式3 0的構成資訊更新部3 0 8會使變更內 容反映在構成資訊記憶部302上。 在步驟3 02 (S 3 02)中，使甩者按下系統管理畫面80的 通知按鈕82時，構成管理程式30之構成資訊管理部310 ^ 係從終端裝置6接受構成資訊變更通知。 在步驟304 (S 3 04)中，構成資訊管理部310係對連接管 理裝置4發送構成資訊被變更之要旨的通知。 在步驟306(S 3 06)中，在連接管理裝置4上動作的連接 管理程式40之構成資訊取得部400係對構成管理裝置3要 求發送構成資訊。在構成管理裝置3中，構成管理程式3 0 之構成資訊管理部3 1 0接受此要求時，對連接管理裝置4 發送所記憶的構成資訊。在連接管理裝置4中，連接管理 < 程式40之構成資訊取得部400係接受被發送之構成資訊， 並儲存於構成資訊記憶部302。 在步驟308(S 3 08)中，連接確立部402係參照所記憶的 構成資訊，根據該構成資訊來辨識應確立連接之1台以上 資料管理裝置5，在與該資料管理裝置5之間確立連接， 並實行初始化處理。 在步驟310(S 3 10)中，連接確立部402係從資料管理裝 置5接受初始化完畢通知。 -36- 200848964 在步驟312(S 31 2)中，連接確立部402係參照所記憶的 構成資訊，根據該構成資訊來辨識應確立連接之1台以上 的基板處理裝置1 0，在與該基板處理裝置1 0之間確立連 接。 以此方式，在基板處理系統2中確立連接時，則藉由 基板處理裝置1 0來實行基板處理。 如同以上所說明，本發明的基板處理系統2係具有處 理基板的複數個基板處理裝置1 0與連接於前述基板處理 (、 裝置1 〇的群組管理系統7，前述群組管理系統7係具有： 構成資訊記憶裝置（構成管理裝置3)，其記憶構成資訊；複 數個通信裝置（連接管理裝置4)，其根據記憶於前述構成資 訊記憶裝置的構成資訊，在與前述複數個基板處理裝置之 至少任一個之間進行通信；以及裝置資訊儲存裝置（資料管 理裝置5)，其儲存有根據記憶於前述構成資訊記憶裝置的 構成資訊而連接於前述複數個通信裝置之任一個，且在與 此通信裝置之間進行通信的基板處理裝置之相關資訊。因 V / 此，根據本發明，即使在連接之基板處理裝置的數量增大 的時候，也不會增加群組管理裝置，且能夠進行和多數基 板處理裝置的連接。另外，在追加基板處理裝置的時候， 也因爲不需要增加群組管理裝置，所以能實現低成本化。 較合適爲，在前述構成資訊中包含前述基板處理裝 置、前述構成資訊記憶裝置、前述通信裝置以及前述裝置 資訊儲存裝置之間的連接關係。藉由本發明，能輕易地進 行連接之裝置的變更、擴張等，能縮短維護所需的時間。 -37 - 200848964 藉此，能提升基板處理系統的運作率。 在前述構成資訊中，包含前述構成管理裝置3、前述 連接管理裝置4以及前述資料管理裝置5能分別互相連接 的連接最大數，更具有設定此連接最大數的設定手段。因 此，藉由變更連接最大數，因爲能增強基板處理系統2的 硬體，所以能更簡易地進行構成變更。特別是，將來在硬 體性能提升的時候，只需變更此參數，就能謀求系統全體 規格的提升。另外，構成變更能用更低成本來實現。 ^ 構成資訊係因爲在構成管理裝置3被集中管理，所以 各個硬體能在起動時，藉由從構成管理裝置3取得構成資 訊來辨識連接構成。因此，在各個硬體中，能使起動序列 固定化。 另外，在構成資訊中，對各硬體賦予固有的名稱，藉 由此名稱來定義連接形態。因此，對於構成變更，變得能 僅以變更硬體之名稱來加以對應。藉此，在構成變更、硬 體之交換作業等方面，能減輕作業所需的時間。 ( V / 前述構成管理裝置3係儲存前述複數個基板處理裝置 1 0的相關資訊，亦即與前述資料管理裝置5所儲存之資訊 不同者。特別是，構成管理裝置3係儲存發生頻率少的資 訊，資料管理裝置5係儲存發生頻率高的資訊。因此’即 使在基板處理系統2全體之負擔增大的情況下，不需要重 新修改系統全體構成，只要增設資料管理裝置5 ’就能提 升基板處理系統2全體的性能。 例如，在基板處理裝置1 〇產生更多該基板處理裝置1 0 -38- 200848964 的相關資訊，儲存該基板處理裝置1 0之相關資訊的資料管 理裝置5之負擔增大的情況下，藉由使儲存該基板處理裝 置1 0之相關資訊的資料管理裝置5的台數增加，能輕易地 擴張系統，並減輕對資料管理裝置5的負擔。 另外，較合適爲，更具有顯示手段，用以顯示前述構 成資訊所包含之前述基板處理裝置的相關資訊。在本發明 的基板處理系統2中，使用終端裝置6而可閱覽基板處理 裝置1 0之相關資訊的權限，係針對每個使用者而設定，且 f% 被記憶於構成管理裝置3。因此，即使是可從終端裝置6 連接之基板處理裝置10的數量設有上限値（例如128台）的 情況下，也藉由使用複數個使用者，而可閱覽超過上限値 之台數的基板處理裝置1 0的相關資訊。較合適爲，更具有 指示手段，用以指示被變更之前述構成資訊的反映以及對 前述通信裝置的通知。 此外，本發明的基板處理裝置1 〇不僅是半導體製造裝 置，還可適用於處理LCD裝置等之玻璃基板的裝置。另外， C , 本發明的基板處理裝置10並不侷限於爐內的處理，可進行 形成C V D、P V D、氧化膜、氮化膜的處理、以及包括形成 含有金屬之膜的處理的成膜處理。另外，本發明的基板處 理裝置10不僅是縱型裝置，也適用於單片裝置。 【圖式簡單說明】 第1圖係表示含有系統A和系統B的基板處理裝置1 之構成的圖。 第2圖係說明在不同的子系統之間轉移基板處理裝置 -39 - 200848964 1 0的圖。 第3圖係表示本發明之實施形態的基板處理系統2之 構成的圖。 第4圖係表示本發明之實施形態的基板處理裝置1 〇的 立體圖。 第5圖係表示本發明之實施形態的基板處理裝置1 〇之 側面透視圖。 第6圖係表示以PMC 14爲中心的基板處理裝置10的 功能構成。 第7圖係表示終端裝置6之硬體構成的圖。 第8圖係說明在基板處理系統2中進行互相通信之硬 體以及連接數的圖。 第9圖係例示各硬體、和記載與在該各硬體之間進行 通信的硬體連接之上限値的上限値參數表的圖。 第1 0圖係例示記憶於構成管理裝置3之構成資訊的 圖。 第1 1圖係模式地例示根據構成資訊而構成之連接關 係的圖。 第1 2圖係表示針對每個使用者設定與基板處理裝置 1 〇相關之資訊的閱覽權限的基板處理裝置選擇畫面70的 圖。 第1 3圖係說明藉由構成管理裝置3而實行之構成管理 程式3 0的功能構成圖。 第1 4圖係說明藉由連接管理裝置4而實行之連接管理 -40 - 200848964 程式4 0的功能構成圖。 第1 5圖係說明藉由資料管理裝置5而實行之資料管理 程式5 0的功㊆構成圖° 第1 6圖係說明藉由終端裝置6而實行之終端程式6 0 的功能構成圖。 第17圖係表示連接管理裝置4之起動時的動作（S 10) 的序列圖。 第1 8圖係表示與使用終端裝置6的基板處理裝置1 0 相關之資訊的閱讀時之動作（S20)的序列圖。 第1 9圖係例示管理基板處理系統2之系統構成的系統 管理畫面80的圖。 第20(A)、（Β)圖係說明在連接管理裝置4中發生故障 時之切換動作的圖。 第21圖係表示已更新構成資訊時之切換動作（S30)的 序列圖。 【主要元件符號說明】 2 基 板 處 理 系 統 3 構 成 管 理 裝 置 4 連 接 管 理 裝 置 5 資 料 管 理 裝 置 6 終 JL山 觸 裝 置 7 群 組 管 理 系 統 10 基 板 處 理 裝 置 12 網 路 -41- 200848964200848964 IX. Description of the Invention: TECHNICAL FIELD The present invention relates to a substrate processing system and a group management system for processing a semiconductor substrate, a glass substrate, and the like. [Prior Art] The substrate processing system includes a plurality of substrate processing apparatuses that perform processing on the substrate, a group management apparatus that performs storage of the operation state of the plurality of substrate processing apparatuses, and storage of production history and the like. By using such a group management device, the efficiency of semiconductor production can be improved. [Problems to be Solved by the Invention] However, in the conventional substrate processing system, the upper limit of the number of substrate processing apparatuses connected to the group management apparatus is set, and the number of substrate processing apparatuses exceeds the upper limit 値Next, it is necessary to adopt a configuration in which the substrate processing system itself is diverged. In addition, even if the number of substrate processing apparatuses exceeds the upper limit 例如, for example, if a new type 1 group management apparatus is required, the burden on the cost will suddenly increase for the terminal user. Big. Further, when the connection configuration of the substrate processing apparatus is changed, time such as transfer of data and adjustment of system parameters are often required. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing system and a group management system which can increase the number of substrate processing apparatuses connected without increasing the group management apparatus and can be connected to a plurality of substrate processing apparatuses. [Means for Solving the Problem] In order to achieve the above object, a substrate processing system of the present invention has: 200848964 a plurality of substrate processing apparatuses for processing a substrate; and a group management system connected to the processing device, wherein the group management system becomes an information memory a device having a plurality of communication devices defining a connection structure, wherein the communication device communicates with at least one of the front panel processing devices according to the configuration information; and the storage device stores information related to the substrate processing device, the device It is connected to any of the aforementioned ones based on the above-described configuration information, and communicates with the communication device. In addition, the group management system of the present invention is connected to a group management system of a plurality of substrate processing apparatuses, and has: a memory device that defines configuration information in the substrate processing system; and a plurality of communication devices according to The at least one of the plurality of substrate processing devices and the device information storage device storing the substrate processing device, wherein the substrate processing device is connected to the plurality of communication devices based on the composition information stored in the component Any communication with the aforementioned communication device. [Effect of the Invention] The substrate processing system of the present invention has: a memorizing device that manages the connection configuration of the entire system; the communication substrate processing device performs communication; and the device information storage device is loaded from the substrate processing device via the communication device The information is not related to the number of connected substrate processing devices, and can be connected to a plurality of substrate processing devices. The substrate has: composition information; repeating a plurality of bases and device information. The substrate processing communication device The complex composition information of the substrate is recorded and connected with the information, and the related information memory device is disposed, and the information recording device is configured and stored, so that even if the group tube 200848964 is added, the embodiment is First, the present invention will be described with reference to Figs. 1 to 2. Fig. 1 is a view showing a configuration of a substrate including a system Α and a system 。. As shown in Fig. 1, the substrate processing system 1 includes the restoration devices 10-1 to 10-n and the group management device 100. The bases 10-1 to 10-n and the group management device 100 are connected via, for example, the network 1 2 . Therefore, the data is received between the substrate ί 〜 10 10-n and the group management device 100 via the network. In addition, when the substrate processing apparatus 10 is not specifically designated as having any of the plurality of constituent parts, the substrate processing apparatus 10 or the like is used. The substrate processing apparatus 10 performs the processing of the substrate according to the process recipe. Specifically, the order of the substrates is recorded in the process recipe, and the substrate processing apparatus 10 is controlled according to the constituent elements in the sequence. In the group management device, the related information of the operation state of the device itself including the temperature information, the pressure information, and the like is transmitted to the group management device. The substrate processing device 10 is, for example, a processing device that is configured as a semi-conductive manufacturing method. In the following description of the semiconductor manufacturing apparatus, the vertical device group management device 100 that performs oxidation, diffusion processing, CVD processing, or the like as the substrate processing apparatus receives the operation state of the substrate processing apparatus substrate processing apparatus 10 from the substrate processing apparatus. Data, and into the background of the I spoon. Processing system 1 several substrates at the board processing device LAN, WAN device 10-1 L2 and sent -1 ~ 1 0 - η, etc. will only be abbreviated as recipe) etc. The device is based on network information, fault: body device (1C). In addition, embodiments are on the substrate. 10 sent and line storage and 200848964 screen representation. Further, the group management device 1 transmits the material relating to the substrate processing apparatus 10 such as the process recipe to the substrate processing 10. The maximum number of connectable substrate placements 10 is preset in the group management device 100. When the number of substrate processing apparatuses 1〇 exceeds a large number, the second group management apparatus 丨00 is added, and the system itself is cut. As shown in Fig. 1, the management device 100 and the substrate processing device 1 are respectively included in the system Α and the system Β. The system A includes a 1^ group management device 100-1 and an N1 substrate processing device 1〇_丨~10_] The system B includes one group management device 100-2 and N2 substrate devices 10-(N1 + 1) ~10-(N1+N2). For example, the number of substrate processing apparatuses 10 that can be connected to one grouping device 100 is a maximum of 32, and the number of substrate processing apparatuses 10 that include a maximum of 32 substrate processing apparatuses in system A and system B is, for example, When it is 6 4, as such, the system and the system B must respectively contain 32 substrate processing apparatuses 1 〇. The system A and the system B and the like are included in the substrate processing system 1 (referred to as a subsystem. When a plurality of subsystems are included in the substrate processing system 1, the processing device 10 is connected to and includes the substrate processing device 1 Data can be received and transmitted between the substrate processing apparatuses 10 included in the subsystem of the subsystem of the subsystem. Therefore, the data is transferred to the other substrate processing apparatus 10 via the group management apparatus 1 . In the case where the substrate processing apparatus is connected to the substrate processing apparatus 10 included in the sub-system different from the subsystem including the substrate processing apparatus 10, the data receiving apparatus cannot perform the processing of the most-grouped group, and the processing group When the tube f waits, 10° is the same as the A, the same substrate is the same as the 1010, and the 200848964 is sent. Therefore, when the user copies data between the substrate processing devices 1 不同 included in different subsystems, It is not possible to easily copy the data. Therefore, for example, when the recipe is changed in the substrate processing apparatus 10 of the system A, the change is reflected in the substrate processing apparatus 10 of the system B. The operation rate of the substrate processing system 1 may be reduced. The group management device 100 displays a list of the substrate processing devices 1 included in the subsystem of the group management device 1 On the screen, the group management device 100 cannot display the substrate processing device 1 included in the different subsystems as a list on the screen. Therefore, all the substrate processing apparatuses 1 included in the substrate processing system 1 cannot be simultaneously viewed. Because of the information about the user, it is difficult for the user to grasp the operating rate of the entire system. Moreover, it is difficult for the user to compare the substrate processing apparatus 1 included in the substrate processing system 1. Further, the user may change the substrate processing system 1 In the case of the configuration, the number of the substrate processing apparatuses 10 included in the subsystem is the maximum 値, and when one substrate processing apparatus I / 10 is added, one additional unit must be added. The group management device 100. Therefore, the user has to raise a large device to add a fee. In addition, for example, the substrate processing device 10 is moved. When the subsystems of the subsystems that are currently included are different, the data must be transferred between the group management devices 100 of these subsystems. Figure 2 illustrates the transfer of the substrate processing apparatus 10 between the different subsystems. As shown in Fig. 2, when the substrate processing apparatus 10 is moved from the system A to the system-10-200848964 B, the related data of the substrate processing apparatus 1 must be transferred from the group management apparatus 100-1 to the system. In the group management device 100-2, the related composition information of the base 10 of the system is pre-stored in the group management device 100-2. In addition to the composition information, the related composition information of the base ΐθ-k must be in the group. The management device 100 is configured and stored in a hard disk drive (HDD) or the like. Further, since the composition is activated when the group management device 100 is started, the group management device must be restarted. Therefore, the time required for the change operation is set (the time required for the change of the configuration information of the group management device 100-2 and the restart of the device 100-2. The group management device 100 will contain the child. The information generated by the device 10 in the system, such as device information or device data, such as device-specific parameters, is generated in the hard disk drive (HDD) of the group management device 100. Therefore, this is When the substrate processing apparatus 10 shifts to a different subsystem, the group management apparatus 1 included in the target subsystem is transferred; in addition, when the substrate processing apparatus 1 is moved, the system parameters and operation confirmation are performed. Further, the system parameter is a parameter defining the configuration of the system 1 or the subsystem, that is, the connection means, the number of connections, etc. of the designated substrate 1 接着. Next, the substrate processing system according to the embodiment of the present invention will be described. A diagram showing a substrate processing configuration according to an embodiment of the present invention. As shown in Fig. 3, the substrate processing system 2 is an i 100-2 having a plurality of systems A. 2 Re-communication is reflected 100-2 It must be stored in the HDD by the memory group management substrate processing history data stored in the storage. The adjustment is performed on the substrate processing unit 2 2 system 2 - 200848964 The device 1 0 -1 to 1 0 - η, the terminal device 6 as the display means and the pointing means, and the group management system 7. The group management system 7 includes the information memory device constituting the memory composition information. One or more of the connection management devices 3, one or more connection management devices 4 as communication devices, and one or more data management devices 5 as device information storage devices for storing information on the substrate processing device 10. The substrate processing device 1 The configuration management device 3, the connection management device 4, the data management device 5, and the terminal device 6 are connected by the network 12. In the substrate processing system 2, the substrate processing device 10, the configuration management device 3, and the connection management Each of the device 4, the data management device 5, and the terminal device 6 is referred to as a hardware. In addition, the configuration management device 3 and the connection management device may be separately installed. 4. The data management device 5 is abbreviated as GDB, EDS, and EDB. In the group management system 7, the configuration management device (GDB) 3 is the configuration information of the memory substrate processing system 2. The configuration information includes the names of the hardware. The configuration of the hardware is used to identify the other hardware of the connection management device 4 and the like and the relationship between the hardware and the other hardware. The configuration management device 3 is shared by the entire substrate processing system 2. The total information is information that occurs at a low frequency of occurrence in the substrate processing apparatus 1 or information that is suddenly generated, and is, for example, failure information and event information of the substrate processing apparatus 10. The connection management device (EDS) 4 communicates with at least one of the plurality of substrate processing devices 1 based on the configuration information stored in the configuration management device 3. The connection management device 4 receives the substrate processing device from the substrate! 〇 Information </ br> According to the requirements of other hardware, the hardware sends information about the device at the base station. When the connection management device 4 receives the notification of the updated configuration information from the configuration management device 3, the connection management device 4 establishes a connection between at least one of the plurality of substrate processing devices 1 and the data management device 5 based on the updated configuration information. The data management device (EDB) 5 is connected to any one of the plurality of connection management devices 4 based on the configuration information stored in the configuration management device 3. The data management device 5 stores information on the substrate processing device 10 that communicates with the connection management device 4 connected thereto. The data management device 5 acquires and accumulates data (event information and process information) transmitted from the substrate processing device 1 via the connection management device 4. This information is information that is high in frequency and contains a large amount of information compared to the information accumulated in the configuration management device 3, and is, for example, temperature information and pressure information of the substrate processing apparatus 10. The terminal device 6 displays information accumulated by each hardware on the screen, and constitutes an interface for providing information to the user. More specifically, the terminal device 6 accepts the user's request via a keyboard or a mouse, and determines whether the related information of the request is information accumulated by any hardware, and based on the determination result, the object is hard. The body gets the information and displays the information on the screen. Further, the composition information stored in the management device 3 and the program operating on the hardware will be described in detail later. Next, the detailed configuration of the substrate processing apparatus 10 will be described. Fig. 4 is a perspective view showing a substrate processing apparatus 丨〇 according to an embodiment of the present invention. Further, Fig. 5 is a side perspective view showing the substrate processing apparatus 10 shown in Fig. 4. 200848964 As shown in FIG. 4 and FIG. 5, a wafer carrier (a substrate container, hereinafter referred to as a long pod) is used as a wafer carrier that accommodates a wafer (substrate) 200 composed of ruthenium or the like. The substrate processing apparatus 10 according to the embodiment of the present invention of the present invention 110 includes a housing 111. A front maintenance port 1 0 3 ' is provided as a front portion of the front wall 111a of the casing 111 as a maintainable opening, and front maintenance doors 104 and 104 are respectively constructed to open and close the front maintenance port 1 〇3. In the front wall 111a of the casing 111, the long cylinder loading/unloading port (the base (the "receiving container loading/unloading port") 1 1 2 is opened to communicate with the inside and outside of the casing 1 1 1 , and the long cylinder loading and unloading port 112 is borrowed. The front window panel (substrate container loading/unloading opening and closing mechanism) 113 is opened and closed. The front side of the long cylinder loading/unloading port 112 is provided with a loading magazine (substrate receiving platform) 1 1 4, and is loaded with 埠1. The 1 4 is configured to mount and align the long cylinder 110. The elongated cylinder 110 is carried into the loading cassette 114 by an in-house conveying device (not shown), and is loaded from the loading cassette 1 4 is carried out. The upper portion of the casing 111 in the front and rear directions is provided with a ί; a rotary long tubular shed (substrate receiving shed) 105, and the rotary long cylindrical shed 105 is configured as Keep a plurality of long cylinders 11 〇. That is, the rotating long-type cylinders 05 A struts 1 16 that are vertically erected and intermittently rotated in a horizontal plane; and a plurality of slabs (substrate receptacles) that are radially supported at each of the upper and lower sections of the struts 1 16 1st, a plurality of slabs 1 1 7 are configured to hold the long cylinders 1 状态 in a state in which they are placed in a plurality of positions. The loading 璋 1 14 and the rotary type in the casing 1 1 1 A long cylinder conveying device (substrate receiving container conveying device) 118 is provided between the casings 1〇5-14-200848964, and the long cylinder conveying device 118 is a long cylinder lifting and lowering which can be raised and lowered while holding the long cylinder 11〇 The ladder (substrate container elevating mechanism) 11 8a and the long cylinder transport mechanism (substrate container transport mechanism) 1 1 8 b as a transport mechanism are configured, and the long cylinder transport device 118 is configured by a long cylinder lift The continuous operation of the ii8a and the long cylinder conveying mechanism 1 1 8 b is carried in the 埠1 1 4, the rotary long cylinder 195, and the long cylinder opening machine (the substrate closing lid opening and closing mechanism) 1 2 1 The long cylinder 1 10 is transported between. (In the lower portion of the casing 11 1 in the front and rear directions, The housing 119 is configured to cover the rear end. A pair of wafer loading/unloading ports (substrate loading/unloading ports) 120 are formed in the front wall 119a of the sub-casing 119, and are vertically arranged in two vertical sections. The wafer housing 200 is carried in and out of the sub-cassettes 1 1 9 , and a pair of elongated cylinder openers 121 and 121 are provided in the upper and lower loading/unloading ports 120 and 120. The long cylinder opening machine 121 is provided. The mounting tables 122 and 122 of the elongated cylinder 110 and the cap loading/unloading mechanisms (chamber body loading and unloading mechanisms) 123 and 123 for attaching and detaching the caps (covers) of the elongated cylinders 11 are placed. The long cylinder opener 1 2 1 is configured to mount and unload the cap of the elongated cylinder 110 placed on the mounting table 122 by the cap attaching and detaching mechanism 丨 23, thereby opening and closing the wafer inlet and outlet of the elongated cylinder 110. The sub-cassette 119 constitutes a transfer chamber 124 which is fluidly isolated from the installation space of the long-tube conveying device 1 18 and the rotary long-tube 195. A wafer transfer mechanism (substrate transfer mechanism) 152 is disposed on a front side region of the transfer chamber 1 24, and the wafer transfer mechanism 125 is configured to rotate the wafer 200 in a horizontal direction or Straight-moving wafer transfer device (substrate transfer -15-200848964 carrier device) 1 2 5 a, and wafer transfer device lift for transferring wafer transfer device 1 2 5 a (substrate transfer device) Lifting mechanism) 125b. As shown in Fig. 4, the wafer transfer device lift 1 2 5 b is disposed at the right end of the pressure-resistant housing 1 1 1 and the right end of the front portion of the transfer chamber 1 24 of the sub-chamber 1 1 9 between. By the continuous operation of the wafer transfer device lift 125b and the wafer transfer device 125a, the clamp (substrate holder) 1 2 5 c of the wafer transfer device 125a is used as the wafer 200. The mounting unit aligns and wafers the wafer 200 on the wafer boat (substrate holder) 217. f ’ A standby unit 126 that accommodates the wafer boat 2 17 and stands by in the rear side region of the transfer chamber 1 24 . A processing furnace 202 is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace opening window (furnace opening and closing mechanism) 147. As shown in Fig. 4, between the right end portion of the pressure resistant housing 1 1 1 and the right end portion of the standby portion 1 26 of the sub housing 1 1 9 , a boat lift for lifting the boat 2 17 is provided. Ladder (substrate holder lifting mechanism) 1 1 5. The arm portion 1 2 8 which is a coupling device connected to the lifting platform of the boat elevator 1 15 is horizontally mounted with a sealing cap 219 as a cover, and the sealing cap 219 is configured to vertically support the boat. 217, and can block the lower end of the processing furnace 202. The structure of the boat 217 is provided with a plurality of holding members, and the plurality of wafers (for example, about 50 to 125 pieces) are aligned in the center of the wafer and arranged in the vertical direction. In the state, it is kept horizontal. As shown in Fig. 4, it is shown on the left end of the wafer transfer device lift 1 25b side of the transfer chamber 124 and the opposite side of the boat lift 1 1 5 side. There is a cleaning unit 134, which is composed of a supply fan that supplies clean air or clean air 133 of the inert gas-16-200848964 gas, and a dust filter, at the wafer transfer device 125a and the cleaning unit 134. Although not shown, a recess alignment device 135 is provided as a substrate integration device that integrates the position of the wafer in the circumferential direction. The clean air 133 from the cleaning unit 134 is circulated in the concave Port alignment device 135 and wafer transfer device 12 5a, after the boat 2 located in the standby unit 126 is sucked by a duct (not shown) or discharged to the casing 1 externally or on the suction side of the cleaning unit 134 (supply side) The cycle is again performed by the cleaning unit 134, and is blown out into the transfer chamber 124. Next, a process module provided in the substrate processing apparatus 1 to control each device in the substrate processing apparatus 10 will be described. Controller (PMC) 14. Fig. 6 shows the functional configuration of the substrate processing apparatus 10 centered on the PMC 1 4. As shown in Fig. 6, the PMC 14 has a CPU 140, a ROM 142, a RAM 144, and a memory material. a hard disk drive (HDD) 158; an input/output interface ^ (IF) 146 for transmitting and receiving data between a display device such as a display and an input means 147 including an input device such as a keyboard; and a communication control unit 156 The network 12 controls data communication with other hardware (connection management device 4, etc.); and I/O control unit 148 performs temperature control unit 150, gas control unit 15 2, pressure control I/O control of the unit 1 5 4 and the temperature control unit 150 These constituent elements are connected to each other via a bus bar 160, and data is input and output between the constituent elements via the bus bar 160. -17- 200848964 In the PMC 14, the CPU 140 processes the substrate according to a predetermined recipe. The CPU 140 outputs control data (control instruction) to the temperature control unit 150, the gas control unit 152, and the pressure control unit 154. The serial program is stored in the ROM 142, the RAM 144, and the HDD 158, and is input and output IF 1 46. The input data is based on the data input by the communication control unit 156. The temperature control unit 150 controls the temperature in the processing chamber 202 by the heater 3 3 8 provided on the outer peripheral portion of the processing furnace 202. The gas control unit 152 controls the supply amount of the reaction gas supplied into the processing furnace 202 based on the output 値 from the MFC (mass flow controller) 3 42 provided in the gas pipe 340 of the processing furnace 202. The pressure control unit 1 54 opens and closes the valve 384 according to the output 値 of the pressure sensor 346 provided in the exhaust pipe 344 of the processing furnace 202, thereby controlling the pressure in the processing chamber 202. The transport control unit 159 controls the transport system of the long cylinder opener 1 2 1 , the boat lift 1 115, the wafer transfer mechanism 125, and the like. As described above, the control controller of the temperature control unit 150 or the like performs control of each part (the heater 3 38, the MFC 3 42, the valve 348, and the like) of the substrate processing apparatus 10 in accordance with a control instruction from the CPU 1 40. Therefore, the CPU 140 starts the sequence program, calls and executes the recipe command in accordance with the sequence program, thereby stepping through the steps of setting the target of the control parameters, etc., and the temperature control unit 150 via the I/O control units 148 and 149. The gas control unit 152, the pressure control unit 154, and the transport control unit 159 transmit a control instruction for processing the substrate. The control controller such as the temperature control unit 150 performs control of each part in the substrate processing apparatus 1 (plus 200848964 heat exchanger 3 3 8 , MFC 3 42 and valve 348, etc.) in accordance with the control instruction. Thereby, the processing of the wafer 200 is performed. The CPU 14 0 transmits the related information of the state of the substrate processing apparatus 10 such as temperature information and pressure information to the connection management device 4 via the communication control unit 156. Further, the CPU 140 similarly transmits the information on the event and the failure occurring in the substrate processing apparatus 10 to the connection management device 4, and the process information. Fig. 7 is a view showing the hardware configuration of the terminal device 6. C. As shown in Fig. 7, the terminal device 6 includes a control device 16 including a CPU 18 and a memory 20, and the like, and a communication interface (IF) 22 for transmitting and receiving data to and from an external hardware via the network 12. A memory device 26 such as a hard disk drive; and a display/input device 24 including a display device such as a liquid crystal display, a keyboard, and a pointing device for a mouse. Further, the configuration management device 3, the connection management device 4, and the material management device 5 have the above-described communication IF 22 and control device 16, and are connected to the display/input device 24 as needed. In the configuration management device 3 and the like, for example, a configuration management program 30 or the like which will be described later is attached. Next, hardware that communicates with each other in the substrate processing system 2 according to the embodiment of the present invention will be described. A diagram showing the hardware and the number of connections for communicating with each other in the substrate processing system 2. The numbers shown in the figure indicate the hard-to-connect hardware. Here, η 1 to n6 are integers of 1 or more. In other words, as shown in Fig. 8, the configuration management device 3 communicates between a plurality of connection management devices 4 having the upper limit 値 ni. The connection management device 4 -19- 200848964 is set to the upper limit. The plurality of data management devices 5 of n2 communicate with a plurality of substrate processing apparatuses 10 having an upper limit of n3 and a plurality of terminal apparatuses 6 having an upper limit of n4. Substrate processing apparatus 10 and data management The device 5 communicates with one of the plurality of connection management devices 4 that are predetermined among the plurality of connection management devices 4. Further, the plurality of terminal devices 6 are composed of one configuration management device 3 and a plurality of upper limit 値 n5 even The communication device 4 communicates with each other. Fig. 9 is a diagram showing the upper limit 値 parameter table of each hardware and the upper limit 値 (maximum number of connections) of the hardware connection between f: communication with each hardware. As shown in Fig. 9, the upper limit parameter table includes the maximum 値 that each hardware can be connected to other hardware. The upper limit 値 parameter list is stored in the composition management device 3, and is connected to the composition management device. The display/input device 2 of 3 is edited. In other words, the maximum value contained in the upper limit parameter table is a change that can be changed by the user. Alternatively, the display/input device 24 of the terminal device 6 can be input. The data is transmitted to the management device 3 via the network 12, whereby the upper limit parameter table is changed. Further, the upper limit parameter table may be included in the configuration information. For example, in the substrate processing system 2, the management device 3 is constructed. The system is connected to and communicated with a maximum of eight connection management devices 4. Each of the connection management devices 4 is connected to one configuration management device 3, a maximum of eight data management devices 5, and a maximum of 32 substrate processing devices 1 In addition, each of the data management devices 5 is connected to and communicates with the network connection management device 4. -20 - 200848964 The connection relationship of each hardware is managed by the configuration information stored in the management device 3. The figure 0 is a diagram constituting the composition information constituting the management device 3. As exemplified in Fig. 10, the composition information is described in the form of XML (Extensible Markup Language). In the composition information, the area indicated by the arrow A in the figure is shown. The setting (type, name, address (position information)) constituting the management device 3 is described. The area indicated by the arrow B in the figure describes the setting (type, name, and position) of the connection management device 4. Address (Location Information)), in the area indicated by the arrow C in the figure, the setting (type, name, address (location information)) of the material management device 5 is described. Further, in the area indicated by the arrow D in the figure, the setting (type, name, address (position information)) of the connection configuration of the substrate processing apparatus 1 and the group management system 7 is described. In the present example, the "nodes" identifier table does not describe the configuration information constituting the management device 3, the connection management device 4, and the material management device 5. The "η 〇 d e" identifier indicates setting information of each hardware, and "η 〇 d e _ t y p e" of the identifier indicates the type of the hardware. For example, "〇 d B" indicates that the hardware is the configuration management device 3, "EDS" indicates that the hardware is the connection management device 4, and "E D B" indicates that the hardware is the management data device 5. Further, "η 〇 d e — i d" of the identifier is used for identifying the unique identifier of the hardware among the categories. In addition, the "η 〇 d e — n a m e" identifier indicates the name of the hardware. The "i P _ a d d r" identifier indicates the 丨p address set in the hardware. 1 200848964 Therefore, in the area indicated by the arrow A, it is described that the type of the hardware is the configuration management device 3 (GDB), and the name of the hardware is "gDB", which is set to the i P bit of the hardware. The address is 1 9 2 . 1 6 8 . 1 1 · 1. Further, in the area indicated by the arrow B, it is described that the type of the hardware is the connection management device 4 (ED S), the identification element of the connection management device 4 is "1", and the name of the hardware is "EDS#". 2", the ip address set in the hardware is 192. 168. 11. 2. Further, in the area indicated by the arrow C, it is described that the type of the hardware is the data management device 5 (EDB), the identification element of the data management device 5 is "1", and the name of the hardware is "EDB#2". The IP address set for this hardware is 1 92. 1 6 8. 1 1. 1 0. Further, in this example, the "e q" identifier indicates setting information of the substrate processing apparatus 1 ,, and "eq_type" of the identifier indicates the type of the substrate processing apparatus 10. The "eq_name" identifier indicates the name of the substrate processing apparatus 10. Further, the "eds_n a me" identifier indicates the name of the connection management device 4 that is connected to the substrate processing apparatus 10 and communicates, and the "edb_name" identifier indicates that the connection management device 4 shown by "eds__name" is connected and accumulated. The name of the material management device 5 of the related information of the substrate processing apparatus 10. Here, the names indicated by the "eds_name" identifier and the "edb_name" identifier are the names indicated by the above "node_name" identifier. Further, the "eq_ad dr" identifier indicates an ip address set in the substrate processing apparatus 1. Therefore, in this example, it is described that the type of the substrate processing apparatus 1 is "systeml", the name of the hardware is "device 1", and the substrate processing apparatus 10 is connected to the name "EDS#2". The connection management device 4, -22 - 200848964 and communicates with the connection management device 4, will be. The data management device 5 of "EDB #1" is connected to the connection pipe ί| The information about the substrate processing device 10 is stored in the resource 5. In addition, the name of the identifier, the setting content, and the like are not limited. The description of the format of the information may be a form described as a material, and is not limited to XML, and EDS and EDB may be plural. This composition information is edited by f 'not shown here. The editing software system herein operates on, for example, the configuration 3, reads the composition stored in the composition management device 3 and displays it on the screen, and accepts the editing content. Fig. 1 is a diagram schematically showing a configuration based on the composition information. As illustrated in Fig. 1, the configuration management device 3 is connected to and connected to the connections 4 -1 to 4 - η. For example, the connection management device configures the management device 3, the two substrate processing devices, and the two data management devices 5 that store the related information of the plate processing device 10 for communication. Further, for example, the connection management device 4-2 communicates with the configuration 3, the substrate processing device 1 and the data management device. The terminal device 6 is connected to and communicates with the configuration management device 3 and the connection pipes 1-4 to η. Therefore, the terminal device 6 acquires information on the substrate processing device 10 connected to the connection 4 -1 to 4 - n from the material management device 5 connected to the devices 4 -1 to 4 - n, and δ is referred to as 1 device. 4. Material management is installed in this example. The connection form. In addition, the editing software is installed to manage the information, and the connection management device 4-1 is connected to the two bases and connected to the management device 5 to connect the device 4-1. The connection management device is displayed on the screen -23 - 200848964 The set of 10 〇 的 76 76 76 〇 ; ; ; ; ; ; ; ;; Therefore, the user views the related information of the substrate device 10 via the terminal device 6. Further, the terminal device 6 can also acquire and display information related to the substrate processing apparatus 1 included in the information. In the substrate processing system 2 according to the embodiment of the present invention, the information related to the substrate processing unit 10, that is, the information that can be viewed by the user is set for each user. As shown in FIG. 2, in this example, the user can view the substrate processing apparatus 1 (the related information and the connection management apparatus 4 - η) connected to the connection management apparatus 4-1 via the terminal device 6. The information relating to the connected substrate processing apparatus is stored in the configuration management apparatus 3. When the user logs in, for example, the terminal apparatus 6, the terminal apparatus 6 confirms the browsing authority stored in the configuration management apparatus 3. 1 2 shows a substrate processing apparatus selection screen 70 map for setting the viewing authority of the information relating to the substrate processing apparatus 10 for each user. As shown in FIG. 12, the substrate processing apparatus selection screen 70 includes ^f. The list display area 72, the viewable device display area 74, the additional button, and the delete button 78 are displayed. In the device list display area 72, a list of 256 substrate processing apparatuses 1 included in the example substrate processing system 2 is displayed. In this example, with respect to each of the substrate processing apparatuses 1A, the identification number of the substrate processing apparatus 10, the name of the substrate processing apparatus 1A, and the substrate processing are connected. The name of the connection management device 4 (server name) is set to 10. The substrate processing device 10 included in the substrate processing system-24-200848964 is displayed in the viewable device display area 7.4, that is, the target user The identification number of the viewer, the name of the substrate processing apparatus 10, and the name of the connection management apparatus 4 connected to the substrate processing apparatus 10. The additional button 76 is for processing the substrate selected in the apparatus list display area 72. The device 10 is added to the button in the viewable device display area 74. When the substrate processing device 10 is added to the viewable device display area 74, the user can view the related information of the substrate processing device 。. The button 78 is used to delete the substrate processing device 10 selected from the viewable device display area 74 from the viewable device display area 74. When the substrate is deleted from the viewable device display area 74 When the processing device 1 is ,, the user cannot view the related information of the substrate processing apparatus 1 . The substrate processing apparatus selection screen 70 is displayed in the composition. The display/input device 24 of the management device 3 stores the set contents in the configuration management device 3. Further, the substrate processing device selection screen 70 is displayed on the display/input device 24 of the terminal device 6 via the terminal. The data input by the display/distribution of the device 6 and the I input device 24 are transmitted to the configuration management device 3 via the network 12, thereby setting the viewing authority. For example, if the user is set, the user can view the first number. In the case of the information on the substrate processing apparatus 10 of the No. 12th, the user B can view the related information of the substrate processing apparatus 10 from the 129th to the 25th, when the user A logs in to the terminal apparatus 6, at 25 In the six substrate processing apparatuses 10, a list of the 28 substrate processing apparatuses 1 to which the authority is given is displayed on the screen. Further, although not described in detail, the user A and the user B two-25-200848964 can of course read the information of the same substrate processing apparatus 10. Next, a program for operating on the hardware included in the substrate processing system 2 of the embodiment of the present invention will be described with reference to Figs. 13 to 16'. Fig. 13 is a view showing the functional configuration of the configuration management program 30 which is executed by the management device 3. As shown in FIG. 1, the configuration management program 30 includes a communication unit 300, a configuration information storage unit 312, a system information storage unit 304, an authority storage unit 306, a configuration information update unit 308, and a configuration information management unit. 3 10. System resource management unit 3 1 2. The authority setting unit 3 1 4 and the authority management unit 3 16 . The configuration management program 30 is stored in the memory device 26 via a recording medium 28 (FIG. 7) such as FD, CD, or DVD, and is supplied to the configuration management device 3, loaded into the memory 20, and used in the control device. 1 6 is performed on the 〇S that is not shown. Further, the configuration management program 30 can be supplied from the external computer connected to the network 1 to the control device 16 via the communication IF 22. In addition, the subsequent programs are also supplied to each hardware in the same manner. In the configuration management program 30, the communication unit 300 performs communication processing necessary for communication with r k of each hardware. Specifically, the communication unit 300 changes the data generated by each of the constituent elements constituting the management program 30 to a form suitable for communication processing, and outputs the network 12 via the communication IF 22. Further, the communication unit 300 outputs data of a predetermined form received from the network 12 to other components. The constituent information storage unit 302 stores the composition information (Fig. 10) and the upper limit parameter table (Fig. 9) of the substrate processing system 2 constituting the management device 3. The information storage unit 322 is realized by at least one of the memory 20 and the memory device 26. The system information storage unit 304 is shared information such as failure information stored in the substrate processing system 2. The authority storage unit 306 is a board processing device selection screen 70 (Fig. 12) to memorize the browsing authority for each setting. The system information storage unit 3 〇4 and the authority memory system are realized in the same manner as the configuration information storage unit 312. The configuration information update unit 308 receives the change operation of the component (addition, deletion, etc.) by the display/input device 24 constituting the management device terminal device 6, and updates the configuration memory unit 302 based on the change content. In addition, the configuration information update system similarly accepts the change operation of the upper limit parameter table, and updates the upper limit parameter constituted by the information storage unit 306 according to the content _ constituting the information management unit 3 The reference information of the configuration information of the other hardware such as the terminal device 6, the connection device 4, and the like is received from the connection management device 4 for the constituent information system information management unit 3 1 2 that is stored in the configuration information storage unit 302. I ί V processing device 10 shares the shared information transmitted by the management device 4, and the system information storage unit 340. The authority setting unit 3 14 refers to the rights storage unit 306 to store the authority 'and the substrate processing device selection screen 7 0 Displayed on the display/set 24, the setting contents input through the screen are accepted, and the viewing authority stored in the authority storage unit 306 is updated based on the content. The management unit 3 16 receives the viewing reference request from the terminal device 6, and transmits the change to the terminal device 6 of the request source in the permission memory, and the change is performed by the base user 3 06 3 or the tracking information unit 3 08. The management permission is stored in the section 3 06 -27 - 200848964 in which the setting authority is stored, and the connection is performed by the connection management apparatus 4. The function configuration diagram of the management program 40. As shown in Fig. 14, the connection management program 40 has a communication unit 300, a configuration information storage unit 302, a configuration information acquisition unit 400, a connection establishment unit 402, and device information memory. The unit 404 and the device information management unit 406. In the respective configurations shown in Fig. 14, the same reference numerals are given to the components shown in Fig. 13. (' In the connection management program 40, the information is formed. After the connection management device 4 is activated, the acquisition unit 400 requests the configuration management device 3 to request information, and receives the configuration information transmitted from the configuration management device 3 and stores it in the configuration information storage unit 322. When the configuration information is acquired by the information acquisition unit 400, the establishment unit 402 establishes a connection between the substrate processing apparatus 10 and the material management apparatus 5 based on the configuration information stored in the configuration information storage unit 302. More specifically, In other words, the connection establishing unit 402 recognizes the connection configuration based on the names of the hard disks described in the configuration information, and establishes a connection with the hardware of the name. The device information storage unit 404 is stored by the connection. The information related to the substrate processing apparatus 1 transmitted by the substrate processing apparatus 10 connected to the management device 4. This information includes the operational status of the device itself, including temperature information, pressure information, gas flow information, and the like. The device information memory unit 404 is realized by at least one of the memory 20 and the memory device 26. -28 - 200848964 The device information management unit 406 receives the information on the substrate processing device 1 transmitted by the substrate processing device 10 connected to the connection management device 4, and stores the information in the device information storage unit 404. The device information management unit 406 transmits, to the configuration management device 3, information having a low frequency of occurrence of failure information or the like in such information. Further, the device information management unit 406 transmits information having a high frequency of occurrence of temperature information, pressure information, and the like to the material management device 5 connected to the connection management device 4. Further, such information may not be stored in the device information storage unit 404, but may be transmitted to the configuration management device 3 and the material management device 5, respectively. Further, the information slave device information management unit 406 performs only various forms such as a form directly transmitted by the configuration management device 3. Fig. 15 is a view showing the functional configuration of the material management program 50 executed by the material management device 5. As shown in FIG. 15, the data management program 50 has a communication unit 300, a configuration information storage unit 3 0, a configuration information acquisition unit 400, a connection establishment unit 402, a data information storage unit 5 00, and data information. Management Department 5 02. In the respective configurations shown in Fig. 15 and the configurations shown in Figs. 13 and 14 are substantially the same, the same reference numerals are given. In the data management program 50, the material information storage unit 500 stores information related to the substrate processing apparatus 10 connected to the connection management device 4 connected to the material management device 5. The information includes, for example, 'temperature information, pressure information, and the like. The data information storage unit 500 is realized by at least one of the memory 20 and the memory device 26. The data information management unit 5 0 receives the slave device -29 - 200848964 processing device 10 from the connection management device 4 The information transmitted by the management device 4 is connected to the information storage unit 500. Fig. 16 is a view showing a functional configuration diagram executed by the terminal device 6. As shown in FIG. 16, the terminal program 60 has a configuration shown in the figure j information storage unit 302, the configuration information acquisition unit 400, the user interface (UI) unit 600, and the authority acquisition unit 602. In the terminal program 60, the UI unit 600 displays a substrate processing device selection screen 70 on the display and a screen for updating the limit parameters (not shown). a screen (not shown) for displaying a substrate processing device, etc. The UI unit 600 transmits the other hardware through the display/input device 24, and the authority acquiring unit 602 is configured to be used by the user to log in to the terminal. The management device 3 requests the authority of the user, accepts the authority to transmit the I3, and connects the output of the connection establishment unit 402 to the connection within the range connectable by the user. Next, the substrate processing according to the embodiment of the present invention will be described. Fig. 17 is a sequence diagram showing the activation of the connection management device 4. As shown in Fig. 17, the connection management device 4 is operated by the startup program 40 on the connection management device 4, and is stored in the terminal program of the data in the step. 6 The utterance unit 00 and the constituting unit 402 are configured. The configuration/input device 24 shown in Fig. 16 constitutes information and the content of the top-side 10's received by the communication unit 301. In the case of the slave management unit, the operation of the connection establishment unit processing system 2 (S 1 0), the connection management 100 (S100), -30-200848964, the configuration information acquisition unit 400 of the connection management program 40 The configuration management device 3 requests the transmission of the composition information. When the composition management unit 3 10 that constitutes the management program 30 receives the request, the composition management device 3 transmits the stored composition information to the connection management device 4. In the management device 4, the configuration information acquisition unit 400 of the connection management program 40 receives the transmitted configuration information and stores it in the configuration information storage unit 312. In step 102 (S102), the connection establishment unit 402 refers to the memory. According to the configuration information, one or more substrate processing apparatuses 1 to be connected are identified, and a connection is established between the substrate processing apparatus 10 and the substrate processing apparatus 10. In step 104 (S104), the connection establishing unit 402 is connected. system Based on the configuration information, the data management device 5 that has established one or more connections is identified, and the connection is established with the data management device 5. The data management device 5 also performs the operation of establishing the connection at the time of startup. 8 is a sequence diagram showing an operation (S20) at the time of reading of information relating to the substrate processing apparatus using the terminal device 6. As shown in FIG. 18, when the user logs in to the terminal device 6, In step 200 (S200), the configuration information acquisition unit 400 of the terminal program 60 requests the configuration management device 3 to transmit the composition information 'and acquires the composition information. Further, the authority acquisition unit 602 requests the management device 3 to request the authority to transmit the user, and acquires the authority. In step 202 (S202), the connection establishing unit 402 recognizes that the 200848964 installation is confirmed based on the stored composition information and the authority acquired by the authority acquisition unit 602. The sender S sends a 123 example 133 111. The connection management device 4 of one or more connected terminals establishes a connection with the connection management unit 4. In step 204 (S204), the connection establishing unit 402 identifies one or more data management devices 5 to be established based on the configuration information and the authority, and communicates with the data management device 5 via the connection management device 4 A separate connection. In this manner, when the connection is established in the substrate processing system 2, the information of the substrate processing performed by the substrate processing apparatus 10 can be received or accumulated. Next, the substrate processing of the substrate processing apparatus 10 will be described in detail. As shown in FIGS. 4 and 5, when the long cylinder 110 is supplied to the carrier 114, the long cylinder is moved into the delivery port 112 by the front window 113, and the long type is loaded on the crucible 114. The cylinder 11 is carried into the inside of the casing 111 from the long cylinder loading/unloading port 112 by the long cylinder conveying device. The long cylinder 11 that has been carried in by the long cylinder conveyance device 118 is conveyed and conveyed to the designated slab of the rotary long shovel 1 〇 5, and is temporarily stored, and then transported and delivered from the shed 117. After the one of the long type 'opening machine 1 2 1 is temporarily stored, it is transported from the slab 1 1 7 to the long cylinder opener 121 and transferred to the mounting table 122, or directly to the long cylinder. The machine 121 is transferred to the mounting table 122. At this time, the wafer loading/unloading port 1 2 0 of the long cylinder starter 1 2 1 is closed by the cap loading and unloading mechanism, and is circulated in the transfer chamber 1 24 and filled with the clean air 133. For example, 'in the transfer chamber 1 24' is set so as to be filled with nitrogen gas as clean air, and the oxygen concentration is 20 ppm or less, which is much lower than the oxygen concentration inside the body (atmospheric gas). -32- 200848964 The end face of the long cylinder 1 1 0 placed on the mounting table 1 22 is pressed to the opening edge portion of the wafer loading/unloading port 120 of the front wall 1 19a of the sub-casing 1 19 . At the same time, the cap is removed by the cap loading and unloading mechanism 1 23, and the wafer entrance and exit is opened. When the long cylinder 1 1 〇 is opened by the long cylinder opener 1 2 1 , the wafer 200 is removed from the elongated cylinder 110 by the clamp 125c of the wafer transfer device 125a and through the wafer inlet and outlet. After picking up, the wafer is integrated by the notch aligning device 1 35 (not shown), and then carried into the standby portion (! 126 located behind the transfer chamber 1 24, and is garnished on the boat 217. The wafer transfer device 125a that transfers the wafer 200 to the wafer boat 217 returns to the elongated cylinder 1 10 and mounts the next wafer 200 to the wafer boat 217. The long cylinder of this side (upper or lower section) is opened. In the mounting operation of the wafer transfer unit 125 of the wafer 121 to the wafer boat 2 17 , the other long cylinders 110 are transported from the rotary long cylinder 105 by the long cylinder conveying device 18 And moving the long cylinder opener 1 2 1 of the other side (lower or upper section) and simultaneously opening and closing the long cylinder 1 1 藉 by the long cylinder opener 1 2 1 . The wafer 200 is mounted on the wafer boat 2, and the lower end of the processing furnace 202, which has been closed by the furnace opening window 147, is opened by the furnace window 147. The 'seal cap 2 1 9 rises due to the boat lift Π 5 , so the boat 217 holding the wafer 200 group will be loaded into the processing furnace 202. After loading, in the processing furnace 202 ' The wafer 200 is processed according to a predetermined recipe. After the processing, except for the integration steps of the wafers of the notch alignment devices 135 - 33 - 200848964 (not shown), in the reverse order described above, 200 and the long type The substrate processing unit 10 is sent out to the outside of the casing. The substrate processing apparatus 10 transmits the substrate processing apparatus in the state of the substrate processing apparatus, such as temperature information and pressure information, during the substrate processing. The system transmits event information, failure information, and history information to the connection pipe 4. Next, a method of reflecting the edited composition information on the substrate unit 2 will be described. Fig. 19 shows a system configuration management screen of the management substrate processing system 2. A map of 80. As illustrated in Fig. 19, the system management screen 80 includes a pass 82, a push button 84, a restore button 86, a node button user edit button 90, and a group edit button 92. The permission editing is performed by the cut and end button 96. The system management screen 80 is displayed on the display/input device 24 connected to the configuration 3, and the management device 3 is configured by the system management screen 80 by, for example, a mouse and a keyboard. In the system management screen 80, the import button 84 is a button that constitutes a state in which the composition information is notified in the configuration 3. When the button 84 is pressed, the composition information is updated to the edited content, and is configured. The memory device 26 of the management device 3. The notification button 8 2 is a button for changing the connection configuration by using information. When the notification button 8 2 is pressed, the other hardware of the connection management device 4 or the like transmits a button other than the import button 8 4 and the notification button 8 2, because the wafer is connected to the management device 0 The system knows the button 88, so that: 94 is managed by the management device that accepts the intervention and is stored in the configuration according to the configuration. OFF and this issue -34 - 200848964 There is no direct relationship, so the description is omitted. Further, the system management screen 80 can also be displayed on the display/input device 24 of the terminal device 6, and the setting contents input via the display/input device 24 of the terminal device 6 can be transmitted to the configuration management device 3 via the network 12. In order to update the composition information. In this case, the editing software herein also operates on the terminal device 6. Fig. 20 is a view for explaining the switching operation when a failure occurs in the connection management device 4. As shown in Fig. 20(A), when the failure occurs in the connection management device 4-1, the operator edits the composition information stored in the configuration management device 3 in the display/input device 24, and the system management screen 8 is received. 0 causes the edited composition information to be reflected on the substrate processing system 2. Therefore, the terminal device 6 or the like instructs the reflection of the changed configuration information and the notification to the connection management device 4. When the notification button 82 is pressed on the system management screen 80, as shown in Fig. 20(B), the configuration management device 3 transmits a configuration information change notification to the connection management device 4-2. When receiving the configuration information change notification, the connection management device 4-2 acquires the configuration information from the configuration management device 3, and establishes a connection between the substrate processing device 1A and the material management device 5 based on the configuration information. Therefore, the substrate processing apparatus 1 and the material management apparatus 5, which have been connected to the connection management apparatus 4-1, establish a connection with the connection management apparatus 4-2 and communicate with the connection management apparatus 4-2. Fig. 21 is a sequence diagram showing the switching operation (S30) when the composition information has been updated. -35 - 200848964 As shown in Fig. 21, in step 300 (S3 00), the user uses the display/input device 24 of the terminal device 6, for example, to edit the memory of the composition management device 3 on the editing software herein. Constitute information. When the user presses the import button 84 of the system management screen 80, the configuration information update unit 308 constituting the configuration management program 30 constituting the management device 3 causes the changed content to be reflected on the configuration information storage unit 302. In step 3 02 (S 3 02), when the notification button 82 of the system management screen 80 is pressed, the configuration information management unit 310 constituting the management program 30 receives the configuration information change notification from the terminal device 6. In step 304 (S 3 04), the configuration information management unit 310 transmits a notification to the connection management device 4 that the information is changed. In step 306 (S306), the configuration information acquisition unit 400 of the connection management program 40 operating on the connection management device 4 requests the configuration management device 3 to transmit the configuration information. In the configuration management device 3, when the configuration information management unit 301 constituting the management program 30 receives the request, the stored configuration information is transmitted to the connection management device 4. In the connection management device 4, connection management < The configuration information acquisition unit 400 of the program 40 receives the transmitted composition information and stores it in the configuration information storage unit 302. In step 308 (S 3 08), the connection establishing unit 402 refers to the stored configuration information, identifies one or more data management devices 5 to be connected based on the configuration information, and establishes with the data management device 5 Connect, and perform initialization processing. In step 310 (S 3 10), the connection establishing unit 402 receives the initialization completion notification from the material management device 5. -36-200848964 In step 312 (S 31 2), the connection establishing unit 402 refers to the stored composition information, and identifies one or more substrate processing apparatuses 10 to be connected based on the configuration information, and the substrate A connection is established between the processing devices 10 . In this manner, when the connection is established in the substrate processing system 2, the substrate processing is performed by the substrate processing apparatus 10. As described above, the substrate processing system 2 of the present invention has a plurality of substrate processing apparatuses 10 for processing a substrate and a group management system 7 connected to the substrate processing (the apparatus 1), wherein the group management system 7 has : constituting an information memory device (constituting the management device 3) constituting information; a plurality of communication devices (connection management devices 4) constituting the plurality of substrate processing devices based on the composition information stored in the information storage device Communicating between at least one of the devices; and a device information storage device (data management device 5) storing any one of the plurality of communication devices based on the composition information stored in the information storage device, and Information about the substrate processing apparatus that communicates between the communication devices. Because of V / , according to the present invention, even when the number of connected substrate processing apparatuses is increased, the group management apparatus is not added, and The connection of many substrate processing apparatuses. Also, when adding a substrate processing apparatus, It is preferable that the group management device is added to reduce the cost. Preferably, the configuration information includes a connection relationship between the substrate processing device, the configuration information storage device, the communication device, and the device information storage device. According to the present invention, it is possible to easily change and expand the connected device, and the time required for maintenance can be shortened. -37 - 200848964 Thereby, the operating rate of the substrate processing system can be improved. The maximum number of connections that the management device 3, the connection management device 4, and the data management device 5 can connect to each other, and the setting means for setting the maximum number of connections. Therefore, by changing the maximum number of connections, the substrate processing system can be enhanced. Since the hardware of 2 can be changed more easily, in particular, in the future, when the hardware performance is improved, it is only necessary to change this parameter to improve the overall system specifications. To achieve this. ^ The information is formed because the management device 3 is centralized. Therefore, each of the hardware can recognize the connection configuration by acquiring the configuration information from the configuration management device 3 at the time of startup. Therefore, in each hardware, the activation sequence can be fixed. In addition, in the configuration information, each hardware is fixed. By giving a unique name, the connection form is defined by the name. Therefore, it is possible to correspond to the change of the hardware name by the name of the change, thereby enabling the change of the configuration and the exchange of the hardware. The time required for the operation is reduced. (V / The configuration management device 3 stores information related to the plurality of substrate processing devices 10, that is, information stored in the data management device 5. In particular, the management device is configured. The 3 system stores information with a low frequency of occurrence, and the data management device 5 stores information with a high frequency of occurrence. Therefore, even when the burden on the entire substrate processing system 2 is increased, it is not necessary to re-modify the entire system configuration, and only the data management is added. The device 5' can improve the overall performance of the substrate processing system 2. For example, in the case where the substrate processing apparatus 1 generates more information about the substrate processing apparatus 10 - 38 - 200848964, and the burden of the data management apparatus 5 storing the related information of the substrate processing apparatus 10 is increased, By increasing the number of data management devices 5 storing the related information of the substrate processing apparatus 10, the system can be easily expanded and the burden on the material management apparatus 5 can be reduced. Further, it is more preferable to have display means for displaying information on the substrate processing apparatus included in the configuration information. In the substrate processing system 2 of the present invention, the authority for viewing the information of the substrate processing apparatus 10 using the terminal device 6 is set for each user, and f% is stored in the configuration management device 3. Therefore, even when the number of the substrate processing apparatuses 10 connectable from the terminal device 6 is limited to an upper limit (for example, 128), the number of substrates exceeding the upper limit can be viewed by using a plurality of users. Processing related information of the device 10. More suitably, there is an indication means for indicating the reflection of the changed composition information and the notification to the communication device. Further, the substrate processing apparatus 1 of the present invention is not only a semiconductor manufacturing apparatus but also a device for processing a glass substrate such as an LCD device. Further, C, the substrate processing apparatus 10 of the present invention is not limited to the treatment in the furnace, and can perform a process of forming C V D, P V D, an oxide film, a nitride film, and a film formation process including a process of forming a film containing a metal. Further, the substrate processing apparatus 10 of the present invention is not only a vertical type device but also a single piece apparatus. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the configuration of a substrate processing apparatus 1 including a system A and a system B. Figure 2 is a diagram illustrating the transfer of substrate processing apparatus - 39 - 200848964 1 0 between different subsystems. Fig. 3 is a view showing the configuration of a substrate processing system 2 according to an embodiment of the present invention. Fig. 4 is a perspective view showing a substrate processing apparatus 1 according to an embodiment of the present invention. Fig. 5 is a side perspective view showing the substrate processing apparatus 1 according to the embodiment of the present invention. Fig. 6 is a view showing the functional configuration of the substrate processing apparatus 10 centering on the PMC 14. Fig. 7 is a view showing the hardware configuration of the terminal device 6. Fig. 8 is a view for explaining the hardware and the number of connections for mutual communication in the substrate processing system 2. Fig. 9 is a view showing an example of an upper limit 値 parameter table of each hardware and an upper limit 硬 of a hardware connection for communication between the respective hardware. Fig. 10 is a view exemplifying the composition information constituting the management device 3. Fig. 1 is a diagram schematically showing a connection relationship formed based on constituent information. Fig. 1 is a view showing a substrate processing apparatus selection screen 70 for setting the viewing authority of the information relating to the substrate processing apparatus 1 to each user. Fig. 13 is a view showing the functional configuration of the configuration management program 30 which is executed by the management device 3. Fig. 14 is a diagram showing the functional configuration of the program 40 by the connection management device 4 - 40 - 200848964. Fig. 15 is a view showing the configuration of the data management program 50 executed by the data management device 5. Fig. 16 is a view showing the functional configuration of the terminal program 60 executed by the terminal device 6. Fig. 17 is a sequence diagram showing an operation (S 10) at the time of activation of the connection management device 4. Fig. 18 is a sequence diagram showing an operation (S20) at the time of reading of information relating to the substrate processing apparatus 10 using the terminal device 6. Fig. 19 is a view showing a system management screen 80 of the system configuration of the management substrate processing system 2. The 20th (A) and (B) diagrams are diagrams for explaining the switching operation when a failure occurs in the connection management device 4. Fig. 21 is a sequence diagram showing the switching operation (S30) when the composition information has been updated. [Main component symbol description] 2 Substrate processing system 3 Construction management device 4 Connection management device 5 Data management device 6 Final JL mountain touch device 7 Group management system 10 Base plate processing device 12 Network -41- 200848964
/ \ 30 構 成 管 理 程 式 40 連 接 管 理 程 式 50 資 料 管 理 程 式 60 終 端 程 式 300 通 信 部 302 構 成 資 訊 記 憶 部 304 系 統 資 訊 記 憶 部 306 權 限 記 憶 部 308 構 成 資 訊 更 新 部 310 構 成 資 訊 管 理 部 312 系 統 資 訊 管 理 部 314 權 限 設 定 部 316 權 限 管 理 部 400 構 成 資 訊 取 得 部 402 連 接 確 部 404 裝 置 資 訊 記 憶 部 406 裝 置 資 訊 管 理 部 500 資 料 資 訊 記 憶 部 502 資 料 資 訊 管 理 部 600 UI 部 602 權 限 取 得 部 -42 -/ \ 30 Configuration management program 40 Connection management program 50 Data management program 60 Terminal program 300 Communication unit 302 Configuration information storage unit 304 System information storage unit 306 Authority storage unit 308 Configuration information update unit 310 Configuration information management unit 312 System information management unit 314 Authority setting unit 316 Rights management unit 400 Configuration information acquisition unit 402 Connection confirmation unit 404 Device information storage unit 406 Device information management unit 500 Data information storage unit 502 Data information management unit 600 UI unit 602 Authority acquisition unit - 42 -