TWI372005B - Method for transferring adhesive film - Google Patents

Method for transferring adhesive film

Info

Publication number
TWI372005B
TWI372005B TW098103988A TW98103988A TWI372005B TW I372005 B TWI372005 B TW I372005B TW 098103988 A TW098103988 A TW 098103988A TW 98103988 A TW98103988 A TW 98103988A TW I372005 B TWI372005 B TW I372005B
Authority
TW
Taiwan
Prior art keywords
adherend
adhesive layer
adhesive
adhesive film
contact
Prior art date
Application number
TW098103988A
Other languages
English (en)
Other versions
TW200938032A (en
Inventor
Misao Konishi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200938032A publication Critical patent/TW200938032A/zh
Application granted granted Critical
Publication of TWI372005B publication Critical patent/TWI372005B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrophotography Using Other Than Carlson'S Method (AREA)
TW098103988A 2008-02-05 2009-02-05 Method for transferring adhesive film TWI372005B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008024723A JP5010493B2 (ja) 2008-02-05 2008-02-05 接着フィルムの転着方法

Publications (2)

Publication Number Publication Date
TW200938032A TW200938032A (en) 2009-09-01
TWI372005B true TWI372005B (en) 2012-09-01

Family

ID=40952117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103988A TWI372005B (en) 2008-02-05 2009-02-05 Method for transferring adhesive film

Country Status (10)

Country Link
US (1) US8105462B2 (zh)
EP (1) EP2144283B1 (zh)
JP (1) JP5010493B2 (zh)
KR (1) KR101033251B1 (zh)
CN (1) CN101681860B (zh)
AT (1) ATE498906T1 (zh)
DE (1) DE602009000738D1 (zh)
HK (1) HK1139787A1 (zh)
TW (1) TWI372005B (zh)
WO (1) WO2009099042A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5289291B2 (ja) * 2009-12-01 2013-09-11 デクセリアルズ株式会社 電子部品の製造方法、電子部品および導電性フィルム
JP7131938B2 (ja) * 2018-03-29 2022-09-06 芝浦メカトロニクス株式会社 粘着テープの貼着装置
DE102018221148A1 (de) 2018-12-06 2020-06-10 Heraeus Deutschland GmbH & Co. KG Verfahren zum Herstellen eines Substratadapters und Substratadapter zum Verbinden mit einem Elektronikbauteil
KR102157003B1 (ko) 2019-07-16 2020-09-16 이재영 측량용 깃발

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299575A (ja) * 1988-10-05 1990-04-11 Hitachi Chem Co Ltd 切り抜き部を有する離型性フィルム付粘接着フィルムの製造法
JP2803579B2 (ja) * 1994-10-31 1998-09-24 松下電器産業株式会社 回路基板の製造方法および製造装置
JP3082697B2 (ja) 1997-02-27 2000-08-28 日本電気株式会社 異方性導電フィルム貼付方法及び装置
KR100263553B1 (ko) 1997-03-21 2000-08-01 안민혁 회로기판용 라미네이팅기
JP3914606B2 (ja) * 1997-04-25 2007-05-16 松下電器産業株式会社 接着層の製造装置、両面基板の製造装置および多層基板の製造装置
KR100268760B1 (ko) 1998-06-19 2000-10-16 정도화 플렉시블볼그리드어레이회로기판의제조장치
JP2001293686A (ja) 2000-04-13 2001-10-23 Seiko Epson Corp 異方性導電フィルムの貼写方法及びフィルムカッター
KR100380611B1 (ko) 2000-10-13 2003-04-26 오티에스테크놀러지 주식회사 필름 라미네이팅 장치 및 그 방법
JP4552352B2 (ja) * 2001-05-09 2010-09-29 ソニー株式会社 接着フィルムの貼着方法、貼着装置および電子回路装置の組立方法
JP4187065B2 (ja) * 2003-01-17 2008-11-26 日東電工株式会社 粘着テープ貼付け方法およびその装置
US7513284B2 (en) * 2004-01-21 2009-04-07 Panasonic Corporation Compression device
JP2006093518A (ja) 2004-09-27 2006-04-06 Seiko Epson Corp 異方性導電膜切断装置、異方性導電膜切断装置を備えた実装装置、異方性導電膜切断方法、および製造方法
JP2006284830A (ja) 2005-03-31 2006-10-19 Sanyo Epson Imaging Devices Corp 電気光学装置の製造装置、電気光学装置の製造方法及び接着剤の貼り付け装置
JP4708896B2 (ja) * 2005-07-20 2011-06-22 芝浦メカトロニクス株式会社 粘着性テープの貼着装置及び貼着方法
JP2007030085A (ja) 2005-07-25 2007-02-08 Pioneer Electronic Corp 粘着フィルム切出装置、配線接続装置、粘着フィルム切出方法、配線接続方法及び平面表示装置の製造方法
JP4878153B2 (ja) 2005-12-08 2012-02-15 電気化学工業株式会社 粘着テープ用フィルム基材及び粘着テープ
JP4818008B2 (ja) * 2006-07-20 2011-11-16 株式会社東芝 異方導電性テープの貼着装置および電気機器の製造方法
US7934531B2 (en) * 2008-04-18 2011-05-03 Brady Worldwide, Inc. Method and apparatus for applying heat activated transfer adhesives

Also Published As

Publication number Publication date
CN101681860A (zh) 2010-03-24
US20100071841A1 (en) 2010-03-25
DE602009000738D1 (de) 2011-03-31
KR101033251B1 (ko) 2011-05-06
HK1139787A1 (en) 2010-09-24
EP2144283B1 (en) 2011-02-16
EP2144283A4 (en) 2010-06-02
ATE498906T1 (de) 2011-03-15
WO2009099042A1 (ja) 2009-08-13
CN101681860B (zh) 2012-03-28
TW200938032A (en) 2009-09-01
JP5010493B2 (ja) 2012-08-29
EP2144283A1 (en) 2010-01-13
US8105462B2 (en) 2012-01-31
KR20100003736A (ko) 2010-01-11
JP2009188073A (ja) 2009-08-20

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