TWI340298B - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
TWI340298B
TWI340298B TW095121437A TW95121437A TWI340298B TW I340298 B TWI340298 B TW I340298B TW 095121437 A TW095121437 A TW 095121437A TW 95121437 A TW95121437 A TW 95121437A TW I340298 B TWI340298 B TW I340298B
Authority
TW
Taiwan
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
TW095121437A
Other languages
English (en)
Other versions
TW200710593A (en
Inventor
Kate Nicolaas Ten
Nicolaas Rudolf Kemper
Sjoerd Nicolaas Lambertus Donders
Christiaan Alexander Hoogendam
Sergei Shulepov
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200710593A publication Critical patent/TW200710593A/zh
Application granted granted Critical
Publication of TWI340298B publication Critical patent/TWI340298B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
TW095121437A 2005-06-28 2006-06-15 Lithographic apparatus and device manufacturing method TWI340298B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/167,552 US7834974B2 (en) 2005-06-28 2005-06-28 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
TW200710593A TW200710593A (en) 2007-03-16
TWI340298B true TWI340298B (en) 2011-04-11

Family

ID=37031324

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095121437A TWI340298B (en) 2005-06-28 2006-06-15 Lithographic apparatus and device manufacturing method
TW99144837A TWI431434B (zh) 2005-06-28 2006-06-15 微影裝置及元件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW99144837A TWI431434B (zh) 2005-06-28 2006-06-15 微影裝置及元件製造方法

Country Status (7)

Country Link
US (4) US7834974B2 (zh)
EP (1) EP1739492B1 (zh)
JP (2) JP4723425B2 (zh)
KR (1) KR100803266B1 (zh)
CN (2) CN1892438B (zh)
SG (1) SG128649A1 (zh)
TW (2) TWI340298B (zh)

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CN113138537B (zh) * 2020-01-17 2023-10-13 浙江大学 一种用于浸没式光刻机的浸液供给回收装置

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CN1892438A (zh) 2007-01-10
CN102117018B (zh) 2012-09-26
JP5437761B2 (ja) 2014-03-12
EP1739492B1 (en) 2013-04-24
US9766556B2 (en) 2017-09-19
JP4723425B2 (ja) 2011-07-13
TW201129880A (en) 2011-09-01
US20070030464A1 (en) 2007-02-08
KR100803266B1 (ko) 2008-02-14
US7834974B2 (en) 2010-11-16
CN102117018A (zh) 2011-07-06
JP2007013151A (ja) 2007-01-18
CN1892438B (zh) 2011-05-04
US20150309422A1 (en) 2015-10-29
JP2010021568A (ja) 2010-01-28
US20170003605A1 (en) 2017-01-05
US20110025994A1 (en) 2011-02-03
SG128649A1 (en) 2007-01-30
TW200710593A (en) 2007-03-16
KR20070001022A (ko) 2007-01-03
TWI431434B (zh) 2014-03-21
EP1739492A3 (en) 2007-04-18
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EP1739492A2 (en) 2007-01-03
US9099501B2 (en) 2015-08-04

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