Ι3312Ό7 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種散熱裝置，尤指一種具有熱管之散 熱器製作方法及其成品。 【先前技術】 在現今科技工業之電子產品發展越趨向精密，除了體 積小型化外，其熱量的產生也越趨增加，由於果多的熱量 會直接影響到電子產品的工作效能及使用壽命，因此為使 電子產品在可容許的工作溫度範圍内正常運作，則必須藉 助於額外之散熱裝置，以減低熱量對於電子產品運作的不 良影響。 在追求體積小型化及輕穎化的趨勢下，而最常被採用 的散熱裝置便是具有熱管結構之散熱器，該散熱器係由具 高導熱係數的材質所製成，在經由熱管管内所設置的工作 流體及毛細組織運作，使該散熱器具有高熱傳導力之特 性，且其結構上具有重量輕之優勢，可減低在散熱裝置所 衍生之噪音、重量、成本及系統複雜性之問題，可大量傳 遞熱源且無需消耗電力，使具有熱管結構之散熱器成為一 種普遍被作為散熱組件之一。 就習知結構而言，熱管散熱器的主要結構係主要包括 一導熱座及複數熱管，該些熱管係間隔排列設置於該導熱 座上，經由該導熱座自發熱元件吸收熱量後，經由該些熱 管内部之毛細組織與工作流體之交互作用，以傳導至熱管 5 1331207 所連接之散熱體上，以進行對發熱元件的散熱作用。 然而’由於發熱元件的熱量發展已經無法預期，而單 熱管内的毛細組織與工作流體具有一定的含熱量，過多 的熱量會造成熱管内部的工作流體完全汽化後無法進行循 嶮，以致於熱管的傳導作用完全喪失，雖然設於同一散熱 器上的熱管具有複數組以上，但導熱座所吸收的熱量並無 • 法均勻分配到各熱管上，仍舊會造成熱管内工作流體完全 • 汽化的問題，因此，勢必要針對上述的問題進行改進原來 的結構設計。 【發明内容】 針對上述之缺失，本發明之主要目的在於提供一種具 有熱管疊置結構之熱管散熱器製作方法及其成品，藉由將 複數熱管同時疊置於同一位置上，以使同一位置之複數熱 管同時吸收熱量，避免熱量超過單一熱管之負荷，以保持 鲁熱管散熱器之散熱效率。 為了達成上述之目的，本發明係主要提供一種熱管散 熱器，包括一導熱座、一第一熱管及一第二熱管，其中該 導熱座具有一容置槽，該第一熱管係容置於該容置槽後， 並產生形變以緊迫於該容置槽内壁面，另該第二熱管係與 第一熱管設於同一容置槽内，係垂直疊置於該第一熱管 上，且產生形變以緊迫於該第一熱管及該容置槽内壁面， 藉此提升該熱管散熱器之導熱效能。 為了達成上述之目的，本發明係主要提供一種熱管散 6 1^^1207 熱器製作方法，其步驟包括： a) 將一熱管置於該容置槽内； b) 壓掣該熱管產生形變而使該熱管緊迫於該 内壁面； c) 將另一熱管置於該容置槽内並疊置於前述熱管 上；以及 d) 壓掣另-熱管產生形變而使該另一熱管緊迫於前 • 述熱管與該容置槽内。 a) τΙ^ — 32 >A J.JU -1- »r 【實施方式】 茲將本發明之内容配合圖式來加以說明： 請參閱第-®及第二圖，係分別為本發明之立體結構 /刀解圖及背視圖。如圖所示，該熱管散熱器係主要包括一 導熱座1、-第-熱管2與—第二熱管3，其中導熱體工 係由高導熱材質所構成，該導熱座1上設有至少一容置槽 11，於本實施例圖式中係為複數容置槽u，且該容置槽U 之兩侧係貫穿該導熱座1並向中間延伸，使該容置槽㈣ 中央位置形成一抵貼段111 ，如第二圖所示；另該第一 熱管2及第二熱管3係以垂直疊置之方式設置於該導熱座 1之同一容置槽11内，於本實施例中該第二熱管3之管徑 係大於該第一熱管2，其中該第一熱管2及第二熱管3皆 呈U型，該第一熱管2之彎曲位置係為一吸熱段21，該第 一熱管2之兩端則為冷凝段22，該熱管2容置於該容置槽 11内後，該吸熱段21係直接貼附於該抵貼段m，並產生 7 1331207 形變而呈扁平狀（如第八圖之剖視圖所示，容後詳述）， 而°玄第熱管2之冷凝段22則貫穿該導熱座1，又，該第 一熱营3之彎曲位置亦具有一吸熱段31，兩端管體則為冷 凝段32，該第二熱管3容設於該容置槽11後，該吸熱段31 係緊貼於該第一熱管2之吸熱段21上，並產生形變而呈扁 平狀（如第八圖之剖視圖所示，容後詳細），以組成該熱 • 管散熱器。 • 茲利用連續圖式來加以說明熱管散熱器之製作方法： 如第二圖所示，係提供一導熱座1，將該導熱座1置 ，於一平台4上，另提供複數第一熱管2，將該些第一熱 管2置於該導熱座i之容置槽丨丨内，使該些第一熱管2之 吸熱段21貼抵於該容置槽丨丨之抵貼段Π1 ;再提供一治具 5，如第四圖所示，利用該治具5下壓設置於該容置槽^ 内之第一熱管2，使第一熱管2之吸熱段21產生形變並緊 迫於該容置槽11内壁面；另提供複數第二熱管3，先行將 瞻該第二熱管3之吸熱段31内侧壓掣成型有-平面311， 如第五圖所示，再將該些第二熱管3置於該容置槽u内， 並使該些第二熱管3之平面311與該些第一熱管2之背面 相互璺置，之後再提供另一治具5&，如第六圖所示，將該 f具5a下壓該些第二熱管3，使該些第二熱管3產生形 變，並緊迫於該容置槽U内壁面及第一熱管2之吸熱段 2；! ’如第七圖所示，同時該些第二熱管3並與該導熱座】 底部等齊；其組合完成剖視圖如第八圖所示。 惟以上所述之實施方式，是為較佳之實施實例，當不 1331207 能以此限定本發明實施範圍，若依本發明申請專利範圍及 說明書内容所作之等效變化或修飾，皆應屬本發明下述之 專利涵蓋範圍。 【圖式簡單說明】 第一圖、係為本發明之立體分解圖。 第二圖、係為本發明之導熱座背視圖。 第三〜七圖、係為本發明之製造流程圖。 第八圖、係為本發明之組合完成剖視圖。 【主要元件符號說明】 導熱座1 容置槽11 抵貼段111 第一熱管2 吸熱段21 冷凝段22 第二熱管3 吸熱段31 平面311 冷凝段32 平台4 治具5、5aΙ3312Ό7 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a method for manufacturing a heat dissipator having a heat pipe and a finished product thereof. [Prior Art] In today's technology industry, the development of electronic products is becoming more and more precise. In addition to the miniaturization of the volume, the heat generation is also increasing. Since the amount of heat directly affects the working efficiency and service life of electronic products, In order for the electronic product to function properly within the allowable operating temperature range, additional heat sinks must be used to reduce the adverse effects of heat on the operation of the electronic product. In the pursuit of volume miniaturization and lightening, the most commonly used heat sink is a heat pipe with a heat pipe structure made of a material with a high thermal conductivity. The working fluid and capillary structure are set to operate, so that the heat sink has the characteristics of high thermal conductivity, and the structure has the advantage of light weight, which can reduce the noise, weight, cost and system complexity caused by the heat sink. The heat source can be transferred in a large amount without consuming power, so that the heat sink having the heat pipe structure becomes one of the common heat dissipation components. In the conventional structure, the main structure of the heat pipe heat sink mainly includes a heat conducting seat and a plurality of heat pipes. The heat pipes are arranged on the heat conducting seat at intervals, and the heat is absorbed from the heat generating component through the heat conducting seat. The interaction between the capillary structure inside the heat pipe and the working fluid is transmitted to the heat sink connected to the heat pipe 5 1331207 to perform heat dissipation on the heat generating component. However, due to the heat development of the heating element, it is unpredictable, and the capillary structure and working fluid in the single heat pipe have a certain heat content. Excessive heat will cause the working fluid inside the heat pipe to completely vaporize and cannot be circulated, so that the heat pipe The conduction is completely lost. Although the heat pipes on the same radiator have more than one array, the heat absorbed by the heat-conducting blocks is not evenly distributed to the heat pipes, which still causes complete problem of vaporization of the working fluid in the heat pipes. Therefore, it is necessary to improve the original structural design for the above problems. SUMMARY OF THE INVENTION In view of the above-mentioned deficiencies, the main object of the present invention is to provide a method for manufacturing a heat pipe heat sink having a heat pipe stack structure and a finished product thereof, by stacking a plurality of heat pipes at the same position at the same time to make the same position The multiple heat pipes absorb heat at the same time, avoiding the heat exceeding the load of a single heat pipe, so as to maintain the heat dissipation efficiency of the heat pipe radiator. In order to achieve the above object, the present invention mainly provides a heat pipe heat sink, comprising a heat conducting seat, a first heat pipe and a second heat pipe, wherein the heat conducting seat has a receiving groove, and the first heat pipe system is disposed in the heat pipe After accommodating the groove, deformation is formed to be tight on the inner wall surface of the accommodating groove, and the second heat pipe is disposed in the same accommodating groove as the first heat pipe, vertically stacked on the first heat pipe, and deformed. To tighten the first heat pipe and the inner wall surface of the accommodating groove, thereby improving the heat conduction performance of the heat pipe heat sink. In order to achieve the above object, the present invention mainly provides a heat pipe dispersing method, the steps of which include: a) placing a heat pipe in the accommodating groove; b) pressing the heat pipe to deform Causing the heat pipe to the inner wall surface; c) placing another heat pipe in the accommodating groove and superimposing on the heat pipe; and d) pressing the other heat pipe to deform and pressing the other heat pipe to the front The heat pipe and the receiving groove are described. a) τΙ^ — 32 > A J.JU -1- »r [Embodiment] The contents of the present invention will be described with reference to the drawings: Please refer to the -- and second figures, respectively Stereo structure / knife solution and back view. As shown in the figure, the heat pipe heat sink mainly comprises a heat conducting seat 1, a first heat pipe 2 and a second heat pipe 3, wherein the heat conductor system is composed of a high heat conductive material, and the heat conducting seat 1 is provided with at least one The accommodating groove 11 is a plurality of accommodating grooves u in the embodiment of the present embodiment, and the two sides of the accommodating groove U extend through the heat conducting base 1 and extend in the middle to form a central position of the accommodating groove (4). The abutting portion 111 is as shown in the second figure; the first heat pipe 2 and the second heat pipe 3 are disposed in the same receiving groove 11 of the heat conducting base 1 in a vertically stacked manner, in this embodiment The second heat pipe 3 has a larger diameter than the first heat pipe 2, wherein the first heat pipe 2 and the second heat pipe 3 are U-shaped, and the bending position of the first heat pipe 2 is a heat absorption section 21, and the first heat pipe The two ends of the two are the condensing section 22, and after the heat pipe 2 is received in the accommodating groove 11, the heat absorbing section 21 is directly attached to the abutting section m, and the 7 1331207 is deformed to be flat. The cross-sectional view of the eighth figure is shown in detail later, and the condensation section 22 of the Histral heat pipe 2 runs through the heat conducting seat 1, and the first heat camp 3 The curved position also has a heat absorbing section 31, and the tube bodies at both ends are the condensing section 32. The second heat pipe 3 is received in the accommodating groove 11, and the heat absorbing section 31 is closely attached to the heat absorbing section of the first heat pipe 2. 21, and deformed to be flat (as shown in the cross-sectional view of the eighth figure, detailed later) to form the heat pipe radiator. • The continuous pattern is used to illustrate the manufacturing method of the heat pipe radiator: As shown in the second figure, a heat conducting seat 1 is provided, and the heat conducting seat 1 is placed on a platform 4, and a plurality of first heat pipes 2 are provided. The first heat pipe 2 is placed in the accommodating groove of the heat conducting seat i, so that the heat absorbing section 21 of the first heat pipe 2 abuts against the nip 1 of the accommodating groove; a jig 5, as shown in the fourth figure, the first heat pipe 2 disposed in the accommodating groove is pressed by the jig 5, and the heat absorbing section 21 of the first heat pipe 2 is deformed and pressed against the accommodating The inner wall surface of the groove 11 is further provided with a plurality of second heat pipes 3, and the inner side of the heat absorption section 31 of the second heat pipe 3 is firstly formed with a flat surface 311, as shown in the fifth figure, and the second heat pipes 3 are placed In the accommodating groove u, the planes 311 of the second heat pipes 3 and the back faces of the first heat pipes 2 are mutually disposed, and then another jig 5& The f 5a is pressed down the second heat pipes 3 to deform the second heat pipes 3, and is pressed against the inner wall surface of the receiving groove U and the heat absorption section 2 of the first heat pipe 2; As shown in the seventh figure, the second heat pipes 3 are simultaneously aligned with the bottom of the heat conducting seat; the combined cross-sectional view is as shown in the eighth figure. The embodiments described above are preferred embodiments, and the equivalent variations or modifications made by the scope of the present invention and the contents of the specification should be in accordance with the present invention. The following patents cover the scope. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective view of the present invention. The second figure is a rear view of the heat conducting seat of the present invention. The third to seventh figures are the manufacturing flow charts of the present invention. The eighth drawing is a cross-sectional view of the combination of the present invention. [Description of main components] Heat transfer seat 1 accommodating groove 11 Abutment section 111 First heat pipe 2 Heat absorbing section 21 Condensing section 22 Second heat pipe 3 Heat absorbing section 31 Plane 311 Condensation section 32 Platform 4 Fixture 5, 5a