1308048 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置’尤係指一種冷卻電子元件之散熱裝 置。 ‘、、、 【先前技術】 積體電路技術之持續快速發展使得包括中央處理器在内之電子 元件運行速度越來越快，當然隨之產生之熱量亦越來越多，熱量之積 累將導致電子元件溫度升高，並由此引起運行不穩定甚至造&電子元 件損毀。故必須採取有效措施對其進行散熱以維持其正常運行。139. The invention relates to a heat dissipating device, and more particularly to a heat dissipating device for cooling electronic components. ',,, [Previous technology] The continuous and rapid development of integrated circuit technology has made electronic components including the central processing unit run faster and faster, and of course, more and more heat is generated, and the accumulation of heat will cause The temperature of the electronic component rises, and thus the operation is unstable or even the electronic component is damaged. Therefore, effective measures must be taken to dissipate heat to maintain its normal operation.
各種結構之散熱器亦因此不斷地被設計出來，隨著發熱量之不斷 升級，單純通過金屬熱傳導方式進行散熱之散熱器已經不能滿足高發 熱量之電子元狀賴需求。近年來，齡因其具有高效快速之熱傳 導能力而在散熱方面麟廣泛應用，使用熱管之散熱科因此不斷地 以新結構出現。 徑，耻雜散熱則能触速散熱，惟，熱管之孰 ΐ 遞給餘鰭片，導致整峨錄《録分佈Ϊ重不 黯片FJ台fc J?t办也iA Α·®» 獲得突破性提高，另-方面，每—較大^散熱 一種典型之熱管散熱器如第-騎示，該散熱器具有—用以盘電 之基座剛，二直立_之熱管2GG中部與基座_目連， £散,，，、鰭# 300穿設在熱管200上，該散熱器通過基座1〇〇吸收轨 篁過熱管200快速地將熱量傳導至散熱鰭片3〇〇進而向外散發、:、 都且ίΪΐ熱器盡可能地具有較大之散熱面積以加速散熱，通常鰭X片 二*^熱管通常具有較小之直徑，二者之間接觸面積 熱管接觸的點被支揮，各鳍片間相二 ^基座影響其將不可避免的，部分震動將被傳 件甚至會影心到電子元 影響更加明顯。 句®，、震發生時上迷震動及噪音之 【發明内容】 裝果好且結構穩固之散熱器。 土座，一散熱體及一連接基座與散熱體之熱 5 1308048 ，，，散熱體包括二組相互交又連接之散熱板，該等散_之間形成 夕數氣流之通道。 相較於習知技術，該散熱裝置中散熱體之兩組散熱板相互交 t構穩固且有利於實現熱量之快速均佈，因此在降低震動及噪立 【實施方式】 等發ίίΐΐ:ί=以對㈣里器、積體電路晶片(圖未示) =二，及第四圖’示出本發明散熱裝置之較 ΐΐί件接觸而吸熱之基座10及一散熱㈣= 埶旦心50連接基座10與散熱體20從而將基座ι〇吸收之 -- 上述每一熱管5〇包括—蒗發部π 10其中-對應溝槽13中，；52置於上述基座 垂直彎折延伸而出，該二冷凝部T Q由蒸發部52兩端同向 之方向。 7疑^54垂直於基座10而伸向遠離基座10 請參閱第二圖至第四圖，該散孰 基座10垂直之均熱板22、24，ϋ 2=括二相互平行間隔並與 直之溝槽29，多數第二散孰板25 24外側面各形成有三豎 -散熱板23垂直於均熱板22、重直交又連接。第 Μ ’該等散熱板23、25 _ 板25平行於均熱板22、 通道27具有一矩形截面及二|口多數:=，流通道27，每一氣流 23、二均熱板22、24共同形成、：=和底:之第一散熱板 25相互交織結合在該框體内，該6散熱體^^板^^反第2!、、 1308048 第二散熱板23、25可诵讲知嫉上., 該第-與第二散熱工5式一體成型。 括-可與散類20之料㈣f相f之結構。第—散熱器30包 面與均熱板22密合，之傳熱板32 ’該傳熱板犯一側 對應之溝槽.辦三倾均熱板22上溝槽29相 部54在其内延伸之‘m9、33則形成三個供熱管5G之一冷凝 平行之則35，另—姆外絲面舰伸出多數 第二；器Cl與第一散熱板23平行。 42，該傳‘42 —之均熱板财接之傳熱板 個:等r細-則形成】 外側表面則延伸出多tl4在ί岐伸之管道，傳熱板42另一相對 平行。 千订之”、、曰片45 ’該等鰭片45與第一散熱板23 件吸安L發熱電子元件上時’基座1〇接觸電子元 轨ΪΙ f分傳至散熱體2G底部並繼續向上傳導，大部 it Λ Ζί發部52吸㈣沿著熱管5°向上傳遞並經由冷 在#22、24及二散熱器30、40,繼而向外散發出去。 又，ί^ΐϊίίΓ由於第—散熱板23與第二散熱板25相互交 姑9^介第一散熱板23被多數個第二散熱板25定位，每—第二散埶 Ϊ樣^數第—散熱板23定位，整個散熱體2G具有一非ΐ ’备強制氣流通過散熱體2〇時’噪音和震動能被有效降 執體2(ΤΓ二相f交又之散熱板23、25使得熱量能夠快速地在散 &升。：佈’其利用率提高’從而散熱裝置之整體散熱性能得以 ，本發明之上述實施例中，熱f 5Q夾置在二散熱⑽、仙與散 ‘哭穿職熱體2°，此使得熱管50與散熱龍及散熱 ° 之釔合在製造上變得容易，亦有利熱管50與其形成均勺户 好之接觸，利於熱量從熱管50至各散熱元⑽、3〇、4〇 相應促進散熱性能之提升。 得邋亦 【圖式簡單說明】 第一圖係習知技術中一典型散熱器之立體分解圖。 第二圖係本發明散熱裝置較佳實施例之立體圖。 1308048 第三圖係本發明散熱裝置之立體分解圖。 第四圖係第二圖之正視圖。 【主要元件符號說明】 基座 10 頂面 12 溝槽 13、 29、 33、 43 固定腳 14 散熱體 20 均熱板 22、24 第一散熱板 23 第二散熱板 25 第一散熱器 30 傳熱板 32、42 第二散熱器 40 縛片 35、45 蒸發部 52 熱管 50 杆件 60 冷凝部 54 8Heat sinks of various structures have therefore been continuously designed. With the continuous increase of heat generation, heat sinks that radiate heat by metal heat conduction alone cannot meet the demand for high heat generation. In recent years, the age has been widely used in heat dissipation because of its high-efficiency and rapid heat transfer capability, and the heat-dissipating section using heat pipes has thus continuously appeared in new structures. The path, shame and heat dissipation can be used to dissipate heat. However, the heat pipe is handed over to the fins, resulting in a complete recording of the 《 《 《 F F F F F F F F F F F F F F F F F F F F F F F Sexual improvement, another-side, each-larger heat dissipation is a typical heat pipe radiator such as the first-riding display, the radiator has - the base for the disk power, the two erect _ the heat pipe 2GG middle and the base _ Mianlian, £散,,,,Fin #300 is placed on the heat pipe 200, and the heat sink quickly transfers heat to the heat radiating fins 3 through the susceptor 1 〇〇 absorption 篁 superheater 200, and then radiates outward ,:, and the heat sink has as much heat dissipation area as possible to accelerate heat dissipation. Generally, the fin X 2 heat pipe usually has a small diameter, and the contact point of the heat pipe between the two is supported. The influence of the two pedestals between the fins will be inevitable, and some of the vibrations will be transmitted or even affected by the electron elements.句®, the vibration and noise during the earthquake [invention] The heat sink with good quality and stable structure. The earth seat, a heat sink and a heat connecting the base and the heat sink 5 1308048 , the heat sink comprises two sets of heat sinks which are connected and connected to each other, and the air gaps form a passage of the air flow. Compared with the prior art, the two sets of heat dissipating plates of the heat dissipating body in the heat dissipating device are mutually stable and convenient for realizing rapid uniform distribution of heat, so that the vibration and the noise are reduced [embodiment], etc. ίίΐΐ: ί= The susceptor 10 and the heat sink (four) = 心 心 50 connection of the heat sink of the present invention are shown in the pair of (4), the integrated circuit chip (not shown) = 2, and the fourth figure ' The susceptor 10 and the heat dissipating body 20 are configured to absorb the susceptor ι - - each of the heat pipes 5 上述 includes a 蒗 10 其中 10 in the corresponding groove 13 , 52 is placed on the pedestal to vertically bend and extend The two condensation portions TQ are in the same direction from both ends of the evaporation portion 52. 7 suspected ^54 perpendicular to the base 10 and extended away from the base 10 Please refer to the second to fourth figures, the divergent base 10 vertical uniform heat plates 22, 24, ϋ 2 = two parallel to each other and With the straight grooves 29, the outer surfaces of the plurality of second diffusing plates 25 24 are respectively formed with three vertical-heat radiating plates 23 perpendicular to the heat equalizing plates 22, and are directly orthogonal and connected. Μ 'The heat sinks 23, 25 _ plate 25 are parallel to the heat equalizing plate 22, the channel 27 has a rectangular cross section and a plurality of ports: =, flow channel 27, each air flow 23, two heat equalizing plates 22, 24 Co-formed, := and bottom: the first heat dissipation plate 25 is intertwined and integrated in the frame body, and the 6 heat dissipation body ^^ plate ^^ 反2!, 1308048 second heat dissipation plate 23, 25 can be known嫉上., The first-and second heat-dissipator 5 are integrally formed. Included - can be combined with the material of the class 20 (four) f phase f. The first heat sink 30 is in close contact with the heat equalizing plate 22, and the heat transfer plate 32' the heat transfer plate has a groove corresponding to one side. The groove 29 phase portion 54 of the three inclined heat equalizing plate 22 extends therein. The 'm9, 33' forms three heat supply tubes 5G which are condensed in parallel, 35, and the other outer wire surface extends a plurality of second; the device C1 is parallel to the first heat dissipation plate 23. 42, the transmission of the '42 - the heat transfer board of the average hot plate: the same r fine - then formed] The outer surface extends more than t14 in the pipe, the heat transfer plate 42 is relatively parallel. Thousands of ", 曰 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 45 Conducting upwards, most of it Λ Ζ 发 发 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 52 The heat dissipating plate 23 and the second heat dissipating plate 25 are mutually arranged. The first heat dissipating plate 23 is positioned by the plurality of second heat dissipating plates 25, and the second heat dissipating plate is positioned. 2G has a non-ΐ 'Preparation of forced airflow through the heat sink 2〇' noise and vibration can be effectively reduced to the body 2 (ΤΓ two-phase f-heating plates 23, 25 so that the heat can quickly and in the air & The cloth 'increased its utilization rate', so that the overall heat dissipation performance of the heat dissipating device can be obtained. In the above embodiment of the invention, the heat f 5Q is sandwiched between the two heat dissipating (10), the fairy and the scattered 'crying wear hot body 2°, which makes the heat pipe The combination of 50 with the heat sink and the heat sink is easy to manufacture, and it is also advantageous for the heat pipe 50 to form a uniform The contact facilitates the heat from the heat pipe 50 to the heat dissipating elements (10), 3〇, 4〇 to promote the improvement of the heat dissipation performance. 得邋也 [Simple diagram description] The first figure is a three-dimensional decomposition of a typical radiator in the conventional technology. The second drawing is a perspective view of a preferred embodiment of the heat dissipating device of the present invention. 1308048 The third drawing is an exploded perspective view of the heat dissipating device of the present invention. The fourth drawing is a front view of the second drawing. 10 Top surface 12 Grooves 13, 29, 33, 43 Fixing feet 14 Heat sink 20 Heat spreader 22, 24 First heat sink 23 Second heat sink 25 First heat sink 30 Heat transfer plates 32, 42 Second heat sink 40 Baffle 35, 45 Evaporation part 52 Heat pipe 50 Rod 60 Condensation part 54 8