200921340 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱裝置，尤其係涉及一種用於電 子元件散熱之散熱裝置。 【先前技術】 隨著電子資訊業不斷發展，電子元件（尤為中央處理 器)一運行頻率和速度在不斷提升。但是，高頻高速將使電 子=件產生之熱量隨之增多，使其溫度不斷升高，嚴重烕 脅者電子兀件運行時之性能。為確保電子元件能正常運 作，必須及時排出電子元件所產生之大量熱量。 马此 — :、界通常使用之散熱裝置一股a祜一底座和言 在該底座上之複數散熱鰭片，該底座底面為平滑之實體^ 屬’供貼設在中央處理器表面吸熱並傳至散熱鳍片四周！ 發。而隨著中央處理器體積越來越小，其發熱也更加 口局限於金屬之傳熱性能，底座中^處之熱量 腿，整個散㈣置，尤其散錢片上遠離底座較遠^ =散熱裝置之散熱性能無法獲得突破及提升。而近年秀 …官因其較佳之熱傳導性能而在散熱領域 θ 使用，埶管成蛊·nni …S成為向端散熱器之優選元件，如何將埶管盘此 合達到較佳的散熱效果，將是當前散熱裝i要: 【發明内容】 本毛月曰在提供—種帶散熱效率高之散熱裝置。 200921340 一種散熱裝置，用於散發—電子元件產生之熱量，其 包括-底部與該電子元件接觸之基座、一散熱鰭片組及連 接：基座與散熱鰭片組之第一、第二熱管；該第一、第二 熱B均具有與基座結合之吸熱段及遠離該吸熱段之放熱 錄熱鰭片組包括並排之第_、第二散熱鰭片組；該 第一、第二散熱鰭片組均具有不在同一平面上之第一、第 二接合面，該第一散熱鰭片組之第一、第二接合面對應與 ，第二散熱鰭片組之第―、第二接合面相互結合；該第-、 第二散熱鰭片組於各自第一、第二接合面上對應第一、第 —熱官之放熱段設有複數凹槽而容置熱管之放熱段。 ^與2知技術相比，由於第一、第二散熱鰭片與第一、 第一熱&之放熱段結合之第一、第二接合面不在同一平面 上，使得第一、第二熱管之放熱段可以分佈在散熱鰭片組 之不同σ卩位，可以更好地均勻散熱，提高整個散熱裝置之 散熱效率。並且’由於而散熱裝置藉由第一、第二散熱鰭 片組夾設：一、第二熱管之放熱段之方式代替了直接在鰭 片上插熱官之方式，使鰭片與熱管之裝配方便，降低了整 個散熱裝置之製造成本。 【實施方式】 一請參閱圖1與圖2,本發明散熱裝置用於安裝在一電子 一件（圖未示）上對其進行散熱。該散熱裝置包括一基座 1〇、一置於基座10上之散熱板20、一置於散熱板20之散 熱鰭片組、一連接基座10、散熱板20及散熱鰭片組之第— 200921340 熱管50及第二熱管60。其中該散熱鰭片組包括相互嚙合之 •苐一散熱鰭片組30與第二散熱鰭片組4〇。 • 請參閱圖3及圖4,該基座1G為—呈矩形之導熱性能 良好之金屬板體，如銅板、鋁板等。該基座1〇之下表面 未標)用以與電子元件接觸，基座1〇之上表面。設有四並 排平行之凹槽120 ’以收容結合熱管5〇、6〇。 散熱板20為一呈矩形且導熱性能良好之金屬板體，具 有-上表面（圖未標）及—與上表面相對之下表面Μ以貼 合基座10之上表面12。基座1〇、散熱板20之凹槽120、 220共同組成四通道以收容上述熱管5〇、6〇。可以= f其它實施例中，可以由—設置有收容孔之基座取代本實 施例中之基座1〇、散熱板2〇。 第一散熱鰭片組30由複數第一散熱鰭片32垂直於BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, and more particularly to a heat sink for heat dissipation of an electronic component. [Prior Art] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially central processors) are constantly increasing. However, high-frequency high-speed will increase the amount of heat generated by the electronic component, causing its temperature to rise continuously, which seriously degrades the performance of the electronic components during operation. In order to ensure that the electronic components can operate normally, the large amount of heat generated by the electronic components must be discharged in time. This is the case: :, the heat sink commonly used in the world is a base and a plurality of heat-dissipating fins on the base. The base of the base is a smooth body ^ for attaching heat to the surface of the central processor and transmitting To the heat sink fins! hair. As the size of the central processing unit is getting smaller and smaller, its heat is also limited to the heat transfer performance of the metal. The heat legs in the base are placed in the whole (four), especially on the loose money sheet far away from the base. The thermal performance cannot be achieved and improved. In recent years, the official...the officer used in the heat dissipation field θ because of its better heat conduction performance, and the n·nni ...S became the preferred component of the end heat sink, how to achieve the better heat dissipation effect of the manifold It is the current heat sink I want to: [Invention content] This month's hair is provided with a heat sink with high heat dissipation efficiency. 200921340 A heat dissipating device for dissipating heat generated by an electronic component, comprising: a base at the bottom contacting the electronic component, a heat sink fin set and a connection: a first heat pipe and a heat sink fin set The first and second heat B each have an endothermic section combined with the base and the exothermic heat-receiving fin set away from the heat-absorbing section, including the first and second heat-dissipating fin sets; the first and second heat-dissipating groups; The fin groups each have a first and a second bonding surface that are not on the same plane, and the first and second bonding surfaces of the first heat dissipation fin group correspond to the first and second bonding surfaces of the second heat dissipation fin group. The first and second heat dissipating fin groups are provided with a plurality of grooves on the first and second joint surfaces corresponding to the first and second heat releasing portions to accommodate the heat releasing portion of the heat pipe. Compared with the prior art, the first and second heat pipes are combined with the first and second joint faces of the first and second heat sinks, and the first and second joint faces are not in the same plane, so that the first and second heat pipes are The heat release section can be distributed in different σ positions of the heat dissipation fin group, which can better disperse heat evenly and improve the heat dissipation efficiency of the entire heat dissipation device. And because the heat dissipating device is sandwiched by the first and second heat dissipating fin groups: the heat release section of the second heat pipe replaces the way of directly inserting the heat officer on the fin, so that the assembly of the fin and the heat pipe is convenient. , reducing the manufacturing cost of the entire heat sink. [Embodiment] Referring to Figures 1 and 2, the heat sink of the present invention is mounted on an electronic piece (not shown) for heat dissipation. The heat dissipating device comprises a base 1 , a heat dissipation plate 20 disposed on the base 10 , a heat dissipation fin set disposed on the heat dissipation plate 20 , a connection base 10 , a heat dissipation plate 20 , and a heat dissipation fin group — 200921340 Heat pipe 50 and second heat pipe 60. The heat sink fin set includes a heat sink fin set 30 and a second heat sink fin set 4〇. • Referring to Figures 3 and 4, the base 1G is a rectangular metal plate body with good thermal conductivity, such as copper plate, aluminum plate, and the like. The lower surface of the pedestal is not marked for contact with the electronic component, and the upper surface of the pedestal 1 is. Four parallel rows of grooves 120' are provided to receive the combined heat pipes 5〇, 6〇. The heat sink 20 is a rectangular metal plate having good thermal conductivity, and has an upper surface (not shown) and a lower surface opposite to the upper surface to conform to the upper surface 12 of the base 10. The pedestal 1 and the grooves 120 and 220 of the heat dissipation plate 20 together form a four-channel to accommodate the heat pipes 5〇 and 6〇. In other embodiments, the susceptor 1 〇 and the heat sink 2 本 in the embodiment may be replaced by a susceptor provided with a receiving hole. The first heat dissipation fin group 30 is perpendicular to the plurality of first heat dissipation fins 32
熱板20且並排組合而成。每一第—散熱鰭片以由單片名 屬片製成並大致呈“凹，，字开I , t U 子开^又置。弟一散熱鰭片組30 $ 一 ”散熱板20接觸之本體36及自本體％兩側部向上莖 直，伸之肩部38。本體36頂部中間具有第—接合面_， 而肩部38 丁頁部具有第二接合面38〇 π 與第一接合面360不在同一水平面^ ^ 一接°面38( < 个隹丨」水+面亚尚於第一接合面36( t第一散熱韓片組3〇於第一、第二接合面360、38( =有二平行溝槽施、388。複數折緣（圖未標）自第 韓片組30之底部、側部及溝槽366、388同向垂直 延伸，以將該等散熱鰭片32間隔相同距離。 200921340 第二散編組40固定在第一散熱鰭片組3〇上並與 其相互4合並且形狀互補。第二散熱鰭片組40由複數第二 散熱籍片42组成。备^ a*. u 、且成母第一放熱韓片42由單片金屬片製 呈倒置之“凸，，字形設置。第二散熱韓片組仙包 括一本體46及自本體46中部向下垂直延伸之凸起部⑽。 凸起部48底部具有第一接人而 I”名弟接。面4δ0,而本體46兩側底部具 有弟二接合面46〇,並且第二接合面_與第—接合面48〇 不：：-平面並高於第一接合面_。第二散熱鰭片組4〇 於一/第二接合面彻、46()分㈣有二平行溝槽488、 466。複數折緣（圖未標）自第二散熱續片組仙之側部及 溝槽466、488同向垂直延伸，以將該等散熱鰭片％間隔 相同之距離。 第一熱官50連續彎折形成相互平行且水平共面之二吸 熱段51、二平行共面且遠離上述基座1〇之放 等吸熱段51相互靠近而二放熱段53相隔1距離。第1 熱官50逛包括二連接段56、57。該連接段56連接其中一 吸熱段51與-放熱段53 ’而連接段57連接另—吸熱段η 與另一放熱段53。該連接段56與連接段57相互成一銳角。 連接段58相互連接二放熱段53,使得第一熱管％之 遠離基座10之部分呈u形設置。 第二熱管60與第一熱管50之結構大致相同。第二执 管連續彎折形成相互平行且靠近之二吸熱段61，以及相 隔-定距離之二放熱段63。該等放熱段幻高於該等吸熱段 61而遠離基座1〇。二吸熱段61與二放熱段63藉由二傾斜 200921340 之連接段66、67相互連接。該連接段的與連接段67相互 成銳角另連接^又68相互連接二放熱段，使得第二 熱管60之遠離基座1〇之上部分呈u形設置。該等吸熱段 61將第「熱管π之吸熱段51並排夾置於其中，而放熱段 63同於第熱官50之放熱段53設置而遠離基座1〇。第二 熱官60之放熱段63相互間之距離大於第一熱管％之放熱 段53相互間之距離。 、，請參^圖4-5,組裝時，基座1〇與散熱板2〇焊接在一 起並將該第-、第二熱管50、6〇之吸熱段51、61夾置於 八間第放熱鰭片組30安置於散熱板2〇之頂面，第二 散熱鰭片組4G安置於散熱.鳍片組3G上。第二散熱縛片組 起部48安置於第—散熱縛片組3Q之肩部38之間。 弟一、第，散熱鰭片組30、40之第一接合面360、相 互嚙t，第二接合面380、460相互嚙合。第一熱管％之 又53夾设於第—接合面36〇、彻之間並收容於溝槽 ^ 488所组成之通道中。第二熱管6〇之放熱段α爽設 」接合面⑽'460之間並收容於溝槽遍、466所组 成之通道中。 ' Λ、、子元件工作時，其產生之熱量傳遞至基座10，其一 Ζ熱量藉由導熱板2()直接傳導至散熱鰭片組；另一部分 二由第―熱管5Q之吸熱段Η吸收，藉由其連接段％、 敎^專遞至位於散熱鰭片、被中間部分之放熱段53,再傳至散 收、了!1組’最後—部分熱量由第二熱管60之吸熱段61吸 措由其連接段66、67傳遞至位於散熱，鰭片遠離基座1〇 200921340 之部分之放熱段63 ’再傳至散熱鰭片組。因此電子元件產 •生之熱量能夠快速傳導至散熱鰭片組之底部、中部和遠離 •基座10之上方部位，最後散熱鰭片組將熱量散發到四周。 在本實施例中，由於第一、第二熱管5〇、60均為一體 彎曲成型，相當於四U型之熱管之導熱功能。因此該散熱裝 置只採用二熱管就達到四熱管之效果，有效降低整個散熱 裝置之製造成本。而散熱裝置藉由第一、第二散熱鰭片組 30、40上下夾設第一、第二熱管5〇、6〇之放熱段％、幻之 方式代替了直接在鰭片上插熱管之方式，使鰭片與熱管之 裝配方便。並且，第一、第二散熱鰭片組3〇、4〇之第一接 δ面360、480、第一接合面380、460相對基座1〇之位置可 以調整，使第一、第二熱管50、6〇之放熱段53、63更合理、 均句地分佈在散熱鰭片組上，以提高整個散熱裝置之散熱 效率。可以理解地，在其他實施例中，靠近基座之第一散 熱韓片組可以設置為“凸，，字形，而同時遠離第二散減片 組可以設置為倒置“凹，，字形結構。 綜上所述，本發明符合發明專利要件，麦依法提出專 f申請°惟，> 以上所述者僅為本發明之較佳實施例，舉凡 f悉本案技藝之人士，在爰依本發明精神所作之等效修倚 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之組裝圖。 圖2係圖1散熱裝置另一角度之示意圖。 200921340 圖3係圖2散熱裝置之立體分解圖。 圖4係圖3散熱裝置之部分組裝圖。 圖5係圖3散熱裝置倒置圖。 要元件符號說明 ] 基座 10 上表面 12 凹槽 120、220散熱板 20 下表面 22 第一散熱鰭片組 30 第一散熱鰭片 32 本體 36、46 第一接合面 360、480 肩部 38 溝槽 366 、 388 、 466 、 488 第二接合面 380、460第二散熱鰭片組 40 第二散熱鰭片 42 凸起部 48 第一熱管 50 吸熱段 51 > 61 放熱段 53、63 第二熱管 60 連接段 56 、 57 ' 58 ' 66 ' 67 ' 68 11The hot plates 20 are combined side by side. Each of the first heat-dissipating fins is made of a single piece of the famous piece and is substantially "concave, and the word is opened, and the U U is opened and placed. The other one of the heat-dissipating fins 30 $ a" heat sink 20 contacts The body 36 and the two sides of the body are straight upwards and extend to the shoulder 38. The top of the body 36 has a first joint surface _, and the shoulder portion 38 has a second joint surface 38 〇 π which is not in the same horizontal plane as the first joint surface 360. + face is still on the first joint surface 36 (t first heat sink Korean group 3 〇 on the first and second joint faces 360, 38 (= there are two parallel grooves, 388. plural folds (not shown) The bottom portion, the side portions and the grooves 366, 388 of the second group 30 are vertically extended in the same direction to divide the heat dissipation fins 32 by the same distance. 200921340 The second group 40 is fixed to the first heat sink fin group 3 The second heat-dissipating fin group 40 is composed of a plurality of second heat-dissipating fins 42. The first heat-dissipating Korean film 42 is made of a single piece of metal sheet. Inverted "convex," glyph setting. The second heat-dissipating Korean group includes a body 46 and a raised portion (10) extending vertically downward from the central portion of the body 46. The bottom of the raised portion 48 has the first access and the I" The surface of the body 46 has a second joint surface 46〇, and the second joint surface _ and the first joint surface 48 are not::-flat And is higher than the first joint surface _. The second heat sink fin group 4 is disposed on the first/second joint surface, and the 46 () minute (four) has two parallel grooves 488, 466. The plurality of flanges (not shown) are from the first The side portions of the two heat-dissipating slabs and the grooves 466 and 488 extend perpendicularly in the same direction to divide the heat-dissipating fins by the same distance. The first heat-offer 50 is continuously bent to form parallel and horizontally coplanar The heat absorption section 51, the two parallel coplanar surfaces, and the heat absorption sections 51 which are away from the base 1b are adjacent to each other and the two heat release sections 53 are separated by one distance. The first heat officer 50 includes two connection sections 56, 57. The connection section 56 One of the heat absorption sections 51 and the heat release section 53' is connected, and the connection section 57 is connected to the other heat absorption section η and the other heat release section 53. The connection section 56 and the connection section 57 form an acute angle with each other. The connection sections 58 are connected to each other and the heat release section 53 is connected. The portion of the first heat pipe % away from the base 10 is disposed in a u shape. The second heat pipe 60 is substantially the same as the structure of the first heat pipe 50. The second pipe is continuously bent to form two heat absorption segments 61 that are parallel to each other and close to each other. And a second-displacement heat-dissipating section 63. The exothermic sections are higher than the heat-absorbing sections 61 The two heat absorption sections 61 and the two heat release sections 63 are connected to each other by the connecting sections 66, 67 of the two tilts 200921340. The connecting sections are at an acute angle with the connecting section 67, and are connected to each other. The portion of the second heat pipe 60 away from the base 1 is disposed in a u shape. The heat absorption segments 61 sandwich the heat absorption section 51 of the heat pipe π side by side, and the heat release section 63 is the same as the heat officer 50. The exothermic section 53 is disposed away from the pedestal 1 . The distance between the exothermic sections 63 of the second thermal officer 60 is greater than the distance between the exothermic sections 53 of the first heat pipe %. Please refer to Figure 4-5. During assembly, the base 1〇 is welded to the heat sink 2〇 and the heat absorption sections 51 and 61 of the first and second heat pipes 50 and 6 are placed in the eighth room. The heat-dissipating fin group 30 is disposed on the top surface of the heat-dissipating plate 2, and the second heat-dissipating fin group 4G is disposed on the heat-dissipating fin group 3G. The second heat-dissipating die set portion 48 is disposed between the shoulder portions 38 of the first heat-dissipating die set 3Q. First, the first joint faces 360 of the heat sink fin sets 30, 40 are mutually engaged, and the second joint faces 380, 460 are engaged with each other. The first heat pipe %53 is interposed between the first joint surface 36 and the space and is accommodated in the passage formed by the groove ^ 488. The heat-dissipating section α of the second heat pipe 6 is cooled between the joint faces (10) 460 and accommodated in the passage formed by the grooves 466. When the sub-components are working, the heat generated by the sub-components is transferred to the susceptor 10, and one of the heat is directly transmitted to the heat-dissipating fin group by the heat-conducting plate 2 (); the other part is the heat-absorbing section of the first heat pipe 5Q. Absorption, by means of its connection segment %, 敎^ to the heat-dissipating fins located in the middle part, and then to the heat-dissipating section 53, and then to the collection, the first group of 'the last part-heat is from the heat-absorbing section 61 of the second heat pipe 60 The suction is transmitted from its connecting sections 66, 67 to the heat releasing section 63' which is located in the heat dissipating portion, and the fin is away from the base 1〇200921340, and is transferred to the heat radiating fin group. Therefore, the heat generated by the electronic component can be quickly conducted to the bottom, the middle portion of the heat sink fin group, and away from the upper portion of the base 10, and finally the heat sink fin group radiates heat to the periphery. In the present embodiment, since the first and second heat pipes 5, 60 are integrally bent and formed, they are equivalent to the heat conduction function of the four U-shaped heat pipes. Therefore, the heat dissipating device uses only two heat pipes to achieve the effect of four heat pipes, thereby effectively reducing the manufacturing cost of the entire heat dissipating device. The heat dissipating device replaces the way of directly inserting the heat pipe on the fin by the first and second heat dissipating fin sets 30 and 40 sandwiching the first and second heat pipes 5〇, 6〇, and the heat releasing section. It is convenient to assemble the fins and heat pipes. Moreover, the positions of the first and second heat dissipating fin groups 3, 4, δ, 360, 480, and the first joint surfaces 380, 460 relative to the pedestal 1 可以 can be adjusted to make the first and second heat pipes The exothermic sections 53, 63 of 50 and 6 are more reasonable and evenly distributed on the heat dissipating fin set to improve the heat dissipation efficiency of the entire heat dissipating device. It will be appreciated that in other embodiments, the first set of heat-dissipating Korean sheets adjacent to the base may be arranged to be "convex," shaped while being away from the second set of diffused sheets may be arranged as an inverted "concave", glyph structure. In summary, the present invention is in accordance with the requirements of the invention patent, and the above is only a preferred embodiment of the present invention, and those skilled in the art are accustomed to the present invention. Equivalent modifications or changes made by the spirit shall be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an assembled view of a heat sink of the present invention. Figure 2 is a schematic view of another embodiment of the heat sink of Figure 1. 200921340 Figure 3 is an exploded perspective view of the heat sink of Figure 2. Figure 4 is a partial assembly view of the heat sink of Figure 3. Figure 5 is an inverted view of the heat sink of Figure 3. Element Symbol Description] Base 10 Upper Surface 12 Groove 120, 220 Heat Sink 20 Lower Surface 22 First Heat Sink Set 30 First Heat Sink 32 Body 36, 46 First Joint Face 360, 480 Shoulder 38 Groove Slots 366, 388, 466, 488 Second joint faces 380, 460 Second heat sink fin sets 40 Second heat sink fins 42 Projections 48 First heat pipe 50 Heat absorption section 51 > 61 Heat release sections 53, 63 Second heat pipe 60 connecting section 56, 57 ' 58 ' 66 ' 67 ' 68 11