TWM269703U

TWM269703U - Heat sink with heat pipe

Info

Publication number: TWM269703U
Application number: TW94200739U
Authority: TW
Inventors: Huei-Min Tsuei; Shu-Bin Wang
Original assignee: Cpumate Inc
Priority date: 2005-01-14
Filing date: 2005-01-14
Publication date: 2005-07-01

Description

M269703 g、創作說明（1) 【新型所屬之技術領域】本創作是有關於一種熱管散熱器（_)， :之整體重*，並增加該熱管與散熱體‘：：面％，進而提升該散熱器之熱傳導效率者。妾觸【先前技術】 :安’ -般習用之熱管散熱器如第—圖所示， — V熱板β、二呈圓柱狀之埶管了、及 ^ “ 中兮1m ^ ”、及一散熱體8所組成，复板6之底面係可貼覆於—中央處理器（⑽）之」、M269703 g. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about a heat pipe radiator (_),: the overall weight *, and increasing the heat pipe and heat sink ':: surface%, and further improve the Heat transfer efficiency of radiator. [Previous technology]: An '-general heat pipe radiator as shown in the figure-V hot plate β, two cylindrical tube, and ^ "Zhongxi 1m ^", and a heat sink The bottom surface of the complex plate 6 can be attached to the central processing unit (中央).

士 ’且该導熱板6係開設有槽溝61，面 =置設該槽溝61中，另該散熱體8係由複數散熱：二可可ί二ί 5熱鰭片81上係具有呈相互對應之穿孔82，兮巧供該熱官7之另—端則穿設連接於各穿孔㈣ μ ::i:熱管散熱器’可對該中央處理器所產生之熱源進行雖然習用之熱管散熱器可對該中央處理器所產生之熱 =進行散逸，但是由於該整片之導熱板6 一般係由銅之材、二所製成，因此，其結合熱管7及散熱體8之後整體重量較且该整片之銅導熱板6亦會使其製作成本相對提高；再者，由於該熱管7係為一圓柱管體，其與散熱體8底 $僅為線接觸型態’故’導致使熱管7與散熱體8接觸之接觸面積較小，而使熱管7與散熱體8間之熱傳導性受到相去程度之限制。田【新型内容】本創作之主要目的，係在於解決上述缺失，避免缺失The heat conduction plate 6 is provided with a groove 61, and the surface 61 is disposed in the groove 61, and the heat sink 8 is radiated by a plurality of heat sinks: two cocoa, two, and five thermal fins 81. The perforation 82 is provided for the other part of the heat officer 7-the end is connected to each perforation. Μ :: i: heat pipe radiator 'can be used for the heat source generated by the central processor. The heat generated by the central processing unit = is dissipated, but since the entire heat conducting plate 6 is generally made of copper and aluminum, the combined weight of the heat pipe 7 and the heat sink 8 is relatively small. The entire copper heat-conducting plate 6 will also increase its production cost. Furthermore, because the heat pipe 7 is a cylindrical pipe body, its bottom contact with the heat sink 8 is only a linear contact type, so the heat pipe 7 is caused. The contact area with the heat sink 8 is small, so that the thermal conductivity between the heat pipe 7 and the heat sink 8 is limited by the degree of deconvolution. Tian [New content] The main purpose of this creation is to solve the above-mentioned shortcomings and avoid them.

M269703 写、創作說明（2) =敎熱管散熱器重新設計’讓熱管散熱器可減二=…D。之整體重量，並增加該熱管與散熱體接觸之接觸面和、，進而提升該散熱器之熱傳導效率。為達上述之目的，本創作係一種熱管散熱器（一），包部之基座；一設置於開口部上之導熱板，板壬一u型狀，其上具有一容置部；—設於基座上、，政…、體；以及至少一熱管，該受熱端配置於埶M269703 Writing and creation instructions (2) = 敎 Redesign of heat pipe radiator ’, so that the heat pipe radiator can be reduced by two = ... D. The overall weight of the heat pipe and the contact surface between the heat pipe and the heat sink are increased, thereby improving the heat conduction efficiency of the heat sink. In order to achieve the above purpose, this creation is a heat pipe radiator (1), the base of the package portion; a heat conducting plate provided on the opening portion, a plate-shaped U-shaped plate having an accommodating portion thereon; On the base, the government, the body; and at least one heat pipe, the heated end is arranged on the base

，與散熱體接觸，而冷卻端則配置於散熱體端面^。【實施方式】如下兹有關本創作之技術内容及詳細說明，現合圖式說明請參閱『第二及三圖』所示，係本創作之第一實施例，立體外觀及分解示意圖，如圖所示：本創作係一種熱管小、、σσ()，係由一基座1、一導熱板2、一散熱體3及至 ^ ，以上之熱管4所構成，藉以組構成可減少散熱器整。。―重量’並增加熱管4與散熱體3接觸面積，進而提升為之熱傳導效率。双…、上述所提之基座1係為鋁之導熱材質所製成，且j：一側係具有一開口部11。八』、該導熱板2係呈一 ϋ型狀，其上具有一容置部21，且以 ^ ^ 1呂之導熱材質所製成，係設置於上述開口部1 1上可與 …、g 4接觸，且該基座1與導熱板2間係以導熱介質接合。該散熱體3係設於上述之基座1上，該散熱體3係由複文轉片32所構成，其上具有一凹陷部3 j。, Is in contact with the heat sink, and the cooling end is arranged on the end face of the heat sink ^. [Implementation] The following is the technical content and detailed description of this creation. For the description of the drawings, please refer to the "second and third pictures". It is the first embodiment of this creation. Shown: This creation is a small heat pipe, σσ (), which is composed of a base 1, a heat conducting plate 2, a heat sink 3, and ^. The above heat pipes 4 can be used to reduce the overall heat sink. . "Weight" and increase the contact area between the heat pipe 4 and the heat sink 3, thereby improving the heat conduction efficiency. Double ..., the base 1 mentioned above is made of aluminum heat-conducting material, and j: one side has an opening 11. VIII. The heat-conducting plate 2 is in the shape of a trough, and has an accommodating portion 21, and is made of ^^ 1 Lu's heat-conducting material. 4 contact, and the base 1 and the heat conducting plate 2 are connected with a heat conducting medium. The heat sink 3 is provided on the base 1 described above, and the heat sink 3 is composed of a replica rotor 32 and has a recess 3j thereon.

第6頁 M269703Page 6 M269703

熱管4係為扁平狀，且且 .^ b 42 ’該受熱端41配置於導敎2::=1與-冷卻端部間，而冷卻端42則配置;置#21與散熱體3之底熱端41透過導教介質盘體3之凹陷部3】上，該受 4? Π接、杀f… ¥熱板2及散熱體3結人，而、人％虓 42同樣透過導熱介質與。而冷卻，相互接觸之併列狀。如是，藉m31Z合’讓熱管4呈熱管散熱器（一）。 ^ 、，、°構構成一全新之請參閱『第四及五圖所The heat pipe 4 is flat, and. ^ B 42 'The heat receiving end 41 is disposed between the guide tube 2 :: = 1 and-cooling end, and the cooling end 42 is disposed; set # 21 and the bottom of the heat sink 3 The hot end 41 passes through the recessed portion 3 of the guide medium disk body 3], and the receiver 4 is connected to the heat sink 2 and the heat sink 3, and the human body 42 also passes through the heat conductive medium. While cooling, they are placed side by side in contact with each other. If so, the heat pipe 4 can be made into a heat pipe radiator (1) by m31Z combination '. ^ ,,, and ° constitute a brand-new

剖面及另一剖面狀態係本創作第一貫施例之 ,,,,, ^ ；: (rλ : ^" ：：! 元件5運作產生埶源時，兮遑勒^/央處理益），當電子再傳導至各埶管:：：妖It熱板2係直接吸收熱源之後， 2散r;f化，速將受熱端41之熱源ΐ 古主:體3，讓電子元件5所產生之熱源能快.速散逸。 ::芩閱『第六圖』戶斤示，係為本創作第二實施例之剖口、、恶不意圖。如圖所示：本創作之熱管散熱器（一），除可為上述形態之外，亦可於該散熱體3之端面上凹設多數具有較大間距之凹陷部3丨，且各熱管4之冷卻端4 2係分別設置於各凹陷部31内，使各熱管4之冷卻端42係呈輻射狀，讓熱源能均勻分散散熱。睛芩閱『第七圖』所示，係本創作第三實施例之剖面狀態圖’其中該散熱體3之端面上凹設多數具有較小間距之弧狀凹陷部31，且各熱管4之冷卻端42係呈圓管狀，並分別設置於各弧狀凹陷部3 1内，使各熱管4呈整齊排列狀Sections and other section states are the first embodiment of this creation ,,,,,, ^;: (rλ: ^ " ：:! When element 5 operates to generate a source, Xi 遑 ^ // 央处理益), When the electrons are re-conducted to each tube ::: 妖 It hot plate 2 directly absorbs the heat source, and then diffuses r; f, and the heat source at the heated end 41 is quickly ΐ Ancient master: body 3, let the electronic component 5 produce The heat source can dissipate quickly and quickly. :: Read the illustration of the "Sixth Figure", which is the section of the second embodiment of this creation. As shown in the figure: In addition to the above-mentioned shape of the heat pipe radiator (1) of this creation, a plurality of recessed portions 3 with a large distance can be recessed on the end surface of the heat sink 3, and each heat pipe 4 The cooling ends 4 2 are respectively arranged in the depressions 31, so that the cooling ends 42 of the heat pipes 4 are radiated, so that the heat sources can be evenly dispersed and dissipated. The “Seventh Picture” shown in the eye is a sectional state diagram of the third embodiment of the present invention. The end face of the heat sink 3 is recessed with a large number of arc-shaped depressions 31 with a small pitch, and each of the heat pipes 4 The cooling end 42 is in a circular tube shape, and is respectively arranged in each of the arc-shaped depressions 31 so that the heat pipes 4 are arranged neatly.

第7頁 M269703 ----- 四、創作說明（4) ，同樣讓熱源能均勻分散散熱。請參閱『第八圖』所示，係本創作第四實施例之剖面狀態示意圖。如圖所示：其中該熱營4呈一 r s」型之彎曲狀，在受熱端41及冷卻端42間設有一個以上之散熱體3，且該冷卻端4 2跨設於散熱體3上’讓電子元件5所產生之熱源能快速散逸。請參閱『第九及十圖』所示，係本創作第五實施例之立體分解及剖面狀態示意圖。如圖所示：此實施例與第一實施例大致相同，所不同處在於熱管4之冷卻端4 2直接併 j列跨設於散熱體3之端面上，讓電子元件5所產生之熱源能 _速散逸。請參閱『第十一圖』所示，係本創作第六實施例之剖面狀態示意圖。如圖所示：本實施例與第二實施例大致相同，所不同處在於熱管4之冷卻端42係以輻射狀方式直跨設於散熱體3之端面上，讓電子元件5所產生 ' 私、备土 <熱源能快速散逸。請參閱『第十二圖』所示，係本創作第七给^ y ^ 』 π只施例之剖面狀恶圖，其中該散熱體3跨設有冷卻端42之頂品+〆 . 只回處係可另f又有一散熱體3 a，藉以輔助該冷卻端4 2之散熱。 || 綜上所述，本創作熱管散熱器（一）可有效改善習用之穆種缺點，可減少散熱器之整體重量，並增加該& ^與五熱體之接觸面積，進而提升散熱器之熱傳導效查、1 、月欠 . 1 人平，使本創作之·生能更進步、更實用、更符合使用者之所須，確符合新型專利申請之要件，爰依法提出專利申請、。已Page 7 M269703 ----- Fourth, the creative instructions (4), also allows the heat source to disperse heat evenly. Please refer to the "eighth figure", which is a schematic sectional view of the fourth embodiment of this creation. As shown in the figure: the thermal camp 4 has a curved shape of "rs", there is more than one heat sink 3 between the heated end 41 and the cooling end 42, and the cooling end 4 2 is straddled on the heat sink 3 'Let the heat source generated by the electronic component 5 dissipate quickly. Please refer to the "ninth and tenth pictures", which are the three-dimensional decomposition and cross-sectional state diagram of the fifth embodiment of this creation. As shown in the figure: This embodiment is substantially the same as the first embodiment, except that the cooling end 4 2 of the heat pipe 4 is directly arranged in parallel to the end face of the heat sink 3 to allow the heat source energy generated by the electronic component 5 _Quickly dissipating. Please refer to the "Eleventh Picture", which is a sectional state diagram of the sixth embodiment of this creation. As shown in the figure: This embodiment is substantially the same as the second embodiment, except that the cooling end 42 of the heat pipe 4 is directly arranged on the end face of the heat sink 3 in a radial manner, so that the electronic component 5 generates , Preparation of soil < heat source can quickly dissipate. Please refer to the "Twelfth Picture", which is the seventh section of this creation ^ y ^ "π only embodiment of the cross-sectional evil picture, in which the heat sink 3 across the top product with a cooling end 42 + 〆. Only back The system may further have a heat sink 3 a to assist the heat dissipation of the cooling end 4 2. In summary, the creative heat pipe radiator (1) can effectively improve the shortcomings of conventional methods, reduce the overall weight of the radiator, and increase the contact area of the & ^ with the five heat bodies, thereby improving the radiator. The heat conduction efficiency check, 1, and monthly owe. One person is equal, so that the creative energy of this creation is more progressive, more practical, and more in line with the needs of users. It is indeed in line with the requirements of new patent applications. Already

第8頁 M269703 四、創作說明（5) 惟以上所述者，僅為本創作之較佳實施例而已，當不能以此限定本創作實施之範圍；故，凡依本創作申請專利範圍及創作說明書内容所作之簡單的等效變化與修飾，皆應仍屬本創作專利涵蓋之範圍内。Page 8 M269703 IV. Creation Instructions (5) However, the above are only the preferred embodiments of this creation, and the scope of implementation of this creation cannot be limited by this; therefore, any application for a patent scope and creation in accordance with this creation The simple equivalent changes and modifications made in the description should still fall within the scope of this creative patent.

第9頁 M269703 圖式簡單說明【圖式簡單說明】第一圖習用之剖面狀態圖。第二圖係本創作第一實施例之立體外觀示意圖。第三圖係本創作第一實施例之立體分解示意圖。第四圖係本創作第一實施例之剖面狀態示意圖。第五圖係本創作第一實施例之另一剖面狀態示意圖。第六圖係本創作第二實施例之剖面狀態示意圖。第七圖係本創作第三實施例之剖面狀態示意圖。第八圖係本創作第四實施例之剖面狀態示意圖。 f第九圖係本創作第五實施例之立體分解示意圖。第十圖係本創作第五實施例之剖面狀態示意圖。第十一圖係本創作第六實施例之剖面狀態示意圖。第十二圖係本創作第七實施例之剖面狀態圖。【主要元件符號說明】Page 9 M269703 Simple illustration of the drawing [Simplified illustration of the drawing] The cross-section state diagram used in the first drawing. The second figure is a schematic diagram of the three-dimensional appearance of the first embodiment of this creation. The third figure is a three-dimensional exploded view of the first embodiment of this creation. The fourth figure is a schematic cross-sectional state diagram of the first embodiment of the present invention. The fifth figure is a schematic view of another cross-sectional state of the first embodiment of the present invention. The sixth diagram is a schematic sectional state diagram of the second embodiment of the present invention. The seventh diagram is a schematic sectional state diagram of the third embodiment of this creation. The eighth figure is a schematic sectional view of the fourth embodiment of the present invention. f The ninth figure is a three-dimensional exploded view of the fifth embodiment of the present invention. The tenth figure is a schematic cross-sectional state diagram of the fifth embodiment of the present invention. The eleventh figure is a schematic sectional view of the sixth embodiment of the present invention. The twelfth figure is a sectional state diagram of the seventh embodiment of the present invention. [Description of main component symbols]

第10頁 (習用部分）導熱板6 槽溝6 1 熱管7 散熱體8 散熱鰭片8 1 穿孔82 (本創作部分）基座1 開口部11 導熱板2 容置部2 1 散熱體3、3a 凹陷部3 1 鱗片3 2 熱管4 受熱端4 1 冷卻端4 2 M269703Page 10 (conventional part) heat transfer plate 6 slot 6 1 heat pipe 7 heat sink 8 heat sink fin 8 1 perforation 82 (this creative part) base 1 opening 11 heat transfer plate 2 accommodating part 2 1 heat sink 3, 3a Depression 3 1 Scale 3 2 Heat pipe 4 Heated end 4 1 Cooling end 4 2 M269703

第11頁Page 11

Claims

M269703M269703

五、申請專利範圍 1、一一基座一導熱上具有一容一散熱至少一一冷卻端，而冷卻端配 2、依其中，該基 3、依其中，該導 4、依立中，該基 5、依 I中，該散端係設置於 6、依 I中，該散，該各熱f 之冷卻端呈 γ、依其中該散熱部，及各熱種熱管 ’係具板，係置部；體，係個以上該受熱置於上申請專座係為申請專熱板係申請專座與導申請專熱體之該凹陷申請專熱體之之冷卻輻射狀申請專體之端管之冷散熱器（一），其包括：有一開口部；呈一 U型狀並設置於上述開部中，其設於上之熱管端配置述散熱利範圍鋁之導利範圍以銅、利範圍熱板間利範圍端面上部内呈利範圍端面上端係分述之基座，其上具於導熱板體之端面第1項所熱材質所第1項所鋁之導熱第1項所係以導熱第1項所凹設凹相互接觸第1項所凹設多數別設置於上；以有至少上，並上。述之埶 #、、、製成。述之熱管散熱器（一），材質所製成。述之熱管散熱器（一），介質接合。述之熱管散熱器（一），陷部，該各熱管之冷卻之併列狀。述之熱管散熱器（一），具有較大間距之凹陷部各凹陷部内，使各熱管及一扁狀受熱端與與散熱體接觸，管散熱器（一），利範圍第1項所述之熱管散熱器（一），面上凹設多數具有較小間距之弧狀凹陷卻端係為圓管狀’龙分別設置於各凹陷V. Scope of patent application 1. A base has a cooling end with a capacity for heat dissipation and at least one cooling end, and the cooling end is equipped with 2. According to which, the base 3, according to the guide 4, and Lizhong, the In base 5, according to I, the scattered end is arranged in 6. According to I, the scattered, the cooling end of each heat f is γ, according to the heat dissipation part, and each heat type heat pipe 'system board. The body is more than one of the end tubes of the heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-receiving heat-removing heat-repellent heat-removing heat-repellant heat-repellent heat-removing heat-repellent heat-repellent heat-repellent heat-repellent heat-repellent heat-repellent heat-repellent heat-repellent heat-repellant heat-repellant heat-repellent heat-repellant heat-repellant heat-repellant heat-repellent heat-repellent heat-repellant heat-repellant heat-repellant heat-repellant heat-repellant heat-repellant heat-repellant heat-repellant heat-repellant heat-repellent heat exchanger A cold radiator (1), comprising: an opening portion; a U-shape and arranged in the above-mentioned opening portion, and arranged on a heat pipe end thereof; In the upper part of the end of the plate, the upper end of the end of the range of interest is divided into bases. The upper end of the heat conduction plate is provided on the end surface of the heat conductive plate. The recesses of 1 item are in contact with each other A majority of the recessed provided on the other; at least on the upper and.述之埶 # 、、、 Made. The heat pipe radiator (1) mentioned above is made of material. In the heat pipe radiator (1), the medium is bonded. The heat pipe radiator (1) mentioned above, the depression, and the cooling of the heat pipes are arranged side by side. The heat pipe radiator (1) described above, each recessed portion of the recessed portion having a large distance, so that each heat pipe and a flat heat receiving end are in contact with the heat sink, the pipe radiator (1), as described in the first item of the scope of interest Heat pipe radiator (1), most of the arc-shaped depressions with a small pitch are recessed on the surface, but the ends are circular tubes. The dragons are respectively arranged in each depression.

第12頁 --- M269703 五、申請專利範圍部内，使各熱 8、依申其中，該各熱端面上。 9、依申其中，該各熱體之端面上， 1 0、依，其中，該熱加以結合。 1 1、依，其中，該熱結合。 1 2、依，其中，該熱端與冷卻端間 1 3、依，其中，該散熱體。管呈整齊排列狀。請專利範圍第1項所述之熱管散熱器（一），管之冷卻端呈相互接觸之併列跨設於散熱體請專利範圍第1項所述之熱管散熱器（一），管之冷卻端間係以預定之距離跨設於該散熱使各熱管之冷卻端呈輻射狀。申請專利範圍第1項所述之熱管散熱器（一）管之冷卻端與散熱體之接觸面係以導熱介質申請專利範圍第1項所述之熱管散熱器（一）管之受熱端係以導熱介質與導熱板及散熱體申請專利範圍第1項所述之熱管散熱器（一）管略呈一「S」型之彎曲狀，該熱管之受熱配置有一個以上之散熱體。申請專利範圍第1項所述之熱管散熱器（一）熱體跨設有冷卻端之頂面處係可另設有一散Page 12 --- M269703 V. Scope of patent application, each heat is applied. 9. Yishen Among them, on the end face of each heating body, 10, Yi, where the heat is combined. 1 1. According to, wherein the thermal bonding. 1 2. According to, where the hot end and the cooling end are between 1 3. According to, where the heat sink. The tubes are neatly arranged. The heat pipe radiator (1) described in item 1 of the patent scope, the cooling ends of the tubes are placed in parallel with each other across the heat sink. The heat pipe radiator (1) described in item 1 of the patent scope, the cooling end of the pipe The space is arranged at a predetermined distance across the heat sink to make the cooling ends of the heat pipes radiate. The heat pipe radiator (1) described in the scope of the patent application (1) The contact surface between the cooling end of the tube and the heat sink is a heat conductive medium. The heat pipe end of the pipe (1) described in the patent scope is the heated end of the tube The heat pipe radiator described in item 1 of the scope of patent application for heat conducting medium, heat conducting plate and heat sink (1) The pipe has a slightly "S" shape. The heat pipe is equipped with more than one heat sink. The heat pipe radiator described in item 1 of the scope of the patent application (1) A heat sink may be provided at the top surface provided with a cooling end.

第13頁Page 13