TW200539788A

TW200539788A - Heat pipe cooling assembly and method of manufacturing the same

Info

Publication number: TW200539788A
Application number: TW93115303A
Authority: TW
Inventors: Jian-Qing Sheng; Meng-Tzu Lee; Shu-Ho Lin
Original assignee: Hon Hai Prec Ind Co Ltd
Priority date: 2004-05-28
Filing date: 2004-05-28
Publication date: 2005-12-01
Also published as: TWI260962B

Abstract

A heat pipe cooling assembly and the method of manufacture, the heat pipe cooling assembly includes: a base defined a groove in the under side thereof; at least one heat pipe and at least one group of cooling fins. The heat pipe heaving a evaporating portion thermally received in the groove of the base, and at least one condensing portion thermally coupled to the group of cooling fins. The evaporating portion has a flat surface directly contacting a heat source, and the flatness of the flat surface is the same as the under side of the base. In manufacturing, the heat pipe is thermally received in the groove of the base. The conbined heat pipe and the base is then mechanically processed to form the flat surface.

Description

200539788200539788

【發明所屬之技術領域】本啦明係關於一種散熱裝置及其製邊方法種利用熱管之散熱裝置及其製造方法σ 【先前技術】隨產業之人電腦即時性提南。性能之理器不間產生身溫度散熱問題。通熱，同器之熱之散熱著大型積體發展突飛猛之應用已基要求提南之眾所周知，優劣直接決斷推出。但大量熱量，之升高，對題已經成為常業界在中時，在散熱量快速散發腦廣泛，為適勢，必理器係電腦之南頻高時排除安全及南速處器等晶裝風扇能夠對行迷度不斯 =70件，其高迷處起處理器自影響，曰 ^ . 目前 f輔助其散 =流使散熱行更為有致進，電本普及發展趨中央處定整個是由於如不及系統之新一代央處理器上安 ’從而斷進夕應用於應資科然要求電腦系性能’ 速運行這些熱性能造理器推片上安 ’以提中央處各行各處理量電腦$ 統之；)¾ 因此，使得處量將弓丨成拫A 出時必裝散熱供強制理器進由於對散熱需求不斷提高將熱管應用於電子元件散熱就在氣、液兩態間轉變時溫度保熱量之原理工作，一改傳統散散熱而效率有限之狀況。熱管盛裝適量汽化熱高、流動性好 :新式散熱裝置不斷出現。是其中一種，其係利用液體持不變而可吸收或放出大量熱器單純以金屬熱傳導方式係於一密封低壓管形殼體内、化學性質穩定、沸點較低[Technical field to which the invention belongs] Benlaming relates to a heat dissipation device and a method for making the edge thereof. A heat dissipation device using a heat pipe and a manufacturing method thereof [Prior technology] The computer of the industry is imminent. Performance controllers constantly cause problems with body temperature and heat dissipation. Ventilation, heat from the same device, heat dissipation, large-scale development, and the rapid development of applications have been based on the well-known requirements of the South, the pros and cons are directly decided to launch. However, a large amount of heat has risen, and the problem has become a common industry. When the heat dissipation is quickly disseminated widely, for proper reasons, the computer must be equipped with a high-frequency device, such as safety and south-speed processors. The fan can affect the degree of fans = 70 pieces, and the high point of the fan affects the processor itself, ^. At present, f assists its dispersion = current makes the cooling line more progressive, and the popularization of electricity books is centrally determined. As the system's next-generation central processor is installed on the computer, it will be applied to the computer department to request the performance of the computer system. 'Running these thermal performance processors on the tablet to speed up the computer to increase the processing capacity of the computer at the central office. The system;) ¾ Therefore, the heat treatment will be installed when the output will be 拫 A. A heat sink must be installed for the processor to enter. Due to the increasing demand for heat dissipation, the heat pipe is used to cool the electronic components. The principle of heat preservation works to change the situation of traditional heat dissipation and limited efficiency. The heat pipe contains a moderate amount of vaporization heat and good fluidity: new heat sinks are constantly appearing. It is one of them, which can absorb or release a large amount of liquid by using the same liquid. The heater is simply metal heat conduction. It is tied in a sealed low-pressure tubular casing with stable chemical properties and low boiling point.

200539788 五、發明說明（2) 之液態物質，如水、乙醇、丙酮等，利用該液態物質受熱和冷卻而在氣、液兩態間轉變時，吸收或放出大量熱量而1 使熱Ϊ由官體一端迅速傳到另一端。現有技術中，將一導熱基座與熱源接觸，將熱管一端接合於導熱基座上，另一端結合於散熱鰭片，從而組裝成散熱裝置，由基座吸收熱量再傳導至熱管’再進一步通過散熱鰭片散發出去。…、上述熱官散熱裝置雖然較傳統散熱方式散熱效率有所提南’但熱官與熱源之間係通過基座連接，熱阻較大，不能充为發揮熱管快速導熱之性能，在熱負荷較大時往往不到所需散熱效果。【發明内容】本發明之目的在於提供一種熱阻小、散熱性能好之埶管散熱裝置及其製造方法。 … 本發明熱管散熱裝置包括基板、至少一熱管及至少一散熱鰭片組，該熱管包括一蒸發部及至少一冷凝部，該基板下表面設有收容該熱管蒸發部之溝槽，該散熱鰭片組與熱管冷凝部熱性結合，該熱管蒸發部具有一用於與熱源發熱面直接接觸之平表面，該平表面之平面度與基板下表面平面度相同。本發明熱官散熱裝置之製造方法包括以下步驟：提供一表面没有溝槽^基板，將熱管蒸發部熱性固接於該基板之溝槽=，使熱官與基板成為一體，然後對熱管蒸發部及基板同打進行機械加工，使該熱管蒸發部暴露於溝槽外部分形成一平表面，該平表面與基板之下表面位於同一平面200539788 V. Description of the invention (2) Liquid substances, such as water, ethanol, acetone, etc. When the liquid substances are heated and cooled to change between gas and liquid states, they absorb or release a large amount of heat and cause the heat to escape from the body Quickly passed from one end to the other. In the prior art, a heat conducting base is contacted with a heat source, one end of the heat pipe is joined to the heat conducting base, and the other end is joined to a heat dissipation fin, thereby assembling a heat dissipation device, and the heat is absorbed by the base and then conducted to the heat pipe, and then further passed. The cooling fins exude. …, Although the above-mentioned thermal official cooling device has a better heat dissipation efficiency than the traditional cooling method, but the thermal official and the heat source are connected through the base, the thermal resistance is large, and it cannot be used to exert the performance of rapid heat conduction of the heat pipe. When larger, the required heat dissipation effect is often not enough. SUMMARY OF THE INVENTION The object of the present invention is to provide a tube heat dissipation device with small thermal resistance and good heat dissipation performance and a manufacturing method thereof. … The heat pipe radiating device of the present invention comprises a substrate, at least one heat pipe and at least one fin group. The heat pipe includes an evaporation portion and at least one condensation portion. A groove is disposed on the lower surface of the substrate to receive the heat pipe evaporation portion. The chip group is thermally combined with a heat pipe condensation part. The heat pipe evaporation part has a flat surface for direct contact with the heating surface of the heat source, and the flatness of the flat surface is the same as the flatness of the lower surface of the substrate. The manufacturing method of the thermal official heat dissipation device of the present invention includes the following steps: providing a substrate without a groove on the surface, thermally fixing the heat pipe evaporation part to the groove of the substrate, so that the heat officer and the substrate are integrated, and then the heat pipe evaporation part is integrated. Machining with the substrate to make the heat pipe evaporation part exposed to the outside of the groove to form a flat surface, the flat surface and the lower surface of the substrate are on the same plane

200539788 ---—----- —----------- 五、發明說明（3) 内，再將一散熱鰭片組熱性固接亍熱管冷凝部。本發明熱管散熱衣置熱管凑發部具有平表面，其可與熱源直接接觸，能更加快速有坆之吸收熱量。【實施方式】下面參照附圖’結合實施例對本發明作進一步描述。參照第一圖及第二圖’本發明熱管散熱裝置，包括二散熱鰭片組1及2、一基板4及熱管5。200539788 ---------- ------------- 5. In the description of the invention (3), a heat sink fin group is thermally fixed to the heat pipe condensation section. The heat pipe radiating part of the heat pipe radiating garment of the invention has a flat surface, which can directly contact the heat source, and can absorb heat more quickly and efficiently. [Embodiment] The present invention will be further described below with reference to the accompanying drawings' in conjunction with embodiments. Referring to the first and second drawings', the heat pipe heat sink device of the present invention includes two heat sink fin groups 1 and 2, a substrate 4 and a heat pipe 5.

該基板4具有上表面43及下表面42，該下表面42上開設有橫直溝槽40，該基板4之一端對應溝槽40開設凹口41 ，該凹口 41與溝槽連通。The substrate 4 has an upper surface 43 and a lower surface 42. Horizontal grooves 40 are formed in the lower surface 42. One end of the substrate 4 is provided with a notch 41 corresponding to the groove 40, and the notch 41 communicates with the groove.

該熱管5呈圓枉形’其沿徑向之内截面為圓形。該熱管 5包括一蒸發部5 1、一冷凝部5 2及一連接該蒸發部5 1及冷凝部5 2之彎折部5 3。該蒸發部5 1外圓面具有一與熱源發熱面直接接觸之平表面510，該平表面51〇與基板4下表面42之平面度相同，最好要小於〇·〇8πιιη，光潔度最好在3.2以内，這樣可保證與熱源之充分接觸。該平表面51〇通過精密機械加工方法加工而成，如銑削。本說明書及其專利申請範圍所指之直接接觸係指區別于利用導熱板將熱源之熱量傳遞至熱管之連接方式，而在熱管與熱源發熱面間設置熱介面材料仍屬於本說明書及專利申請範圍所述之直接接觸。該冷凝部52之延伸方向平行于該平表面510，這樣可使熱管5在垂直於熱源發熱面方向上不至於佔用太多空間。該散熱鰭片組1及2均包括複數平行之散熱鰭片，在該散熱鰭片組1下表面1 0 —端之複數散熱鰭片上開設有呈倒The heat pipe 5 has a round shape, and its inner cross section in the radial direction is circular. The heat pipe 5 includes an evaporation portion 51, a condensation portion 52, and a bent portion 53 connecting the evaporation portion 51 and the condensation portion 52. The outer surface of the evaporation part 51 has a flat surface 510 which is in direct contact with the heating surface of the heat source. The flat surface 51 ° is the same as the flatness of the lower surface 42 of the substrate 4 and is preferably less than 0.08 μm. The smoothness is preferably at Within 3.2, this can ensure full contact with the heat source. The flat surface 51 is formed by a precision machining method such as milling. The direct contact in this specification and the scope of its patent application refers to a connection method different from the use of a heat transfer plate to transfer heat from a heat source to a heat pipe, and the provision of a thermal interface material between the heat pipe and the heating surface of the heat source is still within the scope of this specification and patent application Direct contact. The extending direction of the condensing portion 52 is parallel to the flat surface 510, so that the heat pipe 5 does not occupy much space in a direction perpendicular to the heating surface of the heat source. The heat radiation fin groups 1 and 2 each include a plurality of parallel heat radiation fins, and a plurality of heat radiation fins are provided on the lower surface 10-end of the heat radiation fin group 1 to form an inverted

第8頁 200539788 五、發明說明（4) π ΙΓ形凹槽1 1，該凹槽1 1大小形狀與熱管5之彎折部5 3相配合。该散熱錯片組2具有圓形通孔2 〇。將散熱鰭片組1貼設於基板4上表面4 3，並將該散熱鰭片組1具有凹槽11之一端對應於該基板4具有凹口4丨之一端。熱官条發部5 1熱性固結於基板4之溝槽4 〇内，熱管5彎折部53 ^過該基板4之凹口41並固定於散熱鰭片組i之凹槽n 内/瘵發部52熱性結合於散熱鰭片組2之通孔2〇内。該熱管 5瘵發部51、冷凝部52及彎折部53均可通過焊接或過盈配合等方式固定。、甬、月熱管散熱裝置時，先將熱管5之蒸發部51 之配合熱性固接於該基板4之溝槽40内，使熱官5與基板^為一體，熱管蒸發部51 —部分收容於溝槽40 内’另—/、气暴露於溝槽40外；然後對該熱管蒸發部5 1及基板4同日守進行機械加1，如前述提到之銑削加卫，將敎管蒸發部=暴露於溝槽4〇外之那一部分及基板4下表面“同、時銑平從而幵y成熱管蒸發部之平表面5 1 0 ;然後將散熱ϋ片組1及2分別熱性結合於基板4上表面43及熱管5之冷凝 52 〇將本發明熱管散熱裝置安裝於熱源上後，熱管&蒸發部 5 1内之介質直接吸收熱源熱量並快速蒸發，將熱量傳導至熱管5冷凝部52，熱管5冷凝部52進一步通過散熱鰭片組2將熱源散發之熱量散發到周圍環境中，熱管5冷凝部5 2中之介質由於釋放出熱量恢復至液態，迴流至熱管5蒸發部5丨，在蒸發部5 1内再次吸熱蒸發，如此循環，達到散熱之目的。Page 8 200539788 V. Description of the invention (4) π ΙΓ-shaped groove 11, the size and shape of the groove 11 are matched with the bent portion 5 3 of the heat pipe 5. The heat dissipation fin group 2 has a circular through hole 20. The heat dissipation fin group 1 is attached to the upper surface 43 of the substrate 4, and one end of the heat sink fin group 1 having a groove 11 corresponds to one end of the substrate 4 having a notch 4 丨. The thermal strip section 51 is thermally consolidated in the groove 4 of the substrate 4, and the bent portion 53 of the heat pipe 5 passes through the notch 41 of the substrate 4 and is fixed in the groove n of the heat sink fin group i. The hair part 52 is thermally combined in the through hole 20 of the heat dissipation fin group 2. The heat pipe 5 bursting portion 51, the condensing portion 52, and the bending portion 53 can be fixed by welding or interference fit. In the case of heat dissipation devices such as heat pipes, heat pipes, the matching of the evaporation portion 51 of the heat pipe 5 is first fixed in the groove 40 of the substrate 4 to integrate the heat officer 5 and the substrate ^, and the heat pipe evaporation portion 51 is partially contained in Inside the groove 40 is another— /, the gas is exposed to the outside of the groove 40; then the heat pipe evaporation portion 51 and the substrate 4 are mechanically added by the same date guard, as in the aforementioned milling and guarding, the stern tube evaporation portion = The part exposed outside the groove 40 and the lower surface of the substrate 4 are milled at the same time so as to form a flat surface 5 1 0 of the heat pipe evaporation part; and then the heat dissipation fin groups 1 and 2 are thermally bonded to the substrate 4 respectively. The upper surface 43 and the condensation 52 of the heat pipe 5 After the heat pipe radiating device of the present invention is installed on a heat source, the medium in the heat pipe & evaporation section 51 directly absorbs heat from the heat source and rapidly evaporates, and conducts the heat to the condensation section 52 of the heat pipe 5, The condensing part 52 of the heat pipe 5 further dissipates the heat emitted by the heat source to the surrounding environment through the radiating fin group 2. The medium in the condensing part 52 of the heat pipe 5 returns to the liquid state due to the released heat, and returns to the evaporation part 5 of the heat pipe 5. The evaporation part 5 1 absorbs heat and evaporates again. , The cooling purposes.

200539788 五、發明說明（5) 同時熱管5蒸發部5 1之熱量通過基板4傳通過散熱鰭片組1散發至周圍環境中。^ 分別在散熱鰭片組1及2上加設散熱風扇可以理解的，本發明熱管散熱裝置根，其數目可隨熱負荷而增加或減少，槽40及散熱鰭片組2上通孔2〇之數量與g 可。熱管5蒸發部5 1不限於上述之直線片接觸面積，該熱管5蒸發部5 1也可以在fi 或折彎狀。第三圖所示為本發明另一實施例示有一蒸發部451、兩冷凝部452及連接該部4 5 2之兩彎折部4 5 3。與第一實施例相有一平表面450，該兩冷凝部452分別熱片組2中，基板4，上表面熱性結合有一 | 各元件組裝及工作原理與第一實施例相综上所述，本發明確已符合發明專提出專利申請。惟，以上所述者僅為本 ’自不能以此限制本案之申請專利範圍藝之人士援依本發明之精神所作之等效涵蓋於以下申請專利範圍内。導至散熱鰭片組1， ^增強散熱效果，可〇中熱管5至少為一相應地，基板4之溝七管5之數量一致即 < ’為增加與熱源之 ]一平面内呈彎曲狀意圖。該熱管45具蒸發部4 5 1與兩冷凝同，該蒸發部4 5 1具性結合於兩散熱鰭 t熱鰭片組Γ ，其中同，此不贅述。利之要件，遂依法發明之較佳實施例。舉凡熟悉本案技修飾或變化’皆應200539788 V. Description of the invention (5) At the same time, the heat of the evaporation part 51 of the heat pipe 5 is transmitted through the substrate 4 and dissipated to the surrounding environment through the heat dissipation fin group 1. ^ It can be understood that a cooling fan is additionally installed on each of the heat dissipation fin groups 1 and 2. It can be understood that the number of the heat pipe heat dissipation device of the present invention can be increased or decreased with the heat load. The quantity is equal to g. The evaporation portion 51 of the heat pipe 5 is not limited to the contact area of the linear sheet described above, and the evaporation portion 51 of the heat pipe 5 may be fi or bent. The third figure shows another embodiment of the present invention, which has an evaporation portion 451, two condensation portions 452, and two bent portions 4 5 3 connecting the portions 4 5 2. The first embodiment has a flat surface 450, and the two condensing portions 452 are thermally combined with the upper surface of the substrate 4 and the substrate 2 respectively. The assembly and working principles of the components are the same as those of the first embodiment. It is clear that a patent application has been filed for the invention. However, the above is only for the purpose of this patent. Since the scope of the patent application for this case cannot be limited by the art, the equivalents made by the persons who rely on the spirit of the present invention are covered by the following patent applications. It leads to the heat dissipation fin group 1, which enhances the heat dissipation effect. However, the heat pipe 5 is at least one. Accordingly, the number of the grooves 7 of the substrate 4 is the same. intention. The heat pipe 45 has the same evaporation part 4 51 as the two condensation parts, and the evaporation part 4 51 is combined with the two heat radiating fins t and the heat fin group Γ. The key elements of the invention are the preferred embodiments of the invention. Anyone who is familiar with the technical modifications or changes in this case ’should

200539788 圖式簡單說明【圖式簡單說明】第一圖係本發明熱管散熱裝置各元件立體分解圖。第二圖係本發明熱管散熱裝置立體組裝圖。第三圖係本發明熱管散熱裝置另一實施例各元件立體分解圖。【元件符號說明】散熱縛片組 1、2 下表面 10 、42 凹槽 11 通孔 20 基板 4 溝槽 40 凹口 41 上表面 43 埶管 ί、、、 5、45 蒸發部 5卜 451 平表面彎折部 510 、 450 53 、 453 冷凝部 52 > 452200539788 Brief description of the drawings [Simplified description of the drawings] The first diagram is an exploded perspective view of each component of the heat pipe heat sink of the present invention. The second figure is a three-dimensional assembly view of the heat pipe heat sink of the present invention. The third figure is an exploded perspective view of each component of another embodiment of the heat pipe heat sink of the present invention. [Description of component symbols] Radiating fins group 1, 2 Lower surface 10, 42 Groove 11 Through hole 20 Substrate 4 Groove 40 Notch 41 Upper surface 43 Tubes ί ,, 5, 45 Evaporation section 5 451 Flat surface Bends 510, 450 53, 453 Condensation 52 > 452

Claims

200539788 六、申請專利範圍 1. 一種熱管散熱熱裝，包括：一基板，該基板下表面設有至少一溝槽；至少一散熱鰭片組；及至少一熱管，該熱管包括一蒸發部及至少一冷凝部，該蒸發部收容於該基板之溝槽内，其具有一用於與熱源發熱面直接接觸之平表面，該平表面之平面度與基板之下表面平面度相同，該熱管冷凝部熱性結合於該散熱鰭片組。 2. 如申請專利範圍第1項所述之熱管散熱裝置，其中該熱管蒸發部沿其徑向之内截面為圓形，外圓面設一平表面0 3. 如申請專利範圍第1項所述之熱管散熱裝置，其中該熱管冷凝部與蒸發部之間具有彎折部，在豎直方向上該冷凝部與該蒸發部具有高度差。 4. 如申請專利範圍第1項所述之熱管散熱裝置，其中該熱管散熱裝置進一步包括一設置於基板上之散熱鰭片組〇 5. 如申請專利範圍第1項所述之熱管散熱裝置，其中該熱管蒸發部之平表面之平面度小於〇. 〇8mm。 6. 如申請專利範圍第1項所述之熱管散熱裝置，其中該熱管蒸發部之平表面之光潔度在3. 2之内。 7. —種熱管散熱裝置之製造方法，包括以下步驟：第一步驟，提供一基板，該基板一表面設有溝槽；第二步驟，提供至少一熱管，該熱管具有一蒸發部及200539788 VI. Application Patent Scope 1. A heat pipe heat-dissipating hot pack, comprising: a base plate provided with at least one groove on the lower surface thereof; at least one heat dissipation fin group; and at least one heat pipe, the heat pipe including an evaporation portion and at least A condensing part, the evaporating part is contained in a groove of the substrate, and has a flat surface for direct contact with the heating surface of the heat source, the flatness of the flat surface is the same as the flatness of the lower surface of the substrate, and the heat pipe condensing part Thermally bonded to the heat dissipation fin group. 2. The heat pipe radiating device according to item 1 in the scope of patent application, wherein the inner section of the heat pipe evaporation section is circular in the radial direction, and the outer surface is provided with a flat surface 0 3. As described in item 1 of the scope of patent application The heat pipe heat dissipation device, wherein the heat pipe has a bent portion between the condensation portion and the evaporation portion, and the condensation portion and the evaporation portion have a height difference in a vertical direction. 4. The heat pipe heat sink device described in item 1 of the scope of the patent application, wherein the heat pipe heat sink device further includes a heat sink fin set provided on the substrate. 5. The heat pipe heat sink as described in the scope of patent application item 1, 〇8mm。 The flatness of the flat surface of the heat pipe evaporation part is less than 0.08mm. 6. 内内。 The heat pipe heat sink device described in the scope of application of the patent, wherein the smoothness of the flat surface of the heat pipe evaporation part is 3.2 within. 7. A method of manufacturing a heat pipe heat sink, comprising the following steps: a first step of providing a substrate with grooves on one surface of the substrate; a second step of providing at least one heat pipe having an evaporation section and

200539788 六、申請專利範圍至少一冷凝部，將熱管蒸發部熱性固接於該基板之溝槽内，使熱管與基板成為一體；第三步驟，對熱管之蒸發部及基板同時進行機械加工，使該熱管蒸發部暴露於溝槽外之部分形成一平表面，該平表面與基板下表面位於同一平面内；第四步驟，將一散熱鰭片組熱性固接于熱管冷凝部。 8.如申請專利範圍第7項所述之熱管散熱裝置之製造方法，其中對熱管蒸發部及基板同時進行之機械加工為200539788 6. At least one condensing section in the scope of patent application. The heat pipe evaporation section is thermally fixed in the groove of the substrate to integrate the heat pipe and the substrate. The third step is to simultaneously process the evaporation section and the substrate of the heat pipe so that A part of the heat pipe evaporation part exposed outside the groove forms a flat surface, and the flat surface is located in the same plane as the lower surface of the substrate. In a fourth step, a heat sink fin group is thermally fixed to the heat pipe condensation part. 8. The method for manufacturing a heat pipe heat sink as described in item 7 of the scope of patent application, wherein the simultaneous mechanical processing of the heat pipe evaporation section and the substrate is

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