TWI326618B - Coater and method of coating a substrate with a coating solution using the same - Google Patents

Coater and method of coating a substrate with a coating solution using the same Download PDF

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Publication number
TWI326618B
TWI326618B TW096140612A TW96140612A TWI326618B TW I326618 B TWI326618 B TW I326618B TW 096140612 A TW096140612 A TW 096140612A TW 96140612 A TW96140612 A TW 96140612A TW I326618 B TWI326618 B TW I326618B
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Taiwan
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coating
substrate
unit
cleaning
coating process
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TW096140612A
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Chinese (zh)
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TW200840652A (en
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Park Kwang-Shin
In Eui-Sik
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Semes Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Description

13266181326618

, 4iiIe:TW4115F 為數個單位基板（unit substrates)。由於平面顯示裝置的尺 • 寸增加’相對地主基板的尺寸也隨即增加。於是，光阻的 . 塗佈時間以及光阻膜於主基板上均勻性則對平面顯示裝 - 置的製程效率有很大的影響。 • 傳統用以塗佈光阻於主基板的塗佈機通常包括一用 以固疋基板的支擇元件，如塗佈夾盤（c〇ater ChUCk)。光阻 係經由喷嘴（nozzle)注射至基板上，且一清潔元件係用以 清潔此喷嘴。 • 請參照第1圖’其繪示一種塗佈光阻於基板之傳統塗 佈機之示意圖。傳統塗佈機9〇包括一支撐單元1〇、一塗佈 單元2〇以及一清潔單元30。支撐單元1〇係用以支撐一主基 . 板G，其中主基板G例如主玻璃。塗佈單元2〇係用以塗佈 光阻於基板G，且塗佈單元20係延著基板G的表面移動以 形成一光阻膜（photoresist film)L於基板G上。清潔單元30 係用以清潔塗佈光阻於基板G後的塗佈單元20。 基板G係牢靠放置於支撐元件1〇之上表面上，且一塗 籲佈溶液如光阻液係經由一噴嘴26被注射至基板G的表面 上。喷嘴26例如為一長狹縫且其長度實質上係與基板g的 度相同’如此便可藉由一單位寬度的喷嘴26延著基板G 緯度之方向將塗佈溶液塗佈至基板G上。因此，當塗佈元 件2 〇 ^著基板G的緯度方向移動時，光阻便經由喷嘴2 6將 基板G整個表面覆蓋住。 田光阻液延著緯度方向完全覆蓋於基板G之表面後 且光阻膜也完全形成於基板G的表面時，支撐單元1〇會向 8 1326618, 4iiIe: TW4115F is a unit substrate. Since the size of the flat display device is increased, the size of the main substrate is also increased. Therefore, the coating time and the uniformity of the photoresist film on the main substrate have a great influence on the process efficiency of the flat display device. • Conventional coaters for coating photoresist on the main substrate typically include a spacer element for securing the substrate, such as a coating chuck (c〇ater ChUCk). The photoresist is injected onto the substrate via a nozzle and a cleaning element is used to clean the nozzle. • Refer to Figure 1 for a schematic view of a conventional applicator for coating photoresist on a substrate. The conventional coater 9A includes a support unit 1A, a coating unit 2A, and a cleaning unit 30. The support unit 1 is for supporting a main substrate G, wherein the main substrate G is, for example, a main glass. The coating unit 2 is used to apply a photoresist to the substrate G, and the coating unit 20 is moved along the surface of the substrate G to form a photoresist film L on the substrate G. The cleaning unit 30 is used to clean the coating unit 20 after coating the photoresist on the substrate G. The substrate G is firmly placed on the upper surface of the support member 1 and a coating solution such as a photoresist liquid is injected onto the surface of the substrate G via a nozzle 26. The nozzle 26 is, for example, a long slit and has a length substantially the same as that of the substrate g. Thus, the coating solution can be applied to the substrate G by the nozzle 26 of one unit width extending in the direction of the latitude of the substrate G. Therefore, when the coating member 2 is moved in the latitudinal direction of the substrate G, the photoresist covers the entire surface of the substrate G via the nozzle 26. After the light retardation of the field is completely covered on the surface of the substrate G in the latitudinal direction and the photoresist film is also completely formed on the surface of the substrate G, the support unit 1 will be directed to 8 1326618

' ，file:TW4115F 下移動且塗佈單元20會向上移動，而因此增加了界於塗佈 單元20與基板G之間的間距距離。然後，具有光阻膜l之基 板G從支撐單元1〇上移開，並將另一欲被塗佈之基板放置 於支撐單元10上。當具有光阻膜L之基板G被移開且放置另 基板於支撐單元10上時’塗佈單元2〇返回清潔單元3〇 並預備用於另一基板上接續的塗佈製程。 清潔單元30包括一濕潤器（moisturizer)34及一灌注 滾筒（priming r〇ner)32。濕潤器34係用以濕潤此喷嘴26以 避免噴嘴26乾燥。灌注滾筒32係用以使光阻液均勻地經由 嘴嘴26射出。塗佈單元2〇的喷嘴26係位於灌注滾筒32之圓 周面周圍，且一驅動單元（未繪示）係使灌注滾筒32滾動。 由於塗佈單元20的噴嘴26係位於灌注滾筒32的圓周面周 園且維持光阻液的流量，以便於光阻液經由噴嘴26射出。 一般來說，儘管暫停基板G上的塗佈製程，灌注滾筒32仍 使光阻液均勻地從喷嘴26射出，且濕潤器34可避免光阻液 乾涸及黏附於喷嘴26的周圍。當光阻液凝固且黏附於於喷 =26上時，噴嘴26的清潔程序便會被結錢狀的光阻液阻 f，而塊狀的光阻液也會使基板G上的光阻膜的形成不均 勻。 然而，上述之傳統塗佈機9 0所具有的問題會使塗佈製 程的製程效率降低，這是由於每當技單元2Q之基板⑽ ^佈製程完成時’塗佈單元2G必需先返回清潔單元3〇以準 備後續的塗佈製程》 請參照第2圖，其繪示依照第，中傳統塗佈機塗佈數 9 1326618', file: TW4115F moves down and the coating unit 20 moves upward, thus increasing the distance between the coating unit 20 and the substrate G. Then, the substrate G having the photoresist film 1 is removed from the support unit 1 and another substrate to be coated is placed on the support unit 10. When the substrate G having the photoresist film L is removed and another substrate is placed on the support unit 10, the coating unit 2 is returned to the cleaning unit 3A and is prepared for a subsequent coating process on the other substrate. The cleaning unit 30 includes a moisturizer 34 and a priming roller 32. The humidifier 34 is used to wet the nozzle 26 to prevent the nozzle 26 from drying out. The filling roller 32 is used to uniformly discharge the photoresist liquid through the nozzle 26. The nozzles 26 of the coating unit 2 are located around the circumferential surface of the potting drum 32, and a driving unit (not shown) causes the potting drum 32 to roll. Since the nozzle 26 of the coating unit 20 is located on the circumferential surface of the potting cylinder 32 and maintains the flow rate of the photoresist liquid, the photoresist liquid is ejected through the nozzle 26. In general, although the coating process on the substrate G is suspended, the potting roller 32 uniformly causes the photoresist to be ejected from the nozzle 26, and the humidifier 34 prevents the photoresist from drying and adhering around the nozzle 26. When the photoresist is solidified and adhered to the spray=26, the cleaning process of the nozzle 26 is blocked by the photoresist, and the block photoresist also causes the photoresist film on the substrate G. The formation is uneven. However, the above-mentioned conventional coater 90 has a problem that the process efficiency of the coating process is lowered, because the coating unit 2G must first return to the cleaning unit whenever the substrate (10) of the technical unit 2Q is completed. 3〇 to prepare the subsequent coating process》 Please refer to Figure 2, which shows the number of conventional coating machine coating according to the first, 9 1326618

' -File:TW4115F 個基板的塗佈週期之示意圖。塗佈單元20係先藉由清潔單 • =3Q充份地清潔，且順著基板G之緯度方向移動之同時， \光阻f經由噴嘴26噴射至基板G，以形成光阻膜L於基板G 、斤去'光/且膜L完全形成於基板G上時，塗佈單元20返回鄰 • ^撑單元1Q末端的清潔單元3Q，且塗佈單元2G預備於另 行後續塗佈製程。當塗佈單元2Q於清潔單元 、，同時，具有光阻膜L之基板G便從支撐單元彳〇移除 籲亚為後續塗佈製程放置另-基板於支樓單元1〇上。 美献於塗佈製程完成後，塗佈單元20需延著相對於 上執行塗佈製程之製程路徑Α之回返路徑Β返回清 - 的同^30 *塗佈疋件20延著回返路徑Β返回清潔單元30 ’㈣^板H有光阻膜L之基板G則被將被塗佈元件20塗佈 省略因Λ，於塗佈單元2(3返回清潔單元3。之塗佈製程則 佈每-抬來塗佈製程之時間及成本便會增加。由於塗 • 3〇，因此，塗佈單7^2()都需重覆地返回至清潔單元 忿=及成本也會明顯的增加。而塗佈單元2。返回ί .、〇的動作也明顯導致塗佈製程整體的效率降低。 【發明内容】 ••裝置實施例提供一種塗佈裝置，且藉由省略塗佈 者口逼路徑返回，以提昇塗佈裝置之製程效率。 本發明之實施例也提供一種應用上述塗佈裂置之以 1326618'-File: Schematic diagram of the coating cycle of TW4115F substrates. The coating unit 20 is first cleanly cleaned by the cleaning sheet•=3Q, and moves along the latitudinal direction of the substrate G, and the photoresist photoresist f is ejected to the substrate G via the nozzle 26 to form the photoresist film L on the substrate. When G, jin goes to 'light' and the film L is completely formed on the substrate G, the coating unit 20 returns to the cleaning unit 3Q at the end of the adjacent unit 1Q, and the coating unit 2G is prepared for a separate subsequent coating process. When the coating unit 2Q is in the cleaning unit, at the same time, the substrate G having the photoresist film L is removed from the supporting unit, and the substrate is placed on the branch unit 1 for the subsequent coating process. After the coating process is completed, the coating unit 20 is required to extend the return path relative to the process path on which the coating process is performed, and return to the same state. Cleaning unit 30 '(4) ^ board H The substrate G having the photoresist film L is coated with the coating member 20 to omit the coating, and the coating unit 2 (3 returns to the cleaning unit 3. The coating process is cloth-per- The time and cost of lifting the coating process will increase. Due to the coating, the coating sheet 7^2() needs to be returned to the cleaning unit repeatedly = and the cost will increase significantly. Cloth unit 2. The action of returning ί., 〇 also obviously leads to a decrease in the overall efficiency of the coating process. [Invention] The device embodiment provides a coating device, and by omitting the applicator's mouth to force the path back, Improving the process efficiency of the coating device. Embodiments of the present invention also provide an application of the above coating cracking to 1326618

'* File:TW4115F 塗佈溶液塗佈基板之方法。 根據本發明之第一方面，提出―種塗 裝置係用以將一塗佈溶液塗 ’此塗佈 一士诗口— a 基板上。塗佈裝詈白虹 署早7G、-塗佈單元及—清潔單元 使基板穩固。塗佈單^係藉由提供塗佈以 =衣知於基板上’以形成—塗佈層於基板上二塗 用以清潔㈣單元於塗佈單元執行塗㈣程前係 兀包括-第-清潔部件及—第二清料件 :潔早 係鄰近設置於支撐單元之m 潔部件 近!置於支樓單元之-第二端部，當塗鄰 佈早讀'由第一清潔部件移動至第二清潔部件，塗 清潔部件移動至第一清潔部件。 卉由第二 -實施例中，基板包括用以做為顯示面 以及做為半導體裝置之半導體基板。塗佈 ^板破螭 體、-排出部及-補給線。本體具有—内部括—本 空間係用以儲存塗佈溶液。排出部係面向基且内部 補給線係用以提供塗佈溶液，且塗佈單元係:表面。 供本體，且經由排出部排出塗佈溶液至基板。本^線提 錐形部，錐形部係位於鄰近基板之表面的—端义括- 邛係位於本體的錐形部上。排出部的外型例如^ 乂排出 縫，且其長度實質上係與基板之寬度相等。 長狹 於本實施例中，第一清潔部件包括一第一 了濕潤部。第-均勻部係鄰近於支撐單元的第—二部及第 以維持從排出部排出之塗佈溶液之流量均勻。，且用 弟一濕潤部 11 1326618'* File: TW4115F Method of coating a substrate with a coating solution. According to a first aspect of the invention, a coating apparatus is proposed for coating a coating solution onto a substrate. The coating is installed in the 7G, the coating unit and the cleaning unit to stabilize the substrate. The coating system is formed by applying a coating to the substrate to form a coating layer on the substrate for cleaning (4). The unit is applied to the coating unit to perform a coating process. The component and the second clearing material: the early cleaning system is adjacent to the m-cleaning component disposed near the supporting unit; placed at the second end of the branch unit, when the adjacent cloth is read early, the first cleaning component moves to the first The cleaning component moves to the first cleaning component. In the second embodiment, the substrate includes a semiconductor substrate for use as a display surface and as a semiconductor device. The coating plate breaks the body, the discharge portion, and the supply line. The body has an internal cavity to store the coating solution. The discharge portion is oriented toward the base and the internal supply line is used to provide a coating solution, and the coating unit is a surface. The body is supplied, and the coating solution is discharged to the substrate via the discharge portion. The wire is provided with a tapered portion, and the tapered portion is located on the surface of the adjacent substrate, and the end of the wire is located on the tapered portion of the body. The outer shape of the discharge portion is, for example, a discharge slit, and its length is substantially equal to the width of the substrate. In the present embodiment, the first cleaning member includes a first wet portion. The first uniform portion is adjacent to the second portion of the support unit and is configured to maintain a uniform flow rate of the coating solution discharged from the discharge portion. And use the younger one wet part 11 1326618

I File:TW4115F 係鄰近於第一均勻部且用以濕潤塗佈單元以避免清潔單 . 元乾涸。第二清潔部件包括包栝一第二均勻部及第二濕潤 部。第二均勻部係鄰近於支撐單元的第二端’且用以維持 '從排出部排出之塗佈溶液之流量均勻。第二潤部係鄰近於 • 第二均勻部且用以濕潤塗佈單元以避免清潔單元乾涸。第 均勻部及第二均勻部分別包括一灌注滾筒系統，且灌注 滾筒系統包括一滾筒及一外箱。滾筒係以一外部電源驅 動。外箱係用以支撐滾筒。第_均勻部及第二均勻部係分 • 別包括一清潔液，且清潔液係儲存於外箱，並於外箱中清 潔滾筒。 依據本發明第二方向，提出一種應用上述塗佈裝置以 塗佈溶液之塗佈基板方法。塗佈基板之方法下列包括方 - 法。提供一第一基板於一支撐單元上，且執行一第一塗佈 製程於第一基板之一表面上，第一塗佈製程係藉由從一塗 佈單元所排出之一塗佈溶液由支撐單元之一第—端部延 籲 著一第一方向至支撐單元之一第二端部，同時具有塗佈溶 液之塗佈單元係延著第一方向於第一基板上移動。然後， 以第二基板置換第一基板’係藉由移除支撐單元之第—基 板且&供第二基板至支撐元件上。執行一第二塗佈製裎於 第二基板之一表面上，第二塗佈製程係藉由從塗佈單元所 - 排出之塗佈溶液由支撐單元之第二端部延著一第二方白 至支標單元之第一端部，同時具有塗佈溶液之塗佈單元係 • 延著第二方向於第二基板上移動。 於本實施例中’於提供第一基板及第二基板之步驟中 12 1326618I File: TW4115F is adjacent to the first uniform portion and is used to wet the coating unit to avoid cleaning. The second cleaning member includes a second uniform portion and a second wet portion. The second uniform portion is adjacent to the second end ' of the support unit and serves to maintain a uniform flow of the coating solution discharged from the discharge portion. The second moist portion is adjacent to the second uniform portion and serves to wet the coating unit to prevent the cleaning unit from drying out. The first uniform portion and the second uniform portion each include a filling drum system, and the filling drum system includes a drum and an outer box. The rollers are driven by an external power source. The outer box is used to support the drum. The first uniform portion and the second uniform portion are divided into a cleaning liquid, and the cleaning liquid is stored in the outer box, and the drum is cleaned in the outer box. According to a second aspect of the present invention, a method of coating a substrate using the above coating apparatus to coat a solution is proposed. The method of coating the substrate includes the following method. Providing a first substrate on a supporting unit, and performing a first coating process on a surface of the first substrate, the first coating process being supported by one coating solution discharged from a coating unit One of the first ends of the unit extends a first direction to a second end of the support unit, and the coating unit having the coating solution moves on the first substrate along the first direction. Then, the first substrate is replaced by the second substrate by removing the first substrate of the supporting unit and & supplying the second substrate to the supporting member. Performing a second coating process on one surface of the second substrate, the second coating process is performed by the second end of the support unit by a coating solution discharged from the coating unit The white to the first end of the sizing unit, and the coating unit having the coating solution, moves along the second direction on the second substrate. In the present embodiment, in the step of providing the first substrate and the second substrate 12 1326618

File:TW4115F —钳夾盤穩固基板於支撐單元之—表 淮供；^Λ、·^例中’第—塗佈製程更於—第—清潔單元中 1_ 塗佈製程於第一基板上執行前，其中第一清潔 早兀係鄰近於月冰 一第-、主、切m 早兀之該第一端部。第二塗佈製程更於 :一：：：元中準備並於第二塗佈製程於第 仃別’其中第二渣、％ οσ - 羽1 此外，在準備第早兀係鄰近於支撐單元之第二端部。 各自控制由i佈；及第二塗佈製程之步驟中包括 溶液均勻。另外㈣ 佈溶液的流量以使塗佈 且準備第-塗饰=佈溶液之流量均句之步驟前， -清潔部件及第塗佈製程之步驟更包括於第 佈單元。卩件其中之一提供塗佈溶液至塗 括定===塗佈溶液的流量均勻的步驟包 潔部件各自之一均勻邻錢近第一清潔部件及第二清 以使塗佈溶液由清潔；件容液係經由排出部排出， 之均勻部，以便塗#句勻邛上流出。滾動清潔部件 上，以維持於塗佈單元之 丨之表面 勻。 纟出部所流出塗佈溶液之流量均 於本實施例中，均勻却 外部電源以一固定逮定=包括一滾筒’其中滾筒係藉由 支榜單元之-中心線:::第=件之第-端部係依據 依據本發明之實施例，第一清潔部件及第二清潔部件 13 1326618File: TW4115F —The clamping plate stabilizes the substrate on the support unit—the table is provided in the ^^, ^^ example, the 'coating process is more than the first—the cleaning unit 1_ before the coating process is performed on the first substrate , wherein the first clean early sputum is adjacent to the first end of the moon ice-first, the main, and the cut m early. The second coating process is further prepared in: a::: element and in the second coating process in the second part of the second slag, % οσ - feather 1 In addition, in preparation for the early tethering system adjacent to the support unit Second end. Each of the controls is controlled by the i cloth; and the second coating process includes a uniform solution. Further, (4) the flow rate of the cloth solution is such that the steps of coating and preparing the flow rate of the first coating-cloth solution are the steps of - the cleaning member and the coating process are further included in the fourth unit. One of the components provides a coating solution to the coating === the flow rate of the coating solution is uniform. Each of the cleaning components is uniformly adjacent to the first cleaning member and the second cleaning to clean the coating solution; The volume of the liquid is discharged through the discharge portion, and the uniform portion is discharged so as to be coated. Roll the cleaning parts to maintain the surface of the coating unit. The flow rate of the coating solution flowing out of the crotch portion is in this embodiment, but the external power source is arrested by a fixed amount = including a roller 'where the roller is supported by the column unit - center line::: The first end portion is in accordance with an embodiment of the present invention, the first cleaning member and the second cleaning member 13 1326618

Kile:TW4115F 係位於基板之鄰近兩端，且相互對立。塗佈單元係從第一 清潔部件延著第一路徑移動到第二清潔部件，以執行第一 基板上之第一塗佈製程。塗佈單元係從第二清潔部件延著 第二路徑移動至第一清潔部件，以執行第二基板上之第二 塗佈製程。因此，塗佈製程的時間及成本係可明顯的降低。 為讓本發明之上述内容能更明顯易懂，下文特舉一較 佳實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 本發明參照附加圖示於下文的描述會更為完整，本發 明之實施例係繪示於圖示中。然而，本發明可能以許多不 同型態實施且不應受限於所提出之實施例。更明確地說， 這些提出來的實施例使本發明更為周密且完整，並更徹底 傳達本發明的範疇給所屬技術領域之通常知識者。圖示中 尺寸、各層的相對尺寸及區域係為明確表達而稍為放大。 需瞭解的是，當一元件或層係被指為”位於”、”連 接至”或”耦接至”另一元件上時，可以代表所指元件直 接位於、連接或耦接於另一元件上，或是可能中間存有別 的元件或層。相對的，當一元件被指為”直接位”、”直 接連接”或”直接耦接”於另一元件或層上時，則代表其 間就並沒有別的元件或層存在。全文中相同的標號代表相 同的元件。此處所使用的”及/或”包括所列出的項目其中 之一個或多個項目之組合中的任何一種組合以及全部組 合。 14 1^20018Kile: The TW4115F is located at the adjacent ends of the substrate and is opposite each other. The coating unit moves from the first cleaning member to the second cleaning member along the first path to perform a first coating process on the first substrate. The coating unit is moved from the second cleaning member to the first cleaning member along the second path to perform a second coating process on the second substrate. Therefore, the time and cost of the coating process can be significantly reduced. In order to make the above description of the present invention more comprehensible, the following description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] The present invention will be further described with reference to the accompanying drawings. For the sake of completeness, embodiments of the invention are illustrated in the drawings. However, the invention may be embodied in many different forms and should not be limited to the embodiments presented. More specifically, the present embodiments are intended to be more thorough and complete, and to convey the scope of the present invention to those of ordinary skill in the art. The dimensions, relative sizes and regions of the layers in the figures are slightly enlarged for clarity. It will be understood that when an element or layer is referred to as "directly," "connected to" or "coupled to" another element, it can mean that the element is directly located, connected, or coupled to another element. There are or may be other components or layers in between. In contrast, when an element is referred to as "directly", "directly connected" or "directly coupled" to another element or layer, there is no element or layer in between. The same reference numerals in the full text represent the same elements. "and/or" as used herein includes any and all combinations of combinations of one or more of the listed items. 14 1^20018

* Mle:TW4115F — 本發明在此所述之實施例之剖面圖係為本發明理想 二％例的描繪示意。因此，例如因為製造技術及/或誤差所 ‘致开^狀上的改變，是可以預期的。因此，本發明之實施 例不應被認為限定於在此描繪區域的特定形狀，而是包括 例如生產導致的形狀。例如，—描繪或描述為平坦之區 域，具有粗糙及/或非線性的特徵。此外，描繪之銳角可能 會鈍=。因此，圖示中描繪之區域係為特性之示意，而且 並不思圖描繪出一區域的精確形狀，形狀也不意圖用以 定本發明範嘴。 、 }除非另外定義，所有在此使用之用語（包括技術及科 ^用)係與熟習本發明所屬之技術領域者所瞭解之通常 =義相同。需要進—步瞭解的是，—般字典所定義的用 浯，應被解讀為與相關領域之文章及本揭露内容一致之意 義，並不會解讀為過度理想或過度正式的形式，除非在^ 有明確的定義。 月第3圖，其鳍示依照本發明一較佳實施例之塗 佈裝置之架構示意圖。依照本發明之較佳實補之塗佈裝 置900包括一支撐單元1〇〇、一塗佈單元2〇〇及一清潔^ 元300。一欲塗佈之基板G係位於支撐單元1〇〇上。塗佈* Mle: TW4115F - A cross-sectional view of an embodiment of the invention described herein is a schematic representation of an ideal example of the invention. Thus, for example, changes in manufacturing techniques and/or errors can be expected. Thus, embodiments of the invention should not be considered limited to the particular shapes of the regions depicted herein. For example, a region that is depicted or described as flat with coarse and/or non-linear features. In addition, the sharp angles depicted may be blunt =. Therefore, the regions depicted in the figures are illustrative of the nature and are not intended to depict the precise shape of the region, and the shapes are not intended to be used in the invention. The terms used herein, including the technical and scientific terms, are the same as commonly understood by those skilled in the art to which the invention pertains, unless otherwise defined. What needs to be further understood is that the use of the dictionary defined by the general dictionary should be interpreted as meaning consistent with the articles in the relevant field and the contents of this disclosure, and will not be interpreted as an excessively ideal or overly formal form, except in ^ There is a clear definition. FIG. 3 is a schematic view showing the structure of a coating apparatus according to a preferred embodiment of the present invention. The coating device 900 according to the preferred embodiment of the present invention comprises a support unit 1A, a coating unit 2A, and a cleaning unit 300. A substrate G to be coated is located on the support unit 1A. Coating

單元200係延著基板G移動並提供塗佈溶液D於基板G 之表面上1潔單元期係用以於完成塗佈製程後清潔塗 佈單元_，且同時間塗佈單元細係準備另—基板 之塗佈製程。 、 支撐單元1GQ包括-平板，以及基板G係穩固於支 16The unit 200 is moved along the substrate G and provides a coating solution D on the surface of the substrate G. The cleaning unit is used to clean the coating unit after the coating process is completed, and at the same time, the coating unit is carefully prepared. The coating process of the substrate. The support unit 1GQ includes a flat plate, and the substrate G is fixed to the support 16

R'le:TW4115F 義柘早位寬度…排出至基板°。因此， 基板G的整個表面係可被塗佈溶液D所塗佈。 3ΐ〇ΓΛ實施Γ中，清潔單元獅包括一第一清潔部件 支巧單_ 1η"7潔部件320 °第一清潔部件310係鄰近於 於二二- j的第一端部11〇。第二清潔部件320係鄰近 牙早70 100的第二端部120。 第-清潔部件310包括一第一均勾部312及 =部314。第—羽部312係鄰近於支撑單元100的第 广的：1 二且用;維持經由排出部 319 句勻。第一濕潤部314係鄰近於第一均勻部 第且塗佈單元咖以避免清潔單元3〇〇的乾 網二：ΓΓ2。包括一第二均勾部322及-第二濕 ㈣彻部322係鄰近於支撐單元_的第一 的产旦二用以維持經由排出部260所排出塗佈溶液D 机里：自。第二濕潤部324係鄰近於第二均勻部奶， 用^濕潤塗佈單元2⑻以避免清潔單元細的乾燥。 第-濕潤部314及第二濕潤部324係控制塗佈單元 =排出，〇周圍的濕潤’以避免排出部26〇乾酒， ‘ 2eol早7"12〇 1係準備進行基板G的塗佈製程。當排出 部260周^二^排出部260排出的塗佈溶液D於排出 的塗佈溶液二結塊且：著於排出部260上。由於塊狀 封 曰使塗佈單元200的排出部260變成密 .因此’乾涸的排出部26〇會引起提供給基板G塗稀溶 1326618R'le: TW4115F The width of the early position is discharged to the substrate °. Therefore, the entire surface of the substrate G can be coated with the coating solution D. In the third embodiment, the cleaning unit lion includes a first cleaning member. The first cleaning member 310 is adjacent to the first end portion 11 of the second-j. The second cleaning component 320 is adjacent the second end 120 of the tooth 70 100. The first cleaning member 310 includes a first uniform hook portion 312 and a = portion 314. The first plume 312 is adjacent to the first of the support unit 100: 1 and is used; it is maintained uniformly via the discharge portion 319. The first wetted portion 314 is adjacent to the first uniform portion and coated with the unit to avoid the dry web 2: ΓΓ2 of the cleaning unit 3〇〇. The second uniform hook portion 322 and the second wet (four) portion 322 are adjacent to the first one of the support unit _ for maintaining the coating solution D discharged from the discharge portion 260. The second wetted portion 324 is adjacent to the second uniform portion of milk, and the coating unit 2 (8) is wetted to avoid fine drying of the cleaning unit. The first wetted portion 314 and the second wetted portion 324 control the coating unit = discharge, and the wetting around the crucible 'to avoid the discharge portion 26 from drying the wine, ' 2eol early 7 " 12〇1 is prepared for the coating process of the substrate G . The coating solution D discharged from the discharge portion 260 and the discharge portion 260 is agglomerated on the discharged coating solution 2 and is placed on the discharge portion 260. Since the block seal 420 causes the discharge portion 260 of the coating unit 200 to become dense, the dry discharge portion 26 引起 causes the substrate G to be diluted. 1326618

• Rle:TW4115F 2不均勻’而使於基板Gji形成的光阻層L的厚 .佈製程期間，第—賴部314及第二濕潤 • = 324係可有效地避免排出部26Q乾酒，以 的光阻層L的均勻化。 & • 於本實施财，支撐單it _的第—端部m 二r::20係也支撐單元100之中心線互相對立，因此ί π潔。Η牛310及第二清潔部件32〇 之中4互相對立。 、於本實施财，第—均勻部312及第二均0 322 为別包括一灌注滾筒系統， ㈠、-外箱|及-清潔液。。、上:糸統包括一滾筒 _ ' /袞同Η係以一外部電诉γ去給 示）驅動。外箱丨係心支撐㈣H。清潔液 箱丨並於外箱丨中清潔滾筒Η。 倾存於外 ηίΓί之通常知識者必需注意的為外箱1係僅需包含 j同Η心潔液c並不局限外们於任何外型 的上端係部份暴露於外箱丨的上端。 袞同Η 泣Φ二*參，第4圖’其緣示經由從灌注滾筒上方之排出部 二凸意圖。滾筒Η的上部係從外箱，的二 1部係浸於外箱丨的清中。 二旋轉時，從排出部 徘出之塗佈浴液D係延著滚筒H的旋 滚筒Η周圍的表面，如此便可 至 26〇下累積。因此，塗佈溶液 =於排出部 ‘體攸排出部260排出。此外，滾筒Η之局部:浸 20 1326618• Rle: TW4115F 2 is uneven 'the thickness of the photoresist layer L formed on the substrate Gji. During the cloth manufacturing process, the first portion 314 and the second wet • = 324 system can effectively prevent the discharge portion 26Q from drying the wine. Homogenization of the photoresist layer L. & • In this implementation, the first end of the support unit it _ m two r:: 20 system also supports the center line of the unit 100 opposite each other, so ί π clean. 4 of the yak 310 and the second cleaning member 32 互相 are opposite each other. In the present implementation, the first uniform portion 312 and the second average portion 0 322 include a filling cylinder system, (1), an outer box, and a cleaning liquid. .上上: The 包括 system includes a roller _ ' / / 衮 以 is driven by an external electric γ ) ). The outer box is supported by the heart (4) H. Clean the tank and clean the drum 于 in the outer box. The general knowledge of ηίΓί must be noted that the outer box 1 system only needs to contain j. The core is not limited to the upper end of any outer shape exposed to the upper end of the outer box.衮 Η Φ Φ 二 * 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 其 其 其 其The upper part of the drum cymbal is immersed in the clear of the outer box from the outer box. At the time of the second rotation, the coating bath D which is ejected from the discharge portion is extended by the surface around the reel drum of the drum H, so that it can be accumulated up to 26 Torr. Therefore, the coating solution = is discharged to the discharge portion "body discharge portion 260". In addition, the part of the drum Η: dip 20 1326618

.File:TW4115F C中’因此滾筒H的每次旋轉可藉由清潔液C /月屬展同Η的週圍表面。 -她田第—清潔部件310清潔塗佈單元200時，塗佈單.File: TW4115F C 'So every rotation of the drum H can be achieved by the cleaning liquid C / month. - Her field - cleaning unit 310 when cleaning the coating unit 200, coating sheet

溶液D。然後，塗佈單元2。。係延著= 排中二清潔部件⑽，且塗佈溶液D係由排出部咖 夕具^才反G的表面。由於塗佈單元200的排出部260 上二f對應於基板G的寬度w，所以只要藉由基板G 66笛-2〇0從第一清潔部件31◦至第二清潔部件320 、。冬-人移動就可以塗佈溶液D塗佈基板G的整個表 二:基板G上的塗佈製程完成時’塗佈單元2〇〇係位於 絮部件320之上方，且於同一塗佈裝置900上形成 。佈：的基板G則被另一欲被塗佈的基板置換。也就是 切單％彻上移除具有塗佈層的基板G，另再以 聲早7L 100承載而另一欲被塗佈的基板。於以另一基板 置換基板G之期間’提供塗佈溶液D給塗佈單元200於 2清潔部件320中。於第二清潔部件32〇清潔塗佈單元 =後’塗佈料200於另—基板上方從第二清潔部件 320移動至第—清潔部件⑽，域佈溶液d經由排 2的排出至另-基板的表面以於另一基板上形成另一塗佈 層。 、因此，本實施例之塗佈裝置_則不需要從塗佈單元 返回β潔單元之無塗佈製程的返回路徑，且每當塗佈單元 於基板相對的三端移動時塗佈製程係會於基板上執行。所 以’基板上的塗佈製程的時間及成本係明顯地降低，且充 21 1326618Solution D. Then, the unit 2 is coated. . The system is extended = the second cleaning member (10), and the coating solution D is the surface of the discharge unit that is opposite to G. Since the second f on the discharge portion 260 of the coating unit 200 corresponds to the width w of the substrate G, it is only required to pass from the first cleaning member 31 to the second cleaning member 320 by the substrate G 66. The winter-human movement can apply the solution D to coat the entire substrate G of the substrate G: when the coating process on the substrate G is completed, the coating unit 2 is located above the floc member 320, and is in the same coating device 900. Formed on. The substrate G of the cloth is replaced by another substrate to be coated. That is, the substrate G having the coating layer is removed by the singulation, and the substrate to be coated is again carried by the sound 7L 100. The coating solution D is supplied to the coating unit 200 in the cleaning member 320 during the period in which the substrate G is replaced with another substrate. After the second cleaning member 32 is cleaned by the coating unit = after the coating material 200 is moved from the second cleaning member 320 to the first cleaning member (10) over the other substrate, the discharge of the domain cloth solution d through the row 2 to the other substrate The surface is such that another coating layer is formed on the other substrate. Therefore, the coating device of the present embodiment does not need to return from the coating unit to the return path of the coating unit without the coating process, and the coating process will be applied whenever the coating unit moves at the opposite three ends of the substrate. Performed on the substrate. Therefore, the time and cost of the coating process on the substrate are significantly reduced, and the charge is 21 1326618

» Pile:TW4115F 份地促進塗佈製程的製程效率。 接著’下文係以第3圖至第6圖說明應用本實施例之 塗佈裝置900之基板塗佈製程。第5崎示依據本發明較 佳實施例中以塗佈溶液塗佈基板之方法流程圖。第6圖繪 示依照本發明較佳實施例之第5圖+準備塗饰製程步驟^ 流程圖。 請參照第3圖至第6圖。如步驟S_，以支撐翠元 100之上表面承載欲被塗佈之第—基板。第—基板例如以 真空吸取或鉗夾盤穩固於支撐單元1〇〇的上表面。 然後，如步驟S200,塗佈單元2〇〇係位於第一 部細’且準備於第-基板上的第—塗佈製程。舉麻說: 如第6圖之步驟S210所示，塗佈溶液D係經由補給線24〇 提供給本體22〇的内部空間，以及排出部 :件Γ 〇處避免乾涵。於本實施例中，排出部260係； 部件31〇之第一濕潤部314保咖‘ = : 至本體220的内部空間時，於本步： f旦;、同㈠之滾動控制經由排出部260之塗佈 洛液D之流置均勻〇也就早炎 9nn —丄 就疋為了第一塗佈製程，塗佈單亓 2〇〇猎由維持塗佈溶液D的流 中準備。 匕里岣勺於第一清潔部件31〇» Pile: TW4115F promotes the process efficiency of the coating process. Next, the substrate coating process to which the coating apparatus 900 of the present embodiment is applied will be described below with reference to Figs. 3 to 6 . Fig. 5 is a flow chart showing a method of coating a substrate with a coating solution in accordance with a preferred embodiment of the present invention. Figure 6 is a flow chart showing the fifth step of the preferred embodiment of the present invention. Please refer to Figures 3 to 6. In step S_, the upper surface of the support element Cui 100 carries the first substrate to be coated. The first substrate is secured to the upper surface of the support unit 1〇〇, for example, by vacuum suction or clamping. Then, in step S200, the coating unit 2 is placed on the first portion and is prepared on the first substrate. As a result, as shown in step S210 of Fig. 6, the coating solution D is supplied to the inner space of the main body 22 through the supply line 24, and the discharge portion is prevented from being dried. In the present embodiment, the discharge portion 260 is the first wet portion 314 of the member 31 保 ' ' ' = : to the internal space of the body 220, in this step: f;; the same (a) rolling control via the discharge portion 260 The application of the coating solution D is evenly distributed, and the aging is 9 nn. 丄 丄 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 第一 第一 第一 第一 第一 第一 第一匕 岣 in the first cleaning unit 31〇

於本實施例中’塗佈溶液D 系統控制均勻。經由排出部26Q排出 袞動 近灌注滚筒係統的滾筒H。， 佈洛液D到達接 方向R旋㈣，簡㈣26 闕錢轉 梆出之塗佈溶液0係延著 22 1326618In the present embodiment, the coating solution D system was controlled uniformly. The drum H that swells near the perfusion drum system is discharged via the discharge portion 26Q. , Bulu liquid D reaches the direction of R rotation (four), Jane (four) 26 money transfer 梆 out of the coating solution 0 is extended 22 1326618

^ Rile:TW4115F 滾筒Η的旋轉方❹流至滾 避免塗佈溶液D於排以卩26Q下^的表面’如此便可 此外，滾筒Η之局广體從排*部26。排出。 的每次旋轉可藉由二C中’因此滾筒Η 们猎由L液C清潔滾筒Η的週圍表面。 然後’如步驟S3〇q，塗佈單元咖延著第一 ㈣4板上移動，並按照—單 出部260排出沴佑、於、，产〇 、& 弟丞板從排^ Rile: TW4115F The rotation of the drum ❹ flows to the roll. Avoid the coating solution D on the surface of the 卩26Q. So, the drum Η 广 广 广 广. discharge. Each rotation of the cylinder can be cleaned by the second liquid in the second C. Then, as in step S3〇q, the coating unit is moved along the first (four) 4 plate, and discharged according to the single-part 260, 沴, 、, 〇, &

姑 ^ / 合液〇，以執行第一塗佈製程於第一基 以ml、、帛&板的整個表面係被塗佈溶液D所塗佈 制如—塗佈層於第—基板上。塗佈單元雇的移動係 一第一驅動器(未緣示)控制，且第-驅動器連接至 塗佈早το 200的本體220，以及一控制單元（未繪示）連接 至第-驅動器。當排出部26〇的長度實質上係與第一基板 之寬度w相等時，僅藉由延著第一方向£的第一基板之移 動整個第一基板的表面即充分被塗佈溶液0塗佈。 於第一塗佈製程完成後’塗佈單元2〇〇係位於第二清 潔部件320，且第二塗佈製程係於第二清潔部件320準 備’其中第二清潔部件320係鄰近支撐單元1 〇〇之第二端 120。於步驟S400中’以欲塗佈的第二基板置換具有第 一塗佈層之第一基板，同時間於第二清潔部件320中準備 於第二基板上之第二塗佈製程。也就是說，從支撐單元100 上移除完成第一塗佈製程之第一基板，且欲執行第二塗佈 製程的第二基板係承載於支撐單元1〇〇上。 第二塗佈製程的準備實質上係與第一塗佈製程相 23 1326618The liquid coating is applied to the first substrate in a first coating process, and the entire surface of the ml, 帛 & plate is coated with a coating solution D such as a coating layer on the first substrate. The movement employed by the coating unit is controlled by a first actuator (not shown), and the first actuator is coupled to the body 220 coated early, and a control unit (not shown) is coupled to the first actuator. When the length of the discharge portion 26 is substantially equal to the width w of the first substrate, only the surface of the first substrate, which is moved by the first substrate extending in the first direction, is sufficiently coated with the coating solution 0. . After the first coating process is completed, the coating unit 2 is located in the second cleaning member 320, and the second coating process is prepared in the second cleaning member 320. The second cleaning member 320 is adjacent to the supporting unit 1 The second end 120 of the crucible. In step S400, the first substrate having the first coating layer is replaced with the second substrate to be coated, and the second coating process is prepared on the second substrate in the second cleaning member 320. That is, the first substrate on which the first coating process is completed is removed from the support unit 100, and the second substrate on which the second coating process is to be performed is carried on the support unit 1A. The preparation of the second coating process is substantially the same as the first coating process 23 1326618

File:TW4115F 同，除了第二塗佈製程係準備於第二清潔部件32〇外，因 此則省略準備第二清潔部件320的進一步描述。因此，在 準備第一塗佈製程時提供塗佈溶液〇至塗佈單元2〇〇之本 體220之步驟亦可省略。也就是說，塗佈單元2〇〇的本體 220的塗佈溶液D提供可同時於第一清潔部件Μ 〇及第二 清潔部件320或亦可僅提供於任選兩者其中之一。 然後，如步驟S500，塗佈單元2〇〇延著相對於第一File: TW4115F Same as that, except that the second coating process is prepared for the second cleaning member 32, the further description of preparing the second cleaning member 320 is omitted. Therefore, the step of providing the coating solution 〇 to the body 220 of the coating unit 2 at the time of preparing the first coating process may also be omitted. That is, the coating solution D of the body 220 of the coating unit 2 is provided simultaneously with the first cleaning member 第二 and the second cleaning member 320 or may be provided only by one of either. Then, in step S500, the coating unit 2 is extended relative to the first

方=E之第二方向F於第二基板上移動，並依據第二基板 的單位寬度從排出部260排出塗佈溶液D，而使第二塗佈 製程於第二基板上執行。如此’第二基板的整個表面係被 塗佈溶液D所塗佈以形成第二塗佈層於第二基板上。第二 基板上的第二塗佈製程實質上係與第一基板上的第一塗 佈製程相同，所以便不加以贅述進一步的第二塗佈製程。 因此，本實施例之塗佈裂置9〇〇亦可以以相反方向執 行’即指第4向E及第二方向^者顛倒。於本發明之 實施例之塗佈裝置麵則不再需要額㈣間，來使塗佈單 凡返回清料元卻沒有進行任何的塗佈製程於基板上。如 此一來’便能使本發明之塗佈製程的製程效率較f知塗伟 機提高大約50%。 依據本發明所揭露之實施例，係藉由設置一對清潔部 =於欲塗佈基板相對的兩端，每當塗佈單元延著清潔部件 曰之基板移動時’則執行塗佈製程係於基板上。因此，塗 佈早元則不再需要㈣清潔部件，且在塗佈單元正常返回 24 1326618The second direction F of the square = E is moved on the second substrate, and the coating solution D is discharged from the discharge portion 260 in accordance with the unit width of the second substrate, and the second coating process is performed on the second substrate. Thus, the entire surface of the second substrate is coated with the coating solution D to form a second coating layer on the second substrate. The second coating process on the second substrate is substantially the same as the first coating process on the first substrate, so that a further second coating process will not be described. Therefore, the coating cleavage 9 of the present embodiment can also be performed in the opposite direction, i.e., the fourth direction E and the second direction are reversed. In the coating apparatus of the embodiment of the present invention, the amount (4) is no longer required, so that the coating unit returns to the cleaning unit without performing any coating process on the substrate. As a result, the process efficiency of the coating process of the present invention can be improved by about 50%. According to the embodiment of the present invention, by providing a pair of cleaning portions = at opposite ends of the substrate to be coated, each time the coating unit moves along the substrate of the cleaning member ', the coating process is performed. On the substrate. Therefore, the coating early element no longer needs (4) cleaning parts, and the coating unit returns normally 24 1326618

File:TW4115F 期間，也能於時間内執行塗佈製程。所以，用以塗佈製程 的塗佈時間係可減少亦可促進塗佈製程的製程效率。 綜上所述，雖然本發明已以一較佳實施例揭露如上， 然其並非用以限定本發明。本發明所屬技術領域中具有通 常知識者，在不脫離本發明之精神和範圍内，當可作各種 之更動與潤飾。因此，本發明之保護範圍當視後附之申請 專利範圍所界定者為準。File: TW4115F can also perform the coating process in time. Therefore, the coating time for the coating process can reduce the process efficiency which can also promote the coating process. In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

25 132661825 1326618

* F1le:TW4115F 【圖式簡單說明】 • 第1圖繪示一種塗佈光阻於基板之傳統塗佈機之示 . 意圖， 第2圖繪示依照第1圖中傳統塗佈機塗佈數個基板的 - 塗佈週期之示意圖； 第3圖繪示依照本發明一較佳實施例之塗佈裝置之 架構不意圖， 第4圖繪示經由從灌注滾筒上方之排出部流出塗佈 ® 溶液之示意圖； 第5圖繪示依據本發明較佳實施例中以塗佈溶液塗 佈基板之方法流程圖；以及 第6圖繪示依照本發明較佳實施例之第5圖中準備塗 佈製程步驟之流程圖。 【主要元件符號說明】 A ： 製程路徑 B ： 返路徑 C ： 清潔液 D ： 塗佈溶液 E ： 第一方向 F : 第二方向 G : 基板 Η ： 滾筒 I :外箱 26 1326618* F1le: TW4115F [Simple description of the diagram] • Figure 1 shows a conventional coating machine for coating photoresist on a substrate. Intention, Figure 2 shows the number of coatings in the conventional coating machine according to Figure 1. Schematic diagram of the substrate-coating cycle; FIG. 3 is a schematic view showing the structure of the coating device according to a preferred embodiment of the present invention, and FIG. 4 is a view showing the flow of the coating solution through the discharge portion from above the filling drum. FIG. 5 is a flow chart showing a method of coating a substrate with a coating solution according to a preferred embodiment of the present invention; and FIG. 6 is a view showing a coating process in FIG. 5 according to a preferred embodiment of the present invention. Flow chart of the steps. [Description of main component symbols] A : Process path B : Return path C : Cleaning solution D : Coating solution E : First direction F : Second direction G : Substrate Η : Roller I : Outer box 26 1326618

File:TW4115FFile:TW4115F

L :光阻膜 R:旋轉方向 w :寬度 10、 100 :支撐單元 20、 200 :塗佈單元 30、 300 :清潔單元 32 : 灌注滾筒 34 : 濕潤器 26 : 喷嘴 90 : 傳統塗佈機 110 :第一端部 120 :第二端部 220 :本體 240 :補給線 260 :排出部 310 :第一清潔部件 312 :第一均勻部 314 :第一濕潤部 320 :第二清潔部件 322 :第二均勻部 324 :第二濕潤部 900 :塗佈裝置 27L: photoresist film R: rotation direction w: width 10, 100: support unit 20, 200: coating unit 30, 300: cleaning unit 32: filling drum 34: humidifier 26: nozzle 90: conventional coater 110: First end portion 120: second end portion 220: body 240: supply line 260: discharge portion 310: first cleaning member 312: first uniform portion 314: first wet portion 320: second cleaning member 322: second uniform portion 324: second wet portion 900: coating device 27

Claims (1)

1326618 * Pile:TW4115F 十、申請專利範圍： 1.種塗佈裝置，用以將一塗佈溶液塗佈於一基 板，該塗佈裝置包括： 一支撐單元，用以穩固該基板；以及 、一塗佈單元，係藉由提供該塗料於該基板上，並執行 一塗佈製程於該基板上，以使該塗佈單元於該基板上形成 一塗佈層；1326618 * Pile: TW4115F X. Patent Application Range: 1. A coating device for coating a coating solution on a substrate, the coating device comprising: a supporting unit for stabilizing the substrate; and a coating unit is provided on the substrate by providing the coating, and performing a coating process on the substrate, so that the coating unit forms a coating layer on the substrate; -清潔單元’係用以清潔塗佈單元於該塗佈單元執行 該塗佈製程前，且該清潔單元包括： 端部；及 第-清潔部件’_心該支擇單六 7L之一第 第二清潔部件 ，係鄰近於該支m 二端部，且該塗佈製程執行時，該塗佈單元之一第 潔部件移動至該第二清潔部件’再由該係由該第一清 至該第一清潔部件。 /〜凊潔部件移動- a cleaning unit is used to clean the coating unit before the coating unit performs the coating process, and the cleaning unit comprises: an end portion; and a first cleaning member '_ heart of the selection order six 7L one a cleaning component adjacent to the two ends of the branch, and when the coating process is performed, one of the coating units moves to the second cleaning component, and then the first clearing First cleaning component. / ~ chaste parts moving 基板包括 2.如申請專利範圍第彳項所述 A括： 孟佈巢 置，其中該 一玻璃平板，用以做為一顯示面板 、 一半導體基板。 〜半導體裝置之 3.如申請專利範圍第彳項所述 塗佈單元包括： 盒伟袭置，其中該 一本體，具有一内部空間，且 該塗佈溶液； <間係用以铸存 一排出部，係面對該基板之一 衣命’ β及 28 1326618 File:TW4115F 一補給線，用以提供該塗佈溶液，且該塗佈單元係經 由該補給線提供該塗佈溶液至該本體並經由該排出部將 該塗佈溶液排出至該基板。 。、 4.如申請專利範圍第3項所述之塗佈裝置，苴中 本體包括： 一錐形部，係位於鄰近該基板之該表面的一端，且該 排出部係位於該本體之該錐形部上。 /The substrate includes 2. As described in the scope of the patent application, A: a Mengbu nest, wherein the glass plate is used as a display panel and a semiconductor substrate. The semiconductor unit is as described in claim 3, wherein the coating unit comprises: a box, wherein the body has an inner space and the coating solution; < The discharge portion faces a substrate of the substrate 'β and 28 1326618 File: TW4115F a supply line for providing the coating solution, and the coating unit supplies the coating solution to the body via the supply line and via The discharge portion discharges the coating solution to the substrate. . 4. The coating device of claim 3, wherein the body of the crucible comprises: a tapered portion located at an end adjacent to the surface of the substrate, and the discharge portion is located at the tapered portion of the body Ministry. / 5'如申請專利範圍第4項所述之塗佈裝置，其中該 排f部係為—長狹缝m度實質上係與該基板之寬度 相等。 々、.如申請專利範圍第3項所述之塗佈裝置，其中該 第-清潔部件包括—第—均勻部及—第—濕潤部，該第一 均勻部係鄰近於該支樓單元之該第—端部且用以維持經 由該=出㈣該塗佈溶液之流量，及該第—濕潤部係鄰近 ;k 〃均勻部且用以濕潤該塗佈單元以避免該清潔單 ，乾燥:該第二清潔部件包括_第二均勻部及 4 °亥第一均勻部係鄰近於該支撐單元之該第二端部且用 邱隹由該排出部的該塗佈溶液之流量，且該第二濕潤 :二!!近於該第二均勻部且用以關該塗佈單元以避免 該冷早元乾燥。 笛-^如中請專利範圍第6項所述之塗佈裝置，其中該 、羞二部及該第二均勻部分別包括-灌注滾筒系統，該 灌注滾筒系統包括： 滾筒，係被一外部電源驅動；以及 29 1326618 Fi)e:TW41l5F 一外箱’係用以支撐該滾筒。 8. 如申請專利範圍第7 第一均句部及該第二均勻部分別佈裝置，其中該 液係儲存於該外箱並於該外箱中J潔該；㊁液’且該清潔 9. 如申請專利範圍第彳 二'"二间。 支撐單元的該第一端部及該第、_ “塗佈裝置，其令該 之一中心線互相相對。弟—端部係依據該支樓單元 1〇· —種基板塗佈方法，包括· 提供一第一基板於一支撐單元上； 執仃-第-塗佈製程於該第—基板之— -塗佈製程係藉由從-塗佈單元排出且= 支二單元之-第-端部延著-第-方向至 第一方向於該第一基板上移動； 早疋係延者該 以-第。二基板置換該第一基板，係藉由從 移除該卜基板且提供該第二基板至該切元件上=^ 執行一第二塗佈製程於該第二基板之一 ^佈=藉：從該塗佈單元排出該塗佈;液由 沒早兀之4第―^部延著-第二方向至該切單元 第-端部’其中具有該塗佈溶液之該塗佈單 ^ 二方向於該第二基板上移動。 、考》玄第 11.如中請專利範圍第1〇項所述之基板塗佈方法， 其中於該提供該第-基板及該第二基板之步驟中包括： 以真空吸取或-甜夹盤穩固該基板於該支樓單元之 1326618 * File:TW4115F 一表面上。 12·如申請專利範圍第1〇項所述之基板塗佈方法， 更包括： / ’ 準備該第—塗佈製程於一第一清潔單元中並於該第 -塗佈製程於該第—基板執行前，其中該第—清潔單元 鄰近於該支撐單元之該第一端部；以及 、準備該第二塗佈製程於一第二清潔單元中並於該第 二塗佈製程於該第二基板執行前，其中該第 ^ 鄰近於該支撐單元之該第二端部。 糸早7"係 13.如申請專利範圍第12項所述之基板塗佈方法， 二中在準備該第一塗佈製程及該第二塗佈製程之步驟中 以使制“㈣單元職^錄祕液的流量 以使a亥塗佈溶液均勻。 里 盆中料鄕㈣13韻叙基㈣佈方法， 二:於控制該塗佈溶液之流量均勻之步驟前，在準 塗佈製程及該第二塗佈製程之步驟更包括： / 於該第—清潔部件及該第二清潔部件1中之 δ亥塗佈溶液至該塗佈單元。 臭供 二5·,。申請專利範圍第13項所述 其中，制該塗佈溶液的流量均勾之該步驟包括··佈 ϋ讀佈單元之—排出部接近” 孩第-凊潔部件各自之一均勻部 ""干及 拼出部排出，以使該塗伟溶液由該“部 3] 1 u • File: TW4115F 流出，以及 流出以便該塗佈溶液係均勻 出部排出之該塗佈溶液之流量：持由該塗佈早兀之該排 同八中5玄滾筒係藉由外部電源以一固 定速定旋轉。5' The coating apparatus of claim 4, wherein the row f is a long slit m degree substantially equal to the width of the substrate. The coating device of claim 3, wherein the first cleaning component comprises a first uniform portion and a first wet portion, the first uniform portion being adjacent to the branch unit a first end portion for maintaining a flow rate of the coating solution via the = (four), and the first wet portion is adjacent; k 〃 uniform portion and for wetting the coating unit to avoid the cleaning sheet, drying: The second cleaning member includes a second uniform portion and a first uniform portion of the 4° first adjacent to the second end of the support unit and a flow rate of the coating solution by the discharge portion, and the second Wet: two!! Close to the second uniform portion and used to close the coating unit to avoid drying of the cold early element. The coating device of the sixth aspect of the invention, wherein the shame and the second uniform portion respectively comprise a perfusion roller system, the perfusion roller system comprising: a drum, being externally powered Drive; and 29 1326618 Fi)e: TW41l5F an outer box' is used to support the drum. 8. If the application of the patent scope 7th first sentence part and the second uniform part respectively, the liquid system is stored in the outer box and is cleaned in the outer box; the second liquid 'and the cleaning 9. For example, apply for the second part of the '" The first end portion of the support unit and the first "coating device" such that one of the center lines is opposite to each other. The brother-end portion is based on the substrate unit coating method, including Providing a first substrate on a supporting unit; and performing a coating process on the first substrate - the coating process is performed by the slave coating unit and = the second unit is - the - end portion The first-substrate is replaced by the first-substrate-to-first direction by the first-to-first direction, and the second substrate is replaced by the second substrate by removing the sub-substrate and providing the second Substrate to the dicing element =^ performing a second coating process on the second substrate; l: discharging the coating from the coating unit; the liquid is extended by the 4th portion - the second direction to the first end portion of the cutting unit, wherein the coating sheet having the coating solution moves on the second substrate. 考》玄第11. The substrate coating method of the present invention, wherein the step of providing the first substrate and the second substrate comprises: vacuuming or sweetening The substrate is stabilized on the surface of the 1326618* File: TW4115F of the branch unit. 12. The substrate coating method according to claim 1, further comprising: / ' preparing the first coating process In a first cleaning unit and before the first coating process is performed on the first substrate, wherein the first cleaning unit is adjacent to the first end of the supporting unit; and preparing the second coating process In a second cleaning unit and before the second coating process is performed on the second substrate, wherein the second portion is adjacent to the second end portion of the support unit. 糸早7"System 13. As claimed in the patent scope The substrate coating method according to item 12, wherein in the step of preparing the first coating process and the second coating process, the flow rate of the (4) unit is recorded to make the a coating solution Evenly. In the inner pot, the material is filled with four (four) 13 rhyme base (four) cloth method, two: before the step of controlling the uniform flow rate of the coating solution, the steps of the quasi-coating process and the second coating process further include: / in the first Cleaning the component and the coating solution in the second cleaning component 1 to the coating unit. Stinky two 5·,. According to the scope of claim 13 of the patent application, the flow rate of the coating solution is included in the step of including: the cloth discharge unit is close to the discharge unit, and the uniform portion of each of the child parts is "" The dry and the splicing portion are discharged so that the smear solution flows out from the "part 3] 1 u • File: TW4115F, and the flow rate of the coating solution which flows out so that the coating solution is uniformly discharged is: The slab of the same layer of the eight-segment roller is rotated at a fixed speed by an external power source. ;17.如申請專利範圍第1〇項所述之基板塗佈方法， 其中該支撐7G件之該第—端部與該第：端部係依據該支 撐單元之一中心線互相對立。The substrate coating method according to claim 1, wherein the first end portion of the supporting 7G member and the first end portion are opposed to each other according to a center line of the supporting unit. 3232
TW096140612A 2007-04-04 2007-10-29 Coater and method of coating a substrate with a coating solution using the same TWI326618B (en)

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