TWI323913B - Two-fluid jet module for cleaning substrate and cleaning device using thereof - Google Patents
Two-fluid jet module for cleaning substrate and cleaning device using thereof Download PDFInfo
- Publication number
- TWI323913B TWI323913B TW095133094A TW95133094A TWI323913B TW I323913 B TWI323913 B TW I323913B TW 095133094 A TW095133094 A TW 095133094A TW 95133094 A TW95133094 A TW 95133094A TW I323913 B TWI323913 B TW I323913B
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- substrate
- fluid
- receiving portion
- fluid injection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nozzles (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050133727A KR100728882B1 (ko) | 2005-12-29 | 2005-12-29 | 기판세정용 이류체 분사모듈 및 이를 이용한 기판세정장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729310A TW200729310A (en) | 2007-08-01 |
TWI323913B true TWI323913B (en) | 2010-04-21 |
Family
ID=38212791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095133094A TWI323913B (en) | 2005-12-29 | 2006-09-07 | Two-fluid jet module for cleaning substrate and cleaning device using thereof |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100728882B1 (ko) |
CN (1) | CN1990124A (ko) |
TW (1) | TWI323913B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101617347B1 (ko) * | 2014-12-16 | 2016-05-02 | 주식회사 케이씨텍 | 블록형 버블젯 세정 노즐 |
US9810676B2 (en) * | 2015-01-12 | 2017-11-07 | Ecolab Usa Inc. | Apparatus for, system for and methods of maintaining sensor accuracy |
CN112775096B (zh) * | 2019-11-11 | 2022-04-05 | 安徽汇久管业有限公司 | 一种不锈钢管件用超声波清洗设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003145064A (ja) * | 2001-11-12 | 2003-05-20 | Tokyo Electron Ltd | 2流体ジェットノズル及び基板洗浄装置 |
JP2004344689A (ja) * | 2003-05-19 | 2004-12-09 | Ikeuchi:Kk | 2流体ノズル |
JP4464850B2 (ja) * | 2004-03-09 | 2010-05-19 | 株式会社ルネサステクノロジ | 基板洗浄用2流体ノズル及び基板洗浄装置 |
-
2005
- 2005-12-29 KR KR1020050133727A patent/KR100728882B1/ko not_active IP Right Cessation
-
2006
- 2006-08-08 CN CNA2006101106899A patent/CN1990124A/zh active Pending
- 2006-09-07 TW TW095133094A patent/TWI323913B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1990124A (zh) | 2007-07-04 |
TW200729310A (en) | 2007-08-01 |
KR100728882B1 (ko) | 2007-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |