九、發明說明： 【發明所屬之技術領域】 本發明係關於用於清洗基材之二流體噴射模組及使用該 模.，且之基材，月洗裝置，尤其係關於將兩種流體進行混合並 擴散而喷射至基材表面的用☆清洗基材之二流體喷射模組 及使用該模組之基材清洗裝置。 【先前技術】IX. Description of the Invention: [Technical Field] The present invention relates to a two-fluid injection module for cleaning a substrate, and a substrate, a monthly washing device, and the like, in particular, A two-fluid injection module for cleaning and spraying the substrate onto the surface of the substrate, and a substrate cleaning device using the module. [Prior Art]
通常’半導體裝置錢㈣置藉由使科導體晶圓或平 板顯示器(FPD : flat panel display)，經由蒸鍍製程、蝕刻 製程 '光刻製程、離子注入製程等多種製造製程而製造。 在此等製造製程中表面處理製程係使用清洗液、蝕刻液 或顯影液等處理液處理基材表面，以對基材進行清洗 (cleamng)、# 刻（etching)、顯影㈣或去膜 (stripping)的製程。Generally, the semiconductor device is manufactured by a variety of manufacturing processes such as a vapor deposition process, an etching process, a photolithography process, and an ion implantation process, by using a semiconductor conductor wafer or a flat panel display (FPD: flat panel display). In these manufacturing processes, the surface treatment process uses a treatment liquid such as a cleaning solution, an etching solution, or a developing solution to treat the surface of the substrate to clean the substrate, etching, developing, or stripping. ) process.
亦即’該等表面處理製程藉由該等處職處理由傳送帶 —Μ。⑽移送方法以-定速度沿水平方向進行移送之 基材的上表面、下表面或上下兩面而對基材進行清洗、蝕 刻、顯影或去膜。 。此外，在基材經受包括該等表面處理製程之各種製造裳 力程甲其表面會党顆粒及污染物污染而需清除，為 …分製造製程之前/後進行該等清洗製程。 如此，清決製程係用於清潔基材表面之製輕。 :為：例’清洗製程由藥液處理製程、沖洗製程及乾燥 成’尤其^處理製程為清除基材表面之顆粒及污 U3758.doc 木物，在基材表面上使用去離子水（deionized water)或化 學藥品（chemical)等清洗液。 且清洗製程中曾公開具有用於清洗基材之二流體噴射模 、、且（下面商稱二流體喷射模組）之基材清洗裝置，該二流體 噴射模組為清除顆粒及污染物而使用清洗液處理基材，並 為提咼清洗能力而在清洗液中混合乾燥空氣（cleanThat is, the surface treatment processes are handled by the conveyor belts. (10) Transfer method The substrate is cleaned, etched, developed or removed by the upper surface, the lower surface or the upper and lower surfaces of the substrate which is transferred in the horizontal direction at a constant speed. . In addition, the cleaning process is performed before/after the manufacturing process of the substrate is subjected to various manufacturing processes including the surface treatment processes, such as surface party particles and contaminant contamination. In this way, the cleaning process is used to clean the surface of the substrate. : For example: The 'cleaning process is treated by the chemical solution process, the rinsing process and the drying process. In particular, the process is to remove the particles on the surface of the substrate and the U3758.doc wood. Deionized water is used on the surface of the substrate. ) or a cleaning solution such as a chemical. And a cleaning device having a two-fluid injection mold for cleaning a substrate and (hereinafter referred to as a two-fluid injection module) is disclosed in the cleaning process, and the two-fluid injection module is used for removing particles and contaminants. The cleaning solution treats the substrate and mixes the dry air in the cleaning solution for cleaning the cleaning ability (clean
Au)形成二流體’隨後將所生成之二流體擴散以泡沫 (bubble)形態衝擊基材表面。 圖1為現有的二流體噴射模組之示意圖，圖2為將圖1中 展不的二流體噴射模組沿A_A,線截取之剖面圖。 如圖1及圖2所示，現有的二流體喷射模組在主體1〇内部 之混合空間11分別設有供應乾燥空氣及去離子水的供應管 30、40，乾燥空氣及去離子水分別供應至該混合空間11進 行混合而生成二流體。 如此，在主體10内部之混合空間]^生成的二流體將沿在 主體10之一端朝向基材之寬度方向設置的多個喷嘴尖端汕 擴散，以泡沫形態喷射至基材表面。 對於此種二流體喷射模組而言，尤其重要的係生成細微 而均之--流體以提高清洗基材之效率，並將所生成之— 流體均一地噴射至基材表面。 但現有的二流體噴射模組採用分別供應清洗液及乾燥空 氣之後在主體内部簡單進行混合之方式，因此各二流體之 液滴大小互不均一，導致清洗效率降低。 尤其，現有的二流體噴射模組由於各二流體液滴之大 H3758.doc 未％充分變為微粒，因此難以在精細的清洗製程中使用β 【發明内容】 本發明係為解決如上所述之問題而提出的，其目的在於 提供種以超微粒狀態均一地生成二流體並進行噴射的用 於β洗基材之二流體喷射模組及使用該模組之基材清洗裝 置。 為實現上述目的根據本發明所提供的用於清洗基材之二 流體噴射模組包含：主體内部的用於接收乾燥空氣之第一 接收。卩’該主體内部的用於接收清洗液之第二接收部；喷 射通道’該噴射通道一端與該第一接收部連通，另一端暴 露在該主體外部，而側方具有流入該第二接收部之清洗液 的混入口。 其中’該噴射通道在其兩側形成相互偏心而設置的該混 入口’使清洗液可與乾燥空氣形成渦流的同時流入至該噴 射通道中。 且根據本發明所提供的基材清洗裝置包含：用於移送基 材之移送部；設置於被移送之基材的上側、下側或上下兩 側之該二流體噴射模組；向該二流體喷射模組供應清洗液 之清洗液供應部；向該二流體噴射模組供應乾燥空氣之氣 體供應部。 【實施方式】 以下’參照附圖詳細說明本發明之較佳實施例。 <實施例1> 圖3為本發明所提供的用於清洗基材之二流體喷射模組 113758.doc 之第-實施例的示意圖’圖4為將圖3中展示之用於清洗基 材之二流體噴射模組沿B — B，線截取之剖面圖。 如圖3及圖4所不，根據本發明所提供的用於清洗基材之 二流體喷射模組之第-實施例中，二流體噴射模組包含： 接收乾燥空氣的第一接收部11〇;接收清洗液的第二接收 部120，噴射通道13〇，該喷射通道13〇一端與該第一接收 部110連通，另一端與喷嘴尖端14〇結合，而側方具有與該 第二接收部120連通的混入口 1；H。 尤其’該第一接收部11〇、該第二接收部12〇、該喷射通 道130及該混入口 131藉由在同一主體ι〇〇内進行孔加工而 形成。 具體而言’第一接收部11〇藉由自主體1〇0之上表面朝底 面以預定深度進行孔加工而形成，喷射通道13〇藉由自第 一接收部110之底端朝該主體1〇〇之底面進行孔加工而形 成’第二接收部120藉由自主體1〇〇外側面朝喷射通道130 之側方以預定深度進行孔加工而形成，混入口 13 1藉由自 第二接收部120之端部進行孔加工而形成，以接通喷射通 道 130。 亦即，由於第一接收部110及喷射通道130之直徑沿加工 方向變小，因此易於進行孔加工；同樣，第二接收部120 及混入口 1 3 1之直徑亦沿加工方向變小，因此易於進行孔 加工0 如上所述之根據本發明所提供的用於清洗基材之二流體 噴射模組之第一實施例中，供應乾燥空氣的第一供應管 113758.doc 150連接於第一接收部110，供應清洗液的第二供應管ι6〇 連接於該第二接收部120。 因此，供應至第一接收部11〇之乾燥空氣沿噴射通道13〇 朝垂直下方流動，而供應至第二接收部12〇之清洗液根據 文丘裏（ventud)效應經由混入口 i 3丨高速流入至噴射通道 130 中。 高速流入至喷射通道13〇之清洗液與噴射通道13〇内部之 乾燥空氣高速衝突而進行混合，因此與現有的簡單混合方 式相比生成更為細微且均一之二流體薄霧。 如此混合而生成之二流體沿喷射通道丨3 〇移動的同時被 擴散而生成更為細微之薄霧，最後經由噴射通道丨3 〇端部 之噴嘴尖端140喷射至基材上。 且在喷射通道130内混合而生成並進行擴散的二流體根 據噴射通道130端部之喷嘴尖端14〇之形狀以特定的液滴形 癌嘴射至基材表面。 綜上所述，根據本發明所提供的二流體噴射模組之第— 實施例，根據文丘裏效應使乾燥空氣及清洗液形成均一之 二流體薄霧，並藉由機械加工在同一主體1〇〇内部形成各 接收部110、120及噴射通道130以及混入口 131，因而提高 製作之簡便性。 <實施例2> 圖5為本發明所提供的用於清洗基材之二流體喷射模多且 之第二實施例的示意圖，圖6為將圖5中展示的用於清洗基 材之一流體'^射模組沿C - C ’線截取之剖面圖，圖7為將圖$ 113758.doc 中展不的用於清洗基材之二流體喷射模組沿DD，線截取之 °J面圖。在此’與先前的附圖相同之附圖標記表示具有相 同功能之部件。 如圖5至圖7所示，根據本發明所提供的用於清洗基材之 一 μ體喷射模組之第二實施例中，二流體噴射模組包含： 接收乾燥空氣的第一接收部110 ;接收清洗液的第二接收 部120，喷射通道130 ’該噴射通道130—端與該第一接收 部11 0連通’另一端與噴嘴尖端14〇結合，而侧方具有與該 第二接收部120連通的混入口 13 1 ;尤其，該第二接收部 120在主體1 〇〇之外側面形成為相互對稱的一對而該等混 入口 131、132如圖7所示，形成於噴射通道13〇之兩側並相 互偏心而設置。 因此，供應至第一接收部110之乾燥空氣沿噴射通道〗3〇 朝垂直下方流動’而供應至第二接收部12〇之清洗液根據 文丘裏效應經由混入口 1 3 1、1 3 2高速流入至噴射通道1 3 〇 中。 高速流入至喷射通道130之清洗液與噴射通道υο内部之 乾燥空氣形成旋回狀的渦流，且與乾燥空氣高速衝突，因 此不僅可更加細微地進行擴散，且生成更為均—之二流體 薄霧。 如此混合而生成之二流體沿喷射通道13〇流動的同時再 次被擴散而經由喷射通道13〇端部之喷嘴尖端14〇喷射至基 材上。 如上所述，根據本發明所提供的二流體喷射模組之第二 II3758.doc 實施例，由於具有文丘裏結構及偏心設置的混入口 131、 132 ’從而使乾燥$氣及清洗液在喷射通道13〇中的流動性 大幅增加。 因此，根據本發明所提供的二流體喷射模組之第二實施 例，由於使清洗液流入至噴射通道13〇，因此乾燥空氣及 清洗液形成渦流，同時清洗液與乾燥空氣高速衝突而形成 均一的超微粒狀態之二流體薄霧。 <實施例3> 圖8為本發明所提供的用於清洗基材之二流體噴射模組 之第三實施例的示意圖，圓9為將圖8中展示的用於清洗基 材之二流體噴射模組沿E-E，線截取之剖面圖，圖1〇為將圖 8中展示的用於清洗基材之二流體噴射模組沿F F，線截取之 剖面圖。在此，與先前的附圖相同之附圖標記表示具有相 同功能之部件》 如圖8至圖10所示，根據本發明所提供的用於清洗基材 之二流體噴射模組之第三實施例中，二流體喷射模組包 含：接收乾燥空氣的第一接收部21 〇 ;接收清洗液的第二 接收部310 ;噴射通道330，該噴射通道330 一端與該第一 接收部210連通’另一端與噴嘴尖端340結合，而側方具有 與該第二接收部310連通的混入口 33 1、332。 尤其’該第一接收部210及該第二接收部31〇分別形成於 互不相同之主體200 ' 300内部，設置為上下結構。 如上所述之根據本發明所提供的用於清洗基材之二流體 1射模組之第二貫施例中’形成第一接收部2 1 〇之第一主 U3758.doc -12- 1323913 體2〇0上連接用於供應乾燥空氣的第-供應管22G、形成第 -接收部3 1 0之第二主體3 〇 〇上連接用於供應清洗液的第二 供應管320。 另外，該<實施例2>中分別言曼置形成於主體_兩側的第 一接收部120及向各第二接收部12〇供應清洗液的第二供應 管160 ’而該第三實施例中只在第二主體3〇〇之一側連接第 二供應管320，但亦能向該等混入口 331、出分別供應清 洗液。 因此，供應至第一接收部210之乾燥空氣沿喷射通道33〇 朝垂直下方流動，而供應至第二接收部32〇之清洗液根據 文丘裏效應經由混入口 331、332高速流入至噴射通道33〇 中。 高速流入至喷射通道330之清洗液與喷射通道33〇内部之 乾燥空氣形成旋回狀的渦流，且與乾燥空氣高速衝突，因 此不僅可更為細微地進行擴散，且生成更為均一之二流體 薄霧。 如此混合而生成之二流體沿喷射通道3 3 〇流動的同時再 次被擴散而經由噴射通道330端部之噴嘴尖端34〇噴射至基 材上。 如上所述，根據本發明所提供的二流體噴射模組之第三 實施例，不僅生成均一的超微粒狀態之二流體薄霧，且由 於具有形成第二接收部320之第二主體3〇〇，因而即使只在 第二主體300之一側連接第二供應管32〇，亦能向用於^成 渦流的混入口 33 1、332分別供應清洗液，因此使設備變得 113758.doc 13 1323913 簡單。 <實施例4> 圖Π為使用本發明所提供的用於清洗基材之二流體噴射 模組之基材清洗裝置的一實施例的剖面圖。在此，與先前 的附圖相同之附圖標記表示具有相同功能之部件。 如圖11所示，使用根據本發明所提供的用於清洗基材之 二流體噴射模組之基材清洗裝置的一實施例包含：用於移 送基材S之移送部400 ;設置於被移送之基材s之上側、下 側或上下兩侧的該 <實施例1>至 <實施例3>中之任意一個二 流體喷射杈組500 ;向該二流體噴射模組5〇〇供應清洗液的 清洗液供應部600 ;向該二流體喷射模組5〇〇供應乾燥空氣 的氣體供應部700。 在此，雖然舉出該二流體喷射模組5〇〇採用該〈實施例 之二流體噴射模組5〇〇之實例，但亦可採用該 <實施例1：>或 該<實施例3>之用於清洗基材之二流體喷射模組。 综上所述，雖㈣由附圖以特定的較佳實施例為實例說 明了本發明’但本發明並不限定於上述實施例，在不偏離 本發明思想之範疇内本發明熟習此項技術者可進行各種變 更及修改。 如上所述，由於本發明向基材表面喷射均一併形成為超 微粒狀態之二流體薄霧’因此不僅大幅度提高基材之清洗 效率，且可進行精細的清洗過程。 且由於本發明藉由各種方式以最簡單之結構進行製造， 因此易於製造及維護。 、Au) forms a two-fluid' and then diffuses the resulting two fluids to impact the surface of the substrate in a bubble form. 1 is a schematic view of a conventional two-fluid injection module, and FIG. 2 is a cross-sectional view taken along line A_A of the two-fluid injection module shown in FIG. As shown in FIG. 1 and FIG. 2, the existing two-fluid injection module is provided with supply pipes 30 and 40 for supplying dry air and deionized water in the mixing space 11 inside the main body 1 respectively, and dry air and deionized water are respectively supplied. The mixing space 11 is mixed to generate a two fluid. Thus, the two fluids generated in the mixing space inside the main body 10 are diffused along the plurality of nozzle tips 设置 disposed at one end of the main body 10 toward the width direction of the substrate, and are ejected to the surface of the substrate in the form of foam. It is especially important for such a two-fluid injection module to produce a fine and uniform fluid to increase the efficiency of cleaning the substrate and to uniformly spray the resulting fluid onto the surface of the substrate. However, the existing two-fluid injection module adopts a method of separately mixing the cleaning liquid and the drying air in the main body, so that the droplet sizes of the two fluids are not uniform, resulting in a decrease in cleaning efficiency. In particular, the existing two-fluid injection module is difficult to use β in a fine cleaning process because the large H3758.doc of each of the two fluid droplets is not sufficiently changed into particles. [Invention] The present invention solves the above problems. Accordingly, the object of the present invention is to provide a two-fluid jetting module for a beta-washing substrate and a substrate cleaning device using the same, in which a two-fluid is uniformly generated in an ultrafine particle state and sprayed. A fluid ejection module for cleaning a substrate according to the present invention for achieving the above object comprises: a first receiving inside the body for receiving dry air. a second receiving portion inside the main body for receiving the cleaning liquid; the injection passage' has one end communicating with the first receiving portion, the other end being exposed outside the main body, and the other side having an inflow into the second receiving portion The mixing inlet of the cleaning liquid. Wherein the mixing passage is formed on both sides thereof to form an eccentricity eccentrically disposed so that the cleaning liquid can flow into the ejection passage while forming a vortex with the dry air. And the substrate cleaning device according to the present invention comprises: a transfer portion for transferring the substrate; the two-fluid injection module disposed on the upper side, the lower side or the upper and lower sides of the transferred substrate; to the two fluids The injection module supplies a cleaning liquid supply portion of the cleaning liquid, and supplies a gas supply portion of the dry air to the two-fluid injection module. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. <Example 1> Fig. 3 is a schematic view of a first embodiment of a two-fluid injection module 113758.doc for cleaning a substrate provided in the present invention. FIG. 4 is a view showing the cleaning substrate shown in FIG. The second fluid injection module is taken along the line B-B, and the cross-sectional view is taken. As shown in FIG. 3 and FIG. 4, in the first embodiment of the two-fluid injection module for cleaning a substrate according to the present invention, the two-fluid injection module comprises: a first receiving portion 11 that receives dry air. Receiving a second receiving portion 120 of the cleaning liquid, the injection passage 13A, one end of the injection passage 13 is in communication with the first receiving portion 110, the other end is coupled to the nozzle tip 14A, and the side has a second receiving The mixing inlet 1 of the portion 120 is connected; H. In particular, the first receiving portion 11A, the second receiving portion 12A, the ejection channel 130, and the mixing inlet 131 are formed by performing hole processing in the same body ι. Specifically, the first receiving portion 11 is formed by performing hole processing at a predetermined depth from the upper surface of the main body 1 〇 0 toward the bottom surface, and the ejection passage 13 〇 is from the bottom end of the first receiving portion 110 toward the main body 1 The bottom surface of the crucible is subjected to hole processing to form a second receiving portion 120 formed by performing hole processing at a predetermined depth from the outer side surface of the main body 1 toward the side of the ejection passage 130, and the mixing inlet 13 1 is received by the second receiving portion 13 1 The end of the portion 120 is formed by hole machining to open the injection passage 130. That is, since the diameters of the first receiving portion 110 and the ejection passage 130 become smaller in the machining direction, the hole processing is facilitated; similarly, the diameters of the second receiving portion 120 and the mixing inlet 13 1 are also reduced in the machining direction, Easily performing hole processing. In the first embodiment of the two-fluid injection module for cleaning a substrate according to the present invention as described above, the first supply pipe 113758.doc 150 for supplying dry air is connected to the first receiving The portion 110, the second supply tube ι6 that supplies the cleaning liquid is connected to the second receiving portion 120. Therefore, the dry air supplied to the first receiving portion 11〇 flows downward along the ejection passage 13〇, and the cleaning liquid supplied to the second receiving portion 12〇 flows into the high-speed through the mixed inlet i 3丨 according to the ventud effect. Into the injection channel 130. The high-speed inflow of the cleaning liquid into the injection passage 13 is collided with the dry air inside the injection passage 13 at a high speed, thereby producing a finer and uniform fluid mist than the conventional simple mixing method. The two fluids thus mixed are diffused along the ejection channel 丨3 而 to form a finer mist, and finally ejected onto the substrate via the nozzle tip 140 of the end of the ejection channel 丨3 。. The two fluids which are mixed in the jet passage 130 to be generated and diffused are directed to the surface of the substrate by a specific droplet-shaped cancer nozzle according to the shape of the nozzle tip 14A at the end of the jet passage 130. In summary, according to the first embodiment of the two-fluid injection module provided by the present invention, the dry air and the cleaning liquid form a uniform fluid mist according to the Venturi effect, and are machined in the same body. Each of the receiving portions 110 and 120, the ejection channel 130, and the mixing inlet 131 is formed inside the crucible, thereby improving the simplicity of fabrication. <Example 2> Fig. 5 is a schematic view showing a second embodiment of a two-fluid injection mold for cleaning a substrate according to the present invention, and Fig. 6 is a view showing one of the substrates for cleaning in Fig. 5. The cross section of the fluid 'module module taken along line C - C ', and Fig. 7 is the section of the two fluid jet module for cleaning the substrate shown in Fig. 113733.doc along the DD line. Figure. Here, the same reference numerals as in the previous drawings denote components having the same function. As shown in FIG. 5 to FIG. 7 , in the second embodiment of the present invention, a two-body injection module for cleaning a substrate, the two-fluid injection module includes: a first receiving portion 110 that receives dry air. a second receiving portion 120 that receives the cleaning liquid, the injection passage 130' is in communication with the first receiving portion 110, and the other end is coupled to the nozzle tip 14A, and the side has the second receiving portion 120 communicating inlets 13 1 ; in particular, the second receiving portion 120 is formed in a pair of mutually symmetrical sides on the outer side of the body 1 而 and the mixing inlets 131 , 132 are formed in the injection passage 13 as shown in FIG. 7 . Set on both sides of the cymbal and eccentric to each other. Therefore, the dry air supplied to the first receiving portion 110 flows along the jet passage 〇3〇 vertically downwards' and the cleaning liquid supplied to the second receiving portion 12〇 passes through the mixed inlet 1 3 1 , 1 3 2 according to the Venturi effect. Flows into the jet channel 1 3 〇. The cleaning fluid that flows into the injection passage 130 at a high speed forms a swirling vortex with the dry air inside the injection passage ,, and collides with the dry air at a high speed, so that not only finer diffusion but also a more uniform fluid mist can be generated. . The two fluids thus mixed are again diffused while flowing along the ejection passage 13 而 and are ejected onto the substrate via the nozzle tip 14 of the end portion of the ejection passage 13 . As described above, the second II 3758.doc embodiment of the two-fluid injection module according to the present invention has a venturi structure and an eccentrically disposed mixing inlet 131, 132' to thereby dry the gas and the cleaning liquid in the injection passage. The liquidity in 13〇 has increased significantly. Therefore, according to the second embodiment of the two-fluid injection module provided by the present invention, since the cleaning liquid flows into the injection passage 13〇, the dry air and the cleaning liquid form a vortex, and the cleaning liquid and the dry air collide at a high speed to form a uniformity. The ultra-fine particle state of the two fluid mist. <Example 3> Fig. 8 is a schematic view showing a third embodiment of a two-fluid injection module for cleaning a substrate according to the present invention, and a circle 9 is a two-fluid for cleaning a substrate shown in Fig. 8. The cross-sectional view of the jetting module taken along the line EE, FIG. 1 is a cross-sectional view of the two fluid jetting module for cleaning the substrate shown in FIG. Here, the same reference numerals as in the previous drawings denote components having the same function. As shown in FIGS. 8 to 10, the third embodiment of the two-fluid injection module for cleaning a substrate according to the present invention is shown. In the example, the two-fluid injection module includes: a first receiving portion 21 that receives the dry air; a second receiving portion 310 that receives the cleaning liquid; and an injection passage 330 that is connected to the first receiving portion 210 at one end. One end is coupled to the nozzle tip 340, and the side has a mixing inlet 33 1 , 332 that communicates with the second receiving portion 310. In particular, the first receiving unit 210 and the second receiving unit 31 are formed inside the main body 200' 300 which are different from each other, and are provided in a vertical structure. In the second embodiment of the two-fluid firing module for cleaning a substrate according to the present invention as described above, the first main U3758.doc -12- 1323913 body forming the first receiving portion 2 1 〇 A second supply pipe 320 for supplying dry air is connected to the first supply pipe 22G for supplying dry air, and the second main body 3 for forming the first receiving portion 310 is connected to the second supply pipe 320 for supplying the cleaning liquid. Further, in the <Example 2>, the first receiving portion 120 formed on both sides of the main body and the second supply pipe 160' supplying the cleaning liquid to each of the second receiving portions 12, respectively, and the third embodiment In the example, the second supply pipe 320 is connected only to one side of the second body 3, but the cleaning liquid can also be supplied to the mixing inlets 331 and the outlets, respectively. Therefore, the dry air supplied to the first receiving portion 210 flows vertically downward along the ejection passage 33, and the cleaning liquid supplied to the second receiving portion 32〇 flows into the ejection passage 33 at a high speed via the mixing inlets 331, 332 according to the Venturi effect. In the middle. The cleaning fluid that flows into the injection passage 330 at a high speed forms a swirling vortex with the dry air inside the injection passage 33, and collides with the dry air at a high speed, so that not only finer diffusion but also generation of a more uniform fluid thinner fog. The two fluids thus mixed are again diffused while flowing along the ejection passages 3 3 而 and are ejected onto the substrate via the nozzle tips 34 at the ends of the ejection passages 330. As described above, the third embodiment of the two-fluid injection module according to the present invention not only generates a uniform two-fluid mist of the ultra-fine particle state, but also has a second body 3 that forms the second receiving portion 320. Therefore, even if the second supply pipe 32 is connected only to one side of the second body 300, the cleaning liquid can be supplied to the mixing inlets 33 1 and 332 for the eddy current, respectively, thereby making the device 113758.doc 13 1323913 simple. <Example 4> Fig. 5 is a cross-sectional view showing an embodiment of a substrate cleaning apparatus using a two-fluid ejection module for cleaning a substrate provided by the present invention. Here, the same reference numerals as in the previous drawings denote components having the same function. As shown in FIG. 11, an embodiment of a substrate cleaning apparatus using a two-fluid injection module for cleaning a substrate according to the present invention includes: a transfer portion 400 for transferring a substrate S; The second fluid injection jet group 500 of the upper side, the lower side or the upper and lower sides of the substrate s of any one of <Example 1> to <Example 3>; supplied to the two fluid injection module 5? a cleaning liquid supply unit 600 for cleaning liquid; and a gas supply unit 700 for supplying dry air to the two-fluid injection module 5A. Here, although the two-fluid injection module 5 is exemplified by the two fluid injection modules 5 of the embodiment, the embodiment 1: > or the <implementation Example 3> A two-fluid injection module for cleaning a substrate. In the above, although the present invention is described by way of example with reference to the preferred embodiments, the invention is not limited to the embodiments described above, and the present invention is familiar with the technology without departing from the spirit of the invention. Various changes and modifications are possible. As described above, since the present invention sprays a two-fluid mist uniformly formed in the ultrafine particle state to the surface of the substrate, the cleaning efficiency of the substrate is not greatly improved, and a fine cleaning process can be performed. Moreover, since the present invention is manufactured in the simplest structure by various means, it is easy to manufacture and maintain. ,
c S 113758.doc -14 · 1323913 【圖式簡單說明】 圖1為現有的用於清洗基材之二流體噴射模組之示意 圖； 圖2為將圖1中展示之二流體喷射模組沿A-A'線截取之剖 面圖； 圖3為本發明所提供的用於清洗基材之二流體噴射模組 之第一實施例的示意圖； 圖4為將圖3中展示之用於清洗基材之二流體喷射模組沿 B-B'線截取之剖面圖； 圖5為本發明所提供的用於清洗基材之二流體喷射模組 之第二實施例的示意圖； 圖6為將圖5中展示之用於清洗基材之二流體噴射模組沿 C-C'線截取之剖面圖； 圖7為將圖5中展示之用於清洗基材之二流體喷射模組沿 D-D'線截取之剖面圖； 圖8為本發明所提供的用於清洗基材之二流體喷射模組 之第三實施例的示意圖； 圖9為將圖8中展示之用於清洗基材之二流體喷射模組沿 E-E'線截取之剖面圖； 圖10為將圖8中展示之用於清洗基材之二流體噴射模組 沿F-F'線截取之剖面圖； 圖11為使用本發明所提供的用於清洗基材之二流體噴射 模組之基材清洗裝置一實施例的剖面圖。 【主要元件符號說明】 I13758.doc -15· 1323913c S 113758.doc -14 · 1323913 [Simplified Schematic] FIG. 1 is a schematic view of a conventional two-fluid injection module for cleaning a substrate; FIG. 2 is a second fluid ejection module shown in FIG. -A' line cut-away sectional view; Figure 3 is a schematic view of a first embodiment of a two-fluid injection module for cleaning a substrate provided by the present invention; Figure 4 is a view showing the cleaning substrate shown in Figure 3 2 is a cross-sectional view taken along line BB′; FIG. 5 is a schematic view of a second embodiment of a two-fluid injection module for cleaning a substrate according to the present invention; FIG. A cross-sectional view of the two fluid jet module for cleaning the substrate taken along line C-C'; Figure 7 is a cross-sectional view of the two fluid jet module for cleaning the substrate shown in Figure 5 along the D-D' FIG. 8 is a schematic view showing a third embodiment of a two-fluid injection module for cleaning a substrate according to the present invention; FIG. 9 is a second fluid for cleaning a substrate shown in FIG. A cross-sectional view of the injection module taken along line E-E'; Figure 10 is a two-fluid injection module for cleaning the substrate shown in Figure 8. Sectional view F-F 'line of the taken; FIG. 11 is used according to the present invention is provided for cleaning the two-fluid ejection module substrate of the substrate cleaning apparatus according to an embodiment of a sectional view. [Main component symbol description] I13758.doc -15· 1323913
10 主體 11 混合空間 20 噴嘴尖端 30 供應管 40 供應管 100 主體 110 第一接收部 120 第二接收部 130 噴射通道 13 1 混入口 132 混入口 140 喷嘴尖端 150 第一供應管 160 第二供應管 200 第一主體 210 第一接收部 220 第一供應管 300 第二主體 310 第二接收部 320 第二供應管 330 喷射通道 331 混入口 332 混入口 340 噴嘴尖端 113758.doc -16- 132391310 body 11 mixing space 20 nozzle tip 30 supply tube 40 supply tube 100 body 110 first receiving portion 120 second receiving portion 130 injection channel 13 1 mixing inlet 132 mixing inlet 140 nozzle tip 150 first supply tube 160 second supply tube 200 First body 210 first receiving portion 220 first supply tube 300 second body 310 second receiving portion 320 second supply tube 330 injection channel 331 mixing inlet 332 mixing inlet 340 nozzle tip 113758.doc -16- 1323913
400 移送部 500 二流體噴射模組 600 清洗液供應部 700 氣體供應 -· ΛΓ. ·· I13758.doc -17-400 Transfer unit 500 Two-fluid injection module 600 Cleaning liquid supply unit 700 Gas supply -· ΛΓ. ·· I13758.doc -17-