TWI323013B - - Google Patents
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- Publication number
- TWI323013B TWI323013B TW093115630A TW93115630A TWI323013B TW I323013 B TWI323013 B TW I323013B TW 093115630 A TW093115630 A TW 093115630A TW 93115630 A TW93115630 A TW 93115630A TW I323013 B TWI323013 B TW I323013B
- Authority
- TW
- Taiwan
- Prior art keywords
- ball
- lead
- neck
- wire
- depressed
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 10
- 230000000994 depressogenic effect Effects 0.000 abstract description 6
- 238000002788 crimping Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
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- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
- H01L2224/85947—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape by mechanical means, e.g. "pull-and-cut", pressing, stamping
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/01079—Gold [Au]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003279556A JP4105996B2 (ja) | 2003-07-25 | 2003-07-25 | ワイヤボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504902A TW200504902A (en) | 2005-02-01 |
TWI323013B true TWI323013B (ja) | 2010-04-01 |
Family
ID=34265628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093115630A TW200504902A (en) | 2003-07-25 | 2004-06-01 | Wire-bonding method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4105996B2 (ja) |
KR (1) | KR100571344B1 (ja) |
TW (1) | TW200504902A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0838127A (ja) * | 1994-08-04 | 1996-02-13 | Asahi Chem Ind Co Ltd | 非コーヒー乳性飲料及びその製法 |
TWI372453B (en) | 2008-09-01 | 2012-09-11 | Advanced Semiconductor Eng | Copper bonding wire, wire bonding structure and method for processing and bonding a wire |
US8110931B2 (en) | 2008-07-11 | 2012-02-07 | Advanced Semiconductor Engineering, Inc. | Wafer and semiconductor package |
TWI415707B (zh) * | 2008-09-01 | 2013-11-21 | Advanced Semiconductor Eng | 銅製銲線、銲線接合結構及銲線接合方法 |
JP2011054727A (ja) * | 2009-09-01 | 2011-03-17 | Oki Semiconductor Co Ltd | 半導体装置、その製造方法、及びワイヤボンディング方法 |
CN102097317B (zh) * | 2010-12-01 | 2015-04-29 | 佛山市南海区宏乾电子有限公司 | 一种全包封装开关电源三极管的生产方法 |
JP5890798B2 (ja) * | 2013-05-27 | 2016-03-22 | ラピスセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
BR112015021244A2 (pt) * | 2014-10-03 | 2018-05-08 | Intel Coproration | pacote de matrizes empilhadas sobrepostas com colunas verticais |
JP6166769B2 (ja) * | 2015-12-11 | 2017-07-19 | ラピスセミコンダクタ株式会社 | 半導体装置 |
-
2003
- 2003-07-25 JP JP2003279556A patent/JP4105996B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-01 TW TW093115630A patent/TW200504902A/zh not_active IP Right Cessation
- 2004-07-07 KR KR1020040052573A patent/KR100571344B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20050013074A (ko) | 2005-02-02 |
TW200504902A (en) | 2005-02-01 |
JP4105996B2 (ja) | 2008-06-25 |
KR100571344B1 (ko) | 2006-04-14 |
JP2005045135A (ja) | 2005-02-17 |
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