JP4105996B2 - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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JP4105996B2
JP4105996B2 JP2003279556A JP2003279556A JP4105996B2 JP 4105996 B2 JP4105996 B2 JP 4105996B2 JP 2003279556 A JP2003279556 A JP 2003279556A JP 2003279556 A JP2003279556 A JP 2003279556A JP 4105996 B2 JP4105996 B2 JP 4105996B2
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wire
ball
neck height
bond point
loop
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JP2005045135A (ja
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竜成 三井
直希 関根
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to TW093115630A priority patent/TW200504902A/zh
Priority to KR1020040052573A priority patent/KR100571344B1/ko
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Description

本発明は、第１ボンド点と第２ボンド点間をワイヤで接続するワイヤボンディング方法に係り、特に低ワイヤループ形成方法に関する。
第１ボンド点と第２ボンド点間を接続したワイヤに垂れが生じると、ワイヤがダイに接触して電気的にショート不良となる。これを防止するため、従来は、第１ボンド点にボールを圧着して圧着ボールを形成した後、圧着ボール上に上方に伸びたネック高さ部を形成し、ネック高さ部の上端に屈折部（癖）を形成している。例えば特許文献１参照。
特開平１０−１８９６４１号公報
上記従来技術の方法は、圧着ボール上にネック高さ部を形成するので、必然的に高いワイヤループ形状となる。近年、半導体装置は小型化及び薄型化の傾向にあるが、従来技術の方法では、この要望を十分に満足させることがでなかった。
本発明の課題は、圧着ボール上のネック高さ部を除去して低ワイヤループ化が図れると共に、ワイヤループ強度の向上が図れるワイヤボンディング方法を提供することにある。
上記課題を解決するための本発明の請求項１は、第１ボンド点にボンディングされた圧着ボール上に上方に伸びたネック高さ部を形成して第２ボンド点にワイヤを接続した後、キャピラリの下端に延在したワイヤの先端にボールを形成し、このボールを回路基板に押し付けて下面平坦ボールを形成し、続いて前記下面平坦ボールを前記ネック高さ部の頂部に押し付けてネック高さ部を押し下げることを特徴とする。
ネック高さ部の頂部を押し下げるので、圧着ボールの上端部の強度が増大し、該圧着ボールの上端部からの垂れ下がりが生じなく、またネック高さ部の押し下げにより、ネック高さ部がなくなり、極めて低いワイヤループが形成される。
本発明のワイヤボンディング方法の一実施の形態を図１及び図２により説明する。図１（ａ）に示すように、セラミック基板やプリント基板等の基板又はリードフレーム等よりなる回路基板１上には、電極パッド２ａが形成されたダイ２がマウントされている。電極パッド２ａの第１ボンド点Ａと回路基板１の配線又はリード等の第２ボンド点Ｂ間はワイヤ３により電気的に接続されている。
図１（ａ）に示すワイヤ３のループ形状は、一般に台形ループと呼ばれており、特許文献１の図５（ａ）と同じであり、同文献１の図６に示す工程によって形成されるので、その詳細な説明は省略する。第１ボンド点Ａと第２ボンド点Ｂとに接続したワイヤループ形状は、ネック高さ部３１、台形部長さ部分３２及び傾斜部３３とからなっており、台形部長さ部分３２の両端に屈折部３ａ、３ｂが付けられている。なお、３４は、ワイヤ３の先端に形成されたボールを電極パッド２ａにボンディングして形成された圧着ボールを示す。このような台形ループは、ダイ２の各第１ボンド点Ａと該第１ボンド点Ａに対応する各第２ボンド点Ｂにそれぞれ形成する。以上は従来技術と同じである。
次に図１（ｂ）に示すように、キャピラリ４に挿通されたワイヤ３の先端にボール５を形成する。その後、図１（ｃ）に示すように、キャピラリ４を下降させて回路基板１の電気的な接続部分以外の部分（電気的に影響しない部分）に押し付けて下端を平坦にした下面平坦ボール５ａを形成する。
次に図１（ｄ）に示すように、キャピラリ４を上昇及びＸＹ軸方向に移動させ、下面平坦ボール５ａを１本目のワイヤループのネック高さ部３１の頂部、即ち屈折部３ａの上方に位置させる。続いて図１（ｅ）に示すように、キャピラリ４を下降させて下面平坦ボール５ａで屈折部３ａを下方に押し下げる。これにより、屈折部３ａが除去されてネック高さ部３１は、ほぼ水平に折り曲げられ台形部長さ部分３２とほぼ同じ水平形状となる。その後図２に示すように、キャピラリ４は上昇する。
次の２本目のワイヤループのネック高さ部３１の上方に位置し、前記と同様の動作を行う。この動作は３本目以降のワイヤループについても同様に行う。予め決められた本数のワイヤループについてのネック高さ部３１の押し下げを行った後、下面平坦ボール５ａを回路基板１の電気的に影響しない部分にステッチボンドして取り除き、新しく下面平坦ボール５ａを形成して前記した動作を行う。
次に図１（ａ）に示す台形ループ（以下、従来例という）と図２に示す低ワイヤループ（以下、本実施の形態という）との引張強度試験を行った結果について説明する。ワイヤ３は住友金属鉱山株式会社製の型式「ＳＧＬ（２）」の金線２５μｍを使用し、従来例及び本実施の形態をそれぞれ４０本のワイヤ３について試験を行った。なお、ワイヤループ長は、平均で０．９７ｍｍであった。第１ボンド点Ａから第２ボンド点Ｂの方向に２００μｍ離れたワイヤ３の部分を上方に引張荷重を加えてワイヤ３の破断を調べた結果、〔表１〕のような結果が得られた。
Figure 0004105996
〔表１〕より明らかなように、本実施の形態は従来例より、ループ高さは平均で３０．０μｍ低くなり、引張強度は２．３９ｇ増大した。また従来例は圧着ボール３４の上端部でワイヤ３が破断したが、本実施の形態は引張荷重を加えた箇所でワイヤ３が破断した。
このように、本実施の形態は圧着ボール３４の上端では破断しなく、引張荷重を加えた箇所で破断し、また引張強度が増大したことにより、圧着ボール３４の上端部の強度が増大し、該圧着ボール３４の上端部からの垂れ下がりが生じなく、また下面平坦ボール５ａによるネック高さ部３１の押し下げにより、屈折部３ａの屈折が除去され、ネック高さ部３１と台形部長さ部分３２がほぼ水平に形成されたものと思われる。このように、ネック高さ部３１がなくなり、極めて低いワイヤループが形成された。
なお、上記実施の形態は、図１（ａ）のワイヤループを全て又は複数本形成した後に図１（ｂ）乃至（ｅ）及び図２の工程を行ったが、１本のワイヤループを形成した後に図１（ｂ）乃至（ｅ）及び図２の工程を行ってもよい。しかし、この方法は、図１（ｃ）の工程及び下面平坦ボール５ａを除去するステッチ工程を毎回行う必要があるので生産性が悪い。また上記実施の形態は、図１（ｃ）のように下面平坦ボール５ａを形成した後、該下面平坦ボール５ａを図１（ｄ）（ｅ）に示すようにネック高さ部３１に押し付けたが、この下面平坦ボール５ａを形成しなく、図１（ｂ）に示すボール５を直接ネック高さ部３１に押しつけて図１（ｄ）（ｅ）に示す工程を行ってもよい。しかし、ボール５であると、ボール５とワイヤ３との位置ずれが生じ、一方が逃げ易くなるので注意が必要である。
本発明のワイヤボンディング方法の参考の形態を図３により説明する。上記実施の形態は、ワイヤボンディングを行うキャピラリ４を用い、下面平坦ボール５ａを形成してネック高さ部３１の頂部を押し下げた。本参考の形態は、図１（ａ）及び図３（ａ）に示すように台形ループを形成した後、下面が平坦なワイヤ押圧ツール６で図３（ｂ）〜（ｃ）に示すように屈折部３ａを下方に押し下げる。その後図３（ｄ）に示すようにワイヤ押圧ツール６は上昇し、次の２本目のワイヤループのネック高さ部３１の上方に位置し、前記と同様の動作を行う。このように形成しても、前記と同様の効果が得られる。また本参考の形態は前記実施の形態のようにボール５を形成する必要がないので、生産性に優れている。
なお、前記各実施の形態は、台形ループに適用した場合について説明したが、特許文献１の図５（ｂ）の三角ループ、図１のような台形部長さ部分３２の中央に窪みを形成したループにも適用できることは勿論である。
本発明のワイヤボンディング方法の一実施の形態を示す工程図である。 図１の続きの工程図である。 本発明のワイヤボンディング方法の参考の形態を示す工程図である。
符号の説明
Ａ 第１ボンド点
Ｂ 第２ボンド点
１ 回路基板
２ ダイ
２ａ 電極パッド
３ ワイヤ
３１ ネック高さ部
３２ 台形部長さ部分
３４ 圧着ボール
３ａ、３ｂ 屈折部
４ キャピラリ
５ ボール
５ａ 下面平坦ボール
６ ワイヤ押圧ツール

Claims (1)

  1. 第１ボンド点にボンディングされた圧着ボール上に上方に伸びたネック高さ部を形成して第２ボンド点にワイヤを接続した後、キャピラリの下端に延在したワイヤの先端にボールを形成し、このボールを回路基板に押し付けて下面平坦ボールを形成し、続いて前記下面平坦ボールを前記ネック高さ部の頂部に押し付けてネック高さ部を押し下げることを特徴とするワイヤボンディング方法。
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