TWI315886B - A substrate and a method for polishing a substrate - Google Patents
A substrate and a method for polishing a substrateInfo
- Publication number
- TWI315886B TWI315886B TW095110977A TW95110977A TWI315886B TW I315886 B TWI315886 B TW I315886B TW 095110977 A TW095110977 A TW 095110977A TW 95110977 A TW95110977 A TW 95110977A TW I315886 B TWI315886 B TW I315886B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- polishing
- less
- polishing pad
- layer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005112070 | 2005-04-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701303A TW200701303A (en) | 2007-01-01 |
TWI315886B true TWI315886B (en) | 2009-10-11 |
Family
ID=36645621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095110977A TWI315886B (en) | 2005-04-08 | 2006-03-29 | A substrate and a method for polishing a substrate |
Country Status (7)
Country | Link |
---|---|
US (1) | US7553768B2 (zh) |
EP (1) | EP1710045B1 (zh) |
KR (1) | KR100850732B1 (zh) |
CN (1) | CN1845007B (zh) |
AT (1) | ATE417700T1 (zh) |
DE (1) | DE602006004241D1 (zh) |
TW (1) | TWI315886B (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5065574B2 (ja) * | 2005-01-12 | 2012-11-07 | 住友電気工業株式会社 | GaN基板の研磨方法 |
US20080280539A1 (en) * | 2007-05-11 | 2008-11-13 | Asml Holding N.V. | Optical component fabrication using amorphous oxide coated substrates |
US20080318066A1 (en) * | 2007-05-11 | 2008-12-25 | Asml Holding N.V. | Optical Component Fabrication Using Coated Substrates |
JP2008293552A (ja) * | 2007-05-22 | 2008-12-04 | Fujitsu Ltd | 基板、磁気記録媒体及びその製造方法、並びに磁気記憶装置 |
KR101680866B1 (ko) * | 2008-11-26 | 2016-11-29 | 호야 가부시키가이샤 | 마스크블랭크용 기판 |
TWI396003B (zh) | 2009-07-30 | 2013-05-11 | Au Optronics Corp | 顯示面板及其邊框窄化、邊緣強度提昇方法 |
US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
CN112250313A (zh) * | 2015-02-02 | 2021-01-22 | 康宁股份有限公司 | 强化层压玻璃制品边缘的方法及由此形成的层压玻璃制品 |
CN105842898B (zh) * | 2016-05-30 | 2023-06-02 | 京东方科技集团股份有限公司 | 显示面板的制造方法和装置 |
JP7219009B2 (ja) * | 2018-03-27 | 2023-02-07 | 株式会社荏原製作所 | 基板保持装置およびドライブリングの製造方法 |
CN114527592A (zh) * | 2020-11-23 | 2022-05-24 | 群创光电股份有限公司 | 电子装置及其制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6648733B2 (en) * | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
GB2334205B (en) * | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
US6159643A (en) * | 1999-03-01 | 2000-12-12 | Advanced Micro Devices, Inc. | Extreme ultraviolet lithography reflective mask |
CN100368496C (zh) * | 1999-08-13 | 2008-02-13 | 卡伯特微电子公司 | 抛光***及其使用方法 |
JP3664676B2 (ja) * | 2001-10-30 | 2005-06-29 | 信越半導体株式会社 | ウェーハの研磨方法及びウェーハ研磨用研磨パッド |
JP2003257910A (ja) * | 2001-12-28 | 2003-09-12 | Fujikoshi Mach Corp | 基板における銅層の研磨方法 |
CN1684799A (zh) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | 平面化用的抛光垫片 |
JP4234991B2 (ja) * | 2002-12-26 | 2009-03-04 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板 |
DE10302342A1 (de) * | 2003-01-17 | 2004-08-05 | Schott Glas | Substrat für die EUV-Mikrolithographie und Herstellverfahren hierfür |
JP4790973B2 (ja) * | 2003-03-28 | 2011-10-12 | Hoya株式会社 | 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板 |
US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
-
2006
- 2006-03-29 AT AT06111884T patent/ATE417700T1/de not_active IP Right Cessation
- 2006-03-29 DE DE602006004241T patent/DE602006004241D1/de active Active
- 2006-03-29 TW TW095110977A patent/TWI315886B/zh not_active IP Right Cessation
- 2006-03-29 EP EP06111884A patent/EP1710045B1/en not_active Not-in-force
- 2006-04-04 KR KR1020060030531A patent/KR100850732B1/ko not_active IP Right Cessation
- 2006-04-06 US US11/398,703 patent/US7553768B2/en not_active Expired - Fee Related
- 2006-04-07 CN CN2006100793850A patent/CN1845007B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7553768B2 (en) | 2009-06-30 |
EP1710045B1 (en) | 2008-12-17 |
EP1710045A1 (en) | 2006-10-11 |
ATE417700T1 (de) | 2009-01-15 |
CN1845007A (zh) | 2006-10-11 |
KR100850732B1 (ko) | 2008-08-06 |
TW200701303A (en) | 2007-01-01 |
KR20060107319A (ko) | 2006-10-13 |
DE602006004241D1 (de) | 2009-01-29 |
US20060226124A1 (en) | 2006-10-12 |
CN1845007B (zh) | 2011-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |