TW200600261A - Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method - Google Patents
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing methodInfo
- Publication number
- TW200600261A TW200600261A TW094112745A TW94112745A TW200600261A TW 200600261 A TW200600261 A TW 200600261A TW 094112745 A TW094112745 A TW 094112745A TW 94112745 A TW94112745 A TW 94112745A TW 200600261 A TW200600261 A TW 200600261A
- Authority
- TW
- Taiwan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- manufacturing process
- mgr
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 mgr;m, a core roughness depth (Rk) of 12 to 50 mgr;m and a reduced peak height (Rpk) of 7 to 40 mgr;m, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004125064 | 2004-04-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200600261A true TW200600261A (en) | 2006-01-01 |
TWI290505B TWI290505B (en) | 2007-12-01 |
Family
ID=34935462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094112745A TWI290505B (en) | 2004-04-21 | 2005-04-21 | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050239380A1 (en) |
EP (1) | EP1588803A1 (en) |
KR (1) | KR100640141B1 (en) |
CN (1) | CN100537143C (en) |
TW (1) | TWI290505B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI568541B (en) * | 2010-12-22 | 2017-02-01 | Jsr Corp | Chemical mechanical grinding method |
TWI822861B (en) * | 2018-09-28 | 2023-11-21 | 日商富士紡控股股份有限公司 | Polishing pad and method of manufacturing same |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070161720A1 (en) * | 2005-11-30 | 2007-07-12 | Applied Materials, Inc. | Polishing Pad with Surface Roughness |
JP2007255277A (en) * | 2006-03-23 | 2007-10-04 | Jtekt Corp | Cam follower |
US8388799B2 (en) * | 2008-01-24 | 2013-03-05 | Jsr Corporation | Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method |
US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
JP2014095392A (en) * | 2012-11-07 | 2014-05-22 | Toyota Motor Corp | Gear and manufacturing method thereof |
JP6010511B2 (en) | 2013-08-22 | 2016-10-19 | 株式会社荏原製作所 | Method for measuring surface roughness of polishing pad |
KR102176900B1 (en) * | 2016-10-31 | 2020-11-10 | 교세라 가부시키가이샤 | Probe card substrate, probe card and inspection device |
JP6419391B2 (en) * | 2016-11-29 | 2018-11-07 | 京セラ株式会社 | Watch case |
JPWO2018181347A1 (en) * | 2017-03-31 | 2020-03-05 | 古河電気工業株式会社 | Polishing pad |
JP7083256B2 (en) | 2018-02-19 | 2022-06-10 | 富士電機株式会社 | Semiconductor module and its manufacturing method |
US11759909B2 (en) * | 2020-06-19 | 2023-09-19 | Sk Enpulse Co., Ltd. | Polishing pad, preparation method thereof and method for preparing semiconductor device using same |
CN112461265B (en) * | 2020-11-20 | 2023-03-24 | 大连理工大学 | Nano manufacturing method of quartz hemispherical harmonic oscillator |
KR102512675B1 (en) * | 2020-12-30 | 2023-03-21 | 에스케이엔펄스 주식회사 | Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08216029A (en) | 1995-02-07 | 1996-08-27 | Daiki:Kk | Precision-polishing sheet |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
JP3668046B2 (en) | 1998-05-11 | 2005-07-06 | 株式会社東芝 | Polishing cloth and method for manufacturing semiconductor device using the polishing cloth |
JP3918359B2 (en) | 1998-05-15 | 2007-05-23 | Jsr株式会社 | Polymer composition for polishing pad and polishing pad |
JP2000296461A (en) * | 1999-04-13 | 2000-10-24 | Speedfam-Ipec Co Ltd | Backing pad structure |
US6641471B1 (en) * | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
US6679769B2 (en) * | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
JP2003039329A (en) * | 2001-08-02 | 2003-02-13 | Mitsubishi Materials Corp | Single layer grinding wheel and manufacturing method therefor |
WO2003032379A1 (en) * | 2001-10-09 | 2003-04-17 | Hitachi Chemical Co., Ltd. | Polishing pad for cmp, method for polishing substrate using it and method for producing polishing pad for cmp |
TWI260256B (en) * | 2002-03-25 | 2006-08-21 | Thomas West Inc | Conditioner and conditioning methods for smooth pads |
US20030216111A1 (en) * | 2002-05-20 | 2003-11-20 | Nihon Microcoating Co., Ltd. | Non-foamed polishing pad and polishing method therewith |
JP4790973B2 (en) * | 2003-03-28 | 2011-10-12 | Hoya株式会社 | Method for manufacturing glass substrate for information recording medium using polishing pad and glass substrate for information recording medium obtained by the method |
JP2004303983A (en) * | 2003-03-31 | 2004-10-28 | Fuji Photo Film Co Ltd | Polishing pad |
-
2005
- 2005-04-20 KR KR1020050032612A patent/KR100640141B1/en active IP Right Grant
- 2005-04-20 EP EP05008645A patent/EP1588803A1/en not_active Withdrawn
- 2005-04-21 US US11/110,728 patent/US20050239380A1/en not_active Abandoned
- 2005-04-21 CN CNB2005100788237A patent/CN100537143C/en not_active Expired - Fee Related
- 2005-04-21 TW TW094112745A patent/TWI290505B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI568541B (en) * | 2010-12-22 | 2017-02-01 | Jsr Corp | Chemical mechanical grinding method |
TWI822861B (en) * | 2018-09-28 | 2023-11-21 | 日商富士紡控股股份有限公司 | Polishing pad and method of manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
EP1588803A1 (en) | 2005-10-26 |
US20050239380A1 (en) | 2005-10-27 |
KR100640141B1 (en) | 2006-10-31 |
TWI290505B (en) | 2007-12-01 |
CN1699019A (en) | 2005-11-23 |
KR20060047248A (en) | 2006-05-18 |
CN100537143C (en) | 2009-09-09 |
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