TWI315244B - - Google Patents
Info
- Publication number
- TWI315244B TWI315244B TW98104232A TW98104232A TWI315244B TW I315244 B TWI315244 B TW I315244B TW 98104232 A TW98104232 A TW 98104232A TW 98104232 A TW98104232 A TW 98104232A TW I315244 B TWI315244 B TW I315244B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006190822 | 2006-07-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200930524A TW200930524A (en) | 2009-07-16 |
TWI315244B true TWI315244B (ja) | 2009-10-01 |
Family
ID=38923081
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98104232A TW200930524A (en) | 2006-07-11 | 2007-07-10 | Multijoint robot |
TW98104233A TW200932456A (en) | 2006-07-11 | 2007-07-10 | Multijoint robot |
TW96125092A TW200817151A (en) | 2006-07-11 | 2007-07-10 | Multijoint robot |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98104233A TW200932456A (en) | 2006-07-11 | 2007-07-10 | Multijoint robot |
TW96125092A TW200817151A (en) | 2006-07-11 | 2007-07-10 | Multijoint robot |
Country Status (5)
Country | Link |
---|---|
JP (3) | JP4168410B2 (ja) |
KR (3) | KR100914387B1 (ja) |
CN (3) | CN101844359B (ja) |
TW (3) | TW200930524A (ja) |
WO (1) | WO2008007516A1 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4655228B2 (ja) * | 2006-07-11 | 2011-03-23 | 株式会社安川電機 | 多関節ロボットおよび多関節ロボットの移送方法 |
JP2010064219A (ja) * | 2008-09-12 | 2010-03-25 | Yaskawa Electric Corp | 多関節ロボット |
JP4591624B1 (ja) * | 2010-03-12 | 2010-12-01 | 株式会社安川電機 | 産業用ロボット |
KR200466172Y1 (ko) * | 2010-04-28 | 2013-04-09 | 히라따기꼬오 가부시키가이샤 | 기판반송로봇 |
JP5376065B2 (ja) * | 2010-09-13 | 2013-12-25 | トヨタ自動車株式会社 | サポートアーム |
KR101211911B1 (ko) * | 2010-11-02 | 2012-12-13 | 주식회사 로보스타 | 표시장치용 패널의 반전로봇 |
KR101682465B1 (ko) * | 2010-11-17 | 2016-12-05 | 삼성전자 주식회사 | 기판이송로봇 |
JP5847393B2 (ja) | 2010-11-30 | 2016-01-20 | 川崎重工業株式会社 | 搬送ロボット |
CN102145488B (zh) * | 2011-02-14 | 2012-12-26 | 山东爱通工业机器人科技有限公司 | 一种柔性四自由度机械手 |
JP5565345B2 (ja) * | 2011-03-07 | 2014-08-06 | 株式会社安川電機 | 搬送ロボット |
CN102152297B (zh) * | 2011-03-16 | 2013-04-10 | 哈尔滨工业大学 | 一种串联型r轴扩展机械臂 |
CN102126208B (zh) * | 2011-03-16 | 2012-09-19 | 哈尔滨工业大学 | 一种并联型r轴扩展机械臂 |
CN102161199B (zh) * | 2011-03-16 | 2012-09-19 | 哈尔滨工业大学 | 一种用于硅片传输机器人的w轴同轴传动机构 |
CN102126209B (zh) * | 2011-03-16 | 2012-08-15 | 哈尔滨工业大学 | 一种用于硅片传输机器人的w轴差轴传动机构 |
JP5387622B2 (ja) * | 2011-06-17 | 2014-01-15 | 株式会社安川電機 | 搬送ロボット |
JP5429256B2 (ja) * | 2011-10-03 | 2014-02-26 | 株式会社安川電機 | ロボットシステム |
JP5768827B2 (ja) * | 2013-03-14 | 2015-08-26 | 株式会社安川電機 | ロボットシステムおよびワークの搬送方法 |
KR101458697B1 (ko) * | 2013-04-19 | 2014-11-05 | 현대중공업 주식회사 | 기판 이송장치 및 이를 이용한 기판 이송방법 |
JP6295037B2 (ja) * | 2013-08-08 | 2018-03-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
KR101506188B1 (ko) * | 2013-08-30 | 2015-03-26 | 주식회사 로보스타 | 멀티플 암을 구비한 반송 로봇 |
JP6352016B2 (ja) * | 2014-03-27 | 2018-07-04 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN105922233B (zh) * | 2016-06-28 | 2018-08-07 | 江苏捷帝机器人股份有限公司 | 一种高精准智能化机械臂及其工作方法 |
CN106041876B (zh) * | 2016-06-28 | 2019-01-29 | 江苏捷帝机器人股份有限公司 | 一种全方位移动的智能化机械臂及其工作方法 |
CN105922242B (zh) * | 2016-06-28 | 2018-06-29 | 江苏捷帝机器人股份有限公司 | 一种高效的智能化机械臂及其工作方法 |
CN106175934B (zh) * | 2016-06-29 | 2019-04-30 | 微创(上海)医疗机器人有限公司 | 手术机器人及其机械臂 |
CN106078724B (zh) * | 2016-06-29 | 2020-01-24 | 微创(上海)医疗机器人有限公司 | 机械臂及其手术机器人 |
JP6873881B2 (ja) * | 2017-10-13 | 2021-05-19 | 日本電産サンキョー株式会社 | 産業用ロボット |
KR102059445B1 (ko) | 2017-11-28 | 2019-12-27 | 주식회사 엠티에스이 | 이동식 워크 테이블 |
CN108608460A (zh) * | 2018-04-23 | 2018-10-02 | 深圳市华星光电半导体显示技术有限公司 | 机械臂结构及机器人 |
CN110549354A (zh) * | 2018-05-31 | 2019-12-10 | 北新集团建材股份有限公司 | 下抄式机械抓取夹具 |
CN110454554A (zh) * | 2019-08-26 | 2019-11-15 | 苏州领裕电子科技有限公司 | 一种单轴折叠手臂直线模组 |
JP2022104004A (ja) * | 2020-12-28 | 2022-07-08 | 日本電産サンキョー株式会社 | 産業用ロボット |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58109284A (ja) * | 1981-12-22 | 1983-06-29 | 株式会社小松製作所 | ロボツト装置 |
GB2287045B (en) * | 1994-03-04 | 1997-05-14 | Joseph Michael | Programmable materials |
JP2599571B2 (ja) * | 1994-05-11 | 1997-04-09 | ダイトロンテクノロジー株式会社 | 基板搬送ロボット |
JPH11347982A (ja) * | 1998-06-02 | 1999-12-21 | Mecs Corp | 搬送ロボットの摺動部構造 |
CN2341778Y (zh) * | 1998-12-02 | 1999-10-06 | 和椿事业股份有限公司 | 机械手臂 |
JP3973006B2 (ja) * | 2000-03-23 | 2007-09-05 | 日本電産サンキョー株式会社 | ダブルアーム型ロボット |
JP2003158170A (ja) * | 2001-11-20 | 2003-05-30 | Aitec:Kk | 基板用カセットのスロット検出装置 |
CN2637135Y (zh) * | 2003-07-02 | 2004-09-01 | 陕西科技大学 | 凸轮式提升转位机械手 |
CN100342519C (zh) * | 2003-07-16 | 2007-10-10 | 东京毅力科创株式会社 | 搬送装置及驱动机构 |
JP4063781B2 (ja) * | 2004-03-04 | 2008-03-19 | 株式会社ラインワークス | 搬送装置 |
KR101108767B1 (ko) * | 2006-07-11 | 2012-03-13 | 가부시키가이샤 야스카와덴키 | 다관절 로봇 및 배선 방법 |
-
2007
- 2007-06-15 CN CN 201010188567 patent/CN101844359B/zh active Active
- 2007-06-15 KR KR1020087018494A patent/KR100914387B1/ko active IP Right Grant
- 2007-06-15 WO PCT/JP2007/062154 patent/WO2008007516A1/ja active Application Filing
- 2007-06-15 JP JP2007548639A patent/JP4168410B2/ja active Active
- 2007-06-15 CN CN2010101885593A patent/CN101863015B/zh active Active
- 2007-06-15 CN CN2007800014784A patent/CN101360589B/zh active Active
- 2007-06-15 KR KR1020087018493A patent/KR101120824B1/ko active IP Right Grant
- 2007-07-10 TW TW98104232A patent/TW200930524A/zh unknown
- 2007-07-10 TW TW98104233A patent/TW200932456A/zh unknown
- 2007-07-10 TW TW96125092A patent/TW200817151A/zh unknown
- 2007-11-19 JP JP2007299111A patent/JP4596375B2/ja active Active
-
2008
- 2008-04-28 KR KR20087010138A patent/KR100914386B1/ko active IP Right Grant
-
2010
- 2010-09-01 JP JP2010195489A patent/JP5077406B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP5077406B2 (ja) | 2012-11-21 |
JP2010274413A (ja) | 2010-12-09 |
KR100914387B1 (ko) | 2009-08-28 |
TW200817151A (en) | 2008-04-16 |
KR20080081196A (ko) | 2008-09-08 |
CN101844359B (zh) | 2013-06-05 |
KR101120824B1 (ko) | 2012-03-23 |
JP4596375B2 (ja) | 2010-12-08 |
KR100914386B1 (ko) | 2009-08-28 |
TWI315243B (ja) | 2009-10-01 |
KR20080082606A (ko) | 2008-09-11 |
CN101360589B (zh) | 2011-02-09 |
CN101844359A (zh) | 2010-09-29 |
JP2008155361A (ja) | 2008-07-10 |
TW200930524A (en) | 2009-07-16 |
KR20080081197A (ko) | 2008-09-08 |
JP4168410B2 (ja) | 2008-10-22 |
JPWO2008007516A1 (ja) | 2009-12-10 |
CN101360589A (zh) | 2009-02-04 |
TW200932456A (en) | 2009-08-01 |
WO2008007516A1 (fr) | 2008-01-17 |
CN101863015B (zh) | 2012-02-15 |
TWI357375B (ja) | 2012-02-01 |
CN101863015A (zh) | 2010-10-20 |
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