TWI313055B - - Google Patents

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TWI313055B
TWI313055B TW092126928A TW92126928A TWI313055B TW I313055 B TWI313055 B TW I313055B TW 092126928 A TW092126928 A TW 092126928A TW 92126928 A TW92126928 A TW 92126928A TW I313055 B TWI313055 B TW I313055B
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Taiwan
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base
wiring
solid
opening
imaging device
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TW092126928A
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TW200423390A (en
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Koichi Yamauchi
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Panasonic Corporatio
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

1313055 玖、發明說明： 【發明所屬之技術領域】 本發明，係關於將CCD等攝影元件搭載於基台所構成 之固態攝影裝置及其製造方法。 【先前技術】 固態攝影裝置，廣泛使用於錄影機與靜物攝影機等， 將CCD等之攝影元件搭載於以絕緣性材料構成之基台，以 透光板覆蓋受光區域之封包形態加以提供。為進行裝置之 小型化，攝影元件係以裸晶片的狀態搭載於基台（例如， 請參照特開2_-58805號公報）。以下，參照圖7，說明 此種固態攝影裝設置之習知例。 中之基台31，係由陶瓷或可塑性樹脂構 面形狀係中央部具有開口部32之框狀。基台31:下面+ 沿開口部32周緣之區域凹陷而形成凹部33。於基台31的 下面’從開口部32附近至外周端面，附設有由鍍金層所構 f之配線34。在凹部33之形成配線34之面，搭載由⑽ 等構成之攝影元件35 ’並連接配線34。攝影元件35，係 配置成其受光區域；& a 飞面向開口部32。於基台31上面， 安裝有由玻璃構成之透光板36以覆蓋開口部Μ。於攝系 元件35之端部周邊充填密封樹月旨37，將攝影元件π之端 部與基台31間之間阵、力n j 門障加以被封。如以上之說明，受光區域 35a係配置在形成於開口部&之閉鎖空間内。 …暴？/元件35之與文光區域35a相同的面，配置與受 先£域35a之電路相連接的電極焊塾（未圖示），電極焊塾 1313055 上設有突塊(突起電極)38。配線34之與開口部32相鄰端 部形成有内部端子部’透過突塊38與攝影元件35之電極 焊墊連接。 此固恶攝影裝置，如圖所示，係在將透光板％側朝向 上方的狀態搭載於電路基板上。配線34之配置在基台Μ 外周端部（凹部33之外側部分）下面的部分形成為外部端子 P係用來共電路基板上之電極連接。於透光板％上部， 裝有攝〜光子系統之鏡筒(未圖示），係將與受光區域心 彼此之位置關係設定於既定精度而裝著於其上。通過安麥 於鏡筒之攝影光學系統， 木自被攝衫對象之光被聚光於受 光£域35a，進行光電轉換。 件35又之SI所不構成之基台31構造不同’搭載攝影元 之面：具有凹部33’使用其全體具有平坦平板形狀 之基σ的固恶攝影梦罢介& _ 9ηη〇 亦為眾所周知（例如，請參昭料門 2002-43554號公鉬、± 月乂…、特開 0守，配置在基台外周端部之外％ Γ與電路基板上之電極，係以直徑大的焊球等加2 板之面的間隔。“—35之下面與電路基 平，：而’上述習知例之固態攝影裝置之構成，基”h 千坦度卻不充分。也就是說，由於基台31係且有：1之 32之框狀，因此於苴哉& 係具有開口部 . 4 、/、截面形狀有產生扭曲或翹起之傾6 田龢载攝影兀件35之 〈1負向。 元件35之位置即不安定 之面之平坦度不佳時，攝影 丨个女疋，而無法以良好锫 於受光區域35a。 π又將鏡筒定位 !313〇55 此外’金屬薄板引腳，可藉由金屬薄板之切斷加工以 良好之尺寸精度、較少之偏差、且低成本來加以製造。 再者’藉由金屬溥板引腳之使用，與使用電鑛之情形 相較’能使配線4之厚度充分的加大。因此，如圖1所示 的當配線4之端面露出於基台丨之外端面，以焊接來連接 電路基板上之電極與配線4時，能於配線4之端面充分的 形成焊錫的切角。其結果，能獲得焊接之充分的接合強度 。因此，不需如圖7之習知例般，將配線橫亙形成在基台籲 之外端面，製程非常簡單。 此外，如前所述，將構成配線4之金屬薄板引腳的中 間邛4c埋在形成基台1之樹脂中的話，即能避免來自金屬 薄板引腳面之反射、漏光對收光區域5a造成影響。 《實施形態2》 食 “只〜Wώ <因悲躡影裝】
與實細形恶1相同之要素，係賦予相同的參照號碼並負 其說明。I實施形態中，之構造與實施形態U 。平面形狀為矩形之基台10，其截面形狀係全體具有才 厚度之平坦的板狀，並不具有實施形態}之凹部。板片 基台10之中央部形成開口部u，攝影元件5係以其5 區域5a面向開口部u之方式搭載於其上。 於基台10的下面，從開口部Π之周緣近至基台u 外周端面’附設有由金屬薄板引腳所料之複數條配線 在與攝影7L件5之受光區域5a相同面配置之電極焊 未圖示)上設有突塊8,突塊8係與各配線12之該部丨] 13

Claims (1)

  1. 2009 年 1 131305^ 月 拾、申請專利範園： 1·-種固態攝影裝置，具傷：具有在内部區域形成開 之框狀平面形狀、由絕緣性材料所構成的基台，從附 言史在s亥基台之一面的每· P弓π Ar7 / , ^ 4側區域朝該基台外周端延伸 的複數條配線，在該基台之設有該配線之面、以該開口部 區域之方式搭载的攝影元件’該各配線之該基台 開口部側及外周端側之各端部，分別形成内部端子部及外 部端子部，該攝影元件之電極與該配線之該内部端子部係 電氣連接，其特徵在於： 該配線係由金屬薄板引腳形成，該基台係由埋入有該 金屬薄板引腳之側部端面厘择 ο Η端面厚度方向之至少—部分的樹脂成 形體所形成，至少續#工# 主乂》亥外邛端子部下面係從該基台下面露出 0 19 1313055 f月柯修(更)正替換頁 ’係從該基台表面突出。 6·如申請專利範圍第丨項之固態攝影裝置，其中，該 基台具有複數個形成於其厚度方向之定位孔，該攝影元件 係配置在該定位孔成既定之平面位置關係。 7 ·如申請專利範圍第6項之固態攝影裝置，其中，複 數個該定位孔係分別配置在該基台平面形狀之非對稱位置 〇 8 ·如申请專利範圍第6項之固態攝影裝置，其中，配 置有不同直徑之複數個該定位孔。 ^ 9·如申請專利範圍第δ項之固態攝影裝置，其中，該 疋位孔係貫通該基台之厚度方向，該攝影元件搭載面之直 徑小於其裏面之直徑。 10 ·如申請專利範圍帛丨項之固態攝影裝置，其中， :金屬薄板引腳之側部端面全部埋設於該基台巾，該金屬 溥板引腳之表面整體露出。 11· -種固態攝影裝置之製造方法，該固態攝影裝置 ，具備：纟有在内部區域形成開口部之框狀平面形狀、由 絕緣性材料所構成的基台，#附設在該基台之—面的該開 口部倒區域朝該基台外周端延伸的複數條配線，在該基台 之設有該配線之面、以該開口部面向受光區域之方式搭載 的攝衫7G件，該各配線之該基台開σ部側及外周端侧之各 端部’分㈣成㈣端子部及外部端子部，該攝影元件之 電極與該配線之該㈣端子部係電氣連接，其特徵在於： 使用-對模具與引腳框架，該模具係形成用來使該基 20 1313055 聲(更)正替換頁 台成形之空腔者，該引腳框架係形成該配線之金屬薄板引 腳、與對應該基台之該開口部形狀之補強板部，在彼此之 交界部分以半切斷狀態連結者； 以該金屬薄板引腳位於以該一對模具形成之該空腔内， S亥補強板位於對應該開口部部分的方式，將該引腳框架安 裝於該一對模具之間； 於該空腔充填密封樹脂並使其硬化； 將埋有该金屬薄板引腳、形成為該基台狀之樹脂成形 體從該模具中取出； 將該補強板從該金屬薄板引腳分離以獲得該基台； 將该攝影元件實裝於該基台之附設該配線之面。 12·如申請專利範圍第u項之固態攝影裝置之製造方 去其中，於該一對模具中之一方形成用來形成該空腔之 I部，於另一模具與該引腳框架之間介在毛邊抑制薄片， 來進行該基台之成形。 拾壹、圖式： 如次頁。 21 1313055 7脾/月Z2E]修(更)正替換頁 柒、指定代表圖： (一） 本案指定代表圖為：第（1 )圖。 (二) 本代表圖之元件代表符號簡單說明： 1 基台 2 矩形開口部 3 矩形凹部 4 配線 4a 内部端子部 4b 外部端子部 5 攝影元件 5a 受光區域 6 透光板 7 密封樹脂 8 突塊 9 定位孔 捌、本案若有化學式時，請揭示最能顯示發明特徵的化學式
TW092126928A 2003-04-28 2003-09-30 Solid-state photographing apparatus and its manufacturing method TW200423390A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003123841A JP3768972B2 (ja) 2003-04-28 2003-04-28 固体撮像装置およびその製造方法

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TW200423390A TW200423390A (en) 2004-11-01
TWI313055B true TWI313055B (zh) 2009-08-01

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TW092126928A TW200423390A (en) 2003-04-28 2003-09-30 Solid-state photographing apparatus and its manufacturing method

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US (2) US7154156B2 (zh)
EP (1) EP1473777B1 (zh)
JP (1) JP3768972B2 (zh)
KR (1) KR100603918B1 (zh)
CN (1) CN100433339C (zh)
DE (1) DE60319678T2 (zh)
TW (1) TW200423390A (zh)

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TW200514484A (en) * 2003-10-08 2005-04-16 Chung-Cheng Wang Substrate for electrical device and methods of fabricating the same
JP4290134B2 (ja) * 2005-03-14 2009-07-01 パナソニック株式会社 固体撮像装置と固体撮像装置の製造方法
CN101630687B (zh) * 2005-03-25 2011-11-23 住友化学株式会社 固体摄像装置、固体摄像元件收纳盒以及制造方法
CN100583953C (zh) * 2005-04-01 2010-01-20 松下电器产业株式会社 摄像装置
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CN100433339C (zh) 2008-11-12
KR100603918B1 (ko) 2006-07-24
US7367120B2 (en) 2008-05-06
TW200423390A (en) 2004-11-01
EP1473777A3 (en) 2005-01-05
US7154156B2 (en) 2006-12-26
EP1473777B1 (en) 2008-03-12
JP3768972B2 (ja) 2006-04-19
US20070069319A1 (en) 2007-03-29
JP2004327916A (ja) 2004-11-18
US20040211986A1 (en) 2004-10-28
DE60319678D1 (de) 2008-04-24
KR20040093360A (ko) 2004-11-05
EP1473777A2 (en) 2004-11-03
CN1542979A (zh) 2004-11-03

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