TWM515761U - Combination structure of heat-dissipation device - Google Patents
Combination structure of heat-dissipation device Download PDFInfo
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- TWM515761U TWM515761U TW104217989U TW104217989U TWM515761U TW M515761 U TWM515761 U TW M515761U TW 104217989 U TW104217989 U TW 104217989U TW 104217989 U TW104217989 U TW 104217989U TW M515761 U TWM515761 U TW M515761U
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Description
本創作有關於一種散熱裝置組合結構，尤指一種具有增加散熱面積與提升熱管利用率的效果。This creation relates to a heat sink assembly structure, especially an effect of increasing the heat dissipation area and improving the heat pipe utilization rate.
一般電子元件運作時皆會產生熱，特別是近來隨著科技的進步，電子產品的功能及性能大為提升後，其內部產生的熱更是大幅地增加，為此，大多電子元件均需配設散熱裝置，藉以控制工作溫度而維持電子元件之正常運作，其中，將多片層層疊置的散熱鰭片中穿設有熱管之散熱器，即為常見的一種散熱裝置。In general, electronic components generate heat when they operate. Especially with the advancement of technology, the function and performance of electronic products are greatly improved, and the heat generated inside them is greatly increased. For this reason, most electronic components are required to be equipped. A heat dissipating device is provided to maintain the normal operation of the electronic component by controlling the operating temperature. Among them, a heat sink having a heat pipe is disposed in a plurality of stacked heat dissipating fins, which is a common heat dissipating device.
習知的散熱裝置通常係包括一導熱座、複數熱管以及複數散熱鰭片，導熱座底側貼接於一發熱元件(如處理器或圖形顯示器)上，該等熱管係呈U型熱管，且該每一熱管包含一呈水平的吸熱部以及分別從吸熱部兩端延伸而出的一放熱部。該等熱管之吸熱部係嵌設於導熱座的相反底側之另一側上，而該等散熱鰭片則是一一穿接於熱管之放熱部上。所以發熱元件所產生的熱量係先傳導至導熱座，該導熱座再將熱量傳至熱管，最後熱量由熱管傳至散熱鰭片，並再藉由散熱鰭片的表面與周遭空氣進行熱交換將熱能散逸至空氣中。The conventional heat dissipating device generally includes a heat conducting seat, a plurality of heat pipes and a plurality of heat dissipating fins, and the bottom side of the heat conducting seat is attached to a heating element (such as a processor or a graphic display), and the heat pipes are U-shaped heat pipes, and Each of the heat pipes includes a horizontal heat absorbing portion and a heat releasing portion extending from both ends of the heat absorbing portion. The heat absorbing portions of the heat pipes are embedded on the other side of the opposite bottom side of the heat conducting seat, and the heat radiating fins are respectively connected to the heat radiating portion of the heat pipe. Therefore, the heat generated by the heating element is first transmitted to the heat conducting seat, and the heat conducting seat transfers the heat to the heat pipe, and finally the heat is transferred from the heat pipe to the heat radiating fin, and then the heat exchange between the surface of the heat radiating fin and the surrounding air is performed. Heat dissipates into the air.
雖習知的散熱裝置可達到散熱的效果，可是習知散熱裝置在實際使用上仍具有一些缺失，就是該等散熱鰭片在與該等熱管結合時，僅能在熱管於直管(即放熱部)處穿接結合，而於目前習知技術上在吸熱部與放熱部間的彎曲部分上仍一直無法克服設計穿接散熱鰭片，使得熱管的彎曲部分此段空間便受到限制無法有效利用，只能保留空間讓空氣通過，以導致降低了熱管的利用率及無法增加散熱面積的問題。此外，因受到發熱元件的功率提升，在有限空間下的設計，散熱面積已經達到飽和，使得會影響散熱裝置之整體散熱效能是目前業者積極努力克服的問題。Although the conventional heat dissipating device can achieve the effect of dissipating heat, the conventional heat dissipating device still has some defects in practical use, that is, when the heat dissipating fins are combined with the heat pipes, the heat pipes can only be in the straight pipe (ie, the heat release) In the prior art, the bending portion of the heat absorbing portion and the heat releasing portion is still unable to overcome the design of the heat sinking fins, so that the curved portion of the heat pipe is limited in this space and cannot be effectively utilized. Only space can be reserved for air to pass, resulting in a problem of reduced heat pipe utilization and an inability to increase heat dissipation area. In addition, due to the power increase of the heating element, the design of the heat dissipation area has reached saturation in the design of the limited space, so that the overall heat dissipation performance of the heat sink device is affected by the current efforts of the industry.
爰此，為有效解決上述之問題，本創作之主要目的在提供一種提升熱管利用率及增加散熱面積的散熱裝置組合結構。Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat sink assembly structure that improves heat pipe utilization and increases heat dissipation area.
本創作之另一目的在提供一種具有提升散熱效能的散熱裝置組合結構。Another object of the present invention is to provide a heat sink assembly structure having improved heat dissipation performance.
為達上述目的，本創作係提供一種散熱裝置組合結構，係包括至少一熱管、一第一散熱鰭片組與一第二散熱鰭片組，該熱管具有一吸熱部、至少一放熱部及連接該吸熱部與該放熱部的彎曲部，該第一散熱鰭片組具有相堆疊的複數第一散熱鰭片，該等第一散熱鰭片具有複數開槽，該彎曲部套設於相對該等開槽中，且該等開槽界定有一開放側與一相對開放側的一封閉側，該封閉側沿該彎曲部的一彎曲外側相貼設，而該第二散熱鰭片組係相對該第一散熱鰭片組，該第二散熱鰭片組具有相堆疊的複數第二散熱鰭片，該等第二散熱鰭片具有複數穿孔，該放熱部套設於對應該等穿孔中；透過本創作此結構設計，得有效達到提升熱管利用率及增加散熱面積的效果，進而更有效提升散熱裝置組合結構整體的散熱效能者。In order to achieve the above object, the present invention provides a heat dissipating device assembly structure including at least one heat pipe, a first heat sink fin group and a second heat sink fin group, the heat pipe having a heat absorbing portion, at least one heat releasing portion, and a connection The heat absorbing portion and the curved portion of the heat radiating portion, the first heat radiating fin group has a plurality of first heat radiating fins stacked, the first heat radiating fins have a plurality of slots, and the bending portion is sleeved on the opposite side In the slot, the slots define a closed side and a closed side of the opposite open side, the closed side is attached along a curved outer side of the curved portion, and the second heat sink fin set is opposite to the first a heat dissipation fin set, the second heat dissipation fin set has a plurality of second heat dissipation fins stacked in a row, the second heat dissipation fins have a plurality of perforations, and the heat dissipation portion is sleeved in a corresponding perforation; The structural design can effectively achieve the effect of improving the heat pipe utilization rate and increasing the heat dissipation area, thereby further improving the overall heat dissipation performance of the heat sink assembly structure.
1‧‧‧散熱裝置組合結構1‧‧‧ Heat sink assembly structure
11‧‧‧熱管11‧‧‧ Heat pipe
111‧‧‧吸熱部111‧‧‧heat absorption department
112‧‧‧放熱部112‧‧‧heating department
113‧‧‧彎曲部113‧‧‧Bend
115‧‧‧毛細結構115‧‧‧Capillary structure
13‧‧‧第一散熱鰭片組13‧‧‧First heat sink fin set
131‧‧‧第一散熱鰭片131‧‧‧First heat sink fin
1311‧‧‧開槽1311‧‧‧ slotting
1312‧‧‧開放側1312‧‧‧ open side
1313‧‧‧封閉側1313‧‧‧ Closed side
1315‧‧‧折邊1315‧‧‧Folding
14‧‧‧第二散熱鰭片組14‧‧‧Second heat sink fin set
141‧‧‧第二散熱鰭片141‧‧‧Second heat sink fins
1411‧‧‧穿孔1411‧‧‧Perforation
15‧‧‧基座15‧‧‧Base
151‧‧‧溝槽151‧‧‧ trench
第1圖係顯示本創作之較佳實施例之分解之立體示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing an exploded view of a preferred embodiment of the present invention.
第2圖係顯示本創作之較佳實施例之組合之立體示意圖。Figure 2 is a perspective view showing a combination of preferred embodiments of the present invention.
第3圖係顯示本創作之較佳實施例之第一散熱鰭片組的開槽與熱管彎曲部水平剖面組合的俯視示意圖。Figure 3 is a top plan view showing the combination of the slotting of the first heat sink fin group and the horizontal section of the heat pipe bend of the preferred embodiment of the present invention.
第4圖係顯示本創作之較佳實施例之第一散熱鰭片組的開槽與熱管彎曲部水平剖面組合的另一俯視示意圖。Figure 4 is another top plan view showing the combination of the slotting of the first heat sink fin set and the horizontal section of the heat pipe bend of the preferred embodiment of the present invention.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
本創作提供一種散熱裝置組合結構，係應用安裝設於相對的一發熱元件(如處理器或圖形處理器)上對其進行迅速散熱。參閱第1、2圖示，係顯示本創作之較佳實施例之分解與組合立體示意圖，並輔以參閱第3圖。該散熱裝置組合結構1包括至少一熱管11、一第一散熱鰭片組13、一第二散熱鰭片組14與一基座15，其中前述熱管11於該本較佳實施例係以4個熱管11做說明，但並不侷限於此，於具體實施，該熱管11的數量也可為一個或兩個以上。前述熱管11係大致呈U字形，且具有一吸熱部111、左、右平行的放熱部112及連接該吸熱部111與該放熱部112的彎曲部113，該吸熱部111為一呈扁平狀的水平段，該放熱部112為一垂直段係垂直於該水平段。其中前述熱管11內設有一毛細結構115(如燒結粉末體、金屬網格、溝槽或纖維)，並該熱管內填充有一工作流體(如純水或甲醇)。The present invention provides a heat sink assembly structure that is mounted on an opposite heating element (such as a processor or a graphics processor) for rapid heat dissipation. Referring to Figures 1 and 2, there is shown a schematic exploded view of the preferred embodiment of the present invention, and reference is made to Figure 3. The heat dissipating device assembly structure 1 includes at least one heat pipe 11, a first heat dissipating fin group 13, a second heat dissipating fin group 14, and a pedestal 15, wherein the heat pipe 11 is four in the preferred embodiment. The heat pipe 11 is described, but it is not limited thereto. In the specific implementation, the number of the heat pipes 11 may be one or two or more. The heat pipe 11 has a substantially U-shaped shape, and has a heat absorbing portion 111, a left and right parallel heat radiating portion 112, and a curved portion 113 connecting the heat absorbing portion 111 and the heat radiating portion 112. The heat absorbing portion 111 is flat. In the horizontal section, the heat radiating portion 112 is a vertical segment perpendicular to the horizontal segment. The heat pipe 11 is provided with a capillary structure 115 (such as a sintered powder body, a metal mesh, a groove or a fiber), and the heat pipe is filled with a working fluid (such as pure water or methanol).
該基座15係呈板狀且具有至少一溝槽151，該溝槽151於該較佳實施例係以4個溝槽151做說明，但並不侷限於此。該等溝槽151貫穿該基座15，該等熱管11的吸熱部111係容設於該等溝槽151中，並透過焊接或膠合等方式與基座15固定連接，可吸收來自基座15的熱量，且該吸熱部111的上、下側平齊對應該基座15的頂面與底面，而前述放熱部112位於基座15上方且與基座15大致垂直。The pedestal 15 is plate-shaped and has at least one groove 151. The groove 151 is illustrated by the four grooves 151 in the preferred embodiment, but is not limited thereto. The heat absorbing portions 111 of the heat pipes 11 are received in the grooves 151 and fixedly connected to the susceptor 15 by welding or gluing, and are absorbed from the susceptor 15 . The heat is applied, and the upper and lower sides of the heat absorbing portion 111 are flush with the top surface and the bottom surface of the susceptor 15, and the heat radiating portion 112 is located above the susceptor 15 and substantially perpendicular to the susceptor 15.
前述第一散熱鰭片組13係由複數第一散熱鰭片131相堆疊所組成，該等第一散熱鰭片131具有複數開槽1311，該等開槽1311係沿對應該等熱管11的彎曲部113的延伸方向所構成，並該等熱管11的彎曲部113係被套設於相對該等開槽1311中，且該等開槽1311界定一開放側1312與一相對該開放側1312的一封閉側1313，該封閉側1313沿該彎曲部113的一彎曲外側相貼設，且該熱管11的彎曲部113水平剖面的部分外側輪廓線與相貼對應該等開槽1311的封閉側1313部分輪廓線相一致(如第3圖)，例如第4圖中，8個水平剖面虛線是為由位於相鄰上方該放熱部112的該彎曲部113朝下方該吸熱部111方向依序水平剖面的外側輪廓線，所以從圖4可清楚瞭解該彎曲部113其上每一個水平剖面的部分外側輪廓線會緊貼設相對該等開槽1311的封閉側1313部分輪廓線，藉此讓該等熱管11其上放熱部112與彎曲部113均可被充分利用，以分別與對應該等第一、二散熱鰭片131、141相接觸，以有效提高熱管11的利用率，進而還有效達到增加散熱面積的效果，相對地有利於提高散熱裝置組合結構1的整體散熱效果。其中於該本較佳實施例是透過一治具將二個已相推疊的複數第一散熱鰭片131整個直接一次性分別朝相對該等熱管11的彎曲部113相抵靠接觸後，在透過焊接方式將該等熱管11之彎曲部113的彎曲外側與該封閉側1313相接觸處間連接，藉以達到節省組裝時間及組裝便利及快速的效果。The first heat-dissipating fin group 13 is composed of a plurality of first heat-dissipating fins 131, and the first heat-dissipating fins 131 have a plurality of slots 1311, and the slots 1311 are bent along the heat pipes 11 corresponding thereto. The extending portion of the portion 113 is formed, and the curved portion 113 of the heat pipes 11 is sleeved in the opposite slots 1311, and the slots 1311 define an open side 1312 and a closed portion relative to the open side 1312. Side 1313, the closed side 1313 is attached along a curved outer side of the curved portion 113, and a portion of the outer contour of the horizontal section of the curved portion 113 of the heat pipe 11 is opposite to the closed side 1313 of the groove 1311. The lines are coincident (as shown in FIG. 3). For example, in FIG. 4, the eight horizontal cross-dotted lines are outside the horizontal cross section of the heat absorbing portion 111 from the curved portion 113 of the heat radiating portion 112 adjacent thereto. The contour line, so it can be clearly seen from FIG. 4 that a portion of the outer contour line of each horizontal section of the curved portion 113 abuts a portion of the contour of the closed side 1313 of the slot 1311, thereby allowing the heat pipes 11 to be The upper heat releasing portion 112 and the curved portion 113 can be charged The use of the first and second heat dissipation fins 131 and 141 in contact with each other to effectively improve the utilization rate of the heat pipe 11, thereby effectively achieving the effect of increasing the heat dissipation area, and is relatively advantageous for improving the heat sink assembly structure. 1 overall heat dissipation effect. In the preferred embodiment, the two first heat-dissipating fins 131 that have been pushed together are directly and directly in contact with the curved portion 113 of the heat pipe 11 respectively after being in contact with each other. The welding method connects the curved outer side of the curved portion 113 of the heat pipe 11 to the contact side of the closed side 1313, thereby achieving an assembly time saving and assembly convenience and rapid effect.
另者前述複數第一散熱鰭片131的兩相對邊緣向下彎折延伸形成有一折邊1315，該等第一散熱鰭片131的折邊1315彼此堆疊連接構成所述第一散熱鰭片組13，且於該等開槽1311內的該等第一散熱鰭片131的折邊1315共同構成較大面積的所述封閉側1313，透過較大面積的封閉側1313接觸貼設相對彎曲部113的彎曲外側，藉以可快速將該等熱管11的彎曲部113吸收的熱量傳導至該等第一散熱鰭片131上向外散熱。The two opposite edges of the plurality of first heat dissipation fins 131 are bent downwardly to form a flange 1315. The flanges 1315 of the first heat dissipation fins 131 are stacked on each other to form the first heat dissipation fin group 13 . The flanges 1315 of the first heat dissipation fins 131 in the slots 1311 together form a larger area of the closed side 1313, and the relatively closed side 1313 of the larger area contacts the oppositely bent portion 113. The outer side is bent, so that the heat absorbed by the curved portion 113 of the heat pipes 11 can be quickly transmitted to the first heat dissipation fins 131 to dissipate heat outward.
前述第二散熱鰭片組14係相對連接該第一散熱鰭片組13，且位於該第一散熱鰭片組13上方，該第二散熱鰭片組14具有相堆疊的複數第二散熱鰭片141，該等第二散熱鰭片141具有複數穿孔1411，該放熱部112套設於對應該等穿孔1411中，且該等開槽1311的長度大於該等穿孔1411的長度。The second heat-dissipating fin set 14 is oppositely connected to the first heat-dissipating fin set 13 and located above the first heat-dissipating fin set 13 , and the second heat-dissipating fin set 14 has a plurality of stacked second heat-dissipating fins 141. The second heat dissipating fins 141 have a plurality of through holes 1411. The heat radiating portions 112 are sleeved in the corresponding through holes 1411, and the length of the slots 1311 is greater than the length of the holes 1411.
因此，透過本創作之熱管11的放熱部112與彎曲部113可與對應該第一、二散熱鰭片組13、14相貼設連接的結構設計，使得提高熱管11利用率及增加散熱面積的效果，進而有效提升整體散熱效能。Therefore, the heat radiating portion 112 and the curved portion 113 of the heat pipe 11 of the present invention can be designed to be attached to the first and second heat radiating fin groups 13 and 14 so as to improve the utilization ratio of the heat pipe 11 and increase the heat radiating area. The effect is to effectively improve the overall heat dissipation performance.
在替代實施例中，前述基座15的頂面上可增設一具有複數洞孔供熱管11穿過的壓板（圖中未示出），透過該壓板可壓住固定容設於該基座15內的熱管11之吸熱部111，藉以將熱管11穩固於該基座15上。In an alternative embodiment, a pressure plate (not shown) having a plurality of holes for the heat pipe 11 to pass through can be added to the top surface of the base 15 , and the pressure plate can be pressed and fixed to the base 15 . The heat absorbing portion 111 of the heat pipe 11 therein is used to stabilize the heat pipe 11 on the susceptor 15.
在上述較佳實施例中，本創作之熱管11不侷限於上述大致呈U字形，也可選擇L字形的熱管11可提供上述吸熱部111(即呈扁平狀的水平段)、垂直於吸熱部111的放熱部112(即垂直於水平段的垂直段)及連接吸熱部111與放熱部112的彎曲部113，故本創作使用L字形熱管11，此時熱管11、基座15及該第一、二散熱鰭片組13、14的組合方式可採取上述較佳實施例中的U字形熱管11的組合方式。此外，該等熱管11之吸熱部111可直接與發熱元件相接觸貼設而不需要該基座15。In the above preferred embodiment, the heat pipe 11 of the present invention is not limited to the above-mentioned substantially U-shaped shape, and the heat pipe 11 of the L shape may be provided to provide the heat absorbing portion 111 (ie, a flat horizontal section) and perpendicular to the heat absorbing portion. The heat radiating portion 112 of the 111 (ie, the vertical segment perpendicular to the horizontal segment) and the curved portion 113 connecting the heat absorbing portion 111 and the heat radiating portion 112, the L-shaped heat pipe 11 is used in the present creation, and the heat pipe 11, the pedestal 15 and the first The combination of the two heat dissipation fin groups 13 and 14 can adopt the combination of the U-shaped heat pipes 11 in the above preferred embodiment. In addition, the heat absorbing portion 111 of the heat pipes 11 can be directly attached to the heat generating component without the need for the susceptor 15.
在替代實施例中，該基座15的頂面上可增設一扣具(圖中未示)，該扣具位於二複數第一散熱鰭片131之間的基座15之頂面上，透過該扣具讓該散熱裝置組合結構1可更穩固結合在發熱元件上。In an alternative embodiment, a buckle (not shown) may be added to the top surface of the base 15 , and the buckle is located on the top surface of the base 15 between the plurality of first heat dissipation fins 131 . The clip allows the heat sink assembly 1 to be more securely coupled to the heat generating component.
惟以上所述者，僅係本創作之較佳可行之實施例而已，舉凡利用本創作上述之方法、形狀、構造、裝置所為之變化，皆應包含於本案之權利範圍內。However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention.
1‧‧‧散熱裝置組合結構 1‧‧‧ Heat sink assembly structure
11‧‧‧熱管 11‧‧‧ Heat pipe
111‧‧‧吸熱部 111‧‧‧heat absorption department
112‧‧‧放熱部 112‧‧‧heating department
113‧‧‧彎曲部 113‧‧‧Bend
13‧‧‧第一散熱鰭片組 13‧‧‧First heat sink fin set
131‧‧‧第一散熱鰭片 131‧‧‧First heat sink fin
1311‧‧‧開槽 1311‧‧‧ slotting
1312‧‧‧開放側 1312‧‧‧ open side
1313‧‧‧封閉側 1313‧‧‧ Closed side
1315‧‧‧折邊 1315‧‧‧Folding
14‧‧‧第二散熱鰭片組 14‧‧‧Second heat sink fin set
141‧‧‧第二散熱鰭片 141‧‧‧Second heat sink fins
1411‧‧‧穿孔 1411‧‧‧Perforation
15‧‧‧基座 15‧‧‧Base
151‧‧‧溝槽 151‧‧‧ trench
Claims (6)
至少一熱管，具有一吸熱部、至少一放熱部及連接該吸熱部與該放熱部的彎曲部；
一第一散熱鰭片組，具有相堆疊的複數第一散熱鰭片，該等第一散熱鰭片具有複數開槽，該彎曲部套設於相對該等開槽中，且該等開槽界定有一開放側與一相對開放側的一封閉側，該封閉側沿該彎曲部的一彎曲外側相貼設；及
一第二散熱鰭片組，係相對該第一散熱鰭片組，該第二散熱鰭片組具有相堆疊的複數第二散熱鰭片，該等第二散熱鰭片具有複數穿孔，該放熱部套設於對應該等穿孔中。 A heat sink assembly structure includes:
At least one heat pipe having a heat absorbing portion, at least one heat releasing portion, and a bent portion connecting the heat absorbing portion and the heat releasing portion;
a first heat dissipation fin set having a plurality of first heat dissipation fins stacked in a plurality, the first heat dissipation fins having a plurality of slots, the curved portions being sleeved in the opposite slots, and the slots are defined An open side and a closed side of the opposite open side, the closed side being attached along a curved outer side of the curved portion; and a second heat radiating fin set opposite to the first heat radiating fin set, the second The heat dissipation fin set has a plurality of second heat dissipation fins stacked in a stack, and the second heat dissipation fins have a plurality of through holes, and the heat dissipation portion is sleeved in the corresponding perforations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104217989U TWM515761U (en) | 2015-11-10 | 2015-11-10 | Combination structure of heat-dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104217989U TWM515761U (en) | 2015-11-10 | 2015-11-10 | Combination structure of heat-dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM515761U true TWM515761U (en) | 2016-01-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104217989U TWM515761U (en) | 2015-11-10 | 2015-11-10 | Combination structure of heat-dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM515761U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9909815B2 (en) | 2015-12-01 | 2018-03-06 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
| CN112051701A (en) * | 2019-06-05 | 2020-12-08 | 中强光电股份有限公司 | Heat dissipation module and projection device |
-
2015
- 2015-11-10 TW TW104217989U patent/TWM515761U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9909815B2 (en) | 2015-12-01 | 2018-03-06 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
| CN112051701A (en) * | 2019-06-05 | 2020-12-08 | 中强光电股份有限公司 | Heat dissipation module and projection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |