TWI422315B - Heat sink dissipation - Google Patents
Heat sink dissipation Download PDFInfo
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- TWI422315B TWI422315B TW97138854A TW97138854A TWI422315B TW I422315 B TWI422315 B TW I422315B TW 97138854 A TW97138854 A TW 97138854A TW 97138854 A TW97138854 A TW 97138854A TW I422315 B TWI422315 B TW I422315B
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- heat
- heat sink
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- fin set
- support frame
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明涉及一種散熱裝置,特別係指一種具有良好散熱效果之散熱裝置。 The invention relates to a heat dissipating device, in particular to a heat dissipating device with good heat dissipating effect.
隨著電子產業不斷發展,電子元件(特別係中央處理器)運行速度和整體性能於不斷提升,隨之其發熱量也於不斷增加。為使電子元件能正常工作,業界一般於電子元件上設置散熱器對其進行散熱。通常,該散熱器包括一與發熱電子元件貼設之實心之底座,由底座向上延伸出之複數散熱片,為加強散熱還設有連接底座與散熱片之熱管,以將發熱電子元件之熱量更快地傳至散熱片。然而,由於散熱器之底座為一實心體,發熱電子元件產生之熱量易集中於底座之中央處,不能快速均勻分佈於整個底座上,不利於熱量均勻傳至每一散熱片。此外,於散熱器整體體積不變之情況下,習知結構之散熱片所能提供之散熱面積受到很大限制,從而散熱效率較低。因此,需要提供一種散熱效率較高之散熱裝置。 With the continuous development of the electronics industry, the operating speed and overall performance of electronic components (especially the central processing unit) are constantly increasing, and the heat generation is also increasing. In order to make electronic components work properly, the industry generally uses a heat sink on the electronic components to dissipate heat. Generally, the heat sink includes a solid base attached to the heat-generating electronic component, and a plurality of heat sinks extending upward from the base, and a heat pipe connecting the base and the heat sink is further provided for heat dissipation to heat the heat-generating electronic component. Transfer to the heat sink quickly. However, since the base of the heat sink is a solid body, the heat generated by the heat-generating electronic components is easily concentrated in the center of the base, and cannot be quickly and evenly distributed on the entire base, which is not conducive to uniform heat transfer to each heat sink. In addition, under the condition that the overall volume of the heat sink is constant, the heat dissipation area provided by the heat sink of the conventional structure is greatly limited, so that the heat dissipation efficiency is low. Therefore, it is necessary to provide a heat sink having a high heat dissipation efficiency.
有鑒於此,有必要提供一種散熱效率較高之散熱裝置。 In view of this, it is necessary to provide a heat sink having a high heat dissipation efficiency.
一種散熱裝置,用以對二相鄰之發熱電子元件散熱,包括一設置 於其中一發熱電子元件上之第一散熱器、與第一散熱器並列設置於另一發熱電子元件上之第二散熱器及連接第一、二散熱器之複數熱管,每一熱管包括穿入第一散熱器之蒸發段、穿設於第二散熱器頂端之冷凝段及位於蒸發段與冷凝段之間之連接段,該第一散熱器包括一貼至於其中一電子元件上之均熱板及緊密貼設於均熱板上之第一鰭片組,該第一鰭片組具有蜂窩狀結構,該熱管之蒸發段呈扁平狀,收容於第一鰭片組內並夾緊於第一鰭片組與均熱板之間,該熱管之連接段包括連接蒸發段之水平部與連接冷凝段之傾斜部,該蒸發段與傾斜部異面設置。 A heat dissipating device for dissipating heat from two adjacent heating electronic components, including a setting a first heat sink on one of the heat-generating electronic components, a second heat sink disposed on the other heat-generating electronic component in parallel with the first heat sink, and a plurality of heat pipes connected to the first and second heat sinks, each heat pipe including the penetration An evaporation section of the first heat sink, a condensation section penetrating the top end of the second heat sink, and a connection section between the evaporation section and the condensation section, the first heat sink including a heat spreader plate attached to one of the electronic components And a first fin set closely attached to the heat equalizing plate, the first fin set has a honeycomb structure, and the evaporation section of the heat pipe is flat, is received in the first fin set and clamped to the first Between the fin group and the heat equalizing plate, the connecting portion of the heat pipe includes a horizontal portion connecting the evaporation portion and an inclined portion connecting the condensation portion, and the evaporation portion is disposed opposite to the inclined portion.
與習知技術相比,本發明中第一鰭片組具有蜂窩結構,有效增加散熱面積;均熱板使該其中一發熱電子元件上之熱量均勻傳至第一鰭片組,充分利用第一鰭片組之每一部分進行散熱,有效提高散熱裝置之散熱效率。 Compared with the prior art, the first fin group has a honeycomb structure in the invention, which effectively increases the heat dissipation area; the heat equalizing plate uniformly transfers the heat on the one of the heat-generating electronic components to the first fin group, and fully utilizes the first Each part of the fin set is cooled to effectively improve the heat dissipation efficiency of the heat sink.
10‧‧‧第一散熱器 10‧‧‧First radiator
20‧‧‧第二散熱器 20‧‧‧second radiator
30‧‧‧熱管 30‧‧‧heat pipe
52、54‧‧‧第一、二發熱元件 52, 54‧‧‧ first and second heating elements
50‧‧‧電路板 50‧‧‧ boards
12‧‧‧支撐架 12‧‧‧Support frame
14‧‧‧均熱板 14‧‧‧Homothermal board
16‧‧‧第一鰭片組 16‧‧‧First fin set
120‧‧‧固定孔 120‧‧‧Fixed holes
510‧‧‧穿孔 510‧‧‧Perforation
80‧‧‧螺釘 80‧‧‧ screws
122‧‧‧缺口 122‧‧‧ gap
140‧‧‧封口部 140‧‧‧Seal
160‧‧‧氣流通道 160‧‧‧Air passage
162‧‧‧收容槽 162‧‧‧ Reception trough
22‧‧‧底板 22‧‧‧floor
24‧‧‧第二鰭片組 24‧‧‧second fin set
240‧‧‧孔洞 240‧‧‧ holes
32‧‧‧蒸發段 32‧‧‧Evaporation section
34‧‧‧冷凝段 34‧‧‧Condensation section
36‧‧‧連接段 36‧‧‧Connection section
360‧‧‧水平部 360‧‧‧ horizontal department
362‧‧‧傾斜部 362‧‧‧ inclined section
圖1為本發明散熱裝置之立體組合圖。 1 is a perspective assembled view of a heat sink of the present invention.
圖2為圖1之立體分解圖。 Figure 2 is an exploded perspective view of Figure 1.
圖3為圖1中第一鰭片組之側視圖。 3 is a side view of the first fin set of FIG. 1.
請參閱圖1及圖2,本發明一優選實施例中之散熱裝置,用來對一電路板50上之第一、二發熱元件52、54進行散熱,該散熱裝置包括第一散熱器10、與第一散熱器10並排設置之第二散熱器20及熱連接第一、二散熱器10、20之一對熱管30。該第一、二散熱器10、20分別貼設於第一、二發熱元件52、54對其散熱。 Referring to FIG. 1 and FIG. 2, a heat dissipating device in a preferred embodiment of the present invention is configured to dissipate heat from the first and second heating elements 52 and 54 on a circuit board 50. The heat dissipating device includes a first heat sink 10, The second heat sink 20 disposed along the first heat sink 10 and the heat pipe 30 are thermally connected to one of the first and second heat sinks 10, 20. The first and second heat sinks 10 and 20 are respectively attached to the first and second heat generating elements 52 and 54 to dissipate heat therefrom.
該第一散熱器10包括一支撐架12、固定於支撐架12上之均熱板14及貼設於均熱板14上之第一鰭片組16。均熱板14及第一鰭片組16係通過焊接或粘貼之方式固定。支撐架12呈矩形,靠近四角處各設一固定孔120,固定孔120與電路板50上設置之穿孔510對應,以便螺釘80穿過支撐架12將支撐架12固定於電路板50上。支撐架12一側邊中間位置設有一缺口122。均熱板14為一平板形熱管,其內封裝有工作介質,故相對實體金屬板體來說具有導熱性能好及品質小之優點。均熱板14呈矩形,其形狀大小與支撐架12相匹配,以便均熱板14正好貼設於支撐架12上。均熱板14之一側邊向外凸伸一條形封口部140;當均熱板14貼設於支撐架12時,封口部140穿過支撐架12之缺口122而凸伸於支撐架12之外,避免與支撐架12發生干涉。該第一鰭片組16呈矩形,其蜂窩結構係通過堆疊複數金屬薄片而成,其蜂窩結構可以由複數圓形、三邊形、四邊形等多邊形組成,也可以係由不規則之多邊形狀拼湊於一起而成。於本實施例中,第一鰭片組16具有之蜂窩結構由複數個六邊形孔組成,且每一六邊形孔形成供氣流通過之氣流通道160,(參閱圖3)。第一鰭片組16之底部還設一收容槽162,供熱管30收容其內,收容槽162之橫截面為矩形。 The first heat sink 10 includes a support frame 12 , a heat equalizing plate 14 fixed to the support frame 12 , and a first fin set 16 attached to the heat equalizing plate 14 . The heat equalizing plate 14 and the first fin group 16 are fixed by welding or pasting. The support frame 12 has a rectangular shape, and a fixing hole 120 is disposed adjacent to the four corners. The fixing hole 120 corresponds to the through hole 510 disposed on the circuit board 50, so that the screw 80 passes through the support frame 12 to fix the support frame 12 to the circuit board 50. A notch 122 is defined at an intermediate position of one side of the support frame 12. The heat equalizing plate 14 is a flat-shaped heat pipe, which is packaged with a working medium, so that it has the advantages of good thermal conductivity and small quality relative to the solid metal plate body. The heat equalizing plate 14 has a rectangular shape and is matched in shape to the support frame 12 so that the heat equalizing plate 14 is just attached to the support frame 12. One side of the heat equalizing plate 14 protrudes outwardly from the side of the support frame 12; when the heat equalizing plate 14 is attached to the support frame 12, the sealing portion 140 protrudes through the notch 122 of the support frame 12 and protrudes from the support frame 12 In addition, interference with the support frame 12 is avoided. The first fin group 16 has a rectangular shape, and the honeycomb structure is formed by stacking a plurality of metal foils. The honeycomb structure may be composed of a plurality of polygons such as a circular shape, a triangular shape, a quadrangle shape, or may be a patchwork of irregular polygon shapes. Made together. In the present embodiment, the first fin set 16 has a honeycomb structure composed of a plurality of hexagonal holes, and each hexagonal hole forms an air flow path 160 through which air flows (see FIG. 3). A receiving slot 162 is defined in the bottom of the first fin set 16 for receiving the heat pipe 30. The receiving slot 162 has a rectangular cross section.
第二散熱器20包括一底板22及貼設於底板22之第二鰭片組24。底板22由導熱性能良好之金屬製成,第二鰭片組24具有與第一鰭片組16相同之結構,即也具有蜂窩結構,第二鰭片組24之下表面通過焊接或粘貼之方式固定於底板22之上表面。第二鰭片組24於其頂部間隔設有一對收容熱管30之孔洞240。 The second heat sink 20 includes a bottom plate 22 and a second fin set 24 attached to the bottom plate 22 . The bottom plate 22 is made of a metal having good thermal conductivity, and the second fin set 24 has the same structure as the first fin set 16, that is, also has a honeycomb structure, and the lower surface of the second fin set 24 is welded or pasted. It is fixed to the upper surface of the bottom plate 22. The second fin set 24 is provided at its top with a pair of holes 240 for accommodating the heat pipes 30.
每一熱管30包括一扁平狀之蒸發段32、一冷凝段34及位於蒸發段32與冷凝段34之間之連接段36。蒸發段32之上下表面均為平面,以便蒸發段32收容於第一鰭片組16之收容槽162內,其下表面與第一鰭片組16之底面共面,保證蒸發段32之下表面能直接貼設於均熱板14之上表面以得到最大之接觸面積。連接段36包括連接蒸發段32之水平部360及連接冷凝段34之傾斜部362,水平部360與傾斜部362異面設置。水平部360相互平行且垂直於蒸發段32設置,傾斜部362與蒸發段32異面設置,便於熱管30之冷凝段34順利***第二散熱器20之孔洞240內。 Each heat pipe 30 includes a flat evaporating section 32, a condensing section 34, and a connecting section 36 between the evaporating section 32 and the condensing section 34. The lower surface of the evaporation section 32 is flat, so that the evaporation section 32 is received in the receiving groove 162 of the first fin set 16, and the lower surface thereof is coplanar with the bottom surface of the first fin set 16 to ensure the lower surface of the evaporation section 32. It can be directly attached to the upper surface of the heat equalizing plate 14 to obtain the largest contact area. The connecting section 36 includes a horizontal portion 360 connecting the evaporation section 32 and an inclined portion 362 connecting the condensation section 34, and the horizontal portion 360 is disposed opposite to the inclined portion 362. The horizontal portions 360 are disposed parallel to each other and perpendicular to the evaporation section 32. The inclined portions 362 are disposed opposite to the evaporation section 32, so that the condensation section 34 of the heat pipe 30 is smoothly inserted into the holes 240 of the second heat sink 20.
組裝時,螺釘80順次穿過支撐架12之固定孔120,固定於電路板50之穿孔510內,將第一散熱器10固定於電路板50上並使均熱板14之底面緊貼第一發熱元件52;同樣,螺釘80穿過第二散熱器20之底板22將第二散熱器20固定於電路板50上,同時底板22之底面緊貼第二發熱元件54。熱管30之蒸發段32收容於第一鰭片組16之收容槽162內,其下表面與第一鰭片組16之底面共面並被夾緊於均熱板14與第一鰭片組16之間,冷凝段34間隔穿設於第二散熱器20之孔洞240內,此時,連接段36之水平部360平行設置於第一、二散熱器10、20之側邊。 When assembled, the screw 80 is sequentially passed through the fixing hole 120 of the support frame 12, fixed in the through hole 510 of the circuit board 50, and the first heat sink 10 is fixed on the circuit board 50 and the bottom surface of the heat equalizing plate 14 is closely attached to the first surface. The heating element 52; likewise, the screw 80 passes through the bottom plate 22 of the second heat sink 20 to fix the second heat sink 20 to the circuit board 50 while the bottom surface of the bottom plate 22 abuts against the second heat generating component 54. The evaporation section 32 of the heat pipe 30 is received in the receiving groove 162 of the first fin set 16 , and the lower surface thereof is coplanar with the bottom surface of the first fin set 16 and is clamped to the heat equalizing plate 14 and the first fin set 16 . The condensing sections 34 are disposed in the holes 240 of the second heat sink 20 at intervals. At this time, the horizontal portions 360 of the connecting sections 36 are disposed in parallel on the sides of the first and second heat sinks 10, 20.
工作時,第一散熱器10之均熱板14吸收第一發熱元件52之熱量並快速均勻地分佈於均熱板14上,一部分熱量直接通過第一鰭片組16散熱,另一部分通過熱管30傳遞到第二散熱器20之第二鰭片組24,並由第二鰭片組24頂部向其底部傳遞;同時,第二散熱器20之底板22吸收第二發熱元件54之熱量並快速向上傳遞,即由第二 鰭片組24之底部快速向其頂部傳遞。至此,第一、二發熱元件52、54之熱量均勻分佈於第二散熱器20之第二鰭片組24上,提高第二鰭片組24中部之利用率,充分利用第二鰭片組24之每一部分,提升散熱裝置之散熱效率。 In operation, the heat equalizing plate 14 of the first heat sink 10 absorbs the heat of the first heat generating component 52 and is rapidly and evenly distributed on the heat equalizing plate 14, a portion of the heat is directly radiated through the first fin group 16, and the other portion passes through the heat pipe 30. Passing to the second fin set 24 of the second heat sink 20 and passing it from the top of the second fin set 24 to the bottom thereof; meanwhile, the bottom plate 22 of the second heat sink 20 absorbs the heat of the second heat generating component 54 and rapidly upwards Pass, that is, by the second The bottom of the fin set 24 is quickly transferred to its top. At this point, the heat of the first and second heating elements 52, 54 is evenly distributed on the second fin set 24 of the second heat sink 20, which improves the utilization of the middle of the second fin set 24, and fully utilizes the second fin set 24 Each part enhances the heat dissipation efficiency of the heat sink.
本發明中第一、二鰭片組16、24均為蜂窩結構,具有體積輕、散熱表面積大之優點。此外,第二散熱器20之底板22也可做成一均熱板,以便快速均勻將熱量傳遞至第二散熱器20之第二鰭片組24。 In the present invention, the first and second fin groups 16 and 24 are all honeycomb structures, and have the advantages of light volume and large heat dissipation surface area. In addition, the bottom plate 22 of the second heat sink 20 can also be formed as a soaking plate for quickly and evenly transferring heat to the second fin set 24 of the second heat sink 20.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧第一散熱器 10‧‧‧First radiator
20‧‧‧第二散熱器 20‧‧‧second radiator
30‧‧‧熱管 30‧‧‧heat pipe
52、54‧‧‧第一、第二發熱元件 52, 54‧‧‧ first and second heating elements
50‧‧‧電路板 50‧‧‧ boards
12‧‧‧支撐架 12‧‧‧Support frame
14‧‧‧均熱板 14‧‧‧Homothermal board
16‧‧‧第一鰭片組 16‧‧‧First fin set
120‧‧‧固定孔 120‧‧‧Fixed holes
510‧‧‧穿孔 510‧‧‧Perforation
80‧‧‧螺釘 80‧‧‧ screws
122‧‧‧缺口 122‧‧‧ gap
140‧‧‧封口部 140‧‧‧Seal
162‧‧‧收容槽 162‧‧‧ Reception trough
362‧‧‧傾斜部 362‧‧‧ inclined section
22‧‧‧底板 22‧‧‧floor
24‧‧‧第二鰭片組 24‧‧‧second fin set
240‧‧‧孔洞 240‧‧‧ holes
32‧‧‧蒸發段 32‧‧‧Evaporation section
34‧‧‧冷凝段 34‧‧‧Condensation section
36‧‧‧連接段 36‧‧‧Connection section
360‧‧‧水平部 360‧‧‧ horizontal department
Claims (8)
Priority Applications (1)
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TW97138854A TWI422315B (en) | 2008-10-09 | 2008-10-09 | Heat sink dissipation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW97138854A TWI422315B (en) | 2008-10-09 | 2008-10-09 | Heat sink dissipation |
Publications (2)
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TW201016118A TW201016118A (en) | 2010-04-16 |
TWI422315B true TWI422315B (en) | 2014-01-01 |
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CN218417125U (en) * | 2022-02-18 | 2023-01-31 | 安徽维鸿电子科技有限公司 | Heat sink device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM252255U (en) * | 2004-02-24 | 2004-12-01 | Cpumate Inc | Heat sink module |
TWM268895U (en) * | 2004-12-15 | 2005-06-21 | Cpumate Inc | Uniform temperature heat conduction structure improvement |
TWM293475U (en) * | 2005-12-29 | 2006-07-01 | Hon Hai Prec Ind Co Ltd | Radiator |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM252255U (en) * | 2004-02-24 | 2004-12-01 | Cpumate Inc | Heat sink module |
TWM268895U (en) * | 2004-12-15 | 2005-06-21 | Cpumate Inc | Uniform temperature heat conduction structure improvement |
TWM293475U (en) * | 2005-12-29 | 2006-07-01 | Hon Hai Prec Ind Co Ltd | Radiator |
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TW201016118A (en) | 2010-04-16 |
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