TWI305480B - Method of fabricating printed circuit board having embedded multi-layer passive devices - Google Patents
Method of fabricating printed circuit board having embedded multi-layer passive devices Download PDFInfo
- Publication number
- TWI305480B TWI305480B TW094145790A TW94145790A TWI305480B TW I305480 B TWI305480 B TW I305480B TW 094145790 A TW094145790 A TW 094145790A TW 94145790 A TW94145790 A TW 94145790A TW I305480 B TWI305480 B TW I305480B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- electrode layer
- forming
- rcc
- internal electrode
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000010410 layer Substances 0.000 claims description 126
- 238000000034 method Methods 0.000 claims description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011889 copper foil Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 7
- 239000012792 core layer Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 1
- 235000017491 Bambusa tulda Nutrition 0.000 claims 1
- 241001330002 Bambuseae Species 0.000 claims 1
- 241001481833 Coryphaena hippurus Species 0.000 claims 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 1
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- 239000011425 bamboo Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 238000011068 loading method Methods 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 46
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 6
- 150000002118 epoxides Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- 239000010979 ruby Substances 0.000 description 2
- 229910001750 ruby Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
1305480 九、發明說明: 【發明所屬之技術領域】 一般而言,本發明係關於一種具有嵌入式多層被動裝置 之印刷電路板(PCB)的製造方法,以及更特別地,此為一種 5具有嵌入式多層電容器之印刷電路板的製造方法,此處所 指之一電容器,其在PCB内以多層結構形成,藉此提高電 容量。 【先前技術】 1〇 雖然時至今日分離式晶片電阻器及分離式晶片電容器 般幾乎鑲嵌於所有PCB上,但是被動裝置之於PCB,例 如電阻器或電容器近來已被發展成嵌入式裝置。 h包括嵌入式被動襞置之PCB的製造技術,此類嵌入式 15羞置,例如電阻器或電容器,係使用新穎的材料或製程, 15將其***外部或内部基板,取代傳統的晶片電阻器或晶狀 電容器。 •那歧’包括|人式被動裝置之pCB,其被動裝置, 例如’電容器,***内部或外部基板。無視於基板本身大 2〇 i ,如果一電容器,作為一被動裝置,併入於PCB中,即 %為—“嵌入式電容器”。此處提及之一基板 電容器PCB,,。 式 甘八入式被動裝置pCB大部分最重要的特色,即被動裝 置不需鑲嵌於基板上,便可整體裝配於PCB内。 —般而言,嵌入式被動裝置PCB的製造技術,可大致 1305480 分類為三種形式。 第一種為一聚合物厚膜型電容器的一製造方法,包括塗 佈一聚合物電容器糊狀物,然後加熱固化,意即,乾燥, 於此獲得—電容器。
特別地,此方法包括塗佈聚合物電容器糊狀物於一 PCB 内層上,以及乾燥此塗佈聚合物電容器糊狀物,並於該處 上方印刷一銅膏,然後乾燥形成一電極,由此獲得一嵌入 式電容器。 ❿ 货 弟一種為一嵌入式分離型電容器的一製造方法,包括在 10 — PCB上覆蓋一填滿陶瓷的感光性介電樹脂,此方法已經 由美商摩把羅拉公司獲得專利權。 上述方法包括塗佈具有陶瓷粉末的感光性介電樹脂於 基板的上下表面,樹脂層上方壓合銅箔形成上下電極,完 成電路圖案,接續蝕刻感光性介電樹脂,經此方式獲得一 15 分離式電容器。 第三種為一嵌入式電容器的一製造方法,包括分別將具 鲁t電容特性的-介電層***—pCB内層中,以便取代鎮欲 於PCB上方的一去I禺電容器,此方法已經由美商聖米那 (Sanmina)公司獲得專利權。 2〇 就此點而言,美商聖米那公司被授予的美國專利編號 5’〇79’069’揭露-插人二層間,包括二導電層及一絕緣材 料層(介電層)的嵌入式電容器PCB,以及具有嵌入式電容 器 PCB 的一 PCB。 嵌入式電容器PCB之介電層,其一厚度至少需有 1305480 〇·5ιηι1(12.5μιη) ’普遍地,為卜咖⑵〜別㈣。導電層的 —重ΐ分布,至少需有〇,5oz/ft2(厚度約18叫),普遍地, 為 loz/ft2。 此外,美商聖米那公司被授予的美國專利編號 5 5,155,655及5,161,〇86,揭露所使用的_導電層,係將一導 電金屬薄片經表面處理,以確保附著力及電容密度。 此外,美商聖来那公司被授予的美國專利編號 齡5,162,977 ’揭露使用⑧電容粉末的—電容核心成分。上述 專利中,具有500或更高(至少為1〇倍的環氧化物)的一高 10介電常數之預燒陶竞粉末,被容納於一介電層中,作為提 升去耦能力。 然而,此類傳統技術所製造的產品因為電容過低,導致 實際使用率降低。為了解決上述問題,雖然嘗試使用具有 高電容的一成份材料,依然無法達到產品要求。 15 【發明内容】 I 因此,本發明谨記發生於相關技術領域之上述問題,所 以本么明之一主要目的,係提供一種具有嵌入式多層被動 裝置之PCB,其中—欲入式電容器包括複數個導電層以及 °複數個介電層,藉此提升電容。 為了完成上述目的,本發明提供一種具有嵌入式多層被 動裝置之一PCB的製造方法,其步驟包括:第一步驟為在一 楚二板上塗佈—絕緣層,構成一核心層,然後於絕緣層 上方壓合具有-下電極層的一 RCC;第二步驟為移除rcc 1305480 之上銅箔,然後形成一内電極層;第三步驟為重複第一步 驟及第二步驟的RCC壓合作業數次,形成複數個介電層及 複數個内電極層;以及第四步驟為形成複數個導通孔,貫 穿具有複數個介電層及複數個内電極層之pCB,然後電鍍 導通孔的内部孔壁,形成内電極層在電性上之傳導連接, 完成一多層被動裝置。 【實施方式】 下文中,參照附加圖表,詳述本發明之具體實施例。 圖1A至1J係依據本發明之第一具體實例,針對一包 括-喪入式多層電容器之PCB的—製作程序,作連續式的 圖解說明。 如圖1A所示, &板100的一銅箔102,經影像 製程形成一電路圖案,由此構成一核心層。 15 20 使用作為基礎基板100的一銅箱基板(CCL),視盆使用 目的可分類為玻璃/環氧化物CCL、耐熱樹脂ccl、紙騰 CCL、高頻CCL、可f式咖、複合式ccl等等。為了製 1一雙面PCB或-多層PCB,此類弧t,以覆蓋㈣ 1 、1 〇3的一絕緣樹脂声】〇 9層101 ’所構成的一玻璃/環氧化物 CCL100為較佳的使用材料。 —乾膜(錢示)覆蓋於基礎基板10G上方後,利用具右 2 = 將乾膜經曝光及顯影 相f的乾膜°喷灑1刻液’由此移除 、被乾膜保護區域的銅箔1〇2。移除已使用的乾膜, 8 1305480 形成由銅箔102所構成的一最終電路圖案。 乾膜由三層組成,意即,—覆蓋層、—光阻薄膜以及— 聚㈣膜(Mylar film),其中光p且薄膜的實際功能為—阻劑。 具有一預設圖案的工作底片緊密貼合於乾膜上方表 5面’然後賴射W光至工作底片上方,由此完成乾膜的曝 光及顯影。 就其本身而論’ UV光無法穿透工作底片印刷圖案上相 對應的黑色部分,反之可以穿透工作底片上無圖案的部 讚为,以此方式固化工作底片下的乾膜。 10 當具有已經固化乾膜的CCL102浸於一顯影液中,未固 化的乾膜部份經由顯影液移除,以及僅有固化乾膜保留, 形成一抗蝕圖案。顯影液可為,舉例之,一碳酸鈉(Na2c〇3) 或碳酸鉀(K2C03)水溶液。 /經過一影像製程,於基礎基板100上方形成抗餘圖案 15後,噴灑一蝕刻液以移除相對於抗蝕圖案保護區域外的區 域銅箱102,並且也移除已使用的抗儀圖案,形成由銅羯 , 102所構成的一最終電路.圖案。 如圖1B所示,具有電路圖案的基礎基板1〇〇,其二側 表面壓合預浸材104、105。CCL 110、120,各自僅在一表 2〇面上具有—電路圖案,並且各別與預浸材104、105進行壓 合。 CCL 11〇、120,各自於任一表面形成電路圖案的作業 程序,與上述基礎基板1〇〇形成電路圖案的方式相同, 110、120所提供的絕緣層1U、121,較佳的以具有高介電 1305480 常數的一材料形成,形成具有高電容量的一電容器。 如圖1C所示’最外部的銅箔112、122從CCL 11〇、 120移除。為何從CCL 11〇、12〇移除最外部的銅箔112、 122’其原因為一般CCL所使用的銅箔較厚。如果使用cd 的銅y白作為一多層電容器的一電極層,依據介電層的後續 壓合製程’最終PCB厚度會過f此外,移除㈣形成一 圖案的導電部分,必須填滿樹脂,產品要求將很難實現。 如圖1D所示,提供晶種層13卜132,以便形成— 内嵌入的一多層電容器之内電極層。 可以使用一無電鍍製程形成晶種層131、132。無電铲 製程係指一絕緣材料,兀妹山 在# 、又
Wn不經由—電荷離子反應,改以經由 一沈積反應,更特別地,—、十 沈積反應可以使用一觸媒加速 反應。 15 20 上述無電鑛製程’讀時觸媒必彡請著於-材料表面, 以便於銅從一電鑛溶液中沈積出來。此意即無電鑛製程需 要許多預先處理程序。 牲* 舉例之’無電鍍製程复牛酿 ” V驟包括:清潔、微蝕、預催化、 催化、加速、無電鍍鋼以及抗氧化。 無電鍵銅製程的物理特, … 寺不如電鍍銅製程,因此可以使 用此製程形成一薄電鍍鋼層。 t 如圖1E所示,以電鍍枭 心山 表程形成内導電層133、134,以 作為一 PCB的一嵌入多屛番κ 人 一 夕層電各器之内電極層。 如圖1F所示,内導雷恳 电層133、134使用一影像製程製 作電路圖案,形成内電極; ^ 10 1305480 如圖IF及1G所示,視需要,重複圖1B至ιρ所示, 電鍍層形成圖案的程序,完成一所需的多層電容器。 那就是,作業步驟為i)壓合一預浸材形成一介電層,u) 壓合具有一下部圖案的CCL,Hi)移除一上銅箱,以及iv) 5使用無電鍍及電鍍製程,形成一多層電容器之一内電棰 層,視需求重覆此步驟。 内導電層133、134經使用影像製程製作圖案後,形成 内電極層,壓合RCC形成介電層16卜171,如圖1H所示, •然後RCC之銅箱162、172製作出圖案,形成上電極廣, 10 如圖1G所示。 如圖II所示,—導通孔(無圖示)或貫穿孔形成於多層 PCB間’該處導通孔或貫穿孔的内部孔壁經電鑛後,形成 一電鍍層180’此舉可在電性上之傳導連接多層結構的内電 極層,以便完成一所需的多層電容器。 15 較佳的導通孔或貫穿孔形成方式,為使用一雷射或^ CNC(電腦數值控制)鑽孔機,在一預先設定位置鑽出一導通 φ 孔或貫穿孔。 一 CNC鑽孔機適用於製作一雙面pcB内的導通孔或一 多層PCB内的貫穿孔。 2〇 使用一 CNC鑽孔機完成導通孔或貫穿孔後,較佳的需 使用一去毛邊製程,移除因鑽孔所產生的異物,例如銅箔 所產生的毛邊、導通孔内粉塵以及銅箔上方粉塵。在此步 驟’銅、治表面粗糙不平’由此可增加後續電鍍銅製程中, 與銅之間的附著力。 11 !3〇5480 —雷射適用於一多層PCB内—微導 地,鋼箔及絕緣樹脂層兩者,可使 、。特別 5 雷射同時進行作業。另外,相對二通紅寶石) 可以崎除,然後可以使用一應==部分咖’ 層進行料。 —减㈣射對絕緣樹脂
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元成導通孔後,較佳的使用一本跋、、杰制< 也丨辟^ 去膠渣製程,移除導通孔 2所形成的膠渣,此膠清的形虚扭闵於道s 吵鱼们办成起因於導通孔作業時所 的熱,熔融基礎基板的絕緣樹脂層所導致。 〜如圖U所示,IC晶片190、191鑲嵌於具有一多層電 谷益的PCB上方,完成一半導體晶片封裝。 圖2Α至2J係依據本發明之第二具體實例,針對一包 括一嵌入式多層電容器之PCB的—製作程序,作連 圖解說明。 如圖2A所示,一基礎基板2〇〇之銅箔2〇2、2〇3,藉由 一影像製程形成電路圖案,以此構成一核心層。基礎基板 20(3與第一具體實例中,所使用的基礎基板100相同,視使 用需求可為玻璃/環氧化物CCL、耐熱樹脂CCL·、紙/酚 CCL、高頻CCL、可彎式CCL、複合式CCl等等。此類 CCL中’較佳的為玻璃/環氧化物CCL。 20 如圖2B所示’具有電路圖案的基礎基板200,其兩侧 表面上方壓合預浸材2〇4、205。之後,薄金屬薄片206、 2〇7 ’各自作為一 pcB内一多層電容器之一下電極,並個 別與預浸材204、205進行壓合。隨後,提供一電路圖案, 如圖2C所示。 12 1305480 金屬薄月206、207上形成電路圖案的作業程序,與上 述基礎基板200形成電路圖案的程序相同。 如圖2D所示,超薄金屬薄片載體21〇、22〇,包括具有 高介電係數的介電層211、221;極薄金屬薄片212、222 5壓合於介電層211、221上方,以及載體213、223壓合於 金屬薄片212、222上方。 使用載體213、223作為運載由介電層211、221及金屬 溥片212、222所开> 成的RCC,然後當RCC貼附於金屬薄 • 片206、207,形成下電極時,載體被移除,如圖2E所示。 10 如圖2F所示,金屬薄片212、222使用一影像製程形 成圖案’以此方式可以具有内電極層的功能。使用一載體 (無圖示),複數個RCC(本具體實例中,上方RCC23〇及下 方RCC240個別壓合於上下表面)可以進一步壓合以滿足產 品需求’意即’形成多層介電層以及内電極層。 15 圖2G顯示由此方式形成之多層電容器。製作導通孔 251、252,使内電極層在電性上形成傳導連接。 φ 導通孔較佳的製作方式,可採用上述使用一 CNC鑽孔 機或一雷射’於一預先設定位置形成一導通孔。 一 CNC鑽孔機適用於製作一雙面Pcb内的導通孔或一 2〇 多層PCB内的貫穿孔。 一雷射適用於一多層PCB内一微導通孔的製作。特別 地,銅箔及絕緣樹脂層兩者,可使用一 YAG(釔鋁紅寶石) 田射同時進行作業。二者擇一地,相對應於導通孔部分的 銅、名,可以蝕刻去除,然後可以使用一二氧化碳雷射針對 13 1305480 絕緣樹脂層進行作業。 如圖2H及21所示,壓合RCC26〇、27〇,然後將最外 部金屬薄片262、272使用一影像製程製作圖案,形成外電 極層。 5 另外,形成複數個導通孔281、282,以便於内電極層 在電性上可以傳導連接外電極層,以及各内電極層可以相 互電性連接,由此形成一多層電容器。 如圖2 J所不,鑲嵌IC晶片,完成一半導體晶片封裝。 瞻 I發明中之PCB具有-嵌人式多層電容II,電容器導 1〇電層的層數可為三或更多,以及絕緣層的層數可為二或更 多 0 進步地,經由一集體壓合製程或一增層製程,可能完 成具有一多層電容的RCC或CCL形式層。 田夕層電谷器的絕緣層厚度減少時,絕緣層的層數增 15加電谷增加。另外’多層電容器之内導電層,其厚度必 須儘可能變薄’如此可以減少最終PCB的厚度,以及達到 籲 絕緣層的厚度均勻性。 為了減少内導電層的厚度,導電層使用一原始薄金屬薄 片(5<^./;^18_或更少,3〜9师金屬薄片)製作。另外,導電 2〇 f Ο或更薄厚度)可以利帛RCC或CCL壓合製成,移除 最外#厚V電金屬薄片,經由無電鍵製程形成一晶種層, 由甩鍵製程形成所需之-導電層。另外,可以經由 RCC、CCL表而殿人 合’然後移除部份最外部厚導電金屬薄 片,形成導電層。 14 13〇548〇 如上所述,本發明係提供一種具有嵌入式多層被動裝置 之—PCB的製造方法,該處使用相同材料(所具有的特性, 例如一介電常數、厚度等等)的被動裝置,可以在相同板子 上顯示其高效能(去耦或匹配)。 依據本發明所述之方法,其中將圖案設計成電流反向流 動’由於抵銷電感效應,可以製造一具有良好高頻率特性 的嵌入式電容器PCB。 依據本發明所述之方法,能夠充分表現出多層電容結構 的優點’大大地影響去耦可以獲得一所需水準的電容密度。 依據本發明所述之方法,其中為了訊號匹配,使用一介
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20 2質填充物’以確保一介電常數到達一預設或更高水準, 二例如貧乏溫度特性此類問題產生時,可以使用除了一低 =電#數之外,具有較佳特性的一聚合物材料,設計製作 夕層結構,如此電容量可以提升至一必要或更高水準,而 不降低其他特性。 雖然已揭露本發明之較佳具體實例作說明之目的,熟知 比技1項域者,應可領會各種型態的模擬、增建以及替代, 白不迷背本發明隨附之申請專利精神及範圍内。 【圖式簡單說明】 圖jAi U係、本發明中第—具體實施例之剖面圖表, 劍疋為顯不一包括一嵌入式多層電容器之 製作程序;以及 埂躓 圖2A至2ί係本發明中第二具體實施例之剖面圖表, 15 1305480 其中是為顯示一包括一嵌入式多層電容器之PCB的一連續 製作程序。 【主要元件符號說明】 基礎基板100,200 絕緣樹脂層101,201 銅箔 102,103,112, 122,162,172,202,203 預浸材 104,105,204,205 CCL 110,120 絕緣層111,121 晶種層131,132 内導電層133,134 介電層161,171,211,221 電鍍層180 1C 晶片 190、191,290,291 載體 213,223 金屬薄片 206,207,262,272 超薄金屬薄片載體210,220 極薄金屬薄片212,222 ' RCC230,240,260,270 導通孔 251,252,281,282
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Claims (1)
- I I -----------_.——,,„ 竹年?月β日修(影正替換胃 置之印刷電路板的製造 1305480 第州朽7%號,97年9月修正頁 十、申請專利範圍: 1. 一種包含後入式多層被動裝 方法,其步驟包括: 第-步驟為塗佈-絕緣層於_基礎基板上方,構成—核 心層,然後於該絕緣層上方壓合具有一下電極層的背豚銦 箔(RCC); 夕 第二步驟為移除該背膠銅箱(RCC)之一上銅箔,然後形 成一内電極層; 第二步驟為重複該第一步驟及該第二步驟之背膠銅箔 10 (RCC)遷合製程數二欠’形成複數個介電層及複數個内電極 層;以及 第四步驟為形成複數個導通孔,以貫穿具有該複數個介 電層及該複數個内電極層之印刷電路板,然後電錢該導通 孔的内部孔壁’作為該内電極層在電性上之傳導連接,完 15 成一多層被動裝置。 2.如申請專利範圍第1項所述之方法,其中,該第二步 驟包括: 移除壓合於絕緣層上方的該背膠銅_(RCC)之上銅箔; 經由無電鍍製程,在不具有該上銅箔之背膠銅箔(Rcc) 20 的一絕緣層上形成一晶種層;以及 經由電鍍製程於該晶種層上方形成該内電極層。 3.如申明專利..範圍第2項所述之方法,其中,經由電鍵 於該晶種層上方形成的内電極層,具有一0.卜5μιη的厚度。 17 1305480 4.一種包含嵌入式多層被動裝置之印刷電路板的製造 方法’其步驟包括: 第-步驟為塗佈-絕緣層於—基礎基板上方,構成—核 心層,然後形成一下電極層; X 第二步驟為使用-超薄金屬薄片載體,於下該電極層上 方,形成一絕緣層及一内電極層; 第三步驟為製作一導通孔’貫穿具有該絕緣層及該内電 極層之印刷電路板’以便内電極層在電性上 以及 π 够二四步驟為重稷該第二步驟及該第三步驟,形成複數個 .、邑緣層及複數個㈣極層,完成—多層被動褒置。 驟包5括如申請專利範圍第4項所述之方法,其中,該第一步 於基礎基板上方壓合一 15 20 形成該絕緣m ’構成該心層’以便 於該絕緣層上方壓合一金麗 形成該下電極層。 金屬❹’然後使用-影像製程 6·如申請專利範圍第4項 ㈣A 达之方法’其中’該第二步 使用該超薄金屬薄片載體, 费—车 « % °哀下電極層上方歷:合由 覆盍-_之絕賴_叙— 從該超薄金屬镇Η # M & (KCL) , 移除—载體,使該背膠銅箔 (RCC)溥膜暴露於外;以及 該薄膜經影像製程,形成該内電極層。 18
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CN108682630B (zh) * | 2018-05-15 | 2020-04-24 | 日月光半导体(上海)有限公司 | 封装基板的制造方法 |
CN108550531B (zh) * | 2018-05-15 | 2020-05-08 | 日月光半导体(上海)有限公司 | 封装基板的制造方法 |
CN111986925B (zh) * | 2019-05-22 | 2022-05-17 | 江西兴海容电路板有限公司 | 电容器及其制造方法 |
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US5161686A (en) | 1989-04-14 | 1992-11-10 | Kimberly-Clark Corporation | Odor-absorbing web material and medical material packages containing the web material |
US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5161086A (en) * | 1989-08-23 | 1992-11-03 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5162977A (en) * | 1991-08-27 | 1992-11-10 | Storage Technology Corporation | Printed circuit board having an integrated decoupling capacitive element |
US6023407A (en) * | 1998-02-26 | 2000-02-08 | International Business Machines Corporation | Structure for a thin film multilayer capacitor |
JP2000183536A (ja) | 1998-12-17 | 2000-06-30 | Sony Corp | 機能モジュール及びその製造方法 |
KR20010076476A (ko) * | 2000-01-26 | 2001-08-16 | 이형도 | 인쇄회로 다층기판의 제조방법 |
JP3547423B2 (ja) | 2000-12-27 | 2004-07-28 | 松下電器産業株式会社 | 部品内蔵モジュール及びその製造方法 |
JP2003332749A (ja) * | 2002-01-11 | 2003-11-21 | Denso Corp | 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板 |
KR100455890B1 (ko) * | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
US6885541B2 (en) * | 2003-06-20 | 2005-04-26 | Ngk Spark Plug Co., Ltd. | Capacitor, and capacitor manufacturing process |
JP4523299B2 (ja) * | 2003-10-31 | 2010-08-11 | 学校法人早稲田大学 | 薄膜コンデンサの製造方法 |
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KR20060099245A (ko) | 2006-09-19 |
KR100688743B1 (ko) | 2007-03-02 |
TW200633614A (en) | 2006-09-16 |
JP2006253656A (ja) | 2006-09-21 |
JP4288266B2 (ja) | 2009-07-01 |
CN100548089C (zh) | 2009-10-07 |
CN1832664A (zh) | 2006-09-13 |
US20060203456A1 (en) | 2006-09-14 |
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