TWI300766B - - Google Patents

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Publication number
TWI300766B
TWI300766B TW093111824A TW93111824A TWI300766B TW I300766 B TWI300766 B TW I300766B TW 093111824 A TW093111824 A TW 093111824A TW 93111824 A TW93111824 A TW 93111824A TW I300766 B TWI300766 B TW I300766B
Authority
TW
Taiwan
Prior art keywords
substrate
brittle material
material substrate
protective film
dividing line
Prior art date
Application number
TW093111824A
Other languages
English (en)
Chinese (zh)
Other versions
TW200502184A (en
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200502184A publication Critical patent/TW200502184A/zh
Application granted granted Critical
Publication of TWI300766B publication Critical patent/TWI300766B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/17—Hygienic or sanitary devices on telephone equipment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C13/00—Details; Accessories
    • A45C13/30—Straps; Bands
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Signal Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW093111824A 2003-06-05 2004-04-28 Scribing method and device for brittle material substrate TW200502184A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003160564A JP4256724B2 (ja) 2003-06-05 2003-06-05 脆性材料基板のスクライブ方法及びその装置

Publications (2)

Publication Number Publication Date
TW200502184A TW200502184A (en) 2005-01-16
TWI300766B true TWI300766B (ko) 2008-09-11

Family

ID=34053310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111824A TW200502184A (en) 2003-06-05 2004-04-28 Scribing method and device for brittle material substrate

Country Status (4)

Country Link
JP (1) JP4256724B2 (ko)
KR (1) KR20040108556A (ko)
CN (1) CN100358818C (ko)
TW (1) TW200502184A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408112B (zh) * 2010-08-31 2013-09-11 Liefco Optical Inc A Modified Glass Cutting Method for Preset Paths
TWI415812B (zh) * 2009-02-24 2013-11-21 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
KR100863438B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법
US8289388B2 (en) * 2009-05-14 2012-10-16 Asm Assembly Automation Ltd Alignment method for singulation system
KR101247571B1 (ko) 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 스크라이브 방법
JP5210356B2 (ja) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP5156080B2 (ja) 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
JP2013079170A (ja) 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd スクライブ方法
TWI474983B (zh) * 2011-10-04 2015-03-01 Mitsuboshi Diamond Ind Co Ltd Scoring Method and Breaking Method of Mother Substrate
WO2013094059A1 (ja) * 2011-12-22 2013-06-27 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
CN102530841B (zh) * 2012-01-17 2014-09-03 西安交通大学 一种光学玻璃的高深宽比微结构加工方法
JP5639634B2 (ja) * 2012-12-11 2014-12-10 三星ダイヤモンド工業株式会社 基板分断システム
JP6248401B2 (ja) * 2013-03-19 2017-12-20 富士電機株式会社 半導体装置の製造方法およびそれに用いられる露光マスク
CN106458690B (zh) * 2014-05-30 2020-01-14 三星钻石工业股份有限公司 脆性基板的分断方法
JP2016003165A (ja) * 2014-06-18 2016-01-12 日本電気硝子株式会社 ガラス物品の製造方法および膜付ガラス物品
WO2016047317A1 (ja) * 2014-09-25 2016-03-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN104280922B (zh) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 一种液晶屏玻璃切割方法和装置
JP6311798B2 (ja) * 2014-11-25 2018-04-18 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6563728B2 (ja) * 2015-07-29 2019-08-21 株式会社ディスコ レーザー加工方法
CN105259109B (zh) * 2015-10-28 2018-06-22 环维电子(上海)有限公司 涂层附着力测试治具
CN108548777B (zh) * 2018-04-13 2020-10-20 安徽协诚实业股份有限公司 一种耐腐蚀工件的自动百格测试装置
JP7385908B2 (ja) * 2019-10-30 2023-11-24 三星ダイヤモンド工業株式会社 貼り合わせ基板の分断方法および応力基板の分断方法
CN110981175A (zh) * 2019-12-27 2020-04-10 黄石瑞视光电技术股份有限公司 一种触摸屏的超薄ito玻璃切割工艺
JP2021154502A (ja) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びに基板加工装置
CN114354049B (zh) * 2022-03-18 2022-05-20 深圳市三江名创电子科技有限公司 一种手机保护膜应力检测装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124206A (ja) * 1983-12-10 1985-07-03 有限会社宝寿窯 石こう型
JPS6270241A (ja) * 1985-09-20 1987-03-31 Nikou Kogaku Kk 模様印刷片の加工方法
JPS63295454A (ja) * 1987-05-27 1988-12-01 Mitsuboshi Daiyamondo Kogyo Kk ガラスの切断方法
JPS6481335A (en) * 1987-09-24 1989-03-27 Seiko Epson Corp Scribing line for dicing
JP3271691B2 (ja) * 1996-02-29 2002-04-02 セイコーインスツルメンツ株式会社 表示装置の製造方法
KR970067832A (ko) * 1996-03-12 1997-10-13 김광호 정전기 보호 금속 패턴이 형성되어 있는 웨이퍼
JP2000280234A (ja) * 1999-01-28 2000-10-10 Canon Inc 基板の切断方法
JP2001058317A (ja) * 1999-08-20 2001-03-06 Berudekkusu:Kk スクライブ方法および装置
DE19955824A1 (de) * 1999-11-20 2001-06-13 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
TW544442B (en) * 2000-08-11 2003-08-01 Mitsuboshi Diamond Ind Co Ltd Cutter wheel for brittle material substrate and scriber
TW536527B (en) * 2000-08-11 2003-06-11 Mitsuboshi Diamond Ind Co Ltd Cutter for cutting brittle material, scriber using the same and scribing method
JP2003002675A (ja) * 2001-06-21 2003-01-08 Nakamura Tome Precision Ind Co Ltd ガラス板の割断方法及び装置
JP2003114420A (ja) * 2001-10-03 2003-04-18 Matsushita Electric Ind Co Ltd 液晶表示パネルの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415812B (zh) * 2009-02-24 2013-11-21 Mitsuboshi Diamond Ind Co Ltd Scribing device and scribing method
TWI408112B (zh) * 2010-08-31 2013-09-11 Liefco Optical Inc A Modified Glass Cutting Method for Preset Paths

Also Published As

Publication number Publication date
TW200502184A (en) 2005-01-16
JP2004359502A (ja) 2004-12-24
KR20040108556A (ko) 2004-12-24
JP4256724B2 (ja) 2009-04-22
CN100358818C (zh) 2008-01-02
CN1572738A (zh) 2005-02-02

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MM4A Annulment or lapse of patent due to non-payment of fees