TWI294696B - Side-emission type led package related application - Google Patents
Side-emission type led package related application Download PDFInfo
- Publication number
- TWI294696B TWI294696B TW094146463A TW94146463A TWI294696B TW I294696 B TWI294696 B TW I294696B TW 094146463 A TW094146463 A TW 094146463A TW 94146463 A TW94146463 A TW 94146463A TW I294696 B TWI294696 B TW I294696B
- Authority
- TW
- Taiwan
- Prior art keywords
- led
- wafer
- assembly
- light
- sealing member
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims description 68
- 238000002310 reflectometry Methods 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 29
- 229920000642 polymer Polymers 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 15
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 230000009974 thixotropic effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000000463 material Substances 0.000 description 17
- 230000003287 optical effect Effects 0.000 description 12
- 230000005855 radiation Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 240000003473 Grevillea banksii Species 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 235000021189 garnishes Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20050010046 | 2005-02-03 | ||
KR1020050044649A KR100649640B1 (ko) | 2005-02-03 | 2005-05-26 | 측면 방출형 발광다이오드 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200629609A TW200629609A (en) | 2006-08-16 |
TWI294696B true TWI294696B (en) | 2008-03-11 |
Family
ID=37571518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094146463A TWI294696B (en) | 2005-02-03 | 2005-12-26 | Side-emission type led package related application |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5419289B2 (ja) |
KR (1) | KR100649640B1 (ja) |
NL (3) | NL1030979C2 (ja) |
TW (1) | TWI294696B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103335249A (zh) * | 2013-07-02 | 2013-10-02 | 中节能晶和照明有限公司 | Led中华景观灯 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100757828B1 (ko) * | 2006-09-28 | 2007-09-11 | 서울반도체 주식회사 | 전면 발광 다이오드 패키지 |
KR20100112978A (ko) * | 2009-04-10 | 2010-10-20 | 김덕용 | 엘이디 조명장치 및 엘이디 조명장치의 면발광 방법 |
CN102135239B (zh) * | 2010-01-21 | 2013-01-23 | 财团法人工业技术研究院 | 照明装置及其光学元件模块 |
JP5749555B2 (ja) * | 2011-04-26 | 2015-07-15 | 株式会社エンプラス | 光束制御部材、この光束制御部材を備えた発光装置およびこの発光装置を備えた面光源装置 |
KR101149201B1 (ko) * | 2011-12-20 | 2012-05-25 | 한윤희 | 광고용 엘이디 모듈 및 광고용 엘이디 모듈 제조방법 |
WO2014069973A1 (ko) * | 2012-11-05 | 2014-05-08 | 주식회사 애니캐스팅 | 측면 방출형 발광다이오드용 렌즈, 이를 구비하는 백라이트유닛 및 표시장치 |
KR101398186B1 (ko) | 2012-11-05 | 2014-05-23 | (주)애니캐스팅 | 측면 방출형 발광다이오드용 렌즈, 이를 구비하는 백라이트유닛 및 표시장치 |
CN111063787A (zh) * | 2014-01-23 | 2020-04-24 | 亮锐控股有限公司 | 具有自对准预制透镜的发光设备 |
TWI743540B (zh) * | 2019-08-22 | 2021-10-21 | 友達光電股份有限公司 | 發光單元及其製造方法 |
JP7483474B2 (ja) | 2020-04-15 | 2024-05-15 | 株式会社ジャパンディスプレイ | 照明装置 |
CN114578614A (zh) * | 2020-11-30 | 2022-06-03 | 华为技术有限公司 | 一种背光模组及显示屏 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5977249U (ja) * | 1982-11-16 | 1984-05-25 | 日本電気株式会社 | 横方向出力発光ダイオ−ド装置 |
JPH073154U (ja) * | 1993-06-01 | 1995-01-17 | 株式会社アドビック | 発光ダイオードおよび光反射部材ならびに警告灯 |
JPH0918058A (ja) * | 1995-06-29 | 1997-01-17 | Sharp Corp | 発光半導体装置 |
JP2001076513A (ja) * | 1999-09-07 | 2001-03-23 | Stanley Electric Co Ltd | 車両用灯具 |
JP4082544B2 (ja) * | 1999-12-24 | 2008-04-30 | ローム株式会社 | 裏面実装チップ型発光装置 |
JP2001185752A (ja) * | 1999-12-24 | 2001-07-06 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置とそれを用いた光信号入出力装置 |
KR20020080834A (ko) * | 2001-04-18 | 2002-10-26 | (주)옵토니카 | 엘.이.디. 투광장치 및 그 제조방법 |
JP4239565B2 (ja) * | 2002-03-20 | 2009-03-18 | 豊田合成株式会社 | 発光器および灯具 |
US6679621B2 (en) * | 2002-06-24 | 2004-01-20 | Lumileds Lighting U.S., Llc | Side emitting LED and lens |
JP3715635B2 (ja) * | 2002-08-21 | 2005-11-09 | 日本ライツ株式会社 | 光源および導光体ならびに平面発光装置 |
KR20040024747A (ko) * | 2002-09-16 | 2004-03-22 | 주식회사 티씨오 | 고휘도 발광다이오드 및 그 제조방법 |
JP4182784B2 (ja) * | 2003-03-14 | 2008-11-19 | 豊田合成株式会社 | 発光装置およびその製造方法 |
JP2005026503A (ja) * | 2003-07-03 | 2005-01-27 | Matsushita Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
-
2005
- 2005-05-26 KR KR1020050044649A patent/KR100649640B1/ko active IP Right Grant
- 2005-12-26 TW TW094146463A patent/TWI294696B/zh active
-
2006
- 2006-01-23 NL NL1030979A patent/NL1030979C2/nl active Search and Examination
-
2010
- 2010-06-16 JP JP2010137741A patent/JP5419289B2/ja active Active
-
2011
- 2011-08-31 JP JP2011188240A patent/JP5467584B2/ja active Active
- 2011-11-02 NL NL2007703A patent/NL2007703C2/nl active
- 2011-11-02 NL NL2007700A patent/NL2007700C2/nl active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103335249A (zh) * | 2013-07-02 | 2013-10-02 | 中节能晶和照明有限公司 | Led中华景观灯 |
Also Published As
Publication number | Publication date |
---|---|
NL2007703C2 (nl) | 2013-02-27 |
KR100649640B1 (ko) | 2006-11-27 |
TW200629609A (en) | 2006-08-16 |
NL1030979C2 (nl) | 2011-11-09 |
NL2007700C2 (nl) | 2013-01-31 |
KR20060090149A (ko) | 2006-08-10 |
JP5419289B2 (ja) | 2014-02-19 |
JP2012009889A (ja) | 2012-01-12 |
JP5467584B2 (ja) | 2014-04-09 |
NL2007700A (nl) | 2012-01-16 |
NL1030979A1 (nl) | 2006-08-07 |
NL2007703A (nl) | 2012-01-16 |
JP2010251785A (ja) | 2010-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI294696B (en) | Side-emission type led package related application | |
US7473937B2 (en) | Side-emission type LED package | |
JP5646799B2 (ja) | Ledダイ上のオーバーモールドレンズ | |
JP5676459B2 (ja) | 成型された双方向光学部品を備えるled | |
US20070019416A1 (en) | Light emitting diode package having dual lens structure for lateral light emission | |
TWI323519B (en) | Light emitting device with a lens of silicone | |
TWI393841B (zh) | 背光用發光二極體之寬發光透鏡 | |
EP3133432B1 (en) | Optical lens, light emitting device package using the optical lens, and backlight unit | |
US8251538B2 (en) | Lighting device | |
JP2009522779A (ja) | 複合物カプセル材のレンズを有するled | |
JP2004133391A (ja) | 側面放射led及びレンズ | |
TW201114076A (en) | LED with molded reflective sidewall coating | |
JP2009539250A (ja) | 多重屈折率レンズを備えるパッケージ化された発光デバイスおよびその作製方法 | |
JP2008072092A (ja) | 固体発光デバイス用のリードフレームベースのパッケージ、および固体発光デバイス用のリードフレームベースのパッケージを形成する方法 | |
KR20110090126A (ko) | 발광소자 패키지 | |
TW201044651A (en) | Semiconductor light emitting device | |
JP2000277812A (ja) | ライン光源装置およびその製造方法 | |
KR102107526B1 (ko) | 발광 소자 패키지 | |
TW200827775A (en) | Optical lens and its structure with solid state light laterally emitting device and backlight module | |
KR101650472B1 (ko) | 측면광 생성용 광로 변환 구조체 및 이를 적용한 측면광 생성장치 | |
CN117406486A (zh) | 发光组件、背光模组、终端设备及发光组件制备方法 | |
TWI289816B (en) | Light-emitting module | |
JP2006108177A (ja) | 発光ダイオード装置およびその製造方法 | |
KR20150054266A (ko) | 발광소자 패키지 |