TWI289816B - Light-emitting module - Google Patents

Abstract

A light-emitting module comprising a light source (9), a carrier (8) for the light source and an optical element (1) is specified, the optical element (1) having fitting pins (2) which engage into corresponding cutouts in the carrier (8). The light-emitting module is particularly well suited to use in optical projection apparatuses and also in motor vehicle headlights.

Description

，1289816 九、發明說明： 【發明所屬之技術領域】 特別是關於-種製造方法特 本發明係關於一種發光模組， 別簡單之發光模組。 【先前技術】 習知發光模組的製造方法極為|1,128,816, IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a light-emitting module, and a simple light-emitting module. [Prior Art] The manufacturing method of the conventional light-emitting module is extremely |

下。因此，如何财出-種製造方法 成本居局不 成為發光模組業界非常重要的課題、㈣早之發光模組，便 【發明内容】 特別是關於一種製 本發明之一目的係提供一種發光模組 造方法特別簡單之發光模組。 謂於發光模組所揭露的至少一個實施例，所述 :一彻^5 111接於載具上之發光源’其中所述發光源可以 疋一個或複數個發光二極體晶粒。 ，述載具包含接觸點與導體線路，用以跟所述發光源進行 2連接。此外，在所述發光源在發光時，所述載具亦可做為 t、、、之用。因此較佳者，所述载具是一優良的熱導體。所述載 具可以是一印刷電路板或一金屬核心之電路板。 依據本發明關於發光模組所揭露的至少一個實施例，所述 發光模組包含_找猶，其帽航學元件具有複數健 腳，可與所述載具上相對應之凹洞相接合。換言之，所述载具 上具有之凹洞，可容光學元件上之接腳***。所述光學元件在 所述載具上之配置，使得所述發光源所發出的至少一部份的電 6 1289816 =射，可财職絲元件，錢所縣學树在光學上的 發光nr月關於發光模組所揭露的至少一個實施例，所述 二丰發光源、—肋承紐絲之航以及一光學 對應之;^學元件具有概個接腳，可與所述載具上相 接腳Z本發關於發光模組所揭朗至少—個實施例，所述 姻將所述光學元件解在魅上食之，所述接腳 ，、刀肩對準樁」的角色’使得所述光學元件可相對地與發光 源相對準。相對於發光源而言，所述光學元件係對準於其中 二較佳者’所述載具上之凹洞的形式、尺寸與配置，與親 先予讀之接腳的形式、尺寸與配置，彼此相互匹配，使得接 腳可輕易地***所述凹洞中，並使得所述光學元件可相對地與 發光源相對準。 、前開發光模組的配置，使得所述光學元件可精準地對準在 载具上。為求將所述光學元件力學地固定於所述載具上，可在 所述支架與載具之交界面施以黏著_固定之。 依據本發明關於發光模組所揭露的至少—個實施例，所述 接腳在所述光學元件與载具之間提供一個力學地連接。為求達 、目的了將戶斤述光學元件之接腳以力學地緊壓方式麼入所述 載/、之凹/同中。在此情況下，所述载具之凹洞的直徑必須略小 於接腳之直徑，使得當接腳被力學地壓入所述載具時，所述光 學树1便自動對準並固接於载具之上。此外，可在所述光學 轉與載具之間另施以黏著劑，以增強所述光學元件與載具之 間的力學連接。 7 ，1289816 予元件與發光源之下游的第二光學元件而言，特 可以簡單地達成。 、，依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件之複數個接腳之橫剖面係呈星形樣式。申言之，至少 在所述接· _人所述關之處，其橫係呈星形樣式。 所j接腳之星形樣式，使得尺寸上的微小差異得以獲得麵。 換。之戶斤述接腳呈現星形樣式，使得若該接腳或所述載具之 凹洞的尺寸上有微小誤差，皆能獲得特別好的補償。本實施例 _ 得以獲致此效果之原因，在於呈現星形樣式的接腳較其他雜 之接腳一例如具有平滑侧面之堅實圓柱體，更容易壓入凹洞之 内。 依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件之複數個接腳的直徑係順者所述複數個接聊而改 變，使其可適用於具有不同尺寸之凹洞的所述載具、所述模組 托架、及/或所述第二光學元件。其次所述複數個接腳亦可能 如此設計，使得所述光學元件好似以其支柱豎放，其中所述支 瞻 柱係沿著该光學元件之方向延伸。如此的接腳之直徑，可較其 他接腳的直徑來得小。所述複數個接腳的直徑亦可能順者所述 複數個接腳而連續改變，因而呈現斜截頭的角錐體或斜截頭的 圓錐體。 依據本發明關於發光模組所揭露的至少一個實施例，更包 ^"一用以容納黏著劑之貯存囊（reservoir)，其中所述貯存囊係 被裝置於所述複數個接腳至少之一的附近。舉例而言，所述貯 存囊可以是形成於所述接腳附近之周邊溝槽（peripheral groove)。當利用黏著劑將所述光學元件固定在所述載具上 、1289816 時，所述貯存囊便可用以容納多餘溢出之黏著劑。 依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件包含一支架與一光學本體，其中所述支架係用以力學 性地支撐該光學本體。較佳者，所述光學元件之接腳係位於所 述支架上，或與所述支架形成一個整體。所述光學本體構成所 述光學元件之實際光學料件，其可用以調整電磁輻射之光束型 態。較佳者，所述支架係固接在所述光學本體上，或者以盡量 不影響光學本體之光學性質的方式連接至所述光學本體上。 依據本發明關於發光模組所揭露的至少一個實施例，所述 光學本體係一個光學集中器（optical concentrator)，其向發光 源的方向逐漸變細。依據本發明關於發光模組所揭露的至少一 個實施例’所述光學本體的至少一部份係由下列諸多基本光學 元件之至少其中一種所構成：化合物拋物面集中器（c〇mp〇und parabolic concentrator; CPC )、化合物橢圓面集中器（c〇mp〇und elliptic concentrator; CEC)、化合物雙曲面集中器（c〇mp〇und hyperbolic concentrator; CHC)。換言之，所述光學本體之側面 係由鈿述二種基本光學元件之至少其中一種所構成。此外，所 述光學集中器亦可能呈現斜截頭的角錐體或斜截頭的圓錐 體，並向發光源的方向逐漸變細。在一個實施例中，所述光學 本體可以是一個堅實固體（solidbody)。在另一個實施例中， 所述光學本體可以是一個中空體，其内部側面具有反光之特 性，例如以塗佈有反射面之方式達成之。 依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件之光學本體包含一個光射出表面。所述光射出表面可 以是如下曲面至少其中一種：球面、非球面、橢圓面。 11 、1289816 、，風依據本發日獨於發光模組所揭露的至少—個實施例，所述 件之光學本體是_健實隨。所述光學本體係由透明 例如透明塑膠所構成。在所述光學本體之側面所形成之 ^射，較佳者係為全反射。較佳者，所述光學元件係由下列材 中至種所組成或構成·· Cqc、ρμ^α、pmmi、pc、under. Therefore, how to make money - a manufacturing method cost is not a very important issue in the lighting module industry, (4) early lighting module, [invention] In particular, one aspect of the invention provides a lighting module A light-emitting module that is particularly simple to manufacture. In at least one embodiment disclosed in the light-emitting module, the light source can be connected to one or more of the light-emitting diodes. The carrier includes contact points and conductor lines for connection to the illumination source. In addition, when the light source is emitting light, the carrier can also be used as t, , or . Preferably, the carrier is an excellent thermal conductor. The carrier can be a printed circuit board or a metal core circuit board. In accordance with at least one embodiment of the present invention, the light-emitting module includes a plurality of feet that are engageable with corresponding recesses on the carrier. In other words, the carrier has a recess for receiving the pins on the optical component. Configuring the optical component on the carrier such that at least a portion of the electrical energy emitted by the illumination source is 6 1289816 = shot, and the financial element can be used for the optical illumination of the money tree. With respect to at least one embodiment disclosed in the light-emitting module, the two-bright light source, the ribbed wire, and an optical counterpart; the element has an integrated pin that can be connected to the carrier. The foot Z is disclosed in relation to the illumination module. At least one embodiment, the marriage disassembles the optical component, and the pin, the shoulder is aligned with the role of the post. The optical elements can be relatively aligned with the illumination source. Relative to the illumination source, the optical component is aligned with the form, size and configuration of the recess on the two of the preferred carriers, and the form, size and configuration of the pro-reading pin Matching each other such that the pins can be easily inserted into the recess and the optical elements can be relatively aligned with the source of illumination. The configuration of the optical module is previously developed so that the optical component can be precisely aligned on the carrier. In order to mechanically fix the optical element to the carrier, an adhesive-fixed layer may be applied at the interface between the holder and the carrier. In accordance with at least one embodiment of the present invention, the pin provides a mechanical connection between the optical component and the carrier. In order to achieve the goal, the pin of the optical component is mechanically pressed into the recess/same of the carrier. In this case, the diameter of the recess of the carrier must be slightly smaller than the diameter of the pin so that when the pin is mechanically pressed into the carrier, the optical tree 1 is automatically aligned and fixed to Above the vehicle. Additionally, an additional adhesive may be applied between the optical transducer and the carrier to enhance the mechanical connection between the optical component and the carrier. 7, 12098816 The element and the second optical element downstream of the illumination source are specifically achievable. According to at least one embodiment of the present invention, the plurality of pins of the optical component have a star-shaped cross section. In other words, at least in the place where the said _ person is closed, the horizontal system is in a star pattern. The star pattern of the pin is such that a small difference in size is obtained. change. The pin indicates that the pin has a star pattern so that a particularly good compensation can be obtained if there is a slight error in the size of the pin or the hole of the carrier. The reason why this embodiment is obtained is that the star-shaped pin is more likely to be pressed into the cavity than the other pin, such as a solid cylinder having a smooth side. In accordance with at least one embodiment of the present invention, the diameter of the plurality of pins of the optical component is varied by the plurality of contacts to make it suitable for cavities having different sizes. The carrier, the module carrier, and/or the second optical component. Second, the plurality of pins may also be designed such that the optical element appears to be vertically oriented with its struts, wherein the struts extend in the direction of the optical element. The diameter of such a pin can be made smaller than the diameter of other pins. The diameter of the plurality of pins may also vary continuously with the plurality of pins, thereby presenting a truncated pyramid or a truncated cone. In accordance with at least one embodiment of the present invention, in accordance with the present invention, a storage container for containing an adhesive is provided, wherein the storage bag is mounted on the plurality of pins. One nearby. For example, the reservoir can be a peripheral groove formed adjacent the pin. When the optical component is attached to the carrier with an adhesive, 1298816, the reservoir can be used to contain excess spilled adhesive. In accordance with at least one embodiment of the present invention, the optical component includes a bracket and an optical body, wherein the bracket is configured to mechanically support the optical body. Preferably, the pins of the optical element are located on the bracket or are integral with the bracket. The optical body forms the actual optical material of the optical element that can be used to adjust the beam pattern of the electromagnetic radiation. Preferably, the stent is attached to the optical body or is attached to the optical body in a manner that does not affect the optical properties of the optical body as much as possible. In accordance with at least one embodiment of the present invention, the optical system is an optical concentrator that tapers in the direction of the illumination source. In accordance with at least one embodiment of the present invention, at least a portion of the optical body is comprised of at least one of the following basic optical components: a compound parabolic concentrator (c〇mp〇und parabolic concentrator) ; CPC), compound elliptical concentrator (CEC), compound double concentrator (c〇mp〇und hyperbolic concentrator; CHC). In other words, the side of the optical body is constructed by arranging at least one of the two basic optical elements. In addition, the optical concentrator may also exhibit a truncated pyramid or a truncated cone and taper in the direction of the illumination source. In one embodiment, the optical body can be a solid body. In another embodiment, the optical body may be a hollow body having an inner side having a reflective property, for example, coated with a reflective surface. In accordance with at least one embodiment of the present invention, the optical body of the optical component includes a light exit surface. The light exiting surface may be at least one of the following curved surfaces: a spherical surface, an aspherical surface, and an elliptical surface. 11, 1299816, the wind according to at least one embodiment disclosed in the light-emitting module of the present invention, the optical body of the piece is _ robust. The optical system is constructed of a transparent, e.g., transparent plastic. Preferably, the radiation formed on the side of the optical body is total reflection. Preferably, the optical component is composed or composed of the following materials: Cqc, ρμ^α, pmmi, pc,

Macrolon、APEC 〇 依據本發则自於發光模組所揭露的至少—個實施例，所述 核係橫向地圍繞所述鮮本體。在此情形下，所述支架侧 、、>0“《光源之月架結構（g*ame_type也也⑽）。其次，戶斤述光學 本體被安置麵述支紅，其方錢域體造贱其他方式為 之。接腳係形成於支架上，用以***载具上相對應之凹洞。所 述支架與所述光學本體可以是一體成型。然在其他實施例中， 所述光學元件亦可由複數倾件組合喊，換言之，所述支架 與所述光學本體可以是單獨的物件，並以插塞（咖、嵌入 (insert)、鉗牢（cliP)、或黏結（adhesively bond)之方式結 合在一起。 肇_ ^依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件之支架具有曲面所構成之侧面。為達成此目的，所述 支架的至少一部份是中空的圓柱體，換言之，所述支架之側面 的至少-部份是曲面’而其基底則是圓形或橢圓形。然而在所 述支架之側面的某些部分亦可能是平面，亦即其是沒有曲度 的。這些支架之侧面的平面區域可有利於光學元件之固接。又 將所述支架設計成骨架結構之目的，在於補償來自光學元 件之熱壓力（thermal伽·)。中言之，在發光源之運作過程 中，所述光學元件會被加熱，固定在載具上之支架會向遠離所 12 1289816 述載具之方向_。較佳者，所述支架係與所述光學本體在至 >兩個位置相接合，亦即在所述支架雜載具之頂侧結合。因 所述光學本難朝向雜支架之細的方向麟。所述支 架之熱膨脹健倾絲本體之鱗脹魏相#。較佳者，所 述支木與光學本體係由相同材質所構成，故其具有相同的熱膨 服係數。 、、由於所述支架與騎光學本體有相同的鱗脹係數 ，使得Macrolon, APEC 〇 According to at least one embodiment of the present disclosure, the core system laterally surrounds the fresh body. In this case, the bracket side, > 0 "" the light source of the moon frame structure (g * ame_type also (10)). Secondly, the household optical body is placed in the face of the red, the square money domain In other embodiments, the pin is formed on the bracket for inserting a corresponding recess in the carrier. The bracket may be integrally formed with the optical body. In other embodiments, the optical component It can also be shouted by a combination of multiple pieces, in other words, the bracket and the optical body can be separate objects and can be plugged, inserted, clamped, or adhesively bonded. In accordance with at least one embodiment of the present invention, the bracket of the optical component has a side formed by a curved surface. To achieve this, at least a portion of the bracket is hollow. a cylinder, in other words, at least a portion of the side of the bracket is a curved surface and its base is circular or elliptical. However, some portions of the side of the bracket may also be flat, that is, No curvature The planar area of the sides of the brackets may facilitate the attachment of the optical components. The purpose of designing the brackets as a skeleton structure is to compensate for the thermal stress (thermal gamma) from the optical components. During operation, the optical component is heated, and the support attached to the carrier will be oriented away from the carrier of the 12 1289816. Preferably, the support is attached to the optical body to > The two positions are joined, that is, combined on the top side of the bracket miscellaneous carrier. Because the optical body is difficult to face the fine direction of the hybrid bracket, the thermal expansion of the bracket is the scale expansion of the body. Preferably, the branch and the optical system are made of the same material, so they have the same thermal expansion coefficient. Because the bracket has the same scale expansion coefficient as the riding optical body,

斤述支架遠離載具之熱膨脹與所述光學本體朝向載具之熱膨 脹可相互婦。在此條件下，所·光源與所述光學本體之光 射入表面之間距可保持固定。 假使所述光學元件之支架另有彎曲之側面，則所述光學元 =在平行於載具之平面的熱壓力，可以獲得特财效率之補 =所述絲元件如此的設計，可赠光學元倾發光源之間 二传特別精準之定位，即使當所述發光模組處於加熱狀態下亦 依據本發關於發賴_賊的至少—個實_，所述 trrr個盒子。換言之，所述光學元件之支架狀似一 =广亦可有曾曲之側面。所述支架包覆該發光源，位 於载具上，較佳者至少從其四_面包覆之。輯 學性料’其盒子造型亦可保護發光源免受外力及污染 光學—喻例，所述 凡接聊、找及3本件之所有部件，舉 m从 予條自整體地連接在-起。較佳者，所 、子兀之所有部件皆由同一種材質所構成，較佳者，所述 1289816 光學元件係由射出成型方法所製造而成。 、>依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件係由多數組件所組合而成。換言之，所述光學元件之 至少-個部件，例如接腳、支架或光學本體，係與其他部件分 離製造的。在此實施例中，每一部件皆可由射出成型方法所製 造而成，然不同部件之間亦可採用不同之材質。此外，所述支 架亦可不用透明材質，選用彩色或黑色材質皆可。 依據本發明關於發光模組所揭露的至少一個實施例，所述 馨 發光源包含至少一個發光二極體晶粒。較佳者，所述發光源包 含複數個薄膜型之發光二極體晶粒。 薄膜型之發光二極體晶粒具有如下之特徵： -在一發光磊晶層序列之第一主要區域（其中該發光磊 曰曰層序列係朝向一載子元件（carrier element))，形成一個反射 層，用以反射至少一部份該發光磊晶層序列所發出之電磁輻 射，而將其反射回該發光遙晶層序列。所述反射層係一布拉格 鏡（Braggmirror)。特別較佳者，其係一個金屬鏡面，其係由 讎藝 下列群組之薄膜所構成：銀、金、錯化金、銘、和翻。 -所述發光磊晶層序列之厚度為20微米或更小，較佳 者，所述發光磊晶層序列之厚度為1〇微米。為能激發出電磁 輕射，所述發光磊晶層序列包含一 pn接合面（pnjuncti〇n)、 雙異質結構（double heterostruction)、單量子井結構（single quantum well structure)、或較佳地複量子井結構（multiple quantum well structure)。於本專利申請案中，前開量子井結構 係指任何將電何載子侷限在局部區域而使其展現量子化能熊 (quantization of their energy states)之結構。特別地，前開量 1289816 子井結構並不限定其量子化之維度（dimensionality)，包含但 不限於量子盒（quantum boxes )、量子線（quantum Wires )、量 子點（quantumdots)，以及前述量子結構之任何組合。 —所述發光磊晶層序列更包含至少一半導體層，所述半 導體層之至少一部份區域具有一混雜結構（intennixing structure)。在理想狀況下，此混雜結構可以使得發光磊晶層序 列内之光線开> 成一近似各態歷經的分佈（appr〇ximately erg〇dic distribution; annahemd ergodischen Verteilung (德文））亦即形 成一個盡可能各態歷經的（ergodic)，推測學的（stochastic) 分散作用。 出現特別有利的情況是，選取所述載子元件的自由度相較 於成長基底（growth substate)大得多。因此對於導電性或熱 傳導性等性質而言，所述載具與元件的匹配度較成長基底為 優。因此為求獲致高品質之發光磊晶層序列，蠢晶材質最好能 與所述成長基底之晶格（lattice)相匹配。 關於薄膜發光二極體晶粒之基礎原理，乃由Schnitzer等 人於1993年10月於應用物理學刊（Appiie(j physics Letters) 弟 63 期第 2174-2176 頁發表了 ”30% extemai quantum efficienCy from surface textured LEDs”，其揭露了薄膜發光二極體晶粒之 基礎原理。 依據本發明關於發光模組所揭露的至少一個實施例，所述 發光二極體晶粒之封體可以視需要而排除。其中所述光學元件 係一盒狀結構，至少在四個侧面包覆所述發光二極體晶粒。所 述光學兀件的盒子造型可保護發光二極體晶粒免受外力及污 染之侵襲。 15 1289816 依據本發_於發細組所揭露的至少_個實施例，其中 在所述發光源之發光二極體晶粒與所述光學元件之光射入表 面之間存在-_，其中所述間_填充以氣體，特別較佳 者’所述間隙係填充以空氣。 一依據本發明關於發光模組所揭露的至少一個實施例，所述 f光模組之絲元件有—個輯，與所述發光狀發光二極體 曰曰粒之封體相接觸。為達成此目的，可以將所述光學元件之光 射入表面壓入發光二極體晶粒之封體。在此情形下，所述發光 二極體晶粒之封體可以在固接所述光學元件之後再行固化 (curing) ’或者選用不需進行固化製程之軟性膠狀封體。 此外，亦可先將發光二極體晶粒封入一個需要固化之封體 材料之内，其次再加上一層膠狀封體，較佳者，所述膠狀封體 並不經充分之固化。當所述光學元件被固定至所述載具上時， 所述光學元件之光射入表面被壓入所述膠狀封體中。較佳者， 所述膠狀封體係-種麵合封膠（⑺uplinggel)或係數吻合封膠 (index matching gel)。在此情形下，所述膠狀封體的選取是 為達成發光二極體晶粒與光學元件之間的較佳耦合，使得當電 磁輻射由發光二極體晶粒發射至光學元件時，其折射係數之落 差不至於太大。 依據本發明關於發光模組所揭露的至少一個實施例，其中 所述發光二極冑晶粒與所$光學元件之光射入表面間的距離 至多為250微米，較佳者，所述發光二極體晶粒與所述光學元 件之光射入表面間的距離至多為200微米。所述發光二極=晶 粒與所述光學元件之光射入表面間的微小距離，使得由所述g 光二極體晶粒所發出之電磁輻射，盡可能高比例地耦合進入所 16 1289816 述光學元件中。 依據本發明關於發光模組所揭露的至少一個實施例，其中 斤过毛光模組係做為光學投影設備或汽車頭燈之發光元件。 、，依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件至少有兩健腳，用_人所·具之姆應的凹洞 中。如此的設計使得將光學元件固接至所述發光源時，可避免 旋轉所帶來的誤差。較佳者，所述光學元件具有三個接腳，用 以插人所述載具之相對應的凹洞巾；較佳者，所述光學元件具 讎 *四個接腳，用以***所述載具之相對應的凹洞中。 一依據本發明關於發光模組所揭露的至少一個實施例，所述 光學元件係黏著固接於所述載具上。較佳者，亦可對所述接腳 進行熱壓㈣程（hot_stamped)，使得所學元件可以力學 性地固接於所述載具之上。 以下配合圖式及各實施例，來說明本發明所揭露之光波導 與光電組件。 在各實施例與圖式中，相同之元件賦予相同之元件標號。 _ 赋之元件所描繪之尺寸，與其真實之尺寸並不相干，有時為 求較佳之描繪效果，可能將部分元件尺寸予以誇大。 【實施方式】 首先請參考第-圖’其顯示本發明第—實施例所揭露之發 光模組的透視示意 1,第-_示—載具8以及—光學元件 1，其中光學元件i係固定在载具8上。所述載具8可以是一 電路板’其具有導體線路用以與發光源進 言，所述電路板可以是具有金屬核心之電路板，其 17 1289816 銘荨熱傳物質。 舉例而言，所述發光源可以是發光二極體晶粒9。所述發 光一極體晶粒9置於一陶竟基板（ceramic substrate)上。較佳 者’所述陶瓷基板具有複數個穿透板面之通孔。藉由所述通 孔’使得所述發光二極體晶粒9可以與所述載具8之導體線路 電性接觸。較佳者，所述陶瓷基板係由至少下列物質其中一種 所構成·氮化鋁、氧化鋁、玻璃陶瓷、玻璃、金屬。The thermal expansion of the stent away from the carrier and the thermal expansion of the optical body toward the carrier can be mutually exclusive. Under this condition, the distance between the light source and the light incident surface of the optical body can be kept constant. If the bracket of the optical element has a curved side, the optical element = the thermal pressure parallel to the plane of the carrier, the special efficiency can be obtained = the silk element is so designed, and the optical element can be given The second transmission between the tilting light sources is particularly precise, even when the lighting module is in a heated state, according to at least one real__, the trrr box of the hair _ thief. In other words, the optical element has a bracket shape that looks like a wide area and can also have a side surface. The bracket encloses the illumination source on the carrier, preferably at least from its four sides. The material of the box's shape can also protect the light source from external forces and pollution. As an example, all the parts of the book, which are connected and found, are connected from the whole. Preferably, all of the components of the sub-frame are made of the same material. Preferably, the 1289816 optical component is manufactured by an injection molding method. In accordance with at least one embodiment of the present invention, the optical component is assembled from a plurality of components. In other words, at least one of the components of the optical component, such as a pin, bracket or optical body, is fabricated separately from the other components. In this embodiment, each component can be made by an injection molding method, but different materials can be used between the different components. In addition, the support may be of a transparent material and may be of a color or black material. In accordance with at least one embodiment of the present invention, the singular light source includes at least one light emitting diode die. Preferably, the illuminating source comprises a plurality of thin film type luminescent diode dies. The thin film type light-emitting diode crystal grain has the following features: - a first main region of a luminescent epitaxial layer sequence (where the luminescent reveal layer sequence is oriented toward a carrier element), forming a And a reflective layer for reflecting at least a portion of the electromagnetic radiation emitted by the sequence of the luminescent epitaxial layer and reflecting it back to the sequence of the luminescent crystal layer. The reflective layer is a Bragg mirror. Particularly preferred, it is a metal mirror that consists of a film of the following groups: silver, gold, gold, quartz, and flip. The thickness of the luminescent epitaxial layer sequence is 20 microns or less, and preferably, the luminescent epitaxial layer sequence has a thickness of 1 Å. In order to excite electromagnetic light, the luminescent epitaxial layer sequence comprises a pn junction, a double heterostruction, a single quantum well structure, or preferably a complex Multiple quantum well structure. In the present patent application, a front-open quantum well structure refers to any structure that confines the electrical carrier to a localized region to exhibit quantization of their energy states. In particular, the pre-opening 1298816 sub-well structure does not limit its dimensionality, including but not limited to quantum boxes, quantum wires, quantum dots, and the aforementioned quantum structures. Any combination. The luminescent epitaxial layer sequence further comprises at least one semiconductor layer, at least a portion of the semiconductor layer having an intennixing structure. In an ideal situation, the hybrid structure can cause the light in the sequence of the luminescent epitaxial layer to open into a similar distribution (appr〇ximately erg〇dic distribution; annahemd ergodischen Verteilung (German)) It may be ergodic, stochastic dispersion. A particularly advantageous case arises in that the degree of freedom in selecting the carrier element is much greater than in the growth substate. Therefore, for properties such as electrical conductivity or thermal conductivity, the degree of matching between the carrier and the component is superior to that of the growth substrate. Therefore, in order to obtain a high quality luminescent epitaxial layer sequence, the stray crystal material preferably matches the lattice of the grown substrate. The basic principle of thin film light-emitting diode grains is published by Schnitzer et al., October 1993, in Applied Physics (Appiie (j physics Letters), 63, 2174-2176, "30% extemai quantum efficienCy From the surface textured LEDs, which exposes the basic principle of the thin film light emitting diode die. According to at least one embodiment of the present invention, the light emitting diode die can be sealed as needed. The optical component is a box-like structure, and the light emitting diode die is covered on at least four sides. The box shape of the optical component protects the LED die from external force and pollution. In accordance with at least one embodiment disclosed in the present invention, wherein there is a -_ between the light-emitting diode dies of the illuminating source and the light incident surface of the optical element. Wherein the inter-filler is filled with a gas, and particularly preferably the gap is filled with air. According to at least one embodiment of the present invention, the filament component of the f-light module A set is in contact with the envelope of the light-emitting diodes, and for this purpose, the light of the optical element can be injected into the surface of the light-emitting diode die. In this case, the sealing body of the light-emitting diode die may be cured after fixing the optical component or may be a soft gel-like sealing body that does not require a curing process. First, the light-emitting diode crystal grains are sealed into a sealing material to be solidified, and then a layer of gel-like sealing body is added. Preferably, the gel-like sealing body is not sufficiently cured. When the component is fixed to the carrier, the light incident surface of the optical component is pressed into the gelatinous sealing body. Preferably, the gelatinous sealing system-face sealing sealing glue ((7) uplinggel) Or a coefficient matching gel. In this case, the gelatinous seal is selected to achieve a better coupling between the light emitting diode die and the optical element, such that when the electromagnetic radiation is emitted by the light The difference in refractive index of a polar body grain when it is emitted to an optical element According to the present invention, at least one embodiment disclosed in the light emitting module, wherein the distance between the light emitting diode chip and the light incident surface of the optical element is at most 250 micrometers, preferably The distance between the light-emitting diode crystal grains and the light incident surface of the optical element is at most 200 μm. The light-emitting diodes are a small distance between the crystal grains and the light incident surface of the optical element, The electromagnetic radiation emitted by the g-diode grains is coupled into the optical element as described in the above-mentioned optical module as far as possible. According to the invention, at least one embodiment disclosed in the light-emitting module, wherein the capillary mode is The group is used as a light-emitting element of an optical projection device or a car headlight. According to at least one embodiment of the present invention, in relation to the light-emitting module, the optical element has at least two feet, which are in the cavity of the body. Such a design allows the error caused by the rotation to be avoided when the optical element is fixed to the illumination source. Preferably, the optical component has three pins for inserting corresponding recessed pockets of the carrier; preferably, the optical component has four pins for inserting In the corresponding cavity of the carrier. In accordance with at least one embodiment of the present invention, the optical component is adhesively attached to the carrier. Preferably, the pin can also be hot-stamped so that the learned component can be mechanically secured to the carrier. The optical waveguide and the optoelectronic component disclosed in the present invention will be described below with reference to the drawings and the embodiments. In the embodiments and the drawings, the same elements are given the same reference numerals. _ The dimensions depicted by the component are not related to their true size. Sometimes, for better rendering, some component sizes may be exaggerated. [Embodiment] Referring first to the drawings, there is shown a perspective view 1 of a light-emitting module according to a first embodiment of the present invention, a first embodiment of a light-emitting module, and an optical component 1, wherein the optical component i is fixed. On the carrier 8. The carrier 8 can be a circuit board having conductor tracks for illumination with a source of illumination, the circuit board being a circuit board having a metal core, 17 1289816, the heat transfer material. For example, the light source may be a light emitting diode die 9. The light-emitting diode chip 9 is placed on a ceramic substrate. Preferably, the ceramic substrate has a plurality of through holes penetrating the plate faces. The light-emitting diode dies 9 can be electrically contacted with the conductor lines of the carrier 8 by the through holes. Preferably, the ceramic substrate is composed of at least one of the following materials: aluminum nitride, aluminum oxide, glass ceramic, glass, metal.

所述光學元件1具有一支架5與一光學本體6。在第一圖 所揭示的實施例中，所述支架5與光學本體6是一體成型的。 所述光學元件1係以射出成型（injeeti〇n_m〇lding)或轉印成 型（transfer-molding)等方法所製造而成。所述光學元件1之 光予本體6 了以疋一光學集中器（〇pticai ，其朝 向發光二極體晶粒9之方向逐漸變細。換言之，所述光學集中 器的截面積在朝向發光二極體晶粒9之方向逐漸遞減。 、所述光學本體6 _面，躺下航學元狀至少一麵 組成· CPC、CHC、CEC、斜截頭的角錐體光學儀器（tmncated 辦纖1 Gptie)、斜截·®賴絲伽（tnmeated _ :此）。所述光學本體6係一中空結構，其内側表面塗佈以反 垂用以反射至少大部分所述發光二極體晶粒9所發出之 嵐爲射。所述光學本體6内側表面的塗佈材質可以是一種金 整来本體6的伽在於降健魏射的發散程度、調 整先束⑽狀、及/妓互齡通過㈣制輕射。 所述1 ^―光射出表面3，就光束方向而言， 面3係位於光學本體6的下游。在本發明的一個 18 1289816 光射出表面3係一透明板，其組成材質的熱膨 好疋與所述核5與輕讀6 _。此外，所述光 射出表面3的材f最好與所述光學元件1之其他部分的材質相 同。因此’所述出表面3最好與所述光學元件1 -體成型。 、、所述光學το件1具有複數個接腳（fittingpins) 2，其與所 述支架5係-體構成。所述複數個接腳2最好係與所述支架$ 與光學本體6-起藉由射出成型製程所製造。The optical component 1 has a bracket 5 and an optical body 6. In the embodiment disclosed in the first figure, the bracket 5 is integrally formed with the optical body 6. The optical element 1 is manufactured by a method such as injection molding or transfer-molding. The light of the optical element 1 is preliminarily thinned by the optical concentrator (〇pticai, which is oriented toward the light-emitting diode die 9 in other words. In other words, the cross-sectional area of the optical concentrator is toward the light-emitting diode 2 The direction of the polar body grain 9 is gradually decreasing. The optical body 6 _ face, lying down at least one side of the aeronautical element, including CPC, CHC, CEC, and truncated pyramid optical instrument (tmncated fiber 1 Gptie) And the optical body 6 is a hollow structure, the inner surface of which is coated with a sag to reflect at least a majority of the light-emitting diode grains 9 The coating material of the inner surface of the optical body 6 may be a kind of gold, and the merging of the body 6 is the divergence degree of the reducing vibration, the adjustment of the first beam (10) shape, and//the mutual age passage (four) system. The light is emitted from the surface 3, and the surface 3 is located downstream of the optical body 6 in terms of the direction of the beam. In the 18 1289816 light exit surface 3 of the present invention is a transparent plate which is composed of a material of heat.膨 疋 with the core 5 and light reading 6 _. In addition, the light Preferably, the material f of the surface 3 is the same as the material of the other portions of the optical element 1. Therefore, the surface 3 is preferably formed integrally with the optical element 1. The optical unit 1 has a plurality of Fitting pins 2 are formed integrally with the bracket 5. The plurality of pins 2 are preferably manufactured by the injection molding process with the brackets $ and the optical body 6.

在本發明第-圖所揭露之實施例中，所述光學元件】具有 三個接腳2。所述三個接腳係做為解狀接腳，其剛好可插 入所述載具8之賴中。為求將所述絲元件丨力學地固定於 所述載具8上，可在職該5與載具8之交界面施以黏著劑 以固定之。此外，另可單獨施作或附加於上述實施方式，將所 述光學元件1之接腳2以力學地緊壓方式固接於载具8之上。 為求達此目的，所述載具8之關的餘必須略小於接腳2之 直徑，使得當獅2被力學地壓人所職具8時，所述光學元 件1便自動對準並固接於載具8之上。 在本發明第一圖所揭露之實施例中，所述光學元件丨的形 狀類似一個盒子。換言之，所述支架5狀似一個盒子，並且I 架5之側壁完全包覆所述發光二極體晶粒9，使得發光二極體 晶粒9之封體可以視需要而排除。所述光學元件丨的盒子造型 可保濩發光二極體晶粒9免受外力及污染之侵襲。 此外對於所述光學本體6的較佳設計，是使其盡量靠近發 光二極體晶粒9，以令光學元件有較低之高度。較佳者，所述 光學本體6之光射入表面4與發光二極體晶粒9之輻射射出^ 面之間的距離介於100微米至300微米之間；特別較佳者，戶^ 19 1289816 述光學本體6之光射人表面4與發光二極體晶粒9之輕射射 表面之間的距離介於150微米至250微米之間。所述光學本體 6之光射入表面4與發光二極體晶粒9之輻射射出表面之間的 距離之限制，在於連接兩者之黏接導線。在本實施例中，所 光學本體6之光射入表面4與發光二極體晶粒9之輕射射 面之間係填充以氣體，例如空氣。 ^ 後續請參考第二圖，其顯示本發明第二實施例所揭露之光 學元件1的透視示意圖。較佳者，本發明第二實施例所揭露之 • 絲元件1係一體成型的。與第—圖所揭示之第-實施例相同 的是，所述光學元件1具有-支架5與一光學本體6。然第二 實施例與第-圖所揭示之第-實施例不同的是，第二實=例^ 揭示之光學元件1並非盒子造型。較佳者，本實施例之光學本 體6係-堅實本體。所述光學元件！係由透明材質，例如透明 塑膠所構成。較佳者，所述光學元件丨係由下列材質中至少一 種所組成或構成·· COC、PMMA、PMMI、PC、M_l〇n、AP%。 在本發明弟一圖所揭露之第二實施例中，所述光學本體6 麵 狀似斜截頭的角錐體（truncatedpyramid)，朝向所述光學本體 6之光射入表面4的方向變細。所述光學元件15之光射出表 面3，在每一光學本體6之上彎曲地形成透鏡形狀。此設計一 方面可使光束收斂，另-方面可提高經由光學本體6而離 射出表面3之比例。 一較佳者，呈透鏡形狀的光射出表面3，係與所述支架5與 光學本體6 -體成型。更佳者，整個光學元件i係以射出成^ 或轉印成型等方法所製造而成一體成型。 所述光學元件1更包含複數個接腳2，除了用以對準外， 20 1289816 ===::=述載具8之上，其中所述載 風覆於光學本體6之頂部，脚鄰近所述光 予疋件1之先射出表面3之處，以使得光學本體6之光學 盡可能地少賴it核5卿響。其結觀得麵述光 6之光射人表面，合進人光學賴6之魏輻射，不 述支架5之處造成擾亂性之反射。In the embodiment disclosed in the first embodiment of the present invention, the optical element has three pins 2. The three pins are used as a solution pin which is just inserted into the carrier 8. In order to mechanically fix the wire member to the carrier 8, an adhesive may be applied to the interface between the carrier 5 and the carrier 8 to fix it. Alternatively, the pins 2 of the optical element 1 may be attached to the carrier 8 in a mechanically compressed manner, either alone or in addition to the above embodiment. In order to achieve this, the balance of the carrier 8 must be slightly smaller than the diameter of the pin 2, so that when the lion 2 is mechanically pressed into the tool 8, the optical component 1 is automatically aligned and fixed. Connected to the carrier 8. In the embodiment disclosed in the first embodiment of the present invention, the optical element 丨 is shaped like a box. In other words, the bracket 5 resembles a box, and the side walls of the shelf 5 completely enclose the light-emitting diode die 9, so that the body of the light-emitting diode die 9 can be excluded as needed. The box shape of the optical element 可 protects the light-emitting diode die 9 from external forces and pollution. Further, the preferred design of the optical body 6 is such that it is as close as possible to the light-emitting diode die 9 to provide a lower height of the optical component. Preferably, the distance between the light incident surface 4 of the optical body 6 and the radiation exit surface of the light emitting diode die 9 is between 100 micrometers and 300 micrometers; particularly preferably, the household is 19 1289816 The distance between the light-emitting surface 4 of the optical body 6 and the light-emitting surface of the light-emitting diode die 9 is between 150 micrometers and 250 micrometers. The limitation of the distance between the light incident surface 4 of the optical body 6 and the radiation exit surface of the light-emitting diode die 9 lies in the connection of the bonding wires of the two. In the present embodiment, the light incident surface 4 of the optical body 6 and the light-emitting surface of the light-emitting diode die 9 are filled with a gas such as air. ^ Subsequently, please refer to the second figure, which shows a perspective schematic view of the optical element 1 disclosed in the second embodiment of the present invention. Preferably, the wire element 1 disclosed in the second embodiment of the present invention is integrally formed. The optical element 1 has a holder 5 and an optical body 6 in the same manner as the first embodiment disclosed in the first embodiment. However, the second embodiment is different from the first embodiment disclosed in the first embodiment in that the optical element 1 disclosed in the second embodiment is not a box shape. Preferably, the optical body 6 of the present embodiment is a solid body. The optical component! It is made of a transparent material such as transparent plastic. Preferably, the optical element is composed of or consists of at least one of the following materials: COC, PMMA, PMMI, PC, M_l〇n, AP%. In a second embodiment of the present invention, the optical body 6 has a truncated pyramid shaped like a truncated cone, which tapers toward the light incident surface 4 of the optical body 6. The light of the optical element 15 exits the surface 3, and a lens shape is curvedly formed on each of the optical bodies 6. This design can, in one aspect, converge the beam and, on the other hand, increase the ratio of the exiting surface 3 via the optical body 6. Preferably, the light-emitting surface 3 in the shape of a lens is formed integrally with the holder 5 and the optical body 6. More preferably, the entire optical element i is integrally molded by a method such as injection molding or transfer molding. The optical component 1 further includes a plurality of pins 2, except for the alignment, 20 1289816 ===::= above the carrier 8, wherein the wind is applied to the top of the optical body 6, and the foot is adjacent The light is first projected out of the surface 3 of the element 1 such that the optics of the optical body 6 is as less as possible. The result is that the light of the light 6 strikes the surface of the human body, and the radiation of the human optical ray 6 is combined, and the reflection of the bracket 5 is not caused.

如同第-圖所揭示之實施例，在本實施例中所述光 1亦被岐在所述載具8上。較佳者，每一光學本體6係 置於-個發^二極體晶粒9之下游。較佳者，在光學本體6盥 發光二極體晶粒9之間係填充以發光二極體晶粒9之封體或^ 數吻合之娜，如麟提升發光二_晶粒9至絲本體6之 光學輕合。換言之’在光射人表面4之處反射之機率將合降 低。較佳者，所述絲本體6之光射人表面4與發光二極體晶 粒9之輪射射出表面之間的距離約$ 2〇〇微米。較佳者每一 發光二極體晶粒9之封體與所述絲本體6之光射人表面 間具有一接觸面。 為達成此目的，可以將所述光學元件〗之光射入表面4 壓入發光二極體晶粒9之封體。在此情形下，所述發光二極體 晶粒9之雜可以在關所述絲元件〗之後再行固化 (curing) ’或者顧不需進行固化製程之軟性膠狀封體。 此外’亦可先將發光二極體晶粒9封人—個需要固化之封 體材料之内，其次再加上-轉狀職，較佳者，所述膠狀封 體並不經充分之固化。當所述光學元件丨_定至所述载具8 上時’所述絲元件1之光射人表面4彳鎌人所述膠狀封體 1289816 中。較佳者，所述膠狀封體係一種耦合封膠（c〇uplinggd)或 係數吻合封膠（index matehing gel)。在此飾下，所述膠狀 封體的選取是為達成發光二極體晶粒9與光學元件丨之間的較 佳麵合’使得f電磁輻射由發力二極體晶粒9發射至光學元件 1時，其折射係數之落差不至於太大。As in the embodiment disclosed in the first figure, the light 1 is also clamped on the carrier 8 in this embodiment. Preferably, each optical body 6 is placed downstream of a die diode 9 . Preferably, the optical body 6 盥 the light-emitting diode dies 9 are filled with the sealing body of the illuminating diode crystal 9 or the matching of the number, such as the lining of the light-emitting diode _ grain 9 to the wire body 6 optical light. In other words, the probability of reflection at the surface 4 of the light shot is reduced. Preferably, the distance between the light-emitting surface 4 of the filament body 6 and the shot-ejecting surface of the light-emitting diode particles 9 is about $2 μm. Preferably, the sealing body of each of the light-emitting diode crystal grains 9 has a contact surface with the light-emitting surface of the wire body 6. To achieve this, the light of the optical element can be injected into the surface 4 into the envelope of the light-emitting diode die 9. In this case, the impurities of the light-emitting diode grains 9 can be cured after the wire member is turned off or a soft gel-like seal which does not require a curing process. In addition, it is also possible to first seal the light-emitting diode die 9 into a sealing material that needs to be cured, and then add-turn the shape. Preferably, the gel-like seal is not sufficient. Cured. When the optical element is set to the carrier 8, the light-emitting surface of the wire element 1 is in the gel-like seal 1289816. Preferably, the gel seal system is a coupling sealant or an index matehing gel. In this context, the gel-like seal is selected to achieve a good fit between the light-emitting diode die 9 and the optical component ' such that f electromagnetic radiation is emitted from the force-generating diode die 9 to In the case of the optical element 1, the difference in refractive index is not too large.

第三圖顯示本發明所揭露之光學元件1的另-個實施例 的透視示意圖。在此實施例巾’所述光學本體6是平行六面體 的（parallelepiped)，其同樣被安置於發光二極體晶粒9之下 游。所述平行六面體可以是—個塗翁鏡面之巾空體，或者較 佳者係-堅實本體。所述光學本體6可以由前述各種透明塑膠 所形成。所述光學本體6可做為一種光線的混合器，其置於發 光二極體晶粒9之下游’可用以混合不同顏色的光線以形成^ 光。較佳者，所述光學本體6係與所述支架5 —體成型。所述 支架5至少有兩個呈斜對角制之接腳2，除了肋對準外， 亦用以將所述光學元件！定位在所述載具8之上。較佳者，所 述光學70件1係以射出成型或轉印成型等方法所製造。在第三 圖所顯示之實施例中’所述光學本體6係在絲人表面4 : 處，固定於所述支架5之網絡5a上。 第四圖顯示本發明所揭露之光學元件1的另-個實施例 的透視不意圖。在此實施例中，所述光學本體6 型。特別地，所述光學本體6之紐出表自3是—個向外= 的凸面’形成-個聚焦的透鏡。在此實施例中，所述光 面3可以是如下曲面至少其中—種：球面、非球面、 ，，出表面3之曲度的設計，係在降低光線】 體6時’發生全反射之機率。較佳者，所述光學本體6 22 1289816 稷數:固發光二極體晶粒9之下游。然而，亦可如同第四圖所揭 不之實施例般，將所述光學元件丨精確地安置於—個發光一極 體晶粒9之下游。在此實施例中，所述光學本體6係安置於三 侧絡5a上，其端點是接腳2，除了用以對準外，亦用以將 所述光學元件！定位在所職具8之上。在此加种，所述 接腳2係星形樣式，使得尺寸上的微小差異得以獲得補償。在 第四圖所顯示之實施射，整個所述光學元件丨係以射出_ 或轉印成型等方法所製造而成一體成型。 、第五圖顯示本發卿揭露之光學元件丨的另—個實施例 的透視不意U，其與第―圖相似。在此實補巾，所述光學元 件1具有九個光學本體6，其中每一光學本體6位於—個發光 二極體晶粒9之下游。第五_示之光學元件1狀似一^盒 子，使得發光二極體晶粒9之封體可以視需要而排除。孤 、第六_示本發贿揭露之光學元件1的另-個實施例 的透視示意圖。與第—圖與第五圖不同的是’所述光學元 並非狀似一個盒子。 第七圖顯示本發明所揭露之光學元件1的另一個實施例 的透視示意圖。與第―圖、第二圖、第五圖與第六圖不同的是1， 所述光學元件1具有一個單獨的光學集中器做為光學本體6。 所述光學本體6是—個塗佈有反射面之中空體，較佳者，在第 七圖中所示之光學本體6係位於複數個發光二極體晶粒9之 游。 卜 第八圖顯示本發明所揭露之光學元件1的另一個實施 的透，意51 ’其與第-圖所揭示之實施例相似。 歹 第九a圖與第九b圖顯示本發明所揭露之光學元件i的另 23 1289816 一個實施觸透視示意圖。在第九a 騎顯示之光 學元件1的另一個實施例中，所述光學本體6係與所述支架5 一體成型，其巾所述支架5赫光學元件丨之光㈣表面3的 y部份所組成。腳柱（legs)係橫向地固接在光射出表面3上， 並順著所述光學本體6延伸。在第九a圖所顯示之實施例中， 所述接腳2係用以將所述光學元件！對準並固接至所述載具8 上’其中所述接腳2係位於所述腳柱上，與光射出表面3相反 方向之端面上。在第九b圖所顯示之實施例中，所述腳柱本身 _ 便是接腳2。在第九a圖與第九匕圖所顯示之實施例中，所述 光學元件1是一體成型的。 第十a圖與第十b圖顯示本發明所揭露之光學元件丨的另 二個實施例的透視示意圖，其光學元件丨係由多個料件所組 成，並非一體成型。在第十a圖所顯示之實施例中，所述支架 5係與所述光學本體6僅在兩個位置相接合，其中所述光學本 體6較佳者係為一堅實固體。如此可使得所述光學本體6之光 學性質盡可能地不被所述支架5所影響。 _ 在第十b圖所顯示之實施例中，所述光學元件〗係位於複 數個發光二極體晶粒9之下游。一個光學集中器做為光學本體 6，其係鉗牢於所述支架5之側壁。所述支架5之複數個侧壁 係由一個套筒（sleeve) 5b將其集結並包束在一起。所述光學 本體6可以是一個塗佈有反射面之中空體，或者是一個堅實固 體。 第十一圖顯示本發明所揭露之光學元件〗的另一個實施 例的透視示意圖。在此實施例中，所述光學元件丨係類似第二 圖所示之實施例所揭示的光學元件i。所述光學元件〗'狀似= 24 .1289816 個盒子，較佳者，其係—個堅實固體，狀似斜截頭之角錐體。 然而，揭私其他辨針^，时做為本實 施例之光學本體6。 ΛThe third figure shows a perspective schematic view of another embodiment of the optical component 1 of the present invention. In this embodiment, the optical body 6 is a parallelepiped which is also disposed below the light-emitting diode die 9. The parallelepiped may be a toweled body of a coated mirror or a better body-solid body. The optical body 6 can be formed of various transparent plastics as described above. The optical body 6 can be used as a light mixer that is placed downstream of the light-emitting diode die 9 to mix light of different colors to form a light. Preferably, the optical body 6 is integrally formed with the bracket 5. The bracket 5 has at least two legs 2 which are diagonally opposite to each other, and in addition to the rib alignment, the optical element is also used! Positioned above the carrier 8. Preferably, the optical 70 pieces 1 are produced by a method such as injection molding or transfer molding. In the embodiment shown in the third figure, the optical body 6 is attached to the network 5a of the holder 5 at the surface of the wire. The fourth figure shows a perspective view of another embodiment of the optical element 1 disclosed in the present invention. In this embodiment, the optical body is 6 type. In particular, the button body of the optical body 6 forms a focused lens from 3 being an outwardly convex surface. In this embodiment, the smooth surface 3 may be at least one of the following curved surfaces: a spherical surface, an aspheric surface, and a curvature of the surface 3, which is the probability of total reflection when the light is reduced. . Preferably, the optical body 6 22 1289816 has a number of turns: downstream of the solid-emitting diode die 9 . However, the optical element 丨 can also be accurately placed downstream of the illuminating one-pole die 9 as in the embodiment disclosed in the fourth figure. In this embodiment, the optical body 6 is disposed on the three side cores 5a, and the end points thereof are the pins 2, which are used to align the optical components in addition to being aligned! Positioned on the job 8 . In addition, the pin 2 is in a star pattern so that slight differences in size can be compensated for. In the execution shown in the fourth figure, the entire optical element is integrally molded by a method such as injection molding or transfer molding. The fifth figure shows a perspective view of another embodiment of the optical component disclosed by the present disclosure, which is similar to the first figure. In this case, the optical element 1 has nine optical bodies 6, each of which is located downstream of a light-emitting diode die 9. The fifth optical element 1 is shaped like a box so that the envelope of the light-emitting diode die 9 can be excluded as needed. Solitary, sixth, showing a perspective view of another embodiment of the optical component 1 disclosed by the present bribery. The difference from the first to fifth figures is that the optical element is not shaped like a box. The seventh figure shows a perspective schematic view of another embodiment of the optical element 1 disclosed in the present invention. Different from the first, second, fifth and sixth figures, the optical element 1 has a single optical concentrator as the optical body 6. The optical body 6 is a hollow body coated with a reflecting surface. Preferably, the optical body 6 shown in Fig. 7 is located in a plurality of light-emitting diode crystal grains 9. The eighth figure shows another embodiment of the optical element 1 disclosed in the present invention, which is similar to the embodiment disclosed in the first embodiment.第九 FIGS. 9a and 9b are diagrams showing an embodiment of the optical element i disclosed in the present invention. In another embodiment of the ninth a-ride display optical component 1, the optical body 6 is integrally formed with the bracket 5, and the y portion of the surface 3 of the light (4) of the optical component of the bracket Composed of. Legs are laterally fixed to the light exit surface 3 and extend along the optical body 6. In the embodiment shown in Figure 9a, the pin 2 is used to hold the optical element! Aligned and fixed to the carrier 8' wherein the pin 2 is located on the leg of the leg opposite the light exit surface 3. In the embodiment shown in Figure ib, the leg itself _ is the pin 2. In the embodiment shown in the ninth and ninth drawings, the optical element 1 is integrally formed. Figures 11a and 10b show perspective views of two other embodiments of the optical component cartridge disclosed in the present invention, the optical component of which is comprised of a plurality of components, not integrally formed. In the embodiment shown in Fig. a, the bracket 5 is joined to the optical body 6 only at two locations, wherein the optical body 6 is preferably a solid solid. This makes it possible for the optical properties of the optical body 6 to be as unaffected by the support 5 as possible. In the embodiment shown in the tenth b, the optical element is located downstream of a plurality of light emitting diode dies 9. An optical concentrator is used as the optical body 6, which is fastened to the side wall of the bracket 5. The plurality of side walls of the bracket 5 are gathered and bundled together by a sleeve 5b. The optical body 6 may be a hollow body coated with a reflecting surface or a solid solid. The eleventh drawing shows a perspective schematic view of another embodiment of the optical element disclosed in the present invention. In this embodiment, the optical element is similar to the optical element i disclosed in the embodiment shown in the second figure. The optical element is shaped like = 24.1289816 boxes, preferably a solid solid, shaped like a truncated pyramid. However, when the other needles are exposed, the optical body 6 of the embodiment is used. Λ

第十二圖顯示本發明所揭露之光學元件1的另-個實施 例的透視示意圖’其與第一圖所揭露之實施例相似’然而於本 實施例中，所狀學树1並非狀似-個盒子，更_地說， 所述支架5之四_面的至少—部份是打_。所述接腳2係 用以將所述光學元件1對準並固接至所述載具8上其中所述 接腳2係位於所述光學元件丨之四邊形的四個角邊上、。 第十二a圖至第十三f圖顯示本發明所揭露之光學元件i 的另-個實施例的透視示意圖，其光學元件i係由多個料件所 組成，並非-體成型。如第十三a圖及第十三b圖所顯示，所 述光學元件1具有-光學本體6。所述光學本體6具有一光學 集中器以及-光射出表面3。較佳者，所述光學集巾器係一堅 實固體，由前述諸種透明塑膠之其中一種所構成。在。第十三& 圖至第十二f圖所揭露之實施例中，所述光學本體6係與光射 出表面3 —體成型。所述光射出表面3在光學集中 突出於該光學集中器，使得接腳2得以自由進t中;= 腳2係用以將所述光學本體6對準並固接至所述支架5上。 此外，複數個發光二極體晶粒9係位於所述光學本體6 之光射入表面4之處。舉例而言，五個發光二極體晶粒9係於 光射入表面4之處呈直線排列。較佳者，所述光學本體6之光 射入表面4，與所述發光二極體晶粒9之封體相接觸。換言之， 可以將所述光學元件1之光射入表面4壓入發光二極體晶粒9 之封體。 25 1289816 在第十一 a圖及第十^圖所揭露之實施例中，所述光學 本體6係以射出成型或轉印成型等方法所觀喊，其較適合 =於汽車或機車或其他交通卫具之驗。舉例而言，藉由如 斜三a圖及第十三b圖中所述光學本體6之較佳設計，可以 將頭燈之光束設計成較廣角且均勻的分佈。 第十三〇圖及第十三廿圖則顯示第十三&圖及第十三匕圖 所揭示之光學本體6的支架5。所述支架5在光學本體6上之 設計，碰所述光學本體6可以被辦在所述核5之上，及 /或在所述光射出表面3之邊緣處，將所述光學本體S壓著或 黏著在所述支架5之上。在此情形下，所述接腳2係用以將所 述光學本體6對準並固接至所述支架5上。所述支架5具有一 ^體”基盤其中在$本體上有—開口，該開口係用以容納 光子本體6戶斤述基盤上有複數個接腳2，用以將戶斤述支架$ 對準並固疋在所述載具8之上。較佳者，所述支架5係一體成 型。所述支& 5之鱗脹係數係與光學本體6之_彡脹係數相 #。較佳者，所述支架5與光學本體6係由相同材質所構成。 « 所述支架5可以是彩色的或黑白的。 ，第十二e圖及第十三f圖則顯示具有支架5與光學本體6 之光學兀件卜其安置於所述载具8之上之示意圖。其中所述 載具8與第一圖所揭露者相同。在此實施例中，所述光學本體 6可以被鉗牢在所述支架5之上。 第十四a圖至第十四。圖顯示第十三a圖至第十三f圖所 ^露之光學元件i，固接在一載具8之上的不同方向的透視示 意圖。由第十四&圖至第十四〇圖可看出，位於所述支架5之 基盤上之接腳2穿透載具8上的凹洞，並突出於载具S上遠離 26 -1289816 廣之光分佈，而第十七e圖及第十七f圖所揭露之光學本體6 則具有熱聚光煃之分佈。與第十三圖至第十六圖所揭示之光學 兀件1不同的是，第十七a圖至第十七(1圖所揭露之光學元件 1係一體成型的。在本發明此一實施例中，所述光學元件^係 以射出成型或轉印成型等方法所製造而成。 所述光學元件1在兩處整體地連接至所述支架5。較佳 者’所述光學元件1係在所述支架5的側邊連接到所述支架5, 其中該側邊係指遠離載具8之侧邊。較佳者，其中所述支架5 的至少一部份係為曲面造型。在第十七a圖至第十七d圖所揭 露之實施例中，所述支架5是具有橢圓形基底之中空圓柱體。 在第十七a圖至第十七d圖所揭露之實施例中，所述光學元件 1的設計方法，係使所述支架5的形狀可用以補償光學元件之 熱如脹。因此，熱膨脹的方向係在垂直於所述光學元件1之基 盤的方向（遠離載具8的方向），其中該光學元件丨係固定在 載具8之上。至於連接在所述支架5上的光學本體6，其膨脹 方向則是基盤朝向載具8的方向。由於在此實施例中該光學元 件1係屬一體成型，因此所述支架5與光學本體6有相同的熱 膨脹係數，使得二者之熱膨脹可相互補償。在此條件下，所述 發光二極體晶粒9與所述光學本體6之光射入表面4之間距可 保持固定，即使在發光二極體晶粒9運作時亦然。 前述支架5的曲面設計，亦可提供與載具8平行之平面之 熱壓力（thermal stresses)的補償。該載具8係一具有金屬核 心之電路板，其熱膨脹係數大於該光學元件丨。支架的曲面設 計可提供與載具8平行之平面之熱壓力的補償。在此條件下， 該光學元件1之光射入表面4與所述發光二極體晶粒9可保持 28 1289816 精準的對準，即使在發光二極體晶粒9運作時亦然。 該光學元件1之側壁的厚度介於1毫米至3毫米之間，較 佳者，該光學元件1之側壁的厚度介於13毫米至17毫米之 間。在此條件下，光學元件丨之光射入表面4係位於五個發光 二極體晶粒9的下游，其中該五個發光二極體晶粒9係排列成 一直線。 在第十七a圖至第十七e圖所揭露的實施例中，所述光學 本體6的長度約為20毫米。換言之，光射入表面4與光射出 表面3之間距約為20毫米。所述支架5的直徑在光射出表面 3,之知較小，約為15毫米；在另一端則直徑較大，約為25毫 米。在第十七a圖至第十七c圖所揭露的光學元件丨特別適合 形成較廣光分佈之光束，可使用於汽車頭燈之基礎光分佈。 在第十七e圖及第十七f圖所揭露的實施例中，光射入表 面與光射出表面3之間距約為1〇毫米。所述支架5的直徑 在光射出表面3之端較小，約為14毫米；在另一端則直徑^ 大，約為2〇毫米。在第十七6圖及第十七€圖所揭露的光學 元件1特別適合形成熱聚光燈之分佈。 第十八&圖至第十入—顯示光學元件以其他實施例的 透視示意圖。與第十七a圖至第十七f圖所揭露之光學元件！ 不同的是，光學元件！之支架5有平坦側邊u，其朝向 先學本體6之光射入表面4的方向稍微逐漸變細。由於 η平坦嚼性，使得絲元件丨^靖出之雜製造之。 再者，側邊11平坦的特性，同樣使得光學元件〗胁固接。 =不同平坦側邊u間，係由支架5之弧形側面將其連 ，其中所述弧形侧面為球面或橢圓面。如前所述，所 29 I289816 述弧形側面之弧狀的特性，使其在發光二極體晶粒9之作用 下，可以有效地對熱膨脹進行補償。 日與第十七a圖至第十七f圖所揭露之光學元件丨不同的 是，第十八a圖至第十八d圖所揭露之光學元件丨具有一接腳 % ’其在兩個方向突出於支架5之基盤。所述接腳2a可提供 第二光學元件對準之用，以發光二極體晶粒9所發射之光束的 方向為基準，該第二光學元件係位於所述光學元件1的下游。 在第十八a圖至第十八b圖所揭露的實施例中，所述光學 _ 本體6的長度約為2〇毫米。換言之，光射入表面4與光射出 表面3之間距約為2〇毫米。所述支架5的直徑在光射出表面 3之端較小，約為15毫米；在另一端則直徑較大，約為乃毫 米在第十八a圖至第十八b圖所揭露的光學元件1特別適合 形成較廣光分佈之光束，可使用於汽車頭燈之基礎光分佈。 在第十八c圖及第十八d圖所揭露的實施例中，光射入表 面4與光射出表面3之間距約為1〇毫米。所述支架5的直徑 在光射出表面3之端較小，約為η毫米；在另一端則直徑較 • 大，約為20毫米。在第十八e圖及第十八d圖所揭露的光學 元件1特別適合形成熱聚光燈之分佈。 在第十九a圖及第十九b圖中，位於載具8上之發光源係 由五個薄膜發光二極體晶粒22所組成，其發光效率至少達到 母瓦20流明（lumens)。較佳者，所述薄膜發光二極體晶粒22 係發出藍光。在該薄膜發光二極體晶粒22之下游並安置有冷 光變換材質（luminescence conversion material)。經冷光變換材 質轉換頻率的光線與未被轉換頻率的光線混合之後，便可形成 白光。 30 1289816 所述薄膜發光二極體晶粒22係被安置於一載具上，例如 在一外罩23的底部24。所述外罩23係由陶瓷材料所構成， 較佳者，其内部側壁的至少部分區域，塗佈有反光材質。 所述薄膜發光二極體晶粒22係藉由外罩23之外的接觸點 25a、25b與外界電性連接，再藉由導體線路26將接觸點仏、 25b連接至接觸區30，藉此所述薄膜發光二極體晶粒22得以 跟外部電性連接。舉例而言，所述薄膜發光二極體晶粒22係 藉由相配導線（mating connector )28，連接至汽車之供電網路。 另包含有一突波吸收器（varist〇r) 27，以做為電壓過大時的保 護裝置。前述相配導線28、突波吸收器27與外罩23均被裝 置於金屬核心之電路板29上，所述電路板29除了做為導電之 用外，還可具有對於所述薄膜發光二極體晶粒22所發出之埶 能進行導熱之功能。 … 在此情形下，亦可能在所述電路板29上或所述發光模組 之外加裝一個用以弱化所述薄膜發光二極體晶粒22之光線的 元件。薄膜發光二極體晶粒22之發光特性，亦可隨著外在環 境一例如氣候或照明條件之變化而變更其發光強度。此外，亦 可透過連接或不連接薄膜發光二極體晶粒22的方式，來達到 改變發光強度之目的。 雖然本發明係已參照較佳實施例來加以描述，熟此技藝者 需了解的是，本發明並未受限於其詳細描述内容。熟習此項技 藝之人士當可針對本發明所述之實施例加以修改及潤飾。、然 而，根據本發明之裝置結構，所有具有實質上相同於本發明之 組件結合而達成與本發明實質上相同結果者皆不脫離本創作 之精神範#。目此，所有此等賴方式及修改樣式係意欲落在 31 •1289816 本發明於_申請專概圍及其均等物所界定的範嘴之中。 【圖式簡單說明】 在各實施例與圖式中，相同之元件賦予 =之元件所描繪之尺寸，與其真實之尺寸並二ΓίΙ 求車又佳之姆效果，可能將部分元件尺杆以誇大。 第=顯示本發明之第—實施例中所揭露之發光模 透視不意圖。Figure 12 is a perspective view showing another embodiment of the optical element 1 of the present invention, which is similar to the embodiment disclosed in the first figure. However, in the present embodiment, the tree 1 is not similar. - a box, more to say, at least part of the four sides of the bracket 5 is a hit. The pins 2 are used to align and fix the optical component 1 to the carrier 8, wherein the pins 2 are located on the four corners of the quadrilateral of the optical component. Figures 12a through 13f show perspective views of another embodiment of the optical component i disclosed herein, the optical component i being comprised of a plurality of components, not body-formed. The optical element 1 has an optical body 6 as shown in Figures 13a and 13b. The optical body 6 has an optical concentrator and a light exit surface 3. Preferably, the optical towel dispenser is a solid solid composed of one of the aforementioned transparent plastics. in. In the embodiment disclosed in the thirteenth & fig. to twelfth fth, the optical body 6 is integrally formed with the light exit surface 3. The light exit surface 3 protrudes optically from the optical concentrator such that the pin 2 is free to enter t; the foot 2 is used to align and secure the optical body 6 to the bracket 5. Further, a plurality of light-emitting diode crystal grains 9 are located at the light incident surface 4 of the optical body 6. For example, five light-emitting diode grains 9 are arranged in a line where light enters the surface 4. Preferably, the light of the optical body 6 is incident on the surface 4 in contact with the envelope of the LED die 9. In other words, the light incident on the surface of the optical element 1 can be pressed into the envelope of the light-emitting diode die 9. 25 1289816 In the embodiment disclosed in the eleventh and tenth drawings, the optical body 6 is swayed by a method such as injection molding or transfer molding, which is more suitable for a car or a locomotive or other traffic. The test of the guards. For example, by the preferred design of the optical body 6 as described in the oblique three a and thirteenth b, the beam of the headlight can be designed to be a wider angle and uniform distribution. The thirteenth and thirteenth drawings show the holder 5 of the optical body 6 disclosed in the thirteenth &th and thirteenth drawings. The support 5 is designed on the optical body 6, and the optical body 6 can be mounted on the core 5, and/or at the edge of the light exit surface 3, the optical body S is pressed Attached or adhered to the bracket 5. In this case, the pin 2 is used to align and secure the optical body 6 to the bracket 5. The bracket 5 has a base body having an opening in the body, the opening is for accommodating the photon body 6 and the base has a plurality of pins 2 for aligning the brackets And being fixed on the carrier 8. Preferably, the bracket 5 is integrally formed. The squashing coefficient of the branch & 5 is the same as the swell coefficient of the optical body 6. Preferably The bracket 5 and the optical body 6 are made of the same material. The bracket 5 may be colored or black and white. The twelfth and thfth diagrams show the bracket 5 and the optical body 6. The optical element is disposed on the carrier 8. The carrier 8 is the same as that disclosed in the first figure. In this embodiment, the optical body 6 can be clamped in place. Above the bracket 5. Fourteenth to fourteenth. The figure shows the optical elements i exposed in the thirteenth to thirteenth fth, fixed in different directions above a carrier 8. A perspective view. As can be seen from the fourteenth & to the fourteenth, the pin 2 on the base of the bracket 5 penetrates the recess in the carrier 8, The light body 6 is protruded from the carrier S away from the wide light distribution of 26 -1289816, and the optical body 6 disclosed in the seventeenth e-th and seventeenth f-th views has a distribution of thermal concentrating 。. The optical element 1 disclosed in the six figures is different in that the optical element 1 disclosed in the seventeenth to seventeenth aspects is integrally formed. In this embodiment of the invention, the optical element is It is manufactured by a method such as injection molding or transfer molding. The optical element 1 is integrally connected to the bracket 5 at two places. Preferably, the optical element 1 is attached to the side of the bracket 5. Connected to the bracket 5, wherein the side refers to a side away from the side of the carrier 8. Preferably, at least a portion of the bracket 5 is curved. In the seventeenth to seventeenth In the embodiment disclosed in Fig. d, the bracket 5 is a hollow cylinder having an elliptical base. In the embodiment disclosed in the seventeenth to seventeenth dth, the design method of the optical element 1 The shape of the bracket 5 can be used to compensate for the heat of the optical element such as expansion. Therefore, the direction of thermal expansion is vertical In the direction of the base of the optical element 1 (away from the direction of the carrier 8), wherein the optical element is tethered on the carrier 8. As for the optical body 6 attached to the bracket 5, the direction of expansion is It is the direction in which the base plate faces the carrier 8. Since the optical element 1 is integrally formed in this embodiment, the bracket 5 has the same thermal expansion coefficient as the optical body 6, so that the thermal expansion of the two can compensate each other. The distance between the light-emitting diode die 9 and the light incident surface 4 of the optical body 6 can be kept constant even when the light-emitting diode die 9 operates. The curved surface design of the bracket 5 described above. It is also possible to provide compensation for thermal stresses in a plane parallel to the carrier 8. The carrier 8 is a circuit board having a metal core having a thermal expansion coefficient greater than that of the optical component. The curved surface design of the stent provides compensation for the thermal stress in a plane parallel to the carrier 8. Under this condition, the light incident surface 4 of the optical element 1 and the light emitting diode die 9 can maintain a precise alignment of 28 1289816 even when the light emitting diode die 9 operates. The side wall of the optical element 1 has a thickness of between 1 mm and 3 mm. Preferably, the side wall of the optical element 1 has a thickness of between 13 mm and 17 mm. Under this condition, the light incident surface 4 of the optical element is located downstream of the five light-emitting diode crystal grains 9, wherein the five light-emitting diode crystal grains 9 are arranged in a straight line. In the embodiment disclosed in the seventeenth to seventeenthth embodiments, the optical body 6 has a length of about 20 mm. In other words, the distance between the light incident surface 4 and the light exiting surface 3 is about 20 mm. The diameter of the holder 5 is small on the light exit surface 3, which is about 15 mm, and the other end is larger, about 25 mm. The optical element 丨 disclosed in the seventeenth to seventeenth cth diagrams is particularly suitable for forming a light beam having a relatively wide light distribution, which can be used for the base light distribution of an automobile headlight. In the embodiment disclosed in the seventeenth and seventeenth fth, the distance between the light incident surface and the light exiting surface 3 is about 1 mm. The diameter of the bracket 5 is small at the end of the light exit surface 3, which is about 14 mm; at the other end, the diameter is large, about 2 mm. The optical element 1 disclosed in Figures 17 and 17 is particularly suitable for forming a distribution of thermal spotlights. Eighteen & Figures to Tenth Inlet - show perspective views of optical elements in other embodiments. Optical components as disclosed in Figures 17a through 17f! The difference is that the optical components! The holder 5 has a flat side u which tapers slightly toward the direction in which the light of the body 6 is incident on the surface 4. Due to the flat chewability of η, the silk element is made of smear. Moreover, the flatness of the side edges 11 also causes the optical elements to be fixed. = between the different flat sides u, which are connected by the curved sides of the bracket 5, wherein the curved sides are spherical or elliptical. As previously mentioned, the arcuate nature of the arcuate side of the 29 I289816 allows it to effectively compensate for thermal expansion under the action of the illuminating diode die 9. The difference between the optical elements disclosed in the seventeenth to the seventeenth fth is that the optical element 揭 disclosed in the eighteenth to eighteenthth d has a pin % 'in two The direction protrudes from the base of the bracket 5. The pin 2a provides alignment of the second optical element with respect to the direction of the beam emitted by the LED die 9, which is located downstream of the optical element 1. In the embodiment disclosed in the eighteenth to eighteenth bth, the length of the optical body 6 is about 2 mm. In other words, the distance between the light incident surface 4 and the light exiting surface 3 is about 2 mm. The diameter of the bracket 5 is smaller at the end of the light exit surface 3, which is about 15 mm; at the other end, the diameter is larger, about millimeters. The optical elements disclosed in the eighteenth to eighteenth bth 1 is particularly suitable for forming a light beam with a wide light distribution, which can be used for the basic light distribution of automobile headlights. In the embodiment disclosed in the eighteenth cth and eighteenthth aspects, the distance between the light incident surface 4 and the light exiting surface 3 is about 1 mm. The diameter of the bracket 5 is small at the end of the light exit surface 3, which is about η mm; at the other end, the diameter is larger than about 20 mm. The optical element 1 disclosed in Figures 18e and 18d is particularly suitable for forming a distribution of thermal spotlights. In the nineteenth and nineteenthth bth, the light source on the carrier 8 is composed of five thin film light-emitting diode dies 22, and the luminous efficiency is at least up to the mother dam 20 lumens. Preferably, the thin film light emitting diode 22 emits blue light. A luminescence conversion material is disposed downstream of the thin film light-emitting diode die 22. White light is formed by mixing the light of the luminescence conversion material with the light of the unconverted frequency. 30 1289816 The thin film light emitting diode die 22 is mounted on a carrier, such as at the bottom 24 of a housing 23. The outer cover 23 is made of a ceramic material. Preferably, at least a portion of the inner side wall is coated with a reflective material. The thin film LEDs 22 are electrically connected to the outside by contact points 25a and 25b outside the cover 23, and the contact points 仏, 25b are connected to the contact regions 30 by the conductor lines 26, thereby The thin film light-emitting diode die 22 is electrically connected to the outside. For example, the thin film light emitting diode die 22 is connected to the power supply network of the automobile by a mating connector 28. It also includes a surge absorber 27 (varist〇r) 27 as a protection device when the voltage is too high. The foregoing matching wires 28, the surge absorbers 27 and the outer cover 23 are all disposed on the circuit board 29 of the metal core. The circuit board 29 may have a light-emitting diode crystal for the thin film, in addition to being used for conducting electricity. The enamel emitted by the granules 22 can perform the function of heat conduction. In this case, it is also possible to add an element on the circuit board 29 or outside the light-emitting module for weakening the light of the thin-film light-emitting diode die 22. The luminescent properties of the thin film light-emitting diode dies 22 can also be altered in response to changes in the external environment, such as climate or lighting conditions. In addition, the purpose of changing the luminous intensity can also be achieved by connecting or not connecting the thin film light-emitting diode dies 22. Although the present invention has been described with reference to the preferred embodiments, it is understood that the invention is not limited by the detailed description. Those skilled in the art can modify and modify the embodiments described herein. However, according to the structure of the device of the present invention, all of the components having substantially the same composition as the present invention can achieve substantially the same results as the present invention without departing from the spirit of the present invention. In view of this, all such methods and modifications are intended to fall within 31 • 1289816. The present invention is defined in the scope of the application and its equivalent. [Simple description of the drawings] In the respective embodiments and drawings, the same components are given the dimensions depicted by the components of the =, and the actual dimensions and the effect of the vehicle are better, and some of the component rods may be exaggerated. Fig. = shows that the illuminating mode disclosed in the first embodiment of the present invention is not intended to be seen.

第-圖顯不本發明之第二實施例中所揭露之光學元件的 透視示意圖。 、第三圖顯示本發明所揭露之光學元件的另一個實施例的 透視示意圖。 、第四_不本發明所揭露之光學元件的另_個實施例的 透視不意圖。 第五圖顯示本發明所揭露之光學元件的另一個實施例的 透視示意圖，其與第—圖相似。 、第六圖顯示本發明所揭露之絲元件的另一個實施例的 透視不意圖。 、第七_不本發明所揭露之光學元件的另-個實施例的 透視不意圖。 、第八圖顯示本發明觸露之光學元件的另-個實施例的 透視不思® ’其與第—騎揭示之實施例相似。 第九a圖與第九b圖顯示本發明所揭露之光學元件的另〆 個實施例的透視示意I·在第九a騎顯示之實施射，所述 接腳係用以將所述光學元件對準並固接至所述載具上，其中戶斤 32 1289816 述接腳係位於所述腳柱上’與光射出表面相反方向之端面上； 在第九b圖所顯示之實施例中，所述腳柱本身便是接腳。 第十a圖與第十b圖顯示本發明所揭露之光學元件的另二 個實施例的透視示意圖，其光學元件係由多個料件所組成，並 非一體成型：在第十a圖所顯示之實施例中，所述支架係與所 述光學本體僅在兩個位置相接合，其中所述光學本體較佳者係 為堅實固體；而在第十b圖所顯示之實施例中，所述光學元件 係位於所述複數個發光二極體晶粒之下游。The first drawing shows a perspective schematic view of the optical element disclosed in the second embodiment of the present invention. The third figure shows a perspective schematic view of another embodiment of the optical component of the present invention. Fourth, the perspective of another embodiment of the optical component not disclosed in the present invention is not intended. The fifth figure shows a perspective schematic view of another embodiment of the optical component of the present invention, which is similar to the first. The sixth drawing shows a perspective view of another embodiment of the wire element disclosed in the present invention. The seventh embodiment is not intended to be a perspective view of another embodiment of the optical element disclosed in the present invention. The eighth figure shows a perspective view of another embodiment of the exposed optical element of the present invention which is similar to the embodiment of the first ride. Figures 9a and 9b show a perspective view of another embodiment of the optical element disclosed in the present invention. 1. The ninth a ride shows the implementation of the optical element. Aligned and fixed to the carrier, wherein the pin 32 1289816 is located on the end of the leg in the opposite direction to the light exiting surface; in the embodiment shown in FIG. The leg itself is a pin. 10A and 10B are schematic perspective views showing two other embodiments of the optical element disclosed in the present invention, the optical element being composed of a plurality of materials, not integrally formed: as shown in FIG. In an embodiment, the bracket is engaged with the optical body only at two locations, wherein the optical body is preferably a solid solid; and in the embodiment shown in the tenth b, the The optical component is located downstream of the plurality of light emitting diode dies.

第十一圖顯示本發明所揭露之光學元件的另一個實施例 的透視示意圖。 第忙圖顯示本發明所揭露之光學元件的另一個實施例 的透視示意®，其與第―圖所揭露之實施例相似。 第十二a圖至第十三f圖顯示本發明所揭露之光學元件的 另一個實施例的透視示意圖。其中·· 第十三a ®顯示光學元件具有—光學本體，且所述光學 體具有-光學針H以及—光射出表面； 第十三b ®錢示光學元件具有—光學本體，且所述光 ^體具有—光學集中器以及-光射出表面；其為第十三a圖之 另一個角度之示意圖； t 三b圖所揭示之光學 弟十二c圖則顯示第十三a圖及第十 本體的支架； 弟十二d圖亦顯示第十三圖 本體的支架· _料十-b圖所揭不之光學 J八為第十一e圖之另一個角度之示意圖； 詈於於十二e關顯不具有核與絲本體之絲元件，复摩 置於所述载具之上之示意圖； 仟其文 33 ‘1289816 第十圖亦顯示具有 圓;其為第 第十四a圖顯示第十三圖 件m #日 ㈣弟十二fSI所揭露之光學元 仵固接在-載具之上的透視示意圖。 件’固接在-露之光學元Figure 11 shows a perspective schematic view of another embodiment of the optical component of the present invention. The first busy diagram shows a perspective schematic® of another embodiment of the optical component disclosed herein, which is similar to the embodiment disclosed in the Figures. Figures 12a through 13f show perspective views of another embodiment of the optical component of the present invention. Wherein the thirteenth a ® display optical element has an optical body, and the optical body has an optical needle H and a light exiting surface; the thirteenth b-th optical element has an optical body, and the light The body has an optical concentrator and a light exiting surface; it is a schematic diagram of another angle of the thirteenth a-th diagram; t. The optical brother of the twelve-c diagram reveals the thirteenth a and tenth The bracket of the body; the 12th d-d picture also shows the bracket of the body of the thirteenth figure. The optical J8 which is uncovered by the figure is the other angle of the eleventh e-graph; e is a schematic diagram of a wire element that does not have a core and a wire body, and is placed on the carrier; 仟其文33 '1289816 The tenth figure also shows a circle; it is shown in the fourteenth a Thirteen pictures m #日(四) brother 12 fSI exposed the optical element is fixed on the - above the perspective of the vehicle. Piece-fixed in-exposed optical element

第十四c圖顯示第十三a圖至第十三f圖所揭露之光學元 固接在一載具之上的另一方向的透視示意圖。 第十五a關不將具有光學元件之發光模組組合在一模 組托架上之實施例的透視示意圖。 —第十五1>圖顯示第十五&圖將具有光學元件之發光模組組 合在一模組托架上之實施例中，另一個方向的透視示意圖。 弟十五c圖顯示將具有光學元件之發光模組組合在一模 組托架上之實施例中，另一個方向的透視示意圖。 第十五d圖顯示將具有光學元件之發光模組組合在一模 組托架上之實施例中，另一個方向的透視示意圖。 第十五e圖顯示將具有光學元件之發光模組組合在一模 組托架上之實施例中，另一個方向的透視示意圖。 第十五f圖顯示將具有光學元件之發光模組組合在一模組 托架上之實施例中，另一個方向的透視示意圖。 第十六a圖顯示發光模組之其他實施例的透視示意圖。 第十六b圖顯示發光模組在第十六a圖所顯示之實施例， 在不同方向的透視示意圖。 第十六c圖顯示發光模組在第十六a圖所顯示之實施例， 34 1289816 在不同方向的透視示意圖。 第十六d圖顯示發光模組在第十六&圖所顯示之實施例， 在不同方向的透視示意圖。 第十六e圖顯示發光模組在第十六&圖所顯示之實施例， 在不同方向的透視示意圖。 第十七a圖顯示光學元件之其他實施例的透視示意圖。 第十七b圖顯示光學元件在第十七^圖之實施例中，另一 個方向之透視示意圖。 ® 第十七c圖顯示光學元件在第十七a圖之實施例中，另一 個方向之透視示意圖。 第十七d圖顯示光學元件在第十七a圖之實施例中，另一 個方向之透視示意圖。 第十七e圖顯示光學元件之其他實施例的透視示意圖。 第十七f圖顯示光學元件在第十七e圖之實施例中，另一 個方向之透視示意圖。 第十八a圖係顯示光學元件之其他實施例的透視示意圖。 _ 第十八b圖係顯示光學元件在第十八a圖之實施例中，另 一個方向之透視示意圖。 第十八c圖係顯示光學元件之其他實施例的透視示意圖。 第十八d圖係顯示光學元件在第十八c圖之實施例中，另 一個方向之透視示意圖。 第十九a圖係顯示將相配導線、突波吸收器與外罩裝置於 金屬核心之電路板上之實施例的示意圖。 第十九b圖係顯示將相配導線、突波吸收器與外罩裝置於 金屬核心之電路板上之實施例，在另一個方向的示意圖。 35 •1289816 【主要元件符號說明】Fig. 14c is a perspective view showing the other direction in which the optical elements disclosed in Figs. 13a to 13f are attached to one of the carriers. A fifteenth aspect is a schematic perspective view of an embodiment in which an illumination module having optical components is combined on a modular carrier. - Fifteenth 1> The figure shows a perspective view of the fifteenth & figure in an embodiment in which a light-emitting module having optical elements is combined on a module carrier, in another direction. Figure 15 is a perspective view showing the other embodiment in which the light-emitting module having the optical elements is combined on a module carrier. Fig. 15d is a perspective view showing the other embodiment in which the light-emitting module having the optical element is combined on a module carrier. Fig. 15e is a perspective view showing the other embodiment in which the light-emitting module having the optical elements is combined on a module carrier. Fig. 15f is a perspective view showing the other embodiment in which the light-emitting module having the optical elements is combined on a module carrier. Figure 16a shows a perspective schematic view of another embodiment of a lighting module. Figure 16b shows a perspective view of the embodiment of the illumination module shown in Figure 16a, in different directions. Figure 16c shows a perspective view of the embodiment of the illumination module shown in Figure 16a, 34 1289816 in different directions. Figure 16d shows a perspective view of the embodiment of the illumination module in the sixteenth & figure, in different directions. Figure 16 e shows a perspective view of the embodiment of the illumination module in the sixteenth & figure, in different directions. Figure 17a shows a perspective schematic view of other embodiments of optical components. Figure 17b shows a perspective view of the optical element in the embodiment of the seventeenth embodiment, in another direction. ® Figure 17c shows a perspective view of the optical element in the embodiment of Figure 17a, in another direction. Figure 17d shows a perspective view of the optical element in the embodiment of Figure 17a, in another direction. Figure 17e shows a perspective schematic view of other embodiments of optical components. Fig. 17f is a perspective view showing the optical element in the embodiment of Fig. 17e, in another direction. Figure 18a is a perspective schematic view showing other embodiments of the optical element. _ The eighteenth b-ray shows a perspective view of the optical element in the embodiment of the eighteenth a-th, and the other direction. An eighteenth c-figure is a perspective schematic view showing other embodiments of the optical element. The eighteenth diagram shows a perspective view of the optical element in the embodiment of the eighteenth c-figure, in another direction. Figure 19a is a schematic view showing an embodiment in which a matching wire, a surge absorber and a cover are mounted on a circuit board of a metal core. Figure 19b is a schematic view showing the embodiment of the matching wire, the surge absorber and the cover on the circuit board of the metal core, in another direction. 35 •1289816 [Main component symbol description]

1光學元件 2接腳 3光射出表面 4光射入表面 5支架 6光學本體 8載具 9發光二極體晶粒 10冷卻鰭板 11平坦側邊 22薄膜發光二極體晶粒 23外罩 25a接觸點 25b接觸點1 optical element 2 pin 3 light exit surface 4 light incident surface 5 bracket 6 optical body 8 carrier 9 light emitting diode die 10 cooling fin 11 flat side 22 thin film light emitting diode die 23 cover 25a contact Point 25b contact point

26 導體線路 27突波吸收器 28相配導線 29金屬核心之電路板 3626 Conductor line 27 Surge absorber 28 Matching wire 29 Metal core circuit board 36

Claims (1)

發明專利申請案第095108905號 申請專利範圍替換本 中華民國96年4月13曰 1289816 十、申請專利範圍：厂-^ 梓年月曰修{更)正替換頁 ί____ι ' L 一種發光模組，其包含一發光源、一用以承載所述發光源之 載具以及一光學元件，其中所述光學元件具有複數個接腳，可與 所述載具上相對應之凹洞相接合，其中該些接腳可作為使該光學 70件以相對於該發光源對準之對準樁。 2·如申请專利範圍第1項之發光模組，其中所述複數個接腳係 馨用以將所述光學元件對準定位在所述載具上。 3 ’如中請專赚圍第1項或第2項之發光模組，其巾所述複數 固接腳係做為所述光學元件與所述載具之間的力學連接。 ’其中所述複數 個接^2項之發光模組Patent Application No. 095108905, the scope of application for patent replacement is replaced by the Republic of China on April 13, 1996, 1289816. The scope of application for patents: factory - ^ 梓 曰 曰 { { { ) 正 正 ί ί ί ί ί 一种 一种 一种 一种 一种 一种 一种An optical source, a carrier for carrying the illumination source, and an optical component, wherein the optical component has a plurality of pins that are engageable with corresponding recesses on the carrier, wherein the optical components The pins can serve as alignment posts for aligning the optical 70 pieces with respect to the illumination source. 2. The lighting module of claim 1, wherein the plurality of pins are used to position the optical component in alignment on the carrier. 3 </ br> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; a plurality of light-emitting modules 組，其中所述複數 項或第2項之發賴組，其巾所述複數 光學元件，其_所述另—光學元件係a group, wherein the plurality or the second item of the group, the plurality of optical elements, and the other optical element 其中所述複數個接腳係 F匕罔币0項之發光模組，： 光學元件予力學之定位。 37 ί^98ΐ6 .*·.· 一 . :.，」* , .— -^ττ _ - -- ..unuu ι . s …... ^ s-—〜—一[^^ &quot; p敎更)正替換頁 ’ 如申凊專利範圍第1項或第2項之發光模組，其中所述複數 個接腳之橫剖面呈星形樣式。 9’ 如申睛專利範圍第1項或第2項之發光模組，其中所遮複數 個接腳的直徑係順者所述複數個接腳而改變。 1α如申請專利範圍第1項或第2項之發光模組，其中更包含一 _用以容納黏著劑之貯存囊，其中所述貯存囊係被裝置於所述複數 個接腳至少之一的附近。 Π,如申請專利範圍第1項或第：2項之發光模組，其中所述光學 元件具有一支架與一光學本體。 12·如申請專利範圍第11項之發光模組，其中所述光學本體可 以疋一光學集中器，其朝向所述發光源之方向逐漸變細。 13·如申請專利範圍第11項之發光模組，其中所述光學本體可 以是一光學集中器，其中所述光學本體是一個堅實固體。 14·如申明專利範圍第13項之發光模組，其中所述光學本體係 由下列材質中至少一種所組成或構成：PMMA、PMMI、rc、' Macrolon、APEC、COC 〇 15.如申請專利範圍第11項之發光模組，其中所述支架係橫向 38 1289816 一一 一一一^ — ' ............ 地圍繞所述光學本體。 16·如申請專利範圍第11項之發光模組，其中所述支架包含曲 面造型之側面。 17·如申請專利範圍第11項之發光模組，其中所述支架至少在 部分區域是中空圓柱體，其並且橫向地圍繞所述光學本體。 鲁18.如申清專利範圍第1項或第2項之發光模組，其中所述光學 元件係一盒狀結構。 19·如申請專利範圍第1項或第2項之發光模組，其中所述光學 元件至少在四個侧面包覆所述發光源。 20.如申請專利範圍第1項或第2項之發光模組，其中所述光學 ^ 元件係一體成型。 21 如申請專利範圍第1項或第2項之發光模組，其中所述光學 元件係由複數個組件組合而成。 22·如申請專利範圍第1項之發光模組，其中所述發光源至少包 含一個發光二極體晶粒。 23·如申請專利範圍第22項之發光模組，其中所述發光二極體 晶粒不含封體成分。 39 %年 V 3 f)、The plurality of pins are light-emitting modules of the F-coin 0 item: the positioning of the optical component to the mechanics. 37 ί^98ΐ6 .*·.· I. :.,”* , .— -^ττ _ -- -- ..unuu ι . s ...... ^ s-—~—一[^^ &quot; p敎The light-emitting module of claim 1 or 2, wherein the plurality of pins have a star-shaped cross section. 9' The illumination module of claim 1 or 2, wherein the diameter of the plurality of pins is changed by the plurality of pins. The light-emitting module of claim 1 or 2, further comprising a storage capsule for accommodating an adhesive, wherein the storage capsule is disposed on at least one of the plurality of pins nearby. The light-emitting module of claim 1 or 2, wherein the optical component has a bracket and an optical body. 12. The lighting module of claim 11, wherein the optical body is an optical concentrator that tapers toward the source of illumination. 13. The lighting module of claim 11, wherein the optical body is an optical concentrator, wherein the optical body is a solid solid. The light-emitting module of claim 13, wherein the optical system consists of or consists of at least one of the following materials: PMMA, PMMI, rc, 'Macrolon, APEC, COC 〇 15. If the patent application scope The lighting module of item 11, wherein the bracket is laterally 38 1289816, one by one, and the optical body is surrounded. The lighting module of claim 11, wherein the bracket comprises a side surface of the curved surface. 17. The lighting module of claim 11, wherein the bracket is a hollow cylinder at least in a portion of the area and laterally surrounds the optical body. The light-emitting module of claim 1 or 2, wherein the optical component is a box-like structure. 19. The lighting module of claim 1 or 2, wherein the optical component encloses the illumination source on at least four sides. 20. The lighting module of claim 1 or 2, wherein the optical component is integrally formed. The light-emitting module of claim 1 or 2, wherein the optical component is a combination of a plurality of components. The illuminating module of claim 1, wherein the illuminating source comprises at least one illuminating diode dies. The light-emitting module of claim 22, wherein the light-emitting diode die does not contain a sealing component. 39% year V 3 f), 1289816 24·如申二專利範圍第1項或第2項之發光模組，其中在所述發 光源之光三極體純與所城學元件之—練人表面之間存 在-間隙，其中所述間隙係填充以氣體。 25·如申叫專利範圍第i項或第2項之發光模組，其中所述光學 元件之個區域，與一發光二極體晶粒之一封體相接觸。 26·如申請專利範圍第24項之發光模組，其中所述發光二極體 曰曰粒與所述光學元件之光射入表面間的距離至多為挪微米。 27·如申睛專利範圍第1項或第2項之發光模组，其中所述發光 模組係做為林财設誠汽車賴讀光^件。1289816. The light-emitting module of claim 1 or 2, wherein there is a gap between the pure light body of the light source and the surface of the trained element. The gap is filled with a gas. 25. The illumination module of claim 1, wherein the region of the optical component is in contact with a body of a light-emitting diode die. The light-emitting module of claim 24, wherein the distance between the light-emitting diode particles and the light incident surface of the optical element is at most a micron. 27. The light-emitting module of claim 1 or 2, wherein the light-emitting module is used as a light-receiving device for the forest.