!271262 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板缺陷之整修梦 〇 ^ ^ >衣置者’用於移動 :脅=層之膠帶構件，研磨形成在基板（例如液晶面板 =滤光片等）上之凸起狀之凸起缺陷而整修基板缺陷。 L先丽技術】 習知μ修裝置，具備有檢測凸起缺陷之高度的高度 :測感測益，和從高度方向研磨凸起缺陷的研磨裝置。該 衣置中，使高度檢測感測器朝向凸起缺陷移動，並降下高 度檢測感測器而檢測該高度 '然後，使研磨裝置朝向凸起 缺陷移動、運行’並降下研磨裝置，藉由具有凸曲面之頭 部從該背面推壓膠帶構件，使形成於膠帶構件表面之研磨 層密接、推壓在該凸起缺陷，使膠帶構件移動而實施研磨。 然後，令前述高度檢測感測器朝向經研磨之凸起缺陷移動 並下降，以檢測研磨後之高度，而回傳研磨結果。 【發明内容】 (發明所欲解決問題） 但是，習知之整修裝置係於檢測高度後，將研磨裝置 移動到凸起缺陷之位置而研磨，研磨後必須再度將高度檢 測感測器移動到該凸起缺陷之位置，而耗費在用於移動及 檢測高度之時間。因而，處理一個凸起缺陷須耗費許多時 間’對於要增加每單位時間之處理個數有其限制 近年來，由於使用彩色濾光片之液晶面板之製造量增 加’而且要求高品質，因此必須研磨處理之對象增加，而 6 314357(修正本) 1271262 欲縮短處理時間並增加產量之要求變得非常大。 本發明係鑑於上述問題而研發者，其目的在於提供一 種可縮短處理時間，並增加產量之基板缺陷之整修裝置。 (解決問題之方案） 本發明之申請專利範圍第4之基板缺陷之整修裝 置’藉由移動形成有研磨層之膠帶構件而研磨基板產生、的 =起缺陷’具備：檢測必須研磨之凸起缺陷的高度之研磨 前高度，測機構’·具有與前述膝帶構件的内面密接之頭部 ，件且藉由該頭部構件，將前述膠帶構件之研磨層推抵在馨 前述凸起缺陷而研磨凸起缺陷之推壓機構；及用以測定由 該推壓機㈣行研磨後之凸起高度的研磨後高度檢測機 構；各研磨前高度檢測機構、推麼機構及研磨後高度檢測 機構係在相對於基板移動之本體’配設成大致沿著移動方 向互相接近’前述頭部構件係以其前端部作為交界，而急 劇地=著頭部構件的側面分開膠帶構相形成大致板狀7 並將前述研磨前高度檢職構或研磨後高度檢_構之至 少一者接近配置在前述頭部構件。 攀 口此’可用連績動作使本體和基板進行相對移動，以 研磨前高度檢測機構檢測凸起缺陷之高度，接著以推壓機 構之頭部構件推壓膠帶構件之研磨層並予以研磨，接著以 研磨後高度檢測機構檢測研磨後之高度，而可達到縮短!271262 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate defect remediation nightmare ^^>suiter's use for moving: a rubber layer of a lacquer=layer, which is formed on a substrate (for example Substrate defects are corrected by convex convex defects on the liquid crystal panel = filter or the like. L Xianli Technology] The conventional μ repair device is equipped with a height that detects the height of the bump defect: the sense-sensing benefit, and the grinding device that grinds the bump defect from the height direction. In the garment, the height detecting sensor is moved toward the convex defect, and the height detecting sensor is lowered to detect the height 'then, then the grinding device is moved, operated, and lowered to the convex defect, by having The head of the convex curved surface pushes the tape member from the back surface, and the polishing layer formed on the surface of the tape member is adhered to and pressed against the convex defect, and the tape member is moved to perform polishing. Then, the height detecting sensor is moved toward the polished convex defect and lowered to detect the height after the grinding, and the grinding result is returned. SUMMARY OF THE INVENTION (The problem to be solved by the invention) However, the conventional refurbishing device moves the grinding device to the position of the convex defect and grinds after detecting the height, and the height detecting sensor must be moved to the convex again after the grinding. The location of the defect, and the time spent moving and detecting the height. Therefore, it takes a lot of time to process a convex defect. 'There is a limit on the number of processes to be added per unit time. In recent years, since the manufacturing amount of the liquid crystal panel using the color filter is increased' and high quality is required, it is necessary to grind The number of objects to be processed has increased, and 6 314357 (Revised) 1271262 The requirement to reduce processing time and increase production has become very large. The present invention has been made in view of the above problems, and an object thereof is to provide a refurbishing device which can shorten the processing time and increase the yield of the substrate. (Problem for Solving the Problem) The refurbishing device for the substrate defect of the fourth aspect of the present invention is a method of: grinding a substrate by moving a tape member formed with an abrasive layer to generate a defect; Height of the pre-grinding height, the measuring mechanism '· has a head that is in close contact with the inner surface of the knee band member, and the head member presses the polishing layer of the tape member against the convex defect a pressing mechanism for the convex defect; and a post-grinding height detecting mechanism for measuring the height of the protrusion after the grinding of the pressing machine (4); each height detecting mechanism, the pushing mechanism and the post-polishing height detecting mechanism are The body 'moving relative to the substrate is disposed to be close to each other substantially along the moving direction. The front head member has its front end portion as a boundary, and the side surface of the head member is sharply separated to form a substantially plate-like shape. At least one of the pre-grinding height inspection structure or the post-grinding height inspection structure is disposed close to the head member. The climber can use the continuous action to move the body and the substrate relative to each other, and the height detecting mechanism detects the height of the convex defect before grinding, and then pushes the polishing layer of the tape member with the head member of the pressing mechanism and grinds, and then grinds The height after the grinding is detected by the height detecting mechanism after grinding, and the shortening can be achieved.
理時間，並增加產哥夕曰# lL 里之目的。此外，因為頭部構件係形成 大致板狀’且將研磨前高度檢測機構以及研磨後高度檢測 機構接近配置在該頭部構件，因此可縮小頭部構件與研磨 314357(修正本) 7 1271262 前高度檢測機構或研磨後高度檢測機構之距離，可藉 磨前高度檢測機構測定高度後，直接進行研磨，且^在研 磨後直接進行研磨後之高度測定，進而可謀求處理時間之 縮短，並增加產量，提昇研磨精確度。 本發明之專利申請範圍第2項之基板缺陷之整修裳 ，前述頭部構件前端部’係形成將具有凸弧度之 之开^構件之大致中央部附近切斷為大致平行的兩面 之形狀，且將該凸曲面部當作前端部。 K吏覓度方向之尺寸形成比圓板形頭部構件 小’而縮小推壓機槿$宫_Γ、去2、^ 而可有效地研磨凸起缺陷： 、、、S紐本體之移動距離， 之專财請範圍第3項之基板缺陷之整修裝 二m具備有：前述研磨前高度檢測機構及研磨後 mr機構係由接觸式感測器所構成，在包含前述頭部 移動方向之面内，於從距離前述頭部構件之 器本體部；在包含前述頭部構件移動方向之面内從 :=以本體部凸出之臂部；形成在該臂部前端附近且 直接接觸則述凸起缺陷之感應部。 因為使用接觸式感應器作為研磨前高度檢測機 研磨後而度檢測機構’比起非接觸感應器 以測定凸起缺陷之高度，因而可以將其結果回授至 =步驟°此外’從距離頭部構件之位置所設置之感測部 ^ ^至頭部構件附近配置臂部，因為在其臂部之前端 。請近會形成與凸起缺陷直接接觸之感應部，因而可以將 314357(修正本) 1271262 感應部儘可能地接近配置在頭部構件— 與頭部構件之間的距離 t可此地能縮小 處理時走距離縮短化，並且可詳长 能的增加、提昇研磨精確度等。 月之專利申請範圍第4項之基板缺陷之壯 置，係前轉帶構㈣達㈣料構件、 ，該_筒之中，在=帶; 件之研磨層接觸的引導滾筒之引導面，形 ：: 部使該研磨層不接觸在引導面。 溝 防止二爲到，頭部構件之前’研磨層接觸引導滾筒而可· 砮曰磨才貝、劣化，將研磨性能發揮到最大限戶 =磨的次數變少，進—步可達成縮短處理時間^增加―Take time, and increase the purpose of producing 哥 曰 l # lL. Further, since the head member is formed in a substantially plate shape and the pre-polishing height detecting mechanism and the post-polishing height detecting mechanism are disposed close to the head member, the head member and the grinding 314357 (revision) 7 1271262 can be reduced in height. The distance between the detecting mechanism or the post-grinding height detecting mechanism can be directly polished by the height detecting mechanism before grinding, and the height can be directly measured after grinding, thereby shortening the processing time and increasing the yield. Improve grinding accuracy. In the refurbishment of the substrate defect of the second aspect of the invention, the front end portion of the head member is formed into a shape in which the vicinity of a substantially central portion of the opening member having the convex curvature is cut into substantially parallel surfaces, and This convex curved surface portion is referred to as a front end portion. The size of the K twist direction is smaller than that of the disc-shaped head member, and the pusher 缩小$宫_Γ, go 2, ^ can be used to effectively grind the convex defects: the moving distance of the S, the body of the S For the special purpose of the third section, the substrate defect repairing device is provided with the following: the pre-polishing height detecting mechanism and the post-grinding mr mechanism are formed by a contact sensor, and the surface including the head moving direction is included. Inside, from the body portion of the head member; in the plane including the moving direction of the head member, from: = an arm portion protruding from the body portion; formed near the front end of the arm portion and directly contacting the convex portion The sensing part that is defective. Since the contact sensor is used as the height detecting machine before grinding, the degree detecting mechanism is used to measure the height of the convex defect compared to the non-contact sensor, so that the result can be fed back to the step = The sensing portion provided at the position of the member is disposed to the vicinity of the head member because it is at the front end of the arm portion. Please form a sensing portion that is in direct contact with the convex defect, so that the 314357 (corrected version) 1271262 sensing portion can be placed as close as possible to the head member - the distance t between the head member and the head member can be reduced in processing time. The walking distance is shortened, and the increase in length can be increased, and the grinding precision can be improved. The sturdy of the substrate defect in the fourth application of the patent application scope of the month is the front turn belt structure (4) up to the (four) material member, and the guide surface of the guide roller which is in contact with the abrasive layer of the member :: The part makes the abrasive layer not in contact with the guiding surface. The groove is prevented from being two, and the 'grinding layer is in contact with the guide roller before the head member can be honed and deteriorated, and the polishing performance is maximized to the limit = the number of times of grinding is reduced, and the processing time can be shortened by further steps. ^ increase -
本發明之專利巾請範圍第5項之基板缺陷之整修裝 置’係藉由研磨前高度檢測機構及研磨後高度檢測機構 測凸起缺陷之高度時，推壓機構使該各高度檢測機構和 速推昼機構之高度方向的相對位置，變化成從基板侧遠薄 因此，可減低檢測凸起缺陷之高度時，推壓機構干^ 基板之情形’ ^可提高研磨前高度檢職構及研磨 檢測機構之檢測精確度。 本發明之專利申請範圍第6項之基板缺陷之整修方 法，藉由形成有研磨層之膠帶構件之移動而研磨基板產生 的凸起缺陷，該方法係使用整修裝置，其中具備有：檢測 應研磨之凸起缺陷的高度之研磨前高度檢測機構；將前述 膠帶構件之研磨層推抵在前述凸起缺陷而研磨凸起缺陷之 9 314357(修正本) 1271262 推壓機構；及用以測定由該推壓機構進行研磨後之凸 度的研磨後高度檢測機構；而在相對於基板移動之本Z =設成大致沿著移動方向互相接近，前述頭部構件係=直 丽端部作為交界’而急劇地沿著頭部構件的側面分開膠帶 構件⑽成大致板狀，並將前述研磨前高度檢_構或研 磨後南度檢測機構之至少—者接近配置在前述頭部構件並 且在本體之移動或相對移動之同時進行連續步驟，包括： 檢測必須研磨之凸起缺陷的高度之步驟；將前述踢帶構件 之研磨層推抵在凸起缺陷而研磨凸起缺陷之步驟；以前述 推壓機構檢測研磨後之凸起缺陷高度之步驟。 可用連續動作進行本體和基板之相對移動，以 研磨前高度檢測機構檢測凸起缺陷之高度，接著以推壓機 構推墨膝帶構件而研磨，接著以研磨後高度檢測機構檢測 研磨後高度，而可達成縮短處理時間，並增加產量。此外， 因為頭部構件係形成大致板狀，且將研磨前高度檢測機構 ^及研磨後高度檢測機構接近配置在該頭部構件，因此可 、%百J頭構件與研磨前高度檢測機構或研磨後高度檢測機 構之距離’可藉由研磨前高度檢測機構測定高度後，直接 進仃研磨’且可在研磨|直接進行研磨後之高度測定，進 可。某长處理時間之縮短，並增加產量，提昇研磨精確度。 【實施方式】 士以下茶照圖式’說明本發明實施形態的基板缺陷之整 修衣置。第1圖為本整修裝置之前視圖，第2圖為該側視 圖〇 10 314357(修正本) 1271262 本正化裝置之本體！，具備連結在！轴之 大致矩形基座板3。基座板3安|有驅動;力° 2的 驅動捲繞膠帶構件丁 、、、達，用於旋轉 步進式馬達構成，驅動馬達4之輸 2馬達4係由 輪4a，該小齒輪1 4 & 疋有小齒輪式齒 w輪式齒輪4a咬合在齒輪5。齒 捲繞機RI之捲繞:: 固定有I。：?？周緣的部分，介置以接合構件而 周緣部附近，π著月/2捲繞側捲繞機R1之圓形板η的 :=3二 多數貫穿形成之圓形鎖***孔。( 基庄板“置以輛承構件等而安裝有轴— 有使用前之膠帶構件T #拔 ***捲繞- 小齒輪式齒輪4a :l機2之捲繞機芯部助… 式以輪牦齒輪5及軸6a、6b之基端邻 大致矩形之外蓋構件9覆蓋。 土^附近，以 轴6b之基端部’藉由轴承構件以可自由旋轉 =狀態。大致如對開之2個構件沿著軸⑼:二 =形環板，在基端部以可自由搖動方式支持該等構件叹 以構件之前端間’安裝有彈簧構件，將該等構件 以朝向恆常接觸在軸7外面的方向彈壓。 霉件 ，部6b之基端部安裝有編碼器8。如旋轉轴❿會從 、扁碼器8產生脈衝。霉^ _ 合n 以有捲繞機R2之轴6b正常旋轉時 "十异預疋之脈衝，由於捲繞在捲繞機R2之膠帶構件τ :斷或纏繞：，軸6b之旋轉產生異常，因此完全檢測不出 良衝或所計异的脈衝數與正常時不同。 測膠帶構件T之移動異常。 果才双 314357(修正本) 11 1271262 捲繞機R2及捲繞側捲繞機r 1安裝在卡匣1 〇，卡匣 10對本體1形成可自由η ’可在裂置外將捲繞機R2、 捲繞側捲繞機R1及膠帶構件T安裝在卡匣丨〇。卡匣⑺ =備大致矩形的卡£基座板n，其安U捲繞機R2 繞側捲繞機仏卡厘基座板1之圖式中下部， =帶構件τ之引導滾筒14、15以可自由旋轉*** 軸中。 n f述板件12以可自由旋轉方式安褒在卡匠基座板 卜板件12以同軸狀-體形成有圓錐梯形之承受部13。 板件12之前面側安裝有板件16。板件16之内 錐梯形之推壓部17。前述承受部13插 取？ =或捲繞機…中心部的環形捲繞機 衣攻有板件16，使其推壓部17壓入捲繞機芯部R21，而 = = _R1或捲繞㈣。從該等板件16 刖面女裝有矩形之外蓋構件18。 基座板3安裝有殘餘量成 匣10夕棬婊她^ 2〇,用於檢測保持在卡 匣10之捲繞機R2的膠帶構件τ 旦、 20係且偌剎爾化加 殘餘里。殘餘量感測器 π係具備利用托架而安裝之發 W之#舳姑蚪、，“ m 尤兀件21，和與該發光元件 」之先軸相對亚利用托架而安裝的千 配設成通過預定之殘餘κ 牛2。忒寺光軸 輸入受光元件22,若變成牛T足夠蚪，不會In the patented towel of the present invention, the refurbishing device for the substrate defect of the fifth item is the height of the convex defect detected by the height detecting mechanism before grinding and the height detecting mechanism after the grinding, and the pushing mechanism makes the height detecting mechanism and the speed The relative position of the pushing mechanism in the height direction is changed to be thinner from the substrate side. Therefore, when the height of the detecting protrusion defect is reduced, the pressing mechanism can be used to dry the substrate. ^ The height inspection structure and the grinding inspection can be improved before grinding. Institutional detection accuracy. The method for refurbishing a substrate defect according to the sixth aspect of the invention of the present invention is to illuminate a bump defect generated by a substrate by a movement of a tape member formed with an abrasive layer, wherein the method comprises using a refurbishing device, wherein: detecting: grinding a pre-polishing height detecting mechanism for raising the height of the convex defect; pushing the polishing layer of the tape member against the convex defect and grinding the convex defect 9 314357 (Revised) 1271262 pushing mechanism; The pressing mechanism performs the post-grinding height detecting mechanism for the convexity after the grinding; and the Z = relative to the substrate moves to be close to each other substantially along the moving direction, and the head member = the straight end as the boundary ' The tape member (10) is sharply divided into a substantially plate shape along the side surface of the head member, and at least the pre-grinding height inspection or the grinding south degree detecting mechanism is disposed close to the head member and moved on the body. Or performing a continuous step while moving relatively, comprising: detecting a height of a raised defect that must be ground; pushing the abrasive layer of the kicking member The step of grinding the convex defect in the convex defect; and the step of detecting the height of the convex defect after the grinding by the above-mentioned pressing mechanism. The relative movement of the body and the substrate can be performed by a continuous motion, and the height of the convex defect is detected by the height detecting mechanism before the grinding, and then the knee belt member is pressed by the pressing mechanism to be ground, and then the height after the grinding is detected by the height detecting mechanism after grinding. Achieve shorter processing times and increase production. In addition, since the head member is formed in a substantially plate shape, and the pre-grinding height detecting mechanism and the post-polishing height detecting mechanism are disposed close to the head member, the % head member and the pre-polishing height detecting mechanism or the grinding can be used. The distance of the rear height detecting mechanism can be directly measured by the height of the height detecting mechanism before the grinding, and can be measured by the height of the grinding|grinding directly. A long processing time is shortened, and the output is increased to improve the grinding precision. [Embodiment] The following description of the substrate defect of the embodiment of the present invention will be described. Figure 1 is a front view of the retreading device, and Figure 2 is a side view of the 〇 10 314357 (amendment) 1271262 The body of the normalizing device! , with links in! The substantially rectangular base plate 3 of the shaft. The base plate 3A has a drive; the force of the drive 2 is wound around the tape member, and is used for a rotary stepper motor, and the drive motor 4 of the drive motor 4 is composed of a wheel 4a, the pinion 1 4 & The pinion gear w wheel gear 4a is engaged with the gear 5. Winding of the tooth winding machine RI:: I is fixed. :?? The peripheral portion is interposed between the peripheral portion and the peripheral portion, and the circular plate η of the winding side winding machine R1 of the π lunar/2 winding: ??? (The base plate is mounted with a bearing member, etc., and the shaft is installed - there is a tape member before use. T #拔插wind-pinion gear 4a: 1 machine 2 winding core help... The base end of the gear 5 and the shafts 6a, 6b are adjacent to the substantially rectangular outer cover member 9. In the vicinity of the soil, the base end portion ' of the shaft 6b is freely rotatable by the bearing member. The two members are substantially as opposed to each other. Along the shaft (9): a two-ring plate, supported at the base end in a freely oscillating manner, the members are slanted with a spring member between the front ends of the members, the members being brought into contact with the outside of the shaft 7 in a constant orientation The direction of the mold. The base part of the part 6b is equipped with an encoder 8. If the rotating shaft ❿ will generate a pulse from the flat encoder 8, the mold ^ _ _ n will have the winding machine R2 shaft 6b normally rotate when " The pulse of the pre-existing pulse, due to the winding or winding of the tape member τ wound on the winding machine R2: the rotation of the shaft 6b is abnormal, so that the number of pulses or the number of pulses that are not detected is normal. Different. The movement of the tape member T is abnormal. Fruits 314357 (Revised) 11 1271262 Winder R2 and winding The winder r 1 is mounted on the cassette 1 〇, and the cassette 10 forms a free η ' on the body 1 to mount the winder R2, the winding side winder R1 and the tape member T in the cassette outside the splitting 〇. cassette (7) = a substantially rectangular card base plate n, its U winding machine R2 around the side winding machine 仏 厘 基座 基座 基座 基座 中 , = = = = = = 15 is rotatably inserted into the shaft. The slab member 12 is rotatably mounted on the card holder base plate member 12 in a coaxial manner to form a conical trapezoidal receiving portion 13. The plate member 12 The front side is provided with a plate member 16. The inner portion of the plate member 16 has a tapered trapezoidal pressing portion 17. The receiving portion 13 is inserted into the ring-shaped winding machine of the center portion of the winding machine, and the plate member 16 is struck. The pressing portion 17 is pressed into the winding core portion R21, and = = _R1 or wound (four). The rectangular outer cover member 18 is provided from the plate member 16. The base plate 3 is attached with a residual amount. 10 棬婊 棬婊 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The 千 舳 蚪 , , 装 装 装 装 m m m m m m m m m m m m m m m 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装 装The shaft is input to the light receiving element 22, and if it becomes a cow T is enough, it will not
Min 成預定之殘餘量少時，則合輪入 又“件。因此’可檢測膠 貝“輸入 I1 /〒馎仵τ之殘餘量。 基座板3之下部固定有 筒支持板25,以自由旋轉安：.：25。在引導滾 八女衣有引導滾筒26、27，更 314357(修正本） 12 1271262 在下 以自由旋轉方式安裝有引導滚筒28、Μ。 第3圖所不，料滾筒％在用於引導 之引導面26a形志古® τ + φ销1件1 溝26b，形成在膠帶構:::2二:於形成有該凹 ▼傅件1之表面的研磨層之寬 央部不會接觸在引導面26a。研磨層使用於^缺 ，接觸在其他構件，防止因為磨損或劣化降低 此。由於同樣的理由，引導滾-二1 地在膠帶構件T之引導面形成有更下方之 =。同26同樣 然後’由於引導滾筒14接觸在膠帶構件T背面，而 引導滾筒《ή為研磨後，因此不形成如二而 :;、2:之凹溝亦可。但是，以達成零件共通化之目的而;， 使用形成有同樣凹溝者亦可。 引導滾筒26、27及引導滾筒28、29之上方，朝 ，中上下方向安裝有直線導件3〇,直線導件如安 者直線導件3G而以可朝上下方向移動之方式安農有又引導α 方塊31。引導方塊31藉由固㈣栓等而在基端 頭部構件24。 疋有 /頭部構# 24形成朝向圖式中上下方向延伸之大致 形之形狀’沿著直線導件30朝向上下方向移動引導方塊 時’會在引導滾筒26、27及引導滾筒28、29之退 移動。當位於最下部之狀態時，從捲繞機^輪出之膠* =件Τ稭由引導滾筒14、26、28引導，在頭部構件μ之 =部折I藉由引導滾筒29、27、15引導而形成捲 接繞側捲繞機R1之狀態。藉由頭部構件24之前端部推星 314357(修正本） 13 1271262 膠帶構件τ之内面，將形成於該表面起 缺陷而進行研磨。 3層推&在凸起 如第4圖所示，頭部構件义 固設在基端構件24a之前端部。^件24b固定、 持凸弧度之圓板形構件之大致中央部附近切斷保 的：面而成棒狀。前端構件2仆例如使用將藍寶石玻璃； 不銹鋼等具有财磨損性或耐腐練 形後’切割成2面者等。儘管 十研咖弧面板 性能，但寬度可縮為極小，而達 ^具有相同的研磨 *問之妗而達成即,空間化。由於節省 故’亦可配⑤在接近料滾筒28、29,進—牛，亦 可配设在接近後述感測器35之感應部38。 夕 測 起缺陷高度之研磨前高度檢測機構方前之凸 後之凸起缺陷高度之研磨㈣檢^構構成檢測研磨 、各感測裔35具備有利測角器台4〇而安 之感測器本體部36。残測哭太邮邱1 ^ 上下方平_可二 ::部37。臂部37之前端安裝有感應部3 心 二内建有從臂部37之搖動量計測感應部％:上= 之知进計測機構（例如差動變壓器）。 下4 :第5圖所示’感應部38之前端部恤，例如由薛寶 前端等耐磨損性或耐腐歸之材料構成，：成 大兄八有預定寬度之稜線38b之大致楔形形狀。由 314357(修正本） 14 1271262 ^ 士而P 38a之棱線38b具有寬度，因此檢測凸起缺陷_高 ς日=須數次之曲折往復移動，可用！次掃描檢測高度而 d双測效率。雨述測角器台（g〇ni〇metric crad⑷係以 =部38之前端為中心’用於左右搖動者，藉由該搖動進 仃、感2部38a之稜線38b調整成形成和基板面大致平行。 接著，§兒明關於本整修裝置之使用方法。 β 百先’將膠帶構件T安裝在卡E 1〇。取下外蓋構件 :二及板件!6’將捲附有膠帶構件τ之捲繞機R2的捲繞機 〜邛R21插人承受部13，從捲繞機R2將膠帶構件τ拉出 (^U 30 cm )預疋1，安裝板件j6。接著，將拉出的膠 帶構件τ之前端折2折’***形成在捲繞側捲繞機ri之 開缝部’將捲繞側捲繞機R1旋轉2至3次’捲附膠帶構 件T，安裝板件16,並安裝外蓋構件18。此時，引導架在 捲繞侧捲繞機R1和捲繞機尺2之間的勝帶構件丁通過引導 滾筒14、15之間。 接著，使引導方塊31沿著直線導件3〇上升到上方， 使固定在引導方塊31之頭部構件24的前端部位於勝帶構 件τ之上方後，將卡匣10安裝在本體丨。配合從本體1突 出之軸6a、6b，並將安裝在卡S 10之捲繞側捲繞機…及 捲繞機R2之捲繞機芯部R21***而固定。然後，將固定 用銷***銷孔而固定在基座板3。 然後，使上升的引導方塊3〗沿著直線導件3〇下降到 下方。因此，頭部構件24之前端構件24b抵接在膠帶構件 T背面，拉出膠帶構件T同時下降。 314357(修正本） 15 1271262 料軸之電動台2，朝向高度方向略微（例 〇丽）升。藉由前步驟檢查而將本體1移動、運行到 假設有缺陷之彩色濟光月卜太夕办罢 ㈣運仃到 ,,,^ ^ — 片上方之位置。到達大約該位置即 :^猎由附设在本體1之顯微鏡拍攝缺陷附近的影 二 =地觀察缺陷之平面形狀等。觀察的結： =:起缺陷時’將感測器35、頭部構件“朝向 方之感測态35來到凸起缺陷附近時，驅動電動二2 =略微下降’使感應部38接觸基板，以極為低速（例:( 移動時，如第ό圖（a)所示，_方 35之感應部38碰到凸起㈣^所不方之感測器· 高度尺寸而開始研2業缺檢測該高度。對應檢測之- 即，如第6 ® (b)所示，將高度檢 測結果回傳，驅動i軸之 之才双 體1之高度，使頭部構件24之：二t 低本 只丨偁件24之丽端構件24a之前 :缺陷c之頂點低。對應所需要之狀況 =本體,推壓到下方，同時一面使膠帶構= 在凸起缺陷C，一而雖:紅庄广乂 司 *、、、動驅動馬達4，移動膠帶形構件τ 並同時使本體1行進、移動，而凸起缺陷e 起缺^ C之研磨結束之後使頭部構件24稍微上升， =頭料们4^We，仍料—㈣動Pi。 猎此’如弟6圖（Ο所示，另—方檢測器35之 起缺陷C，檢測該高度。若檢測的高度尺；；目 W度’則上升本體1而朝向另一方凸起缺陷c移動。判 314357(修正本） 16 Ϊ271262 斷未到達目標高度時，將該感測器35之檢測結果回傳，驅 動電動台2而降低太碑Ί . 、 -尽版1之回度，朝向反方向移動本體-1， 以和上述同樣的步驟再度開始研磨作業。 如此，由於可將研磨前高度檢測、研磨、研磨後高度 檢測’在朝向-方向移動本體i日夺，當作連續作輩進行， 因此可縮短處理時間’而可增加每單位時間之產量。 由於各感测為35之感應部38和頭部構件24之前端構 件24b之距離配設成極小，因此藉由感應部％檢測高度之 後’可直接轉移至研磨作業，並且可縮短處理時間。馨 —然後，亦可僅裝設-個感測器35，設定為兼用在研磨 所高度檢測和研磨後高度檢測。此時，研磨後朝向反方向 移動而進行研磨後之高度檢測。 雖然已經以固定基板而移動整修裝置者為例加以說 明，但設定成固定整修裝置而移動固定基板之基底（台） 者亦可。 (發明功效） 如以上說明，本發明之基板缺陷之整修裝置可達成以 下效果： (1) 可用連縯動作進行下列步驟··使整修裝置對於基 板相對移動，以研磨前高度檢測機構檢測凸起缺陷之高 度，接著以推壓機構推壓膠帶構件而研磨，接著以研磨後 高度檢測機構檢測研磨後高度，而可達成縮短處理時間， 並增加產量。 (2) 相較於圓板形頭部構件，可縮短寬度方向之尺 314357(修正本) 17 1271262 寸’而可達成縮小推壓機構之寬度，縮短整修裝置本體之 移動距離。 ()可縮短碩部構件和研磨前高度檢測機構或研磨後 高度檢測機構之距離，以研磨前高度檢測機構檢測高度 後^接進行研磨，研磨後可直㈣行研磨後高度㈣， 、乂可達成縮短處理時間，增加產量，提升研磨精確度。 (4) 研磨層在到達頭部構件前接觸引導滚筒，可防止 ^磨層磨損、劣化，將研磨性能發揮至最大限度，並可減 夕重新研磨之次數，進一步可達到縮短處理時間，並增加 產量之目的。 (5) 檢測凸起缺陷之高度時，可減低推壓構件干擾基 板，而可提高研磨前高度檢測機構及研磨後高度檢測機構 之檢測精確度。 【圖式簡單說明】 第1圖為本發明之實施形態相關之整修裝置前視圖。 第2圖為本發明之實施形態相關之整修裝置側視圖。 第3圖為本發明之實施形態相關之整修裝置之引導滾 筒剖視圖。 第4圖為本發明之實施形態相關之整修裝置之頭部構 件前端部放大圖。 第5圖為本發明之實施形態相關之整修裝置之感應部 前端部放大圖。 第6圖（a)至（c)為本發明之實施形態相關之整修裝置 步驟示意圖。 18 314357(修正本) 1271262 【主要元件符號說明】 1 整修裝置本體 2 電動台 3 基座板 4 驅動馬達 4a 小齒輪式齒輪 5 齒輪 6a ^ 6b 轴 7 銷 8 編碼 9、 18 外蓋構件 10 卡匣 11 卡匣基座板 12、 16 板件 13 承受部 14、 15 、26 、 27 、 28 、 29 引導滾筒 17 推壓部 20 ^ 35感測器 21 發光元件 22 受光元件 24 頭部構件 24a 基端構件 24b 前端構件 25 引導滚筒支持板 26a 引導面 26b 凹溝 30 直線導件 31 引導方塊 36 感測器本體部 37 臂部 38 感應部 38a 前端部 38b 棱線 40 測角器台 c 凸起缺陷 R1、 R2捲繞機 R21 捲繞機芯部 T 膠帶構件 19 314357(修正本)When Min is less than the predetermined residual amount, it is rounded up and then "piece. Therefore" can detect the residual amount of input "I1 / 〒馎仵τ". A tube support plate 25 is fixed to the lower portion of the base plate 3 so as to be freely rotatable::25. In the guide roller, there are guide rollers 26 and 27, and more 314357 (revision) 12 1271262. The guide rollers 28 and Μ are mounted in a freely rotatable manner. In the third figure, the material roller % is used for guiding the guiding surface 26a. The shape of the zirconia® τ + φ pin 1 piece 1 groove 26b is formed in the tape structure: :: 2 2: in the formation of the concave ▼ The wide central portion of the abrasive layer on the surface does not contact the guide surface 26a. The abrasive layer is used in contact with other components to prevent this from being reduced due to wear or deterioration. For the same reason, the guide roller-two is formed on the guide surface of the tape member T to have a lower portion. Similarly to 26, then, since the guide roller 14 is in contact with the back surface of the tape member T, the guide roller is "after grinding", so that the grooves are not formed as follows: However, in order to achieve the purpose of common parts, it is also possible to use the same groove. Above the guide rollers 26 and 27 and the guide rollers 28 and 29, a linear guide 3〇 is attached to the upper and lower directions, and the linear guide, such as the linear guide 3G, is movable in the up and down direction. Guide the alpha block 31. The guide block 31 is at the base end member 24 by a solid (four) plug or the like. The 疋/head structure #24 forms a shape of a general shape extending in the up-and-down direction in the drawing. 'When the guide block is moved in the up-and-down direction along the linear guide 30', the guide rollers 26, 27 and the guide rollers 28, 29 are formed. Move back. When in the lowermost state, the glue from the winding machine is swept by the guide rollers 14, 26, 28, and the head member μ is folded by the guide rollers 29, 27, 15 is guided to form a state in which the winding side winding machine R1 is wound. The inner surface of the tape member τ is pushed by the front end portion of the head member 24 by the front end portion 314357 (Revised) 13 1271262, and the surface is formed to have a defect and polished. 3-layer push & in the projection As shown in Fig. 4, the head member is fixed to the front end of the proximal end member 24a. The member 24b is fixed and the convex portion of the circular plate-shaped member is cut near the center of the substantially central portion: the surface is formed into a rod shape. The front end member 2 is, for example, a sapphire glass or a stainless steel or the like which has a wear-resistant property or a corrosion-resistant shape and is cut into two sides. Despite the performance of the Ten Research Café arc panel, the width can be reduced to a minimum, and the same grinding is achieved. Due to the saving, it is also possible to arrange 5 in the vicinity of the feed rolls 28, 29, and to feed the cows, or to the induction portion 38 of the sensor 35 which will be described later. In the evening, the height of the defect height is measured before the polishing of the height detecting mechanism. The height of the convex defect is corrected. (4) The inspection structure constitutes the detection and polishing, and each sensory body 35 has a favorable goniometer stage. Part 36. Residual test crying too post Qiu 1 ^ upper and lower flat _ can be two :: part 37. The sensing portion 3 is attached to the front end of the arm portion 37. The center of the arm portion 37 has a built-in measuring unit (for example, a differential transformer) for measuring the sensing portion % from the arm portion 37. Next 4: The front end of the sensing portion 38 shown in Fig. 5 is made of, for example, a material resistant to abrasion or corrosion resistance such as the front end of the Xue Bao, and has a substantially wedge shape of a ridgeline 38b having a predetermined width. From 314357 (amendment) 14 1271262 ^ 士 and P 38a ridgeline 38b has a width, so the detection of the convex defect _ high ς day = several times the zigzag reciprocating movement, available! The secondary scan detects the height and the d double measures the efficiency. The rain angle goniometer (g〇ni〇metric crad (4) is centered on the front end of the = part 38' is used for the left and right shaking, and the ridge line 38b of the sensation 2 and the 38a is adjusted to form a substrate surface. Parallel. Next, § clarify the use of the retreading device. β 百先' Install the tape member T on the card E 1 〇. Remove the cover member: 2 and the plate! 6' Attach the tape to the tape member τ The winding machine 邛R21 of the winding machine R2 is inserted into the receiving portion 13, and the tape member τ is pulled out from the winding machine R2 (^U 30 cm) to prepare the sheet j6. Then, the sheet is pulled out. The tape member τ is folded at the front end by two folds 'inserted into the slit portion of the winding-side winder ri', and the winding-side winder R1 is rotated 2 to 3 times, the tape member T is attached, the plate member 16 is mounted, and The outer cover member 18 is installed. At this time, the win-belt member between the winding-side winder R1 and the winder ruler 2 passes between the guide rollers 14, 15. Next, the guide block 31 is placed along the straight line The guide member 3 is raised upward to mount the cassette 10 after the front end portion of the head member 24 fixed to the guide block 31 is positioned above the belt member τ. The shaft 6a, 6b protruding from the main body 1 is fitted, and the winding side winding machine R21 attached to the card S 10 and the winding core portion R21 of the winding machine R2 are inserted and fixed. The pin is inserted into the pin hole and fixed to the base plate 3. Then, the rising guide block 3 is lowered to the lower side along the linear guide 3〇. Therefore, the front end member 24b of the head member 24 abuts against the back surface of the tape member T, Pull out the tape member T and drop it at the same time. 314357 (Revised) 15 1271262 The electric table 2 of the material shaft is slightly raised toward the height direction. The body 1 is moved and operated to the assumption that there is a defect by the previous step inspection. The color of the Jiguang month is too late (4) to reach the position above the film. Arriving at about the position: ^ hunting by the shadow of the microscope attached to the body 1 near the defect Plane shape, etc. Observed knot: =: When the defect is caused, 'the sensor 35 and the head member are brought toward the side of the convex defect when the sensed state 35 of the head member is approaching, and the driving electric 2 2 = slightly decreased' 38 contact the substrate at a very low speed (eg: (when moving, as shown in the figure) (a), the sensing portion 38 of the _ square 35 hits the bump (four), the sensor, the height, and the height of the sensor, and the height is detected. The corresponding detection - that is, as the 6th ( b), the height detection result is transmitted back, and the height of the i-axis is doubled, so that the head member 24: 2 t is lower than the front end member 24a of the piece 24: defect c The apex is low. Corresponding to the required condition = body, push to the bottom, while making the tape structure = in the convex defect C, one though: Hongzhuang Guangji *,,, and the drive motor 4, moving the tape-shaped member τ and At the same time, the body 1 is moved and moved, and the head member 24 is slightly raised after the end of the grinding of the protrusion defect e, and the head material is 4^We, still (-) moving Pi. Hunt this 'Figure 6 (Figure ,, the other side of the detector 35 from the defect C, detect the height. If the height gauge detected;; W degree' then rise the body 1 and convex toward the other convex c Move. Judgment 314357 (Revised) 16 Ϊ271262 When the target height is not reached, the detection result of the sensor 35 is returned, and the electric table 2 is driven to lower the monument. - The degree of return of the version 1 is reversed. Moving the body-1 in the direction, the grinding operation is started again in the same manner as described above. In this way, since the height detection before the grinding, the grinding, and the height detection after the grinding can be performed, the body i is moved in the direction of the direction, and it is performed as a continuous generation. Therefore, the processing time can be shortened, and the yield per unit time can be increased. Since the distance between the sensing portion 38 of each sensing 35 and the front end member 24b of the head member 24 is extremely small, the height is detected by the sensing portion % After that, it can be directly transferred to the grinding operation, and the processing time can be shortened. Xin-then, then only one sensor 35 can be installed, which is set to be used for both the height detection of the grinding and the height detection after the grinding. At this time, after grinding Oriented Height detection after polishing in the direction of movement. Although the person who has moved the refurbishing device by fixing the substrate has been described as an example, it is also possible to set the fixed refurbishing device to move the base (station) of the fixed substrate. (Effect of the invention) It is to be noted that the substrate defect refurbishing device of the present invention can achieve the following effects: (1) The following steps can be performed by the serial operation: · The refurbishing device is relatively moved relative to the substrate, and the height detecting mechanism detects the height of the convex defect before polishing, and then The pressing mechanism pushes the tape member to be ground, and then the post-grinding height detecting mechanism detects the post-grinding height, thereby shortening the processing time and increasing the yield. (2) The width direction can be shortened compared to the disc-shaped head member The ruler 314357 (revision) 17 1271262 inch can achieve the reduction of the width of the pressing mechanism and shorten the moving distance of the body of the reconditioning device. () The distance between the member and the height detecting mechanism before grinding or the height detecting mechanism after grinding can be shortened. After grinding, the height detection mechanism detects the height and then grinds it. After grinding, it can be straight (four) after grinding. Degree (4), 乂 can achieve shorter processing time, increase production, and improve grinding accuracy. (4) The polishing layer contacts the guide roller before reaching the head member, which can prevent the wear layer from being worn and deteriorated, and maximize the grinding performance. And the number of times of re-grinding can be reduced to further shorten the processing time and increase the output. (5) When detecting the height of the convex defect, the pressing member can be reduced to interfere with the substrate, and the height detecting mechanism before grinding can be improved. And the detection accuracy of the height detecting mechanism after the grinding. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a refurbishing device according to an embodiment of the present invention. Fig. 2 is a side view of a refurbishing device according to an embodiment of the present invention. 3 is a cross-sectional view of a guide roller of the refurbishing device according to the embodiment of the present invention. Fig. 4 is an enlarged view of the front end portion of the head member of the refurbishing device according to the embodiment of the present invention. Fig. 5 is an enlarged view of the front end portion of the sensing portion of the refurbishing device according to the embodiment of the present invention. Fig. 6 (a) to (c) are schematic diagrams showing the steps of the refurbishing device according to the embodiment of the present invention. 18 314357 (Revised) 1271262 [Description of main components] 1 refurbishing unit body 2 electric table 3 base plate 4 drive motor 4a pinion gear 5 gear 6a ^ 6b shaft 7 pin 8 code 9, 18 cover member 10 card匣11 cassette base plate 12, 16 plate member 13 receiving portion 14, 15, 26, 27, 28, 29 guide roller 17 pressing portion 20 ^ 35 sensor 21 light-emitting element 22 light-receiving element 24 head member 24a base End member 24b Front end member 25 Guide roller support plate 26a Guide surface 26b Groove 30 Linear guide 31 Guide block 36 Sensor body portion 37 Arm portion 38 Sensing portion 38a Front end portion 38b Ridge line 40 Goniometer table c Projection defect R1, R2 winder R21 Winding movement part T Tape member 19 314357 (Revised)