JP3845165B2 - Polishing height position setting method in polishing apparatus - Google Patents

Polishing height position setting method in polishing apparatus Download PDF

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Publication number
JP3845165B2
JP3845165B2 JP1693797A JP1693797A JP3845165B2 JP 3845165 B2 JP3845165 B2 JP 3845165B2 JP 1693797 A JP1693797 A JP 1693797A JP 1693797 A JP1693797 A JP 1693797A JP 3845165 B2 JP3845165 B2 JP 3845165B2
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Japan
Prior art keywords
polishing
polishing head
head
height
sensor
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JP1693797A
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JPH10217089A (en
Inventor
透 石川
秀行 石丸
宣夫 安平
治人 内田
研二 河西
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、平面上に存在する微小な突起を所定高さ位置で研磨により除去する研磨装置における研磨ヘッドの研磨高さ位置設定方法に関するものである。
【０００２】
【従来の技術】
図２は、液晶カラーフィルタの表面に生じた微小突起を研磨除去する研磨装置の構成を示す斜視図である。研磨装置１は、Ｙ軸方向（前後方向）に吸着テーブル７を移動させるＹ軸ステージ５と、Ｘ軸方向（左右方向）に研磨ヘッド６を移動させるＸ軸ステージ４とを備え、前記吸着テーブル７上に研磨対象物である液晶カラーフィルタ２を吸着保持してＹ軸方向に移動させ、研磨ヘッド６をＸ軸ステージ４により往復移動させることにより前記液晶カラーフィルタ２の表面に存在する微小突起を研磨除去する。前記微小突起は前記研磨ヘッド６に隣接して取り付けられたセンサにより検出される。
【０００３】
図３は、前記研磨ヘッド６の先端部を拡大図示する正面図で、研磨ヘッド６の先端部に設けられたコンタクトロッド１０に、順次供給される研磨テープ８が装着され、研磨ヘッド６が移動するＸ軸方向の両側に微小突起９を検出する一対のセンサ３ａ、３ｂが取り付けられている。このセンサ３ａ、３ｂは、エアマイクロセンサとして形成されており、吹き出し空気の圧力の対面物との距離による変化から微小突起９を検出する。
【０００４】
このセンサ３ａ、３ｂにより微小突起９を検出し、前記研磨ヘッド６により研磨する原点位置の設定は、従来図４に示すように、研磨ヘッド６を下降させ、研磨テープ８が装着された研磨ヘッド６の先端部を剛性体からなる校正テーブル１１に当接させたときに、前記センサ３ａ、３ｂが校正テーブル１１の表面を検出する高さにセンサ３ａ、３ｂを設定する。センサ３ａ、３ｂの高さ設定がなされた後、研磨ヘッド６を微小突起９を研磨除去する所定高さに設定して研磨動作が開始され、センサ３ａ、３ｂにより微小突起９が検出されない状態にまで研磨ヘッド６による研磨動作が実行される。
【０００５】
【発明が解決しようとする課題】
しかしながら、研磨ヘッド６の先端部を校正テーブル１１に押し当てたとき、校正テーブル１１が剛性体であるため、当接圧力によって研磨テープ８に弾性変形が生じるため、正確な原点位置の設定ができない問題点があった。また、研磨ヘッド６の校正テーブル１１への押し当て時に、研磨ヘッド６の損傷を防止するため、図示しない押し当て停止位置検出センサを設ける必要があった。
【０００６】
本発明は、研磨高さの原点位置の設定構造を改良して、設定精度の向上と構造の簡易化を実現する研磨装置における研磨高さ位置設定方法を提供することを目的とするものである。
【０００７】
【課題を解決するための手段】
本発明は、研磨テープが装着された研磨ヘッドと、この研磨ヘッドの近傍に研磨ヘッドの先端から所定距離だけ後退した位置に配設されたセンサとを備え、研磨対象物の平面から突出する微小突起を前記センサにより検出して、前記研磨ヘッドの前記研磨対象物の平面に平行した往復移動により前記微小突起を研磨除去する研磨装置における研磨高さ位置設定方法において、研磨開始に先立って、前記研磨ヘッドの押しつけ圧力で容易に沈み込む程度の柔支持構造の弾性支持体により弾性支持されてなる校正テーブルに前記研磨ヘッドを押しつけて当接させ、このときの前記センサが検出する前記校正テーブルからの高さ位置を前記研磨ヘッドによる研磨高さとすることを特徴とする。
【０００８】
上記構成によれば、校正テーブルは研磨ヘッドの押しつけ圧力で容易に沈み込む程度の柔支持構造の弾性支持体により弾性支持されているので、研磨ヘッドが押しつけられたとき、押しつけ加圧に応じて沈み込む。従って、研磨ヘッドの降下速度や加圧が大きくても、研磨ヘッドに損傷を与えたり、研磨テープの変形による設定高さに誤差を生じさせることがない。また、従来構成では必要とした押しつけ停止機能センサを設ける必要もなく構造を簡易化することができ、センサの高さ原点の設定時に、研磨ヘッドの先端部に装着された研磨テープと校正テーブルとは点接触の状態で当接するので、正確且つ迅速にセンサの高さ原点の設定を行うことができる。
【０００９】
【発明の実施の形態】
以下、添付図面を参照して本発明の一実施形態について説明し、本発明の理解に供する。尚、以下に示す実施形態は本発明を具体化した一例であって、本発明の技術的範囲を限定するものではない。
【００１０】
ここに、図１〜図３は本発明の一実施形態に係る研磨高さ位置設定の状態を示す説明図である。尚、従来構成と共通する要素には同一の符号を付して、その説明は省略する。
【００１１】
図１〜図３において、研磨ヘッド６は、テープ基材に砥粒を付着させた研磨テープ８と、この研磨テープ８を微小突起９に押しつけるコンタクトロッド１０と、コンタクトロッド８に供給された前記研磨テープ８を保持するテープロック１３と、研磨対象物である液晶カラーフィルタ２の表面上に存在する微小突起９を検出する一対のセンサ３ａ、３ｂとを備えて構成されている。
【００１２】
上記構成になる研磨ヘッド６は、図２に示したような研磨装置１のＸ軸ステージ４に搭載されてＸ軸方向に往復移動し、Ｙ軸ステージ５に搭載された吸着テーブル７に保持された液晶カラーフィルタ２がＹ軸方向に移動することによって、液晶カラーフィルタ２の全表面を走査することができる。このように研磨ヘッド６が液晶カラーフィルタ２の全表面を走査して、表面に存在する微小突起９をセンサ３ａ、３ｂにより検出し、研磨テープ８をコンタクトロッド１０により微小突起９に押しつけ、図３に示したように所定高さ位置で研磨除去する。
【００１３】
前記センサ３ａ、３ｂは、非接触で微小突起９を検出するエアマイクロセンサとして構成されており、このセンサ３ａ、３ｂによる微小突起９を検出する高さ原点の設定方法は、図１（ａ）、（ｂ）に示すようになされる。
【００１４】
センサ３ａ、３ｂの高さ原点の設定は、研磨動作に先立って、図１（ｂ）に示すように、校正テーブル１５に研磨テープ８が装着されたコンタクトロッド１０の先端部を当接させたとき、センサ３ａ、３ｂが校正テーブル１５の表面を検出できる高さにセンサ３ａ、３ｂの高さが設定される。
【００１５】
センサ３ａ、３ｂの高さ設定がなされた後、図１（ａ）に示すように、研磨ヘッド６を微小突起９を研磨除去する所定高さに設定して研磨動作が開始され、図３に示すように、センサ３ａ、３ｂが微小突起９を検出すると、コンタクトロッド１０に装着された研磨テープ８は微小突起９を研磨し、センサ３ａ、３ｂにより微小突起９が検出されなくなる所定高さで頭頂部９ａを研磨除去する。
【００１６】
前記校正テーブル１５は、図１に示すように、剛性体からなるテーブル１６をスプリング等の弾性支持体１４により支持して構成されている。この弾性支持体１４によるテーブル１６の支持は、研磨ヘッド６の下降による前記コンタクトロッド１０の押しつけ圧力で容易に沈み込む程度の柔支持構造である。従って、研磨テープ８が装着されたコンタクトロッド１０が図１（ａ）に示す状態から図１（ｂ）に示すように校正テーブル１５上に下降して当接し加圧を受けたときには沈み込むので、コンタクトロッド１０の降下速度や加圧が大きくても、コンタクトロッド１０に損傷を与えたり、研磨テープ８の変形による設定高さに誤差を生じさせることがない。また、従来構成では必要とした押しつけ停止機能センサを設ける必要もなく構造を簡易化することができる。
【００１７】
上記構成になる校正テーブル１５により、センサ３ａ、３ｂの高さ原点の設定時に、コンタクトロッド１０の先端部に装着された研磨テープ８と校正テーブル１５とは、点接触の状態で当接するので、正確且つ迅速にセンサ３ａ、３ｂの高さ原点の設定を行うことができる。
【００１８】
【発明の効果】
以上の説明の通り本発明によれば、研磨ヘッドの降下速度や加圧が大きくても、研磨ヘッドに損傷を与えたり、研磨テープの変形による設定高さに誤差を生じさせることがない。また、従来構成では必要とした押しつけ停止機能センサを設ける必要もなく構造を簡易化することができ、センサの高さ原点の設定時に、研磨ヘッドの先端部に装着された研磨テープと校正テーブルとは点接触の状態で当接するので、正確且つ迅速にセンサの高さ原点の設定を行うことができる。
【図面の簡単な説明】
【図１】本発明に係るセンサの高さ原点の設定方法を（ａ）、（ｂ）に説明する正面図。
【図２】研磨装置の構成を示す斜視図。
【図３】研磨ヘッドの先端部の構成を示す正面図。
【図４】従来構成に係るセンサの高さ原点の設定方法を説明する正面図。
【符号の説明】
１ 研磨装置
２ 液晶カラーフィルタ（研磨対象物）
３ａ、３ｂ センサ
６ 研磨ヘッド
８ 研磨テープ
９ 微小突起
１０ コンタクトロッド
１４ 弾性支持体
１５ 校正テーブル[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing height position setting method of a polishing head in a polishing apparatus that removes minute protrusions existing on a plane by polishing at a predetermined height position.
[0002]
[Prior art]
FIG. 2 is a perspective view showing a configuration of a polishing apparatus that polishes and removes fine protrusions generated on the surface of the liquid crystal color filter. The polishing apparatus 1 includes a Y-axis stage 5 that moves the suction table 7 in the Y-axis direction (front-rear direction) and an X-axis stage 4 that moves the polishing head 6 in the X-axis direction (left-right direction). The liquid crystal color filter 2 that is the object to be polished is sucked and held on the surface 7 and moved in the Y-axis direction, and the polishing head 6 is reciprocated by the X-axis stage 4, thereby causing minute projections present on the surface of the liquid crystal color filter 2. Is removed by polishing. The minute protrusions are detected by a sensor attached adjacent to the polishing head 6.
[0003]
FIG. 3 is an enlarged front view of the front end portion of the polishing head 6. A polishing tape 8 that is sequentially supplied is attached to the contact rod 10 provided at the front end portion of the polishing head 6, and the polishing head 6 moves. A pair of sensors 3a and 3b for detecting the minute protrusions 9 are attached to both sides in the X-axis direction. The sensors 3a and 3b are formed as air microsensors, and detect the minute protrusions 9 from the change of the pressure of the blown air depending on the distance from the facing object.
[0004]
The sensor 3a, 3b by detecting a microprojection 9, setting the origin position to be polished by the polishing head 6, as shown in prior art Figure 4, the polishing head 6 is lowered, the polishing head polishing tape 8 is mounted The sensors 3a and 3b are set to a height at which the sensors 3a and 3b detect the surface of the calibration table 11 when the tip of 6 is brought into contact with the calibration table 11 made of a rigid body. After the heights of the sensors 3a and 3b are set, the polishing head 6 is set to a predetermined height at which the fine protrusions 9 are removed by polishing, and the polishing operation is started, so that the fine protrusions 9 are not detected by the sensors 3a and 3b. The polishing operation by the polishing head 6 is executed.
[0005]
[Problems to be solved by the invention]
However, when the tip of the polishing head 6 is pressed against the calibration table 11, the calibration table 11 is a rigid body, so that the polishing tape 8 is elastically deformed by the contact pressure, so that an accurate origin position cannot be set. There was a problem. Further, when the polishing head 6 is pressed against the calibration table 11, it is necessary to provide a pressing stop position detection sensor (not shown) in order to prevent the polishing head 6 from being damaged.
[0006]
An object of the present invention is to provide a polishing height position setting method in a polishing apparatus which improves the setting structure of the origin position of the polishing height and realizes improvement of setting accuracy and simplification of the structure. .
[0007]
[Means for Solving the Problems]
The present invention includes a polishing head on which a polishing tape is mounted, and a sensor disposed in the vicinity of the polishing head at a position retracted by a predetermined distance from the tip of the polishing head, and protrudes from the plane of the object to be polished. In a polishing height position setting method in a polishing apparatus that detects protrusions by the sensor and polishes and removes the fine protrusions by reciprocating movement of the polishing head parallel to the plane of the object to be polished, prior to the start of polishing, From the calibration table detected by the sensor at this time, the polishing head is pressed against and brought into contact with a calibration table that is elastically supported by an elastic support having a flexible support structure that is easily submerged by the pressing pressure of the polishing head. The height position is defined as a polishing height by the polishing head.
[0008]
According to the above configuration, since the calibration table is elastically supported by the elastic support body having a soft support structure that can easily sink by the pressing pressure of the polishing head, when the polishing head is pressed , the calibration table is subjected to the pressing pressure. Sink. Therefore, even if the lowering speed and pressurization of the polishing head are large, the polishing head is not damaged, and an error is not caused in the set height due to deformation of the polishing tape. In addition, it is possible to simplify the structure without the need to provide a pressing stop function sensor required in the conventional configuration, and when setting the sensor height origin, a polishing tape and a calibration table mounted on the tip of the polishing head Since abuts in a point contact state, the sensor height origin can be set accurately and quickly.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings for understanding of the present invention. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.
[0010]
Here, FIGS. 1 to 3 are explanatory views showing a state of setting a polishing height position according to an embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the element which is common in a conventional structure, and the description is abbreviate | omitted.
[0011]
1 to 3, the polishing head 6 includes a polishing tape 8 in which abrasive grains are attached to a tape base material, a contact rod 10 that presses the polishing tape 8 against a minute protrusion 9, and the above-described supply to the contact rod 8. A tape lock 13 that holds the polishing tape 8 and a pair of sensors 3a and 3b that detect minute protrusions 9 existing on the surface of the liquid crystal color filter 2 that is an object to be polished are provided.
[0012]
The polishing head 6 configured as described above is mounted on the X-axis stage 4 of the polishing apparatus 1 as shown in FIG. 2 and reciprocates in the X-axis direction, and is held by the suction table 7 mounted on the Y-axis stage 5. By moving the liquid crystal color filter 2 in the Y-axis direction, the entire surface of the liquid crystal color filter 2 can be scanned. In this way, the polishing head 6 scans the entire surface of the liquid crystal color filter 2, detects the minute protrusions 9 existing on the surface by the sensors 3a and 3b, and presses the polishing tape 8 against the minute protrusions 9 by the contact rod 10. As shown in FIG. 3, polishing is removed at a predetermined height position.
[0013]
The sensors 3a and 3b are configured as air microsensors that detect the minute protrusions 9 in a non-contact manner. A method for setting the height origin for detecting the minute protrusions 9 by the sensors 3a and 3b is shown in FIG. (B).
[0014]
Prior to the polishing operation, the height origin of the sensors 3a and 3b was set such that the tip of the contact rod 10 on which the polishing tape 8 was mounted was brought into contact with the calibration table 15 as shown in FIG. At this time, the heights of the sensors 3a and 3b are set to such a height that the sensors 3a and 3b can detect the surface of the calibration table 15.
[0015]
After the heights of the sensors 3a and 3b are set, as shown in FIG. 1A, the polishing operation is started by setting the polishing head 6 to a predetermined height at which the fine protrusions 9 are removed by polishing. As shown, when the sensors 3a and 3b detect the microprojections 9, the polishing tape 8 attached to the contact rod 10 polishes the microprojections 9, and at a predetermined height at which the microprojections 9 are not detected by the sensors 3a and 3b. The top 9a is polished and removed.
[0016]
As shown in FIG. 1, the calibration table 15 is configured by supporting a table 16 made of a rigid body by an elastic support 14 such as a spring. The support of the table 16 by the elastic support 14 is a flexible support structure that can be easily sunk by the pressing pressure of the contact rod 10 caused by the lowering of the polishing head 6. Therefore, when the contact rod 10 with the polishing tape 8 is lowered from the state shown in FIG. 1A onto the calibration table 15 as shown in FIG. Even if the lowering speed and pressurization of the contact rod 10 are large, the contact rod 10 is not damaged, and an error is not caused in the set height due to the deformation of the polishing tape 8. Further, it is not necessary to provide a pressing stop function sensor which is necessary in the conventional configuration, and the structure can be simplified.
[0017]
With the calibration table 15 configured as described above, when the height origin of the sensors 3a and 3b is set, the polishing tape 8 attached to the tip of the contact rod 10 and the calibration table 15 come into contact in a point contact state. The height origin of the sensors 3a and 3b can be set accurately and quickly.
[0018]
【The invention's effect】
According as the present invention explained above, even large descending speed and pressure of Migaku Ken head, or damage to the polishing head, it is not to cause an error in setting the height due to the deformation of the polishing tape. In addition, it is possible to simplify the structure without the need to provide a pressing stop function sensor required in the conventional configuration, and when setting the sensor height origin, a polishing tape and a calibration table mounted on the tip of the polishing head Since abuts in a point contact state, the sensor height origin can be set accurately and quickly.
[Brief description of the drawings]
1A and 1B are front views illustrating a method for setting the height origin of a sensor according to the present invention.
FIG. 2 is a perspective view showing a configuration of a polishing apparatus.
FIG. 3 is a front view showing a configuration of a tip portion of a polishing head.
FIG. 4 is a front view illustrating a method for setting the height origin of a sensor according to a conventional configuration.
[Explanation of symbols]
1 Polishing device 2 Liquid crystal color filter (polishing object)
3a, 3b sensor 6 polishing head 8 polishing tape 9 minute projection 10 contact rod 14 elastic support 15 calibration table

Claims (1)

研磨テープが装着された研磨ヘッドと、この研磨ヘッドの近傍に研磨ヘッドの先端から所定距離だけ後退した位置に配設されたセンサとを備え、研磨対象物の平面から突出する微小突起を前記センサにより検出して、前記研磨ヘッドの前記研磨対象物の平面に平行した往復移動により前記微小突起を研磨除去する研磨装置における研磨高さ位置設定方法において、
研磨開始に先立って、前記研磨ヘッドの押しつけ圧力で容易に沈み込む程度の柔支持構造の弾性支持体により弾性支持されてなる校正テーブルに前記研磨ヘッドを押しつけて当接させ、このときの前記センサが検出する前記校正テーブルからの高さ位置を前記研磨ヘッドによる研磨高さとすることを特徴とする研磨装置における研磨高さ位置設定方法。A polishing head on which a polishing tape is mounted, and a sensor disposed in the vicinity of the polishing head at a position retracted by a predetermined distance from the tip of the polishing head, and the minute projections protruding from the plane of the object to be polished are provided on the sensor. In a polishing height position setting method in a polishing apparatus for detecting and removing the fine protrusions by reciprocating movement parallel to the plane of the polishing object of the polishing head,
Prior to the start of polishing, the polishing head is pressed against and brought into contact with a calibration table that is elastically supported by an elastic support having a soft support structure that can be easily depressed by the pressing pressure of the polishing head, and the sensor at this time A polishing height position setting method in a polishing apparatus, wherein a height position from the calibration table detected by the polishing head is a polishing height by the polishing head.
JP1693797A 1997-01-30 1997-01-30 Polishing height position setting method in polishing apparatus Expired - Fee Related JP3845165B2 (en)

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JP3844705B2 (en) * 2002-03-13 2006-11-15 株式会社アクト・ブレイン Apparatus and method for repairing substrate defects
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JP4566785B2 (en) * 2005-02-28 2010-10-20 東洋刃物株式会社 Round blade edge finisher
KR100807089B1 (en) * 2006-06-09 2008-02-26 에스엔유 프리시젼 주식회사 Device for Removing Protrusion on Substrate
JP5463461B2 (en) * 2010-07-20 2014-04-09 株式会社ブイ・テクノロジー Color filter protrusion height measuring instrument and repair device
KR101405226B1 (en) * 2012-12-17 2014-06-13 현대자동차 주식회사 Surface treatment device for welding quality detecting system and control method of the same

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