TWI265612B - A heat spreader and a heat sink - Google Patents
A heat spreader and a heat sinkInfo
- Publication number
- TWI265612B TWI265612B TW094101033A TW94101033A TWI265612B TW I265612 B TWI265612 B TW I265612B TW 094101033 A TW094101033 A TW 094101033A TW 94101033 A TW94101033 A TW 94101033A TW I265612 B TWI265612 B TW I265612B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- present
- spreader
- layers
- heat spreader
- Prior art date
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 3
- 229910002804 graphite Inorganic materials 0.000 abstract 3
- 239000010439 graphite Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K47/00—Beehives
- A01K47/06—Other details of beehives, e.g. ventilating devices, entrances to hives, guards, partitions or bee escapes
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K47/00—Beehives
- A01K47/02—Construction or arrangement of frames for honeycombs
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K47/00—Beehives
- A01K47/04—Artificial honeycombs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Environmental Sciences (AREA)
- Animal Husbandry (AREA)
- Biodiversity & Conservation Biology (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004006061 | 2004-01-13 | ||
JP2004367252A JP2005229100A (ja) | 2004-01-13 | 2004-12-20 | 放熱シート及びヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200529394A TW200529394A (en) | 2005-09-01 |
TWI265612B true TWI265612B (en) | 2006-11-01 |
Family
ID=35003516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094101033A TWI265612B (en) | 2004-01-13 | 2005-01-13 | A heat spreader and a heat sink |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005229100A (zh) |
KR (1) | KR100798833B1 (zh) |
TW (1) | TWI265612B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8929076B2 (en) | 2011-12-21 | 2015-01-06 | Tsinghua University | Heat-dissipation structure and electronic device using the same |
TWI474446B (zh) * | 2007-05-16 | 2015-02-21 | Toshiba Kk | 熱傳導體 |
US9017503B2 (en) | 2011-12-21 | 2015-04-28 | Tsinghua University | Method for making carbon nanotube paper |
US9576879B2 (en) | 2011-12-21 | 2017-02-21 | Tsinghua University | Heat-dissipation structure and electronic device using the same |
Families Citing this family (27)
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---|---|---|---|---|
JP2007165415A (ja) * | 2005-12-09 | 2007-06-28 | Japan Matekkusu Kk | 複合基板 |
KR100834149B1 (ko) * | 2006-08-22 | 2008-06-02 | 자화전자(주) | 열 확산시트와 그 확산시트를 채용한 전자기기 |
US20080128067A1 (en) * | 2006-10-08 | 2008-06-05 | Momentive Performance Materials Inc. | Heat transfer composite, associated device and method |
TW200846499A (en) * | 2007-05-24 | 2008-12-01 | Liung Feng Ind Co Ltd | Method of generating hydrogen using dissimilar metal |
JP4978478B2 (ja) * | 2008-01-11 | 2012-07-18 | ソニー株式会社 | 電磁波抑制放熱シート及び電子機器 |
US8673446B2 (en) | 2008-06-02 | 2014-03-18 | Panasonic Corporation | Graphite complex and manufacturing method thereof |
TW201035513A (en) | 2009-03-25 | 2010-10-01 | Wah Hong Ind Corp | Method for manufacturing heat dissipation interface device and product thereof |
JP4564586B1 (ja) * | 2010-01-26 | 2010-10-20 | 有限会社アイレックス | 放熱シート及び放熱シートの製造方法 |
JP5791984B2 (ja) | 2011-07-13 | 2015-10-07 | 株式会社Joled | ディスプレイ装置 |
WO2013118168A1 (ja) * | 2012-02-08 | 2013-08-15 | 国立大学法人東北大学 | 放熱部材及び放熱部材を備えた電子デバイス |
WO2014054842A1 (ko) * | 2012-10-04 | 2014-04-10 | 한국기계연구원 | 금속메쉬층을 포함하는 히트싱크 및 이의 제조방법 |
KR101422218B1 (ko) * | 2012-10-04 | 2014-07-30 | 한국기계연구원 | 금속메쉬층을 포함하는 히트싱크 및 이의 제조방법 |
KR101425995B1 (ko) * | 2012-10-04 | 2014-08-06 | 한국기계연구원 | 금속메쉬층을 포함하는 히트싱크 및 이의 제조방법 |
CN102917574B (zh) * | 2012-10-24 | 2015-05-27 | 华为技术有限公司 | 导热垫、制造导热垫的方法、散热装置和电子设备 |
CN103281888B (zh) * | 2013-05-11 | 2015-08-19 | 深圳市同安泰电子科技有限公司 | 一种高导热天然石墨散热片的制备方法 |
KR101447878B1 (ko) * | 2013-05-13 | 2014-10-27 | 주식회사 데코미 | 벌집형 방열시트 |
CN208791533U (zh) | 2015-06-12 | 2019-04-26 | 新格拉夫解决方案有限责任公司 | 复合物制品、制品以及服装 |
JP2017028280A (ja) * | 2015-07-20 | 2017-02-02 | アールエヌユー カンパニー リミテッド | 高性能電磁波シールド及び高放熱複合機能シート |
ES2746161T3 (es) * | 2015-09-07 | 2020-03-04 | Hak Sik Joo | Lámina compleja para la absorción/extinción y el blindaje contra las ondas electromagnéticas, y para la elevada disipación de calor de un dispositivo electrónico y procedimiento de fabricación de la misma |
WO2017043831A1 (ko) * | 2015-09-07 | 2017-03-16 | 주학식 | 전자파 흡수소멸과 차폐용 및 전자기기 고방열용 융합시트 및 그 제조방법 |
KR101749460B1 (ko) * | 2015-09-07 | 2017-06-21 | 주학식 | 전자파 흡수소멸 및 차폐용 융합시트 |
KR101749461B1 (ko) * | 2015-09-07 | 2017-06-21 | 주학식 | 전자기기용 고방열 융합시트 및 그 제조방법 |
KR102104331B1 (ko) * | 2015-12-31 | 2020-04-24 | 경북대학교 산학협력단 | 전자기파 차폐 기능을 갖는 방열 시트 및 그의 제조 방법 |
WO2017172939A1 (en) | 2016-03-31 | 2017-10-05 | Advanced Energy Technologies Llc | Noise suppressing assemblies |
US20190181070A1 (en) * | 2016-06-28 | 2019-06-13 | Zeon Corporation | Heat radiation device |
JP6956565B2 (ja) * | 2017-08-29 | 2021-11-02 | 日本ピラー工業株式会社 | 熱伝導成形体 |
JP7396204B2 (ja) * | 2020-06-01 | 2023-12-12 | 株式会社デンソー | 冷却装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172799A (ja) * | 1986-01-24 | 1987-07-29 | 日本ピラ−工業株式会社 | 電磁波シ−ルド材 |
US5079900A (en) * | 1990-09-26 | 1992-01-14 | Minnesota Mining And Manufacturing Company | Method and apparatus for forming a tape handle |
JPH06134917A (ja) * | 1992-10-28 | 1994-05-17 | Taenaka Kogyo Kk | 膨張黒鉛ラミネートシート、膨張黒鉛シート複合材、その製造方法 |
JP3417253B2 (ja) | 1997-05-30 | 2003-06-16 | 松下電器産業株式会社 | 金属−グラファイト複合体及びそれを用いた放熱体 |
JPH1158591A (ja) | 1997-08-22 | 1999-03-02 | Furukawa Electric Co Ltd:The | 熱伝導シート |
JP3515368B2 (ja) | 1998-05-22 | 2004-04-05 | ポリマテック株式会社 | 実装素子用の高熱伝導性電磁波シールドシートおよびその製造方法ならびに実装素子の放熱および電磁波シールド構造 |
JP2001240404A (ja) * | 2000-02-25 | 2001-09-04 | Japan Matekkusu Kk | 膨張黒鉛及び膨張黒鉛成形品の製造方法 |
US6503626B1 (en) | 2000-02-25 | 2003-01-07 | Graftech Inc. | Graphite-based heat sink |
JP4116238B2 (ja) | 2000-05-19 | 2008-07-09 | 株式会社タイカ | 電磁波遮蔽性を有する熱伝導性シート |
JP2003008263A (ja) | 2001-06-27 | 2003-01-10 | Sony Corp | 熱伝導部材および熱伝導部材を有する電子機器 |
JP4062994B2 (ja) * | 2001-08-28 | 2008-03-19 | 株式会社豊田自動織機 | 放熱用基板材、複合材及びその製造方法 |
JP3938681B2 (ja) * | 2001-11-21 | 2007-06-27 | 信越化学工業株式会社 | 放熱構造体 |
KR20050001039A (ko) * | 2003-06-26 | 2005-01-06 | 주식회사 포스코 | 마이크로 프로세서를 이용한 안전 표시장치 |
KR20050019232A (ko) * | 2003-08-18 | 2005-03-03 | 자화전자 주식회사 | 방열시트 및 그 제조방법 |
-
2004
- 2004-12-20 JP JP2004367252A patent/JP2005229100A/ja active Pending
-
2005
- 2005-01-06 KR KR1020050001039A patent/KR100798833B1/ko not_active IP Right Cessation
- 2005-01-13 TW TW094101033A patent/TWI265612B/zh not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI474446B (zh) * | 2007-05-16 | 2015-02-21 | Toshiba Kk | 熱傳導體 |
US8929076B2 (en) | 2011-12-21 | 2015-01-06 | Tsinghua University | Heat-dissipation structure and electronic device using the same |
US9017503B2 (en) | 2011-12-21 | 2015-04-28 | Tsinghua University | Method for making carbon nanotube paper |
US9576879B2 (en) | 2011-12-21 | 2017-02-21 | Tsinghua University | Heat-dissipation structure and electronic device using the same |
Also Published As
Publication number | Publication date |
---|---|
KR100798833B1 (ko) | 2008-01-28 |
TW200529394A (en) | 2005-09-01 |
JP2005229100A (ja) | 2005-08-25 |
KR20050074287A (ko) | 2005-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |