TWI265612B - A heat spreader and a heat sink - Google Patents

A heat spreader and a heat sink

Info

Publication number
TWI265612B
TWI265612B TW094101033A TW94101033A TWI265612B TW I265612 B TWI265612 B TW I265612B TW 094101033 A TW094101033 A TW 094101033A TW 94101033 A TW94101033 A TW 94101033A TW I265612 B TWI265612 B TW I265612B
Authority
TW
Taiwan
Prior art keywords
heat
present
spreader
layers
heat spreader
Prior art date
Application number
TW094101033A
Other languages
English (en)
Other versions
TW200529394A (en
Inventor
Katsuro Tsukamoto
Toshiharu Sakura
Hiroaki Tsukamoto
Original Assignee
Japan Matex Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Matex Kabushiki Kaisha filed Critical Japan Matex Kabushiki Kaisha
Publication of TW200529394A publication Critical patent/TW200529394A/zh
Application granted granted Critical
Publication of TWI265612B publication Critical patent/TWI265612B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K47/00—Beehives
    • A01K47/06—Other details of beehives, e.g. ventilating devices, entrances to hives, guards, partitions or bee escapes
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K47/00—Beehives
    • A01K47/02—Construction or arrangement of frames for honeycombs
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K47/00—Beehives
    • A01K47/04—Artificial honeycombs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW094101033A 2004-01-13 2005-01-13 A heat spreader and a heat sink TWI265612B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004006061 2004-01-13
JP2004367252A JP2005229100A (ja) 2004-01-13 2004-12-20 放熱シート及びヒートシンク

Publications (2)

Publication Number Publication Date
TW200529394A TW200529394A (en) 2005-09-01
TWI265612B true TWI265612B (en) 2006-11-01

Family

ID=35003516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101033A TWI265612B (en) 2004-01-13 2005-01-13 A heat spreader and a heat sink

Country Status (3)

Country Link
JP (1) JP2005229100A (zh)
KR (1) KR100798833B1 (zh)
TW (1) TWI265612B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8929076B2 (en) 2011-12-21 2015-01-06 Tsinghua University Heat-dissipation structure and electronic device using the same
TWI474446B (zh) * 2007-05-16 2015-02-21 Toshiba Kk 熱傳導體
US9017503B2 (en) 2011-12-21 2015-04-28 Tsinghua University Method for making carbon nanotube paper
US9576879B2 (en) 2011-12-21 2017-02-21 Tsinghua University Heat-dissipation structure and electronic device using the same

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* Cited by examiner, † Cited by third party
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JP2007165415A (ja) * 2005-12-09 2007-06-28 Japan Matekkusu Kk 複合基板
KR100834149B1 (ko) * 2006-08-22 2008-06-02 자화전자(주) 열 확산시트와 그 확산시트를 채용한 전자기기
US20080128067A1 (en) * 2006-10-08 2008-06-05 Momentive Performance Materials Inc. Heat transfer composite, associated device and method
TW200846499A (en) * 2007-05-24 2008-12-01 Liung Feng Ind Co Ltd Method of generating hydrogen using dissimilar metal
JP4978478B2 (ja) * 2008-01-11 2012-07-18 ソニー株式会社 電磁波抑制放熱シート及び電子機器
US8673446B2 (en) 2008-06-02 2014-03-18 Panasonic Corporation Graphite complex and manufacturing method thereof
TW201035513A (en) 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
JP4564586B1 (ja) * 2010-01-26 2010-10-20 有限会社アイレックス 放熱シート及び放熱シートの製造方法
JP5791984B2 (ja) 2011-07-13 2015-10-07 株式会社Ｊｏｌｅｄ ディスプレイ装置
WO2013118168A1 (ja) * 2012-02-08 2013-08-15 国立大学法人東北大学 放熱部材及び放熱部材を備えた電子デバイス
WO2014054842A1 (ko) * 2012-10-04 2014-04-10 한국기계연구원 금속메쉬층을 포함하는 히트싱크 및 이의 제조방법
KR101422218B1 (ko) * 2012-10-04 2014-07-30 한국기계연구원 금속메쉬층을 포함하는 히트싱크 및 이의 제조방법
KR101425995B1 (ko) * 2012-10-04 2014-08-06 한국기계연구원 금속메쉬층을 포함하는 히트싱크 및 이의 제조방법
CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
CN103281888B (zh) * 2013-05-11 2015-08-19 深圳市同安泰电子科技有限公司 一种高导热天然石墨散热片的制备方法
KR101447878B1 (ko) * 2013-05-13 2014-10-27 주식회사 데코미 벌집형 방열시트
CN208791533U (zh) 2015-06-12 2019-04-26 新格拉夫解决方案有限责任公司 复合物制品、制品以及服装
JP2017028280A (ja) * 2015-07-20 2017-02-02 アールエヌユー カンパニー リミテッド 高性能電磁波シールド及び高放熱複合機能シート
ES2746161T3 (es) * 2015-09-07 2020-03-04 Hak Sik Joo Lámina compleja para la absorción/extinción y el blindaje contra las ondas electromagnéticas, y para la elevada disipación de calor de un dispositivo electrónico y procedimiento de fabricación de la misma
WO2017043831A1 (ko) * 2015-09-07 2017-03-16 주학식 전자파 흡수소멸과 차폐용 및 전자기기 고방열용 융합시트 및 그 제조방법
KR101749460B1 (ko) * 2015-09-07 2017-06-21 주학식 전자파 흡수소멸 및 차폐용 융합시트
KR101749461B1 (ko) * 2015-09-07 2017-06-21 주학식 전자기기용 고방열 융합시트 및 그 제조방법
KR102104331B1 (ko) * 2015-12-31 2020-04-24 경북대학교 산학협력단 전자기파 차폐 기능을 갖는 방열 시트 및 그의 제조 방법
WO2017172939A1 (en) 2016-03-31 2017-10-05 Advanced Energy Technologies Llc Noise suppressing assemblies
US20190181070A1 (en) * 2016-06-28 2019-06-13 Zeon Corporation Heat radiation device
JP6956565B2 (ja) * 2017-08-29 2021-11-02 日本ピラー工業株式会社 熱伝導成形体
JP7396204B2 (ja) * 2020-06-01 2023-12-12 株式会社デンソー 冷却装置

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JPS62172799A (ja) * 1986-01-24 1987-07-29 日本ピラ−工業株式会社 電磁波シ−ルド材
US5079900A (en) * 1990-09-26 1992-01-14 Minnesota Mining And Manufacturing Company Method and apparatus for forming a tape handle
JPH06134917A (ja) * 1992-10-28 1994-05-17 Taenaka Kogyo Kk 膨張黒鉛ラミネートシート、膨張黒鉛シート複合材、その製造方法
JP3417253B2 (ja) 1997-05-30 2003-06-16 松下電器産業株式会社 金属−グラファイト複合体及びそれを用いた放熱体
JPH1158591A (ja) 1997-08-22 1999-03-02 Furukawa Electric Co Ltd:The 熱伝導シート
JP3515368B2 (ja) 1998-05-22 2004-04-05 ポリマテック株式会社 実装素子用の高熱伝導性電磁波シールドシートおよびその製造方法ならびに実装素子の放熱および電磁波シールド構造
JP2001240404A (ja) * 2000-02-25 2001-09-04 Japan Matekkusu Kk 膨張黒鉛及び膨張黒鉛成形品の製造方法
US6503626B1 (en) 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
JP4116238B2 (ja) 2000-05-19 2008-07-09 株式会社タイカ 電磁波遮蔽性を有する熱伝導性シート
JP2003008263A (ja) 2001-06-27 2003-01-10 Sony Corp 熱伝導部材および熱伝導部材を有する電子機器
JP4062994B2 (ja) * 2001-08-28 2008-03-19 株式会社豊田自動織機 放熱用基板材、複合材及びその製造方法
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
KR20050001039A (ko) * 2003-06-26 2005-01-06 주식회사 포스코 마이크로 프로세서를 이용한 안전 표시장치
KR20050019232A (ko) * 2003-08-18 2005-03-03 자화전자 주식회사 방열시트 및 그 제조방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474446B (zh) * 2007-05-16 2015-02-21 Toshiba Kk 熱傳導體
US8929076B2 (en) 2011-12-21 2015-01-06 Tsinghua University Heat-dissipation structure and electronic device using the same
US9017503B2 (en) 2011-12-21 2015-04-28 Tsinghua University Method for making carbon nanotube paper
US9576879B2 (en) 2011-12-21 2017-02-21 Tsinghua University Heat-dissipation structure and electronic device using the same

Also Published As

Publication number Publication date
KR100798833B1 (ko) 2008-01-28
TW200529394A (en) 2005-09-01
JP2005229100A (ja) 2005-08-25
KR20050074287A (ko) 2005-07-18

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees