TW200529394A - A heat spreader and a heat sink - Google Patents
A heat spreader and a heat sink Download PDFInfo
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- TW200529394A TW200529394A TW094101033A TW94101033A TW200529394A TW 200529394 A TW200529394 A TW 200529394A TW 094101033 A TW094101033 A TW 094101033A TW 94101033 A TW94101033 A TW 94101033A TW 200529394 A TW200529394 A TW 200529394A
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- heat sink
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Classifications
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K47/00—Beehives
- A01K47/06—Other details of beehives, e.g. ventilating devices, entrances to hives, guards, partitions or bee escapes
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K47/00—Beehives
- A01K47/02—Construction or arrangement of frames for honeycombs
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
- A01K47/00—Beehives
- A01K47/04—Artificial honeycombs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Environmental Sciences (AREA)
- Animal Husbandry (AREA)
- Biodiversity & Conservation Biology (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
200529394 九、發明說明： 一、【發明所屬之技術領域】 、本發明係關於一種散熱片及熱沈，用以將使用於筆記型電腦 或行動電話等電子產品等的CPU、功率電晶體等的半導體零件、以 及電漿電視的電漿顯示器面板、矽微處理器、發光二極體(LED)、 或是有機發光二極體(0LED)等的散熱裝置中所產生的熱予以有效 地散熱。 二、【先前技術】 y j近幾年來，在我們的日常生活中所使用，以筆記型電腦或行 動電話為代表的各種電子產品，非常明顯地日趨高性能化與小型 4匕。 ” 然而，Ik著此種電子產品的高性能化與小型化，組裝在其内 4的半導體零件也不斷邁向大容量化與集約化，因此，在電子產 品内部的> 發熱量也隨之大幅度地增加。 白主技術巾’像筆記型電腦等㈣子產品巾，大多係將來 零件的熱能’經由銅或料熱傳導性佳的金屬板，傳送 ίΐϊ ()或熱沈(heat sink)之後，再傳播到外部散熱。但是 請ϊί專(卿hitesheet)來代替金屬板。例如， 為金屬板的替代品的原因在，在石墨片的面内的 可用來作為在Γ此種特點’ 祐盥其層的電路基板所構成的璺層基板中，介於基 散^等。摘放熱片，或者是在電漿電視中電漿顯示器面板的 係屬;^^==為，片卻存在一個問題’也就是因為礙 有層人的構造’因此雖然各層的平面方向的分子，係透 5 200529394 而地結合在—起，但是，與面方向呈垂直相交的 間^離_為分子間力的結合較弱，因此容易產生層 面方向除ίί:交=向其=二的 無法得到充分的散熱效果方向）的熱傳導率低，因此有時候 除，之外，就其他的公知技術而言，尚有—種散孰片，200529394 IX. Description of the invention: 1. [Technical field to which the invention belongs] The present invention relates to a heat sink and heat sink, which are used for CPUs, power transistors, etc. of electronic products such as notebook computers or mobile phones. Heat generated in semiconductor components, plasma display panels, plasma microprocessors, silicon microprocessors, light emitting diodes (LEDs), or organic light emitting diodes (OLEDs) such as plasma televisions is effectively dissipated. 2. [Previous Technology] In recent years, various electronic products such as notebook computers or mobile phones used in our daily life have become increasingly high-performance and compact. However, Ik is focusing on the high-performance and miniaturization of such electronic products, and the semiconductor components assembled in them are also continuously moving towards higher capacity and intensification. Therefore, the > heat generation in electronic products will also follow Increased greatly. White main technical towels, such as laptop products such as laptops, are mostly the thermal energy of future parts. After being transmitted through copper or metal plates with good thermal conductivity, heat transfer (ΐϊ) or heat sinks are transmitted. And then dissipate it to the outside for heat dissipation. However, please replace it with a metal sheet. For example, the reason for the replacement of the metal sheet is that the graphite sheet can be used as a feature in Γ ' The layered substrate composed of the circuit substrates of the layers is interspersed with the substrates, etc. The heat-dissipating film, or the system of the plasma display panel in the plasma television; ^^ == is, there is a problem with the film 'That is because the structure of a layer of humans is obstructed'. Therefore, although the molecules in the plane direction of each layer are connected together through 5 200529394, the distance perpendicular to the plane direction intersects _ is the combination of intermolecular forces Weaker, so capacity Generating layer in addition to the surface direction ίί: AC = low thermal conductivity = II thereto a sufficient heat radiation effect can not be obtained direction), and therefore sometimes other, outside on other known technology, there are - what kind of loose sheets,
摻雜銅粉。藉由此種散熱片，關於在與面方向垂直S ^，iSi 率’雖然可使原來散熱效率較差的散熱 轉付。許的提昇’但械無紐底解決Α最大的 缺點一層間剝離的問題。 - /、取大的 把」外，一般而言熱沈係以喊是銅等所形成，由此種全屬材 成的熱沈其散熱效果有限，對於近幾年來隨著半^體3 的谷置增大以及顏更秘小化的進展導量^ 大，並無法充分的對應。 宁又㈣’、、、里日赵增 因此’有人提議採用_石墨作為材f的熱沈（例如 1專利文件2)，但S，此種熱沈卻仍具有上述石墨片容二 ，，也就是容易產生層間剝離，以及與面方向呈垂直 =厚度方向）的熱傳導率低，因而無法得到充分的散熱效果等Doped copper powder. With this type of heat sink, the heat dissipation efficiency of the original heat sink with a lower heat dissipation efficiency can be transferred with respect to the vertical S ^, iSi rate '. Xu's promotion ’but the machine has no bottom to solve A ’s biggest disadvantage, the problem of peeling between layers. -/, Take a big handle ", in general, the heat sink is formed by shouting is copper, etc., the heat sink made of this all-generic material has a limited heat dissipation effect. The increase in trough setting and the reduction in the appearance of the face are more significant and cannot be adequately addressed. Ning Youyi ', Zhao Li, and Zeng Zeng therefore' someone proposed to use _graphite as the heat sink of the material f (for example, 1 patent document 2), but S, this type of heat sink still has the above graphite sheet capacity II, also It is easy to cause peeling between layers, and has a low thermal conductivity, which is perpendicular to the plane direction), so it cannot obtain a sufficient heat dissipation effect, etc.
方面，在習知技術中，較廣為人知的是採用在塑膠 口磁性材料的>；狀物’用來作為遮蔽從電子產品的各種零甚 ^的電磁波的片狀物，然而因為此種習知的電磁波^埶 性低，因此也不能得到充分的散熱效果。 门…得V 【專利文件1】日本特開2003-168882號公報 【專利文件2】日本特開2〇〇3-6〇14〇號公報 三、【發明内容】 欲解決之課題 200529394 之問題本及熱沈，用简決上述習知技術 除了在面的二―:;易片般層間_的問題，而且 筆記型電腦或電漿電視辈^具有優異的熱傳導性，可將 解決問顳之 在申請專利範圍第〗項所記 在膨脹石墨片的正面與背面分別心二二ί關於一種散熱片’ 使該膨脹石墨片與該網狀體一體^而又由金屬線所構成的網狀體’ 申請專利範圍第2項所記载之發明 項之散熱片，但以袋狀體代替該網】V月f'f申請專利範圍第〗 該袋狀體内。 罔狀體，且使該膨脹石墨片*** 或2項之散熱片®手'如申請專利範圍第！ S複數片的膨服石墨片之間介在有由金C石構=中； 申請專利範圍第4項所纪#夕八,口 或2項之散熱片，該膨脹石黑^ ^月’係如申請專利範圍第1 該複數片的膨脹石墨片之間旻數片的石墨片所構成，且 起的金屬箔。 在有於正面及背面設有多數之突 第1〜申/f中第1;頁=明，係關於申請專利範圍 滾乾處理，使其4層—體化而形成的石墨片與該網狀體係藉由 以 圍第====二項在之發 卿。C以上的溫度進行加熱處理/、在進行前述之絲處理後， 卜卜而申凊專利範圍第11項〜第 範圍第1〜4項中任一項之散熱片 明’係關於申請專利 … 。網狀體對金屬線進行編 200529394 製加工而成。 項〜第16項之發明，係’申請專利 ^加工二。、*—項之散熱片，且係該網狀體齡屬線進行織 I γ L 、 …、片’且係於該膨脹石墨片的正面鱼背 申的第面 圍第1〜4項中任一項之散熱片 = 圍第2。〜22項中任一項之散二25 發明，係關於申請專利範 合成樹脂薄膜戶斤構成的保護政層、。片’且於該樹脂層的正面設置有由 體係藉由還原水予以清洗Γ Λ M化的祕石墨>1與網狀 申請專利範圍第29項〜第叫^ D 將該申請專利範圍第卜5 ' 8、I月：’―種熱沈’ 熱片成形加工而得到的。 11 14、17、2〇、23、26項之散 發明之效果 面與為係她石墨片的正 因此藉由此種以金屬線所網 在此種結構下，熱傳導係藉由由金問題。而且由於 向進行傳導，因此在厚度方向的熱傳狀體向厚度方 明可得到-散熱片，對於使·筆記，f t秀。因此，本發 品等的CPU ;功率電晶體等的半導體裳^仃動電話等電子產 ▽牛，以及電漿電視的電漿顯 8 200529394 遮蔽效果散熱。另外’在具有高電磁波 =，可使石墨片的電磁“蔽效成0_狀體的方 為遮蔽從電子產品產生的電===也^。因此，就作 地顯著。 反炙兒磁波遮敝片而言，效果非常 _在f請專利範圍第2項之發明中，伽純料秩， 狀體，且使該膨脹石墨片插以衣狀體代替則迷之網 .網狀體的分離，使兩者讀實内’可防止膨脹石墨片與 或2 ΐΐίϊΐ圍id斤之發明’係如申請專利範圍第1 間夾有—由金騎成之網狀中間體。 數片的石墨片所構成，且該複數片的‘二=J片= 面與背面具備多數之突起的金屬ί⑽脹石墨片之間夾有一在正 申凊專利範圍第5項〜第7項之發明，俏蔣兮膨胳r罢y s 該網狀體，葬由、，靜理#甘田，Θ係將義^脹石墨片與 咖挪！^措由雜處使其®層—體化而形成的。因為可使 在膨脹石墨片中，使正面平坦化，因此可減少整體石 ^ +子又，使石墨片更不容易產生層間剝離的現象。此外，更 可使在厚度方面的熱傳導性進一步提昇。 申請專利範圍第8項〜第1〇 j員之發明，係在進行前述之滾軋 ^後之疊層片，以3G(TC以上的溫度進行加熱處理，並且藉由這 4丨胁式’使金屬原子與碳原子產生擴散結合，使石墨片的抗層間 "強度大幅度地提南，同時亦可大幅度地提昇石墨片在厚度方 向的傳導性。 申請專利範圍第11項〜第13項之發明，係該網狀體將金屬 線，行編製加工而成，因此不但網狀體具備柔軟的特性，而且可 ，厚度更薄。所以，可得到一又薄，而且又具有優秀柔軟性的散 熱片。 在申請專利範圍第14項〜第16項之發明，係該網狀體對金 9 200529394 加工而f ’丨因此在網狀體的金屬線彼此之間的社人 =的正面與背面至少-面中，將該網狀體mu 不容易產生軸離的現象，同時= 的正面申ΐί:ϊ，二項〜第22項之發明’係於該膨脹石墨片 .石==度__正面與背面都賦^緣性1 於半導體構件等與膨脹石墨該保護層介 ㈤ecular cluster)較小片的還；^體’所《 f由分子團簇 石墨片上的微小雜f，更 * ^但可確貫地去除附著在 的現象產生，因此是-種適合裝置由的口帶内電二質附著 申請專利範圍第29項〜第39項^1 散熱片。 行成形加；之 ，狀體墨=向離進的= 腦!^秀。因此本發明可提供-種孰沈，熱傳導 可以有效地進行發散。羊電曰曰體專的半導體零件等所產生的熱， 10 200529394 四、【實施方式】 實施發明之最袪 將參照圖式詳細制依據本發明散熱片及熱沈的較佳資 施型悲。 . 係圖圖 1!係之顯Γ體依f解本圖發明的散熱片之-例的外觀立體圖。圖2 脹的正面與背面’分 ㈣⑺晶爲m網狀體⑵亦即是將膨脹石墨片⑴與網 -體化的構成的。將膨脹石墨片⑴與網狀體⑵疊層On the other hand, in the conventional technology, it is more well-known that the "material" used in the plastic mouth magnetic material is used as a sheet to shield various electromagnetic waves from electronic products. However, because of this knowledge, The electromagnetic wave is low in resistance, and therefore, a sufficient heat radiation effect cannot be obtained. Door ... V [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-168882 [Patent Document 2] Japanese Patent Application Laid-Open No. 2003-004040 3. [Contents of the Invention] Problems to be solved 200529394 And heat sinks, in addition to the above-mentioned conventional techniques, in addition to the above-mentioned two problems: easy-to-layer interlayer problems, and notebook computers or plasma TV generations have excellent thermal conductivity, which can solve the problem of The scope of the patent application No. 〖1 is described on the front and back of the expanded graphite sheet, respectively. About a heat sink 'the expanded graphite sheet is integrated with the mesh body ^ and a mesh body composed of metal wires' Apply for the heat sink of the invention described in item 2 of the patent scope, but replace the net with a bag-shaped body] V month f'f Application for patent scope No.〗 The bag-shaped body.罔 shaped body, and the expanded graphite sheet is inserted into the 2 or 2 heat sink ® hand 'as the scope of patent application! The multiple expanded graphite sheets of S are interposed between the gold C stone structure and the radiating fins of the patent application scope No. 4 and the second or the second heat sink, the expanded stone black ^ ^ month 'is such as The first scope of the patent application is a metal foil composed of a plurality of graphite sheets between the plurality of expanded graphite sheets. There are many protrusions on the front and the back of the first 1 ~ shen / f, the first page; it is stated that the patent application is a roll-drying process, and the 4-layer body is formed into a graphite sheet and the mesh. The system is developed by surrounding the ==== binomial. Heat treatment at a temperature higher than C // After performing the aforementioned silk treatment, the heat sink of any one of the scope of patents No. 11 to No. 1 to No. 4 of the patent application is related to patent application ... The mesh body is made by weaving 200529394. The inventions from item 16 to item 16 are applied for patent ^ Processing 2. , * —The heat sink of the item, and the mesh body age line is woven I γ L,…, sheet 'and is attached to the front surface of the expanded graphite sheet. One item of heat sink = round number 2. The invention of San Er 25 in any one of ~ 22 items is about a protection layer composed of patents for synthetic resin films. Sheet ”, and on the front side of the resin layer, a system is used to wash the graphite with reduced water. Γ Λ Mized graphite > 1 and mesh application patent scope No. 29 ~ No. ^ D 5 '8, I month:' -kind heat sink 'obtained by hot sheet forming. 11 14, 17, 20, 23, 26 Effects of the invention The face is the same as the graphite sheet. Therefore, with this type of wire netting, in this structure, the heat conduction is caused by the problem of gold. In addition, since heat conduction is conducted in the thickness direction, the heat transfer body in the thickness direction can be obtained in the thickness direction. For heat sinks, f t shows. Therefore, CPUs of this product, semiconductors such as power transistors, electronic products such as mobile phones, etc., and plasma displays of plasma TVs 8 200529394 provide shielding effect to dissipate heat. In addition, 'with a high electromagnetic wave =, the electromagnetic effect of the graphite sheet can be shielded into a 0-shaped body to shield the electricity generated from electronic products === also ^. Therefore, it is significant on the spot. In terms of cymbals, the effect is very _ In the invention of the second scope of the patent, the pure material rank, shape body, and the expanded graphite sheet is inserted with a clothes body instead of the mesh. The separation of the mesh body In order for the two to read, the invention that can prevent the expansion of graphite sheet and or 2 系 ΐΐ id ϊΐ id 斤 斤 the invention of the invention is as shown in the first patent application range sandwiched between-a network of intermediate intermediates made of gold riding. Structure, and the two pieces of 'two = J pieces = metal sheets with a large number of protrusions on the back and the back of the sheet are sandwiched between the 5th and 7th patents of Zhengshen Patent, and they are invented. This is a reticular body, buried by ,, Jing Li # 甘 田, Θ is formed by swelling graphite sheets and coffee! ^ Measures are formed by mixing its layers into a body. Because it can expand in In the graphite sheet, the front surface is flattened, so that the overall stone can be reduced, and the graphite sheet is less prone to peeling between layers. In addition, the thermal conductivity in terms of thickness can be further improved. The inventions of the eighth to tenth members of the scope of patent applications are the laminated sheets after the aforementioned rolling ^, at a temperature of 3G (TC or higher) Heat treatment, and through the 4 ′ threat formula, the metal atoms and carbon atoms are diffused and combined, so that the resistance between layers of graphite sheet is greatly increased, and the thickness of graphite sheet in the thickness direction can be greatly improved. The invention of the 11th to 13th of the scope of application for patents is that the mesh body is made of metal wires and processed, so the mesh body not only has soft characteristics, but also has a thinner thickness. So You can get a thin and thin heat sink with excellent flexibility. The inventions in the scope of application for patent Nos. 14 to 16 are processed by the mesh body for gold 9 200529394 and f '丨 is therefore in the mesh body The metal wire between the company = the front side and the back side at least-the mesh body mu is not easy to cause the phenomenon of off-axis, at the same time = the front side of the application: ϊ, two to twenty-two inventions 'Tied to this expanded graphite sheet. == 度 __ Both the front and back sides are assigned a marginal value 1 for semiconductor components, etc. and expanded graphite. The protective layer intervenes with the smaller piece of the eclectic cluster. It is more * ^ but it can remove the phenomenon of adherence consistently, so it is a kind of device suitable for the device's mouthband electric secondary adhesion. Applicable patent scope No. 29 ~ 39 ^ 1 heat sink. Forming plus; In other words, the shape of the body ink = the distance = the brain! ^ Show. Therefore, the present invention can provide-a kind of sinking, heat conduction can be effectively dissipated. The heat generated by the semiconductor components such as the body of the sheep electricity, 10 200529394 4. [Embodiment] The best method for implementing the invention will be described in detail with reference to the drawings in detail of the preferred embodiment of the heat sink and heat sink. Fig. 1 is a perspective view of an external appearance of an example of a heat sink according to the present invention. Fig. 2 The swollen front and back sides are separated into m-mesh bodies, that is, the expanded graphite sheet ⑴ and the net-body structure. Laminate expanded graphite sheet ⑴ with reticulate body ⑵
C 解石==脹=i1)❿較佳的情況是將天然石墨、熱分 硝^反應石墨粉末與濃硫酸、濃 ==脹石墨本體，藉:滾使ί 話，就無法得到充足的石墨片強^疋口 厚度不到〇.馳的 ⑵進行滾軋一體化的時候，產生i脹^述^疊設網狀體 當厚度超過1.5職的時候，容易產又5 2折，的可能；而 向的熱料性射雛轉低，麵使厚度方 關於膨脹石墨片⑴的密度別严理想。 熱傳導性叹石墨㈣強度3^^不滿的話， 話，可撓性就會降低，無論是何曰比而^超過2.2g/an3的 就構成網狀體⑵的金屬線材^H合。 熱傳導率者較佳。例如銅、鋼情況是使用有高 +鏽鋼、白金、鈦、紹、英高錄 200529394 (I_el)、蒙鎳合金（Monel metal)、鎳等 但是並不限於此等之金屬。 疑此寻的口至 構成網狀體(2)的金屬線之粗細，可根據膨服石 ，適當地設定。例如假使觸脹石的厚度設為i的心^ 0 2可= 〇〜G·5者更佳的情況是制直徑比例約 具體而言，金屬線的粗細’較佳的情況是使用粗細約〇 〇5〜 〇· 15 mm左右者。 · 關於網狀體⑵的粗細（大小）’亦無_的限制，只要設定成 士，><1〇腿的面積内’有5〜40個左右相同圖案的花紋即可。 1疋因為假使網目過大的話，就喪失了避免層間剝離的效 在厚度方向的熱傳導性也會縣；相反地，假 增加M，_會造成可撓性減低，無論何種情況 就網狀體（2)而言，較佳的情況是如圖3所示，對金 ，製力:工之後成為片狀者較佳。此外，亦可如圖4所示，對 線進巧織造加工後成為#狀者。另外，鱗是編製加卫或織造加 工以〔卜的方法’只要是可使金屬線成為片狀的網狀體者皆可。 就編製加工而言，可使用平針組織、羅紋組織、雙反面组 集圈組織、洋線編織、單吊目組織、雙吊目組織、添紗_、雔 ，織等的緯編製加卫；或者是單流櫛經平組織、雙流梅】‘ 織、網眼組織、米蘭組織等的經編製加工等方式。 ㈣方式’對金屬線進行編製加I以作為網狀 體⑵的方式’可使陳體⑵成為具備優㈣軟 亦可減少其厚度。因此，可制—謂，又十分柔軟的A片门寸 就織造加工而言，可使用平紋織法、斜紋織法、锻紋織法、 夕重織法、紗羅織法、紋織法等方式。 這ί，藉由這種方式，對金屬線進行織造加工以作為網狀 體⑵的方式’可得到在網狀體⑵中金屬線與金屬線之間的結合 12 200529394 的正面f背面兩面，都以疊設的狀ιΓ疊層石一墨片⑴ 方式雖無朗的限定，但較佳的方式5 一體化的 軋處理的方法。 扪用滾軋滾同等，使用滾 圖5係由利用滾軋處理而疊層一 網狀體⑵所構成的散熱片的示意剖面圖。嫌石墨片⑴；以及 正面:，产脹石墨片⑴的 為略同-平面。另夕^里在又的狀=’=大體⑵與膨脹石墨片⑴係 丨墨>U1)係完全在同—平ϋ、#巾，雖然網狀體⑵與膨脹石 石墨片⑴的正面突出的…+’相,也4可以採用網狀體⑵從膨脹 大。 大出的4 °但是’較佳的方式是突出量不要太 埋沒在膨脹石藉由經過滾軋處理而分別 此，可使石im，，罔狀體⑵攸正面與背面兩面牢固地夾持。因 由金屬線所“的網於熱傳導係藉著 向的熱傳導性非常優秀即)⑽度方向進仃傳導，因此在厚度方 ，及/或‘等:件:在t二， 與背二系可在膨脹石墨片⑴的正面 片⑴滾軋一體:。思一面，疊層稷數片、網狀體⑵，與該膨脹石墨 ⑵，面與背^ ^ 13 200529394 在圖6所示的例子中，正面與背面 ⑵，但亦可疊層3片以上。同時 ^的網狀體 同的張數（例如2片與3片，3月面與月面分別使用不 置於加熱爐中的方法進行加熱處理月。（）斤構成的放熱片，以放 加熱的溫度可在30(rc以上，更 J情=〇Γ°°。。。此外，較佳的處理時|佳 昇華======膨脹獨⑴的石墨之 情況是設為不滿構成網狀體⑵的S 以j)，較佳的 狀體構成的話，_為不假躺 加熱處理環境成為惰性環境的構成型態“乱體相方式，採用使 如果將藉由滾軋處理而疊層一艚介 ίίίί強烈地運動，使原子的移動超過石墨層間、，並ΓΓ於Ϊ 碳原子產生熱化學反應，而形成擴散結合。 方向的熱傳請可大幅度地提昇，同時對厚度 (2)正面的結構。 彳木用以樹知覆盍網狀體 是採用此種構成時的散熱片之概略剖面圖。 〜、fl|77〇、、M不機層⑶僅覆蓋藉由將膨脹石墨片⑴的正面盘 在祕石墨片⑴的正面與背面，都以樹脂層⑶覆 14 200529394 f狀體⑵的正面射面之例。另外，在此雖未圖 能。二ίί木用樹脂層(!_)僅覆蓋網狀體⑵的背面側的構成型 =於脾種以樹脂覆蓋網狀體⑵的正面的構成方式，亦可適 用於^如®^6所示的網狀體⑵疊層複數層的散熱片。 矽樹月ί覆體=面之樹=言，可使用例如：環氧樹脂、 烯⑽Ε)ϊ^ 漆（varnish)、珠瑯質（_el)、聚四說乙 藉由此種以樹脂覆蓋網狀體（2)的正面的方式，可以 黑C calcite == bulge = i1) ❿ The best case is to use natural graphite, thermal denitrification ^ reactive graphite powder and concentrated sulfuric acid, thick == bulge graphite body, if you roll it, you cannot get enough graphite When the thickness of the sheet is less than 0.0, and the thickness of the sheet is rolled and integrated, the swell is generated. When the thickness of the stacked mesh is more than 1.5, it is easy to produce and may be 50% off; However, the direction of the hot-shot ejector is lowered, and the thickness of the expanded graphite sheet is particularly ideal. If the thermal conductivity is not satisfied with the strength of graphite ㈣, the flexibility will be reduced. No matter what ratio it is, if it exceeds 2.2 g / an3, it will form the metal wire of the mesh 合. The thermal conductivity is preferred. For example, in the case of copper and steel, high + rust steel, platinum, titanium, Shao, Inco Record 200529394 (I_el), monel metal, nickel, etc. are used, but not limited to these metals. The thickness of the metal wire constituting the reticulate body (2) in doubt may be appropriately set according to the puffstone. For example, if the thickness of the dilatant stone is set to the center of i ^ 0 2 = 〇 ~ G · 5, it is better to make the diameter ratio ratio. Specifically, the thickness of the metal wire is' better to use a thickness of approximately 〇. 〇5 ～ 〇 · 15 mm or so. · There is no restriction on the thickness (size) of the reticulate body, as long as it is set to > < within the area of 10 legs, there are about 5 to 40 patterns with the same pattern. 1) If the mesh size is too large, the thermal conductivity in the thickness direction will be lost if the effect of avoiding interlayer peeling is lost. Conversely, if M is increased, the flexibility will be reduced. In any case, the mesh body ( 2) As for the better case, as shown in Fig. 3, it is better to make gold to the plate after the work: In addition, as shown in FIG. 4, the thread may be made into a # shape after weaving. In addition, the scales are prepared by guarding or weaving, and any method may be used as long as the wire can be made into a sheet-like network. In terms of weaving and processing, weft weaving and weaving can be performed using flat stitch, rib weave, double-reverse set circle weaving, western thread weaving, single hoisting weave, double hoisting weaving, weaving, weaving, weaving, etc .; or It is a method of warp knitting and weaving such as single-flow stitching, plain weave, and double-sweet plum], weaving, mesh, and Milan. The "method" is a method of weaving a metal wire and adding I as a mesh body ", so that the Chen body can be made softer and its thickness can be reduced. Therefore, it can be made into a very soft A-sheet door. In terms of weaving processing, plain weave, twill weave, forged weave, evening re-weave, leno weave, and weave weave can be used. This, in this way, the way of weaving the metal wire as a mesh body 'can get the combination between the metal wire and the metal wire in the mesh body 12 200529394 on the front f back both sides, both Although the method of stacking stacked stromatolites and ink flakes is not limited, a preferred method 5 is an integrated rolling process. Fig. 5 is a schematic cross-sectional view of a radiating fin formed by laminating a mesh body ⑵ by a rolling process. It is suspected that the graphite sheet ⑴; and the front face: the swelled graphite sheet ⑴ is almost the same-plane. In the meantime, the shape = '= the general body and the expanded graphite sheet 丨 丨 ink> U1) is completely the same-flat ϋ, # towel, although the mesh body ⑵ and the expanded graphite sheet ⑴ are protruding from the front The… + 'phase can also be expanded by using the reticulate body. It is 4 ° larger, but the best way is not to overburden the expanded stone by rolling, so that it can be firmly clamped on the front and back of the stone. Because the metal wire's network is very good in thermal conductivity through the heat conduction system, that is, it conducts heat in the direction of the direction, so in the thickness direction, and / or 'etc: pieces: at t two, and the back two system can be at Expanded graphite sheet ⑴ The front sheet ⑴ is rolled and integrated: Think of one side, a stack of several sheets, a mesh body 与, and the expanded graphite sheet 面 ^ 13 200529394 In the example shown in Figure 6, the front side It is the same as the back, but it can also be laminated more than 3 pieces. At the same time, the same number of mesh bodies (for example, 2 pieces and 3 pieces, the March face and the moon face are heated by using a method not placed in a heating furnace, respectively). The exothermic sheet composed of () pounds can be heated at a temperature of more than 30 (rc, more J = 〇Γ °° ... In addition, the better processing | good sublimation ====== expansion alone In the case of graphite, it is assumed that S is dissatisfied with the formation of the reticulate body, and j). If the structure is better, _ is the configuration type of the inert environment without lying on the heat treatment environment. If the layer will be laminated by rolling, it will move strongly and make the atom move beyond the graphite layer. And ΓΓ produces a thermochemical reaction with the carbon atoms of Ϊ, forming a diffusion bond. The heat transfer in the direction can be greatly improved, and the thickness (2) of the front structure is used. A schematic cross-sectional view of the heat sink when this structure is adopted. ~, Fl | 77, M, and the mechanical layer ⑶ cover only the front and back of the graphite sheet ⑴ by placing the front face of the expanded graphite sheet ⑴ on the front and back of the graphite sheet ⑴. Resin layer ⑶ 14 200529394 Example of the front surface of f-shaped body ⑵. In addition, although it is not shown here, the resin layer (! _) For wood only covers the back side of the reticulated body = = The spleen seed is covered with a resin to cover the front of the reticulate body ⑵, and it can also be applied to ^ as shown in ® ^ 6. Laminated body with multiple layers of heat sinks. In other words, for example, epoxy resin, varnish, varnish, _el, and polysilicon can be used to cover the front surface of the mesh body (2) with resin. black
熱片的正面脫離’或是網狀體從膨脹石墨片脫離等狀況： ㈣整方式也對正面射面賦予絕雜，因此可容 樹脂層⑶的厚獅無制的關，但是雛的情況是設定為 •上mm〜丨· 2 mm左右。這是因為如果樹脂層（3)的厚度未滿〇· 〇〇1 mm^N舌’就無法獲得充分的覆蓋效果，但是如果厚度超過I ? _ 的活，不但無法提高覆蓋的效果，反而可能導致熱傳導性以及 撓度降低的結果。 乂另外，就覆蓋的方法而言，可使用眾所週知的覆蓋方法，例 如採用在浸潰（dipping)法之後，再予以烘烤乾燥而成。 除此之外，在本發明之中，如圖9及圖1〇所示，亦可在樹脂 層（3)的正面設置由合成樹脂薄膜構成的保護膜（4)，且以可剝離 或是不可剝離的型態設置。 圖9係顯示僅將樹脂層（3)設置於散熱片正面侧的情況，在此 種情況下，保護層（4)亦僅設置於正面側。圖1〇係顯示將樹脂層 (3)没置於散熱片的正面與背面的狀態，在這種情況下，保護層（4) 亦係設置於正面與背面兩侧。此外，在此雖未予以圖示，但是亦 可採用在散熱片的正面及/或背面不設置樹脂層（3);而僅設置保 護層（4)的構造。 μ 就構成保護層（4)的合成樹脂而言，可採用pet (聚對苯二甲 二乙酯）、聚乙稀、聚丙烯、聚醯亞胺、丙烯酸樹脂、尼龍、聚氯 15 200529394 乙烯等。同時，由此等物質所構成的薄膜，係直接或透過接著劑 等，與樹脂層（3)疊層一體化。 以下的表1係顯示構成上述保護層（4)的合成樹脂之物性值 刿。 之一例 物性 比重 伸縮強度 ---—--—---- 彎曲彈性 線膨脹係 率 數 單位 MPa MPa 二 xl〇'5/°C ASTM試驗法 D-792 D - 638 D-790 D—696 PET 1.39 84 l30lT ——丨— 6.0 聚乙烯（高密度） 0.96 ——-- 25 |079_ 11 0 聚乙稀(低密度） 0.92 90-110 2000 16 〜18 聚丙烯 0.91 32 1667 A yJ x U ii n 聚醯亞胺 1.43 92 3430 ~ -—-~~·——一 丄 JL · V«/ 3· 6 丙烯樹脂 1.19 ----— 75 3300 —-~-—-_ 7 Π 66尼龍 1.13-1.15 83— ~ ί. U 2795 —~~—_ 9.0 聚氣乙烯 1.47 -—-~_ 55 3300 —-—— -kL . 1 . 7.0 圖11至圖13 > ί系顯示根櫨 ——-- -一上㈣…,小职叫、κ琢个贫明之散熱片 之圖，其中（a)為外嵌立體圖；（b)則為剖面、圖 ----^ 句刘曲圖。 如圖11所示的散熱片，係以袋狀體代 網狀體，且使該膨脹石墨片⑴插人該 ^由if，成之 式’使膨脹石墨片⑴的正面與背面二^=$種方 構成網狀體（2)的袋狀體，可倍借一加狀體（2)的型悲。 袋狀體；也可以是兩個端部都是開口 =而°卩有開口之有底部的 在圖11的散熱片中，膨脹石墨片，狀體亦可。 體化。疊層-體化的方式並無_特二敝體(2)係疊層-等滾軋處理的方式，或是使膨脹石黑=限制，可使用滾軋滾筒 為略同-平面。另外，也可以採用⑵的正面成 正面突出的設計。但是，較佳的方气3 攸知脹石墨片（1)的 式疋突出量不要太大。然而， 16 200529394 在圖η⑻的剖面圖係顯示網狀體⑵從膨脹石墨片⑴的正 全顯露出來的狀態。 如圖12所示的散熱片中，上述的膨騰石墨片⑴係由兩片石 ^所構成’在該兩 膨脹石墨片⑴之間係夾著由金屬線所構成 播ί狀中間體⑸。然後，在此膨脹石墨片⑴與網狀中間體⑸所 ^成的構造體的正面與背面’該網狀體⑵被以疊層—體化的方式 设置。 . 侧狀中間體⑸而言，係使用與該網狀體⑵具備相同結構 •伯Θ另外」ί圖,的例子中，雖然膨脹石墨片⑴係設定為2片， GGr定為三片以上、然後使網狀中間體⑸介於各膨脹石墨 髀夕此外二f由該膨脹石墨片⑴與網狀中間體⑸所構成的構造 ^正面與月面，就疊層網狀體⑵的方法而言，可以如圖2所示 的將片狀物重複覆蓋於該構造體的正面與背面；也可以如圖u所 =者將構造體插人有底或無底的袋狀體中。在圖示的例子係顯示 在如圖12的散熱片巾，膨脹石墨片⑴、網狀體⑵、以及網 定中係被疊層一體化。疊層一體化的方式雖無特別的限 义’但杈制方敍糊滾軋滾筒等，使赌軋處理的方法。 精由此種滾軋處理，使構成網狀體⑵與網狀 埋脹石墨片⑴的正面與背面；而且使膨脹石S )’網狀體⑵，以及網狀中間體⑸三者的正面呈略同—平面。 」1也可以採用網狀體(2)及網狀中間體(5)從膨脹石墨片⑴的 ==設計。但是’較佳的方歧突出量不要太大。然而， = (b)㈣關細示峨體⑵及網狀巾間體 墨片（1)的正面完全暴露出來的狀態。 片…13所示的散熱片’上述的膨脹石墨片⑴係由兩片石墨 斤構成，且在該兩片膨脹石墨片⑴之間，係夾著金屬箱⑹。 17 200529394 而在由此膨脹石墨片（1)與金屬箔（6) 面，上述網狀體⑵被疊層-體化。冑成的構造體的正面與背 圖13(c)係顯示金屬箔（6)的概略 箱⑹的正面與背面形成多數之突起以面圖。如圖所不’在金屬 佳，而且廉價的銅。但是亦可使用鈕，凡疋仗用…得W生 細的厚度，較佳的情況是屬，= „情況是設定在約〇. i刪左右。ϋ 〜0·2 mra左右’最佳的 另外，在圖示的例子中，雖然膨脹射 亦可奴為三片以上、然後使金㈣ ㈣匕„該膨服石墨片⑴與由金屬簿⑹所構成的構造 的方法而言，可係將如圖2所示的片狀 3所极正面舆背面’也可以將該構造體***如圖 11所底或無底的袋狀體中。本圖所顯示的例子係顯示後者。 在圖13的散熱片巾，網狀體⑵、膨服石墨片⑴、金 一體化的方式雖無特別的限定’ 式疋利用滾軋滾同荨，使用滾軋處理的方法。 纽ϋ藉由此種滾乳處理，使構成網狀體⑵的金屬線以及形 成於金屬泊（6)的突起埋沒在膨脹石墨片⑴的正面與背面 脹石墨片（1)、網狀體（2)、以及金屬箔（6)的正面呈略同一的情況 較佳。另外，雖然可使網狀體（2)及金屬箔（6)從膨脹石墨片〇)的 ^面突出二但是突出量最好不要太大。然而，在圖13(1))的剖面圖 中，係顯示網狀體（2)從膨脹石墨片（1)的正面完全顯露 ， 而略去顯示金屬箔（6)的突起。 心 ^圖11〜13所示的散熱片中，可採用在膨脹石墨片（1)的正 面與背面其中至少一面，較佳的情況是採用在兩面，將網狀體（2) 的正面以樹脂予以覆蓋，形成樹脂層的構成。 就覆蓋網狀體（2)的正面的樹脂而言，可使用例如環氧樹脂、 18 200529394 石夕樹^由=脂清^法瑯質、聚四氟乙烯(p ί‘石sr训正面與背面都賦： 散熱片脂的覆蓋方法而言，可採用輿前述 - 除此之外，在本發明中，關於上述 況是採用將一體化的膨脹石墨片⑴=狀熱片，The front side of the hot sheet is detached, or the mesh body is detached from the expanded graphite sheet. The trimming method also imparts absolute impurities to the front surface, so it can accommodate the thick lion of the resin layer ⑶, but the situation of the chick is Set from • Top mm to 丨 · 2 mm. This is because if the thickness of the resin layer (3) is less than 〇 · 〇〇1 mm ^ N tongue ', a sufficient coverage effect cannot be obtained, but if the thickness exceeds I? _ Not only can not improve the coverage effect, but may be possible This results in reduced thermal conductivity and deflection.乂 In addition, as for the covering method, a well-known covering method can be used, for example, after the dipping method, and then baking and drying. In addition, in the present invention, as shown in FIG. 9 and FIG. 10, a protective film (4) made of a synthetic resin film may be provided on the front surface of the resin layer (3), Non-peelable profile settings. Fig. 9 shows a case where the resin layer (3) is provided only on the front side of the heat sink, and in this case, the protective layer (4) is also provided only on the front side. Fig. 10 shows a state where the resin layer (3) is not placed on the front and back surfaces of the heat sink. In this case, the protective layer (4) is also provided on both sides of the front and back surfaces. Although not shown here, a structure in which the resin layer (3) is not provided on the front and / or the back surface of the heat sink and only the protective layer (4) may be used. μ As for the synthetic resin constituting the protective layer (4), pet (polyethylene terephthalate), polyethylene, polypropylene, polyimide, acrylic resin, nylon, polyvinyl chloride 15 200529394 ethylene Wait. At the same time, the thin film made of these materials is laminated or integrated with the resin layer (3) directly or through an adhesive or the like. The following Table 1 shows the physical property values 合成 of the synthetic resin constituting the protective layer (4). An example of physical property specific gravity expansion strength ------------ bending elastic linear expansion coefficient number unit MPa MPa two xl0'5 / ° C ASTM test method D-792 D-638 D-790 D-696 PET 1.39 84 l30lT —— 丨 — 6.0 Polyethylene (high density) 0.96 ——-- 25 | 079_ 11 0 Polyethylene (low density) 0.92 90-110 2000 16 ～ 18 Polypropylene 0.91 32 1667 A yJ x U ii n Polyimide 1.43 92 3430 ~ -——- ~~ · ———— JL · V «/ 3 · 6 acrylic resin 1.19 ----— 75 3300 —- ~ -—-_ 7 Π 66 nylon 1.13- 1.15 83— ~ ί. U 2795 — ~~ —_ 9.0 Polyethylene 1.47 -—- ~ _ 55 3300 —-—— -kL. 1. 7.0 Figure 11 to Figure 13 > ί shows roots --- --A picture of a small fan named κ, a poor heat sink, (a) is an in-line perspective view; (b) is a cross-section, figure ---- ^ sentence Liu Qutu. The heat sink shown in FIG. 11 is a bag-shaped body instead of a mesh body, and the expanded graphite sheet is inserted into the ^ by if, the formula 'make the front and back of the expanded graphite sheet ^ = $ The seed forms the pouch-shaped body of the reticulate body (2), which can double the shape of the plus-shaped body (2). Bag-shaped body; it is also possible that both ends are open = and that there is an opening with a bottom. In the heat sink of Fig. 11, an expanded graphite sheet may also be used. Body. The lamination-body method does not include the special di-body (2) system of lamination-and-rolling treatment, or the expansion stone black = limit, and the rolling roller can be used to be almost the same-plane. In addition, the design of the front of the cymbal can also be adopted. However, the better formula 3 is that the amount of protrusion of the expanded graphite sheet (1) should not be too large. However, the cross-sectional view of Fig. 16 200529394 shows the state where the mesh body ⑵ is exposed from the full side of the expanded graphite sheet ⑴. In the heat sink shown in FIG. 12, the above-mentioned expanded graphite sheet ⑴ is composed of two pieces of stone ′. Between the two expanded graphite sheets ⑴, an intermediate intermediate ⑸ made of metal wire is sandwiched. Then, here, the front and back surfaces of the structure formed by the expanded graphite sheet ⑴ and the net-like intermediate body 网 are provided in a laminated body. For the lateral intermediate ⑸, the same structure as that of the reticulate ⑵ is used. In the example shown in the figure, although the expanded graphite sheet ⑴ is set to 2 pieces, the GGr is set to 3 or more pieces. Then, the network intermediate ⑸ is interposed between each expanded graphite 膨胀 In addition, the structure composed of the expanded graphite sheet ⑴ and the network intermediate ⑸ 正面 The front side and the moon surface, in terms of the method of laminating the network ⑵ As shown in Figure 2, the sheet can be repeatedly covered on the front and back of the structure; or as shown in Figure u, the structure can be inserted into a bottomed or bottomless bag. The example shown in the figure shows that in the heat sink sheet shown in Fig. 12, the expanded graphite sheet ⑴, the mesh body ⑵, and the netting are laminated and integrated. Although the method of lamination integration is not particularly limited, it is a method in which a roll is rolled, for example, by a rolling roller or the like. By this rolling treatment, the front and back sides of the reticulated body 埋 and the reticulated expanded graphite sheet ⑴ are formed; and the expanded stone S) 'reticulated body ⑵ and the front of the reticulated intermediate ⑸ are presented. The same-plane. "1 can also be designed from the expanded graphite sheet ⑴ == with the mesh body (2) and the mesh intermediate (5). But 'the preferred amount of outliers should not be too large. However, (b) Tongguan shows the state where the front face of the ink sheet (1) of the eel body and the interstitial tissue is completely exposed. The heat sink fin shown in sheet 13 is the above-mentioned expanded graphite sheet ⑴ composed of two sheets of graphite, and a metal box ⑹ is sandwiched between the two expanded graphite sheets ⑴. 17 200529394 On the surface of the expanded graphite sheet (1) and the metal foil (6), the above-mentioned mesh body is laminated and formed. Front and back of the formed structure Fig. 13 (c) is a schematic view showing the outline of the metal foil (6). As shown in the figure, the metal is better and cheaper than copper. But you can also use the button, where you can use ... to get a thin thickness, the best case is genus, = "the case is set to about 0. i deleted about. 〜 ~ 0 · 2 mra about 'best in addition In the example shown in the figure, although the expansion shot can be made into three or more pieces, and then the method of making the swollen graphite sheet ⑴ and the structure made of metal sheet ， can be such as It is also possible to insert the structure into the bottom or bottomless bag-like body as shown in FIG. 11. The example shown in this figure shows the latter. In the heat sink sheet of FIG. 13, although the method of integrating the mesh body ⑵, expanded graphite sheet ⑴, and gold is not particularly limited, the method 疋 uses rolling and rolling, and uses a rolling method. With this kind of rolling treatment, the button wire is used to bury the metal wire forming the reticulate body 以及 and the protrusions formed on the metal poise (6) in the expanded graphite sheet ⑴, the expanded graphite sheet (1), and the reticulated body (1). 2) It is preferable that the front surface of the metal foil (6) is slightly the same. In addition, although the mesh body (2) and the metal foil (6) can be protruded from the surface of the expanded graphite sheet 0) by two, the amount of protrusion is preferably not too large. However, in the cross-sectional view of FIG. 13 (1)), the mesh body (2) is completely exposed from the front of the expanded graphite sheet (1), and the protrusions of the metal foil (6) are omitted. ^ In the heat sink shown in Figures 11 to 13, at least one of the front and back sides of the expanded graphite sheet (1) can be used. It is preferable to use two sides to make the front of the mesh body (2) with resin. Cover it to form a resin layer. As for the resin covering the front side of the mesh body (2), for example, epoxy resin, 18 200529394 Shi Xishu ^ by = Zhi Qing ^ fragrant, polytetrafluoroethylene (p ′ 'stone sr training front and back Du Fu: As for the method of covering the heat sink grease, the foregoing can be used-In addition, in the present invention, the above-mentioned situation is to use an integrated expanded graphite sheet
—_:4?情況是I 像這樣子的還原水，不但可笋捏 右 水比較起來，其水分子的團薦（clH的而且與純 因此，藉由利用還原水洗淨的方式，甚將;的滲透力。 小雜質確實地去除。同時，也 ，附者於石墨片的微 但 質附著的現象，因此可得到最適合於安裝由在的口帶電所導致雜 在本發明中所使用的還 ' ^口 ^的散熱片。 是可:採用例如以下的例示方法'的生產方式並無特別的限制，彳 】·氣體氣泡（gas bubbling)法 ..化還氣的氣泡’使水中的氧氣濃度下降，並且使氧 2·肼聯胺(hydrazine)添加法 藉由添加肼聯胺的方式 化還原電位亦下降。 使尺中的乳.辰度下降，並且使氧 3.電解法 19 200529394 / (aj藉由正負的波高值以及/或負荷比（duty rati〇)施加 對稱的高頻電壓的方式，進行水的電解，使氧化還原電位降低。 ⑹使電極由一片接地電極(ground electrode)(負極）；以及 特殊形狀電極（例如菱形網狀雜或六角形網狀電極j所構成， 其中’後者係由兩片正極與負極兩者交互變化的與以所構 並且施加高觀壓進行水的電解，使氧化還原電位降低。 卵圖=係?ίϊ據本發日狀触；射⑷為熱域形品的立 • 體圖，（W〜（d)為熱沈材料的概略剖面圖。 熱沈係由平板狀的底板部⑺；複數條的縛 .⑻’以直立的型‘威置於該底板部⑺的正面，且 -定距離方式的平行妓。另外，根據本發明_沈 ^ ^ f板部⑺的厚度、面積、形狀；鰭片部⑻的個^因5 精二，由將前述之散熱片沈 ^狀而付。就此政熱片而έ ’可使用前述的所有 將在圖η所示的散熱片進行成度圖示 在圖12所示的散熱片進行成形加工的情 ;係例不將 圖13所示的散熱>；進行成形加卫的情況⑷係例示將在 至於成形加工的方式則無特別的限制，較 具備所希望的熱沈的内部空間之缉模，成形^教片7方兄=可使用 容易產生石墨的層間剝離的問題，而且 較不 線所構成的網狀體，向厚度方向進行傳導，、；；、傳¥係错由由金屬 傳導性非常優秀。所以，本發明係對於筆。度方向的熱 電子產品等的CPU;以及功率電晶體等的半導行動電話等 予以有效地散熱的熱沈。另外，因為該網狀 1件專所產生的熱 故會對散熱片賦予適度的剛性，因此亦由金屬線所構成， /、有k秀的成形性以及強 20 200529394 度。 圖15係顯示根據本發明的散熱片及熱沈的使用狀態一例之 概略圖，其係顯示筆記型電腦的内部。 在圖示例中’散熱片（10)係緊密附著於搭載在基板(K)上的 MPU等的半導體構件（μ)的正面，❿熱沈（2〇)係配置於此散熱片 (10)上。 .、 藉由14種方式’從半導體構件(M)所產生的熱會經由散熱片 ，(10)傳導到熱沈(20)。而從熱沈(20)再透過鰭片（F)，有效率址 將熱發散到外部。 • 【實施例】 以下，藉由顯示根據本發明之散熱片的實施例與比較例，使 本發明的效果更為明確。但是，本發明並不限定於該等實施 1·實施例1與比較例1的樣本製作 、 (實施例1) i尤f Γί墨片3( 1)而言，可使用厚度G.15 mm，大小5GG隨500 mm，岔度1.65g/cm，石墨含量99.7%的膨脹石墨片。而 ⑵而言’可將直徑G. 12 mm的銅線採用平編的方式，並且使其^ 平均10 mmxlO麵的面積之内，就有25個網目的疏鬆度編=徭 傷再使用滾闻使其滾軋一體化。藉由此種方式，得到具備如 圖5所示構成的散熱片，並且作為實施型態丨的樣^。回 (比較例1) 僅使用與實施例1相同的膨脹石墨片⑴所構成 .實施例1的樣本。 狀"、、月，作為 2.實施例1與比較例1的樣本特性評估 關於上述實施例1與比較例1的樣本，分別測量埶 方向與厚度方向）、層間剝離強度（膨脹石墨片⑴的 21 200529394 认麻,ΐϋΐ而言’關於熱傳導率可使用#閃光（flash)法；關 杨上jί離強度則可藉由瓜~·718G。剝離(Peel)法，測量拉 伸男斷黏附強度。 ~ 測量的結果顯示於表2 【表2】 ^—_: 4? The situation is I. Reduced water like this can not only be compared with right water, but its water molecules are recommended (clH and also pure. Therefore, by using the reduced water washing method, even the ; Penetration force. Small impurities are surely removed. At the same time, the phenomenon of micro but quality attachment to graphite flakes can be obtained. Therefore, it is possible to obtain the most suitable for installation in the present invention. The heat sink of ^ 口 ^ is acceptable: Production methods such as the following exemplified method are not particularly limited, 彳] · Gas bubbling method.. The concentration decreases, and the oxygen 2 · hydrazine addition method also reduces the reduction potential by adding hydrazine. The milk and the degree in the ruler are reduced, and the oxygen 3. electrolysis method 19 200529394 / (aj uses a symmetrical high-frequency voltage to apply positive and negative wave height values and / or duty ratios to reduce the redox potential by electrolysis of water. ⑹ Make the electrode a ground electrode (ground electrode) ( Negative electrode); and special shapes Electrode (such as a diamond-shaped mesh or hexagonal mesh electrode j, where 'the latter is composed of two positive and negative electrodes that interact with each other and electrolyze water with a high pressure applied to make the oxidation-reduction potential Lowered. Egg diagram = Department? Ϊ 触 According to the date of this issue; the shot is a stereogram of the hot area shape, (W ~ (d) is a schematic cross-sectional view of the heat sink material. The heat sink system consists of a flat plate. The bottom part ⑺; a plurality of bindings. ⑻ is placed on the front of the bottom part ⑺ in an upright type, and parallel prostitutes at a fixed distance. In addition, according to the present invention, the thickness of the plate part ⑺ , Area, shape; the size of the fin part 因 is based on 5 fines, paid by sinking the aforementioned heat sink. For this purpose, you can use all the previously mentioned heat sinks as shown in Figure η. The case where the forming degree is shown in FIG. 12 is used for the forming process; the example does not include the heat radiation shown in FIG. 13; and the case where the forming is reinforced. The example is that the forming process will not be performed. Special restrictions, compared to the mold with the desired internal space of the heat sink, forming 7 squares = It is possible to use the problem of exfoliation of graphite that is easy to occur, and the net-like body composed of less wires conducts in the thickness direction, ;;, and the transmission is caused by the excellent metal conductivity. Therefore, the present invention is CPUs for thermal electronics such as pens and heat sinks; and heat sinks that effectively dissipate heat from semi-conducting mobile phones such as power transistors. In addition, the heat generated by this mesh-shaped one piece can dissipate heat from the heat sink. It provides moderate rigidity and is therefore also composed of metal wires. It has a K-show formability and a strong 20 200529394 degrees. Figure 15 is a schematic diagram showing an example of the use state of a heat sink and a heat sink according to the present invention. Shows the inside of the laptop. In the example shown in the figure, the heat sink (10) is closely attached to the front surface of a semiconductor component (μ) such as an MPU mounted on a substrate (K), and the heat sink (20) is disposed on the heat sink (10). on. . In 14 ways, the heat generated from the semiconductor component (M) is conducted to the heat sink (20) via the heat sink (10). From the heat sink (20) to the fins (F), the efficient site radiates heat to the outside. [Examples] Hereinafter, the effects and advantages of the present invention will be made clearer by showing examples and comparative examples of the heat sink according to the present invention. However, the present invention is not limited to the production of the samples of Example 1 · Example 1 and Comparative Example 1. (Example 1) For the ink sheet 3 (1), a thickness G.15 mm may be used. An expanded graphite sheet with a size of 5GG and 500 mm, a bifurcation of 1.65g / cm, and a graphite content of 99.7%. In terms of “'”, we can use a flat braided copper wire with a diameter of G. 12 mm, and make it ^ average 10 mm × 10 area, there are 25 meshes looseness braid = 徭 wound and then use the roll Make it rolled and integrated. In this way, a heat sink having a structure as shown in FIG. 5 is obtained, and is similar to the implementation mode. (Comparative Example 1) A sample of Example 1 was constructed using only the same expanded graphite sheet ⑴ as in Example 1. As the sample characteristics evaluation of Example 1 and Comparative Example 1, the samples of Example 1 and Comparative Example 1 were measured in the 埶 direction and the thickness direction, and the interlayer peel strength (expanded graphite sheet ⑴). 21 200529394 For identification of numbness, the “flash” method can be used for the thermal conductivity; Guan Yang's separation strength can be measured by the melon ~ 718G. Peel method to measure the tensile breaking strength of males. ~ The measurement results are shown in Table 2 [Table 2] ^
.實施例 比較例 熱傳導率（面方] —_ (厚度支 層間剝離強度（拉伸剪斷黏 mjk^) ^ 在厚 32样。〃λ’细羊約為刖者的6.4倍；層間剝離強度約為 向的I可知，根據本發明之散熱片具備極佳之厚度方 層間亲Ϊ離二象極佳的散熱效果，同時也非常不容易產生 3.實施例2與實施例3的樣本製作研究 (實施例2) 就膨脹石墨片（1)而言，可借用戶疮 ^ L 65g/^ - 此作為實施例2的樣本。 皿又σ”、、5 5½，亚且以 (貫施例3) 在實關2的散熱片中，將未施⑽ 作為實施例3雜本。 ”，、傾的賴>；，用來Examples Comparative Examples Thermal conductivity (face side) — _ (thickness of interlaminar peel strength (tensile shear viscosity mjk ^) ^ in thickness of 32 samples. 〃Λ 'thin sheep is approximately 6.4 times the rate of interstitial; interlaminar peel strength It can be seen from the direction I that the heat sink according to the present invention has excellent thickness and excellent heat dissipation effect between the two layers of the two layers, and it is also very difficult to produce 3. Samples of Example 2 and Example 3 (Example 2) As far as the expanded graphite sheet (1) is concerned, it can be borrowed sores ^ L 65g / ^-this is taken as the sample of Example 2. The plate σ ",, 5 5½, and ((Example 3) ) In the heat sink of Practical Example 2, no application was made as the miscellaneous version of Example 3. ""
W/m°C(W/mK)56Q W/m°C(W/mK) MPa 260 23 3· 〇·38 0.012 22 200529394 4.實施例2與實施例3的樣本特性評估 如圖16所示，將上述實施例2、3的散埶 =板⑹，並縣散熱片的長邊方向的二個』部 層間剝離，並且將散熱片分離成兩广將被分離墨稍微 時的拉伸=。曰的孔，然後向上方拉伸，測量出產生層間剝離延ΐ 其結果顯3W / m ° C (W / mK) 56Q W / m ° C (W / mK) MPa 260 23 3 〇 · 38 0.012 22 200529394 4. The characteristics of the samples of Example 2 and Example 3 are shown in Figure 16 In the above-mentioned embodiments 2 and 3, the scatters are separated from each other by two layers in the long side direction of the heat sink, and the heat sink is separated into two regions, which are stretched when the ink is separated slightly. Said hole, and then stretched upward to measure the occurrence of interlayer peeling extension.
實施例 ----—^ 1 0.24 層間剝離強度（拉伸剪斷黏附 強度） 从表3所不’與實施例3的樣本相較之下，實施例2的授太 =間剝離強度提昇了 L 5倍。由此可知，根本 膨網狀體，滾軋—體化之後再進行=熱^ 田^ 7成金屬原子知原子經由熱化學反應的擴散结人， 因此可確認其抵抗層關離㈣度大幅度地提高。 〇 【產業上利用性】 型電散熱片，#由使其在緊密接著在搭載筆記 動电荨電子產品半導體構件的基板上，或是使1介Example ---- ^ 1 0.24 Interlayer peel strength (tensile shear adhesive strength) Compared with the samples in Example 3, the interlayer peel strength in Example 2 is improved. L 5 times. It can be seen that the net-like body is expanded at all, and then rolled-rolled, and then performed = thermal ^ field ^ 70% of metal atoms and atoms are diffused through thermochemical reactions, so it can be confirmed that the resistance of the resistance layer is greatly reduced. To improve. 〇 [Industrial applicability] Type electric heat sinks, either by attaching them closely to the substrate on which semiconductor components of notebook electronics are mounted, or by using
Stί之間’可將基板的半導體構件所產生的熱，傳遞至i熱 二pii:，）。*發明可用來配置在電漿電視的電漿顯示器面板 (PDP)的月面之玻璃板與PDP板，與支撐PDP的底殼兩者之間，用 广避，在PDP的局部溫度過熱的散刻；此外，亦可在賤鑛法 ^puttenng)或乾财置中，用來作為冷卻⑽散熱片； ΪΙΪί將透過散熱片而傳遞的半導體構件等的熱，效率良好地 發散出去的熱沈。 丁 Κ ^nnw另f卜、，本發明亦可作為將來自熱源的熱以高速（速度 m傳遞到像熱沈一類的冷源之熱管的熱連接媒介體來使 23 200529394 磁 】之=隔ttr亦可用於作為阻隔電子產品所產生的電 五、【圖式簡單說明】圖。 製加狀平賴，此_對金麟進行編 造加工圖之====財测，_糊線進行織 ξ 65ίϊ示ϊίί發明的散熱片之—例的概略示意剖面圖。 ΚΐΓ ⑽散刻之變糊的立體分解圖。 圖7係顯不依據本發明的散熱片之變形例的概略示意剖面 係顯示依據本發明的散熱片之變形例的概略示意剖面 係顯示依據本發明的散熱片之變形例的概略示意刹面 圖 圖 圖 圖 圖Between Stί ’can transfer the heat generated by the semiconductor components of the substrate to i heat two pii :,). * The invention can be used to arrange between the glass plate and PDP board on the moon surface of the plasma display panel (PDP) of the plasma TV, and the bottom case supporting the PDP. In addition, it can also be used as a cooling fin in the base ore method (Puttenng) or dry property; 的 ΙΪί A heat sink that efficiently radiates heat from semiconductor components and the like transmitted through the fin. In addition, the present invention can also be used as a thermal connection medium for transferring heat from a heat source at a high speed (speed m to a heat pipe such as a heat sink to make 23 200529394 magnetic). = Ttr It can also be used to block the electricity produced by electronic products. [Simplified illustration of the diagram] diagram. Addition is common, this _ made Jinlin processing graphics ==== financial measurement, _ paste line weaving ξ 65ίϊ 示 ϊίί The invention of the heat sink-an example of a schematic cross-sectional view. ΚΐΓ ⑽ Scattered three-dimensional paste exploded view. Figure 7 shows a schematic diagram of a modified example of the heat sink according to the present invention A schematic and schematic cross-section of a modified example of the heat sink according to the present invention is a schematic and schematic cross-sectional view showing a modified example of the heat sink according to the present invention.
圖 圖 圖10係顯示依據本發明的散熱片之變形例的概略示意刹面 圖11(a)及（b)係顯示依據本發明的散熱片之另一變形例之 圖12(a)及（b)係顯示依據本發明的散熱片之另一變形例之 圖13(a)、（b)及(c)係顯示依據本發明的散熱片之另一變形 例之圖。 ” 圖14(aj、（b)、（c)及(d)係顯示依據本發明的熱沈之圖。 圖15係顯示依據本發明的散熱片以及熱沈之使用狀態/例 之概略圖。 24 200529394 圖16係顯示依據本發明的散熱片之特性評估實驗方法之圖。 【主要元件符號說明】 1〜膨脹石墨片 2〜網狀體 3〜樹脂層 4〜保護層 5〜網狀中間體 6〜金屬箔 7〜底板部 8〜鰭片部 10〜散熱片 20〜熱沈 B〜彈簧秤 K〜基板 F〜鰭片 G〜玻璃板 Μ〜半導體構件FIG. 10 is a schematic diagram showing a modified example of the heat sink according to the present invention. FIGS. 11 (a) and (b) are FIGS. 12 (a) and ( b) Figs. 13 (a), (b) and (c) are diagrams showing another modification of the heat sink according to the present invention. 14 (aj, (b), (c), and (d) are diagrams showing heat sinks according to the present invention. FIG. 15 is a schematic diagram showing states / examples of heat sinks and heat sinks according to the present invention. 24 200529394 Figure 16 is a diagram showing an experimental method for evaluating the characteristics of a heat sink according to the present invention. [Explanation of Symbols of Main Components] 1 ~ Expanded Graphite Sheet 2 ~ Net 3 ~ Resin Layer 4 ~ Protective Layer 5 ~ Net Intermediate 6 ~ metal foil 7 ~ bottom plate portion 8 ~ fin portion 10 ~ heat sink 20 ~ heat sink B ~ spring scale K ~ substrate F ~ fin G ~ glass plate M ~ semiconductor component
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| JP2004006061 | 2004-01-13 | ||
| JP2004367252A JP2005229100A (en) | 2004-01-13 | 2004-12-20 | Heat-dissipating sheet and heatsink |
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| TW200529394A true TW200529394A (en) | 2005-09-01 |
| TWI265612B TWI265612B (en) | 2006-11-01 |
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| TW094101033A TWI265612B (en) | 2004-01-13 | 2005-01-13 | A heat spreader and a heat sink |
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| JP (1) | JP2005229100A (en) |
| KR (1) | KR100798833B1 (en) |
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| JP3417253B2 (en) | 1997-05-30 | 2003-06-16 | 松下電器産業株式会社 | Metal-graphite composite and radiator using the same |
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| JP2001240404A (en) * | 2000-02-25 | 2001-09-04 | Japan Matekkusu Kk | Method for manufacturing expanded graphite and expanded graphite mold |
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| JP4116238B2 (en) | 2000-05-19 | 2008-07-09 | 株式会社タイカ | Thermally conductive sheet having electromagnetic shielding properties |
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| JP4062994B2 (en) * | 2001-08-28 | 2008-03-19 | 株式会社豊田自動織機 | Heat dissipation substrate material, composite material and manufacturing method thereof |
| JP3938681B2 (en) * | 2001-11-21 | 2007-06-27 | 信越化学工業株式会社 | Heat dissipation structure |
| KR20050001039A (en) * | 2003-06-26 | 2005-01-06 | 주식회사 포스코 | Micro processor safety annunciator |
| KR20050019232A (en) * | 2003-08-18 | 2005-03-03 | 자화전자 주식회사 | Heat conduction sheet |
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2004
- 2004-12-20 JP JP2004367252A patent/JP2005229100A/en active Pending
-
2005
- 2005-01-06 KR KR1020050001039A patent/KR100798833B1/en not_active IP Right Cessation
- 2005-01-13 TW TW094101033A patent/TWI265612B/en not_active IP Right Cessation
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| CN103178026A (en) * | 2011-12-21 | 2013-06-26 | 清华大学 | Heat-dissipating structure and electronic device using same |
| CN103178026B (en) * | 2011-12-21 | 2016-03-09 | 清华大学 | Radiator structure and apply the electronic equipment of this radiator structure |
| CN108260366A (en) * | 2015-09-07 | 2018-07-06 | 朱鹤植 | Rubber-ferrite and shielding are used and electronic equipment superhigh radiating fusion piece and its manufacturing method |
| CN108260366B (en) * | 2015-09-07 | 2020-01-14 | 朱鹤植 | Electromagnetic wave absorbing and shielding fusion sheet for superstrong heat dissipation of electronic equipment and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI265612B (en) | 2006-11-01 |
| KR100798833B1 (en) | 2008-01-28 |
| JP2005229100A (en) | 2005-08-25 |
| KR20050074287A (en) | 2005-07-18 |
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