TWI265567B - Polishing medium for chemical-mechanical polishing, and polishing method - Google Patents

Polishing medium for chemical-mechanical polishing, and polishing method

Info

Publication number
TWI265567B
TWI265567B TW089117424A TW89117424A TWI265567B TW I265567 B TWI265567 B TW I265567B TW 089117424 A TW089117424 A TW 089117424A TW 89117424 A TW89117424 A TW 89117424A TW I265567 B TWI265567 B TW I265567B
Authority
TW
Taiwan
Prior art keywords
polishing
medium
water
chemical
polishing medium
Prior art date
Application number
TW089117424A
Other languages
English (en)
Inventor
Takeshi Uchida
Tetsuya Hoshino
Yasuo Kamigata
Akiko Igarashi
Hiroki Terasaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TWI265567B publication Critical patent/TWI265567B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/04Aqueous dispersions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/32115Planarisation
    • H01L21/3212Planarisation by chemical mechanical polishing [CMP]
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW089117424A 1999-08-26 2000-08-25 Polishing medium for chemical-mechanical polishing, and polishing method TWI265567B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP23977899 1999-08-26
JP23978099 1999-08-26
JP23977799 1999-08-26
JP23978199 1999-08-26
JP23977999 1999-08-26

Publications (1)

Publication Number Publication Date
TWI265567B true TWI265567B (en) 2006-11-01

Family

ID=27530024

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093135637A TWI290740B (en) 1999-08-26 2000-08-25 Polishing compound for chemical-mechanical polishing and polishing method
TW089117424A TWI265567B (en) 1999-08-26 2000-08-25 Polishing medium for chemical-mechanical polishing, and polishing method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW093135637A TWI290740B (en) 1999-08-26 2000-08-25 Polishing compound for chemical-mechanical polishing and polishing method

Country Status (7)

Country Link
US (3) US7232529B1 (zh)
EP (1) EP1223609A4 (zh)
KR (1) KR100512453B1 (zh)
CN (1) CN1161826C (zh)
AU (1) AU6731600A (zh)
TW (2) TWI290740B (zh)
WO (1) WO2001017006A1 (zh)

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Also Published As

Publication number Publication date
US7232529B1 (en) 2007-06-19
TWI290740B (en) 2007-12-01
KR20020042814A (ko) 2002-06-07
WO2001017006A1 (fr) 2001-03-08
TW200511421A (en) 2005-03-16
US20070190906A1 (en) 2007-08-16
KR100512453B1 (ko) 2005-09-07
US20060186373A1 (en) 2006-08-24
AU6731600A (en) 2001-03-26
CN1371529A (zh) 2002-09-25
CN1161826C (zh) 2004-08-11
EP1223609A1 (en) 2002-07-17
EP1223609A4 (en) 2006-03-15

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