TWI367524B - Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof - Google Patents

Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof

Info

Publication number
TWI367524B
TWI367524B TW097108401A TW97108401A TWI367524B TW I367524 B TWI367524 B TW I367524B TW 097108401 A TW097108401 A TW 097108401A TW 97108401 A TW97108401 A TW 97108401A TW I367524 B TWI367524 B TW I367524B
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
polishing apparatus
polishing method
chemical
Prior art date
Application number
TW097108401A
Other languages
Chinese (zh)
Other versions
TW200908118A (en
Inventor
Chao Chang Chen
Li Sheng Hsu
Original Assignee
Univ Nat Taiwan Science Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Taiwan Science Tech filed Critical Univ Nat Taiwan Science Tech
Priority to TW097108401A priority Critical patent/TWI367524B/en
Priority to US12/219,800 priority patent/US20090036028A1/en
Publication of TW200908118A publication Critical patent/TW200908118A/en
Application granted granted Critical
Publication of TWI367524B publication Critical patent/TWI367524B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097108401A 2007-08-01 2008-03-10 Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof TWI367524B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097108401A TWI367524B (en) 2007-08-01 2008-03-10 Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof
US12/219,800 US20090036028A1 (en) 2007-08-01 2008-07-29 Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW96128302 2007-08-01
TW097108401A TWI367524B (en) 2007-08-01 2008-03-10 Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof

Publications (2)

Publication Number Publication Date
TW200908118A TW200908118A (en) 2009-02-16
TWI367524B true TWI367524B (en) 2012-07-01

Family

ID=40338600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097108401A TWI367524B (en) 2007-08-01 2008-03-10 Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof

Country Status (2)

Country Link
US (1) US20090036028A1 (en)
TW (1) TWI367524B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112008594B (en) * 2020-08-31 2021-08-03 浙江工业大学 Chemically enhanced efficient ultra-precise polishing method based on shear expansion effect
CN116810619B (en) * 2023-08-09 2024-04-02 哈尔滨工业大学 Chemical mechanical polishing device based on microwave assistance and polishing CaF by using same 2 Method for wafer

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
JPH09139368A (en) * 1995-11-14 1997-05-27 Sony Corp Chemically and mechanically polishing method
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
AU6731600A (en) * 1999-08-26 2001-03-26 Hitachi Chemical Company, Ltd. Polishing compound for chemimechanical polishing and polishing method
US6375550B1 (en) * 2000-06-05 2002-04-23 Lsi Logic Corporation Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer
US7481695B2 (en) * 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6640155B2 (en) * 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
JP3922887B2 (en) * 2001-03-16 2007-05-30 株式会社荏原製作所 Dresser and polishing device
US6725120B2 (en) * 2001-03-29 2004-04-20 Lam Research Corporation Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer
US6767428B1 (en) * 2001-12-20 2004-07-27 Lam Research Corporation Method and apparatus for chemical mechanical planarization
US6939198B1 (en) * 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
TWI246952B (en) * 2002-11-22 2006-01-11 Applied Materials Inc Methods and apparatus for polishing control
US7050880B2 (en) * 2003-12-30 2006-05-23 Sc Solutions Chemical-mechanical planarization controller
JP4756884B2 (en) * 2005-03-14 2011-08-24 信越半導体株式会社 Polishing head, polishing apparatus and polishing method for semiconductor wafer
US20070149094A1 (en) * 2005-12-28 2007-06-28 Choi Jae Y Monitoring Device of Chemical Mechanical Polishing Apparatus
JP5583137B2 (en) * 2008-11-26 2014-09-03 アプライド マテリアルズ インコーポレイテッド Using optical metrology for feedback and feedforward process control

Also Published As

Publication number Publication date
US20090036028A1 (en) 2009-02-05
TW200908118A (en) 2009-02-16

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