TWI257584B - IC card and manufacturing method thereof - Google Patents

IC card and manufacturing method thereof Download PDF

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Publication number
TWI257584B
TWI257584B TW092115637A TW92115637A TWI257584B TW I257584 B TWI257584 B TW I257584B TW 092115637 A TW092115637 A TW 092115637A TW 92115637 A TW92115637 A TW 92115637A TW I257584 B TWI257584 B TW I257584B
Authority
TW
Taiwan
Prior art keywords
antenna
card
wafer
attached
circuit pattern
Prior art date
Application number
TW092115637A
Other languages
English (en)
Other versions
TW200307886A (en
Inventor
Deok-Heung Kim
Chang-Gyoo Kim
Seung-Seob Lee
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of TW200307886A publication Critical patent/TW200307886A/zh
Application granted granted Critical
Publication of TWI257584B publication Critical patent/TWI257584B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
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    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Description

\0" - ,r' 1;?Λ. '-f ：；12575ΜΜ γ-4--14— @ 號 92115637 五、發明說明（1)
【本發明所屬之技術領域】 本發明係關於一種I C卡及其製 種1 C卡’其中I C卡内組合晶片的天 係直接連接，是以電阻得以減小， 法0 造方法，尤其是關於一 '緣電路板與接觸電路板 迷關於此I c卡的製造方 L先前技術】 所謂I C卡 1 c卡、證照片 訊於I C晶卡即 名、1C晶片的 療保險號碼， 另一例子 可用做電子金 核銀行資料而 中，一定量的 或電氣火車費 依照IC卡 接觸型與非接 終端上形成的 汛於I C卡與終 觸型I C卡使用 於此，_ 片模組。組合 成通訊。因此 乃其上設有I C 、電子金錢、 可。例如說， 市民登記號碼 1 c卡可用為一 中，藉輸入銀 錢，所以不用 從銀行存款扣 錢種成電子錢 可以扣除支付 與終端機間互 觸型。接觸蛩 1 c卡的接觸終 端機間，利用 高頻與低頻的 級合型I c具有 晶片模組可藉 ，組合型I C卡
晶片的卡y 及***〖，且可利藉輸人個I i /口、要輸 Μη% 資訊例如 (I D说瑪）、驾 種電子ID卡執照 行存款資料於晶片中 現款亦可付款於商店 除購貨價袼即可。再，而從此電子錢中地 〇 相通訊的方法，10卡 IC卡完成形成於終端 端既定動β。非接觸 無線頻率（R F )實行通 RF做為通訊。 一低頻RF晶片模組及 接觸型方法或利用高 可藉接觸型方法並斥|J 用為電子 入各種資 地址、姓 號碼、醫 ，IC卡即 ，只要查 一例子 下鐵車費 可分類成 機的接觸 型1C卡通 訊。非接 一組合 頻RF來完 用低或高 曰曰
年月曰 修正 圖 第1圖為一典型組合型I C卡的說明用剖面圖。參照此 1 g 、且6型I C卡包含一低頻晶片模組2 1及一組合晶片模紐 排。低頻晶片模組2 1排列於卡片的中央而組合晶片模組則 列於卡片的一側。低頻晶片模組2 1及組合晶片模組j 6各 ，入於互相附著的第一與第二介質層11、12内。上、下保 °蔓層13與14各設置於第一介質層11上表面與第二介質層12 2下表面’一上覆層15附著於下保護層14的表面。同樣， —全息圖2 3可附於上保護層1 3表面一側。 一低頻天線圖案24設於低頻晶片模組2 1上，並排列於 支持著低頻晶片模組2 1的薄膜2 1 a上，並封入於第一與第 二介質層11與1 2内。低頻晶片模組2 1乃排列於卡片之中 央。因此，低頻天線圖案2 4則排列成圈狀於卡片的中央。 一高頻天線圖案1 8設於組合晶片模組1 6内，並在組合 晶片模組1 6***於第一與第二介質層1 1與1 2之前形成。當 組合晶片模組1 6藉銑工法***於第一與第二介質層11與1 2 内形成的孔（未圖示）中時，高頻天線圖案1 8則經一導電性 貧糊（未圖示）電氣上連接於一組合晶片模組1 6的天線連接 用焊接點（未圖示）。高頻天線圖案1 8則配置於卡片的周邊 部位。 第2A至2E圖為第1圖所示1C卡製造步驟的說明用剖面 圖。參照第2 A圖，此中設有第一與第二介質層1 1、1 2，封 入於第一與第二介質層1 1、1 2間的低頻晶片模組2 1，及 上、下保護層1 3與1 4。***有低頻晶片模組2 1的孔11 a係
第9頁 修正一 4 廪歒 92115637^ 先形成=";1貝層1 1。低頻晶片模組2 1係設置於一模組 中’此松組中：一 5持薄膜25支持著低頻天線24。 又，可看付出鬲頻天線丨8係配置於上保護層丨3與第一 介質層11之間。就是說在設置組合晶片模組之前，在卡片 内已設置了連接於組合晶片模組的高頻天線1 8。 參照第2B圖，所有出現於第以圖的元件均予組裝。當 低頻晶片模組2 1的晶片（未圖示）被***於第一介質層1 1的 孔11 a内時，低頻晶片模組2 1即封入於第一與第二介質層
11與1 2間。又，低頻天線2 4係封入於第一與第二介質層i i 與1 2間。咼頻天線1 8則封入於第一介質層1 1與上保護層1 3 之間。 參照苐2 C圖’有一全息圖2 3附於保護層1 3的上表面 側0 參照第2D圖’有一孔27的形成，其中***組合晶片模 組。孔2 7係藉銳削上保達層1 3，第一介質層11，及第二介 質層1 2而形成者。高頻天線1 8的一部份之曝露，係藉將上 保護層13的孔27之面積做成大於第一與第二介質層丨丨與^ 者而得以實現。
參照第2E圖，高頻天線18的曝露部份係以一導電性膏 糊2 8塗佈。 第2 F圖說明組合晶片模組1 6。 參照第2 G圖、第2F圖所示之組合晶片模組丨6係藉*** 於孔2 7中組裝者。組合晶片模組1 6本身乃經一钻著部2 9附 著於卡片。設於組合晶片模組16中的天線接觸焊接點（未
第10頁 属2W綱 丨讓號92115637 _η 曰 修正 五、發明說明（4) 圖示）係經導電性焊接點2 8電氣上連接於高頻天線1 8。 在上述I C卡中，由於高頻天線1 8及組合晶片模組1 6的 接觸焊接點係利用導電性膏糊電氣上連接，因此導電性膏 糊的電阻增加。就是說由於導電性膏糊包含有導電性成份 與黏著劑，因此導電性成份的低密度化造成其電阻的增 加。隨黏著劑的高分子物質的反應，導電性成份的體積就 減小，導電性膏糊的電阻更增加。同樣，由於焊接點被溶 劑成份所氧化，焊接點的電阻於是增加。結果，辨認高頻 信號的長度就減短了。此導電性膏糊乃一種展現高度硬度 的塑膠成份與一種展現無粘著性的導電性粒子的混合物， 是以導電性膏糊的機械性抗彎強度不高。因此發生彎曲、 龜裂或短路等。尤有甚者，由於晶片或晶片模組及外部接 觸焊接點係堆積於有限厚度的卡片内，很難製造出具有優 異耐久性的接觸焊接點與晶片模組。同樣，須要有製造晶 片模組與附固此模組的額外步驟。 【本發明之内容】 為了解決上述這些問題，本發明提供了一種I C卡其藉 直接連接天線與組合晶片而將電阻降至最低。 同時，本發明提供了製造一種I C卡的方法其天線與組 合晶片係直接連接者。 依照本發明的一種形態，該IC卡包含有一形成於絕緣 膜上的天線電路圖案，並具有一導線狀天線部份，一對應 於組合晶片的晶片塊部份，及一為外部接觸焊接點所附著 的部份，組合晶片附固於對應於天線電路圖案上晶片組合
第11頁 修正 曰 抵纟且的晶片 案，~ I Α塊部份’至少有一介質層附著於天線電路圖 内’並且4接觸焊接點***於介質層一部份中形成的孔 連接的終=固於遠孔’且有一形成於基板内外表面而互相 附著部7端’内表面的終端接觸於設於天線電路圖案上的 同的表片及外部接觸焊接點附著於天線電路圖案上不 I c卡路圖案的天線部份以圈狀沿1 c卡外周部延伸。 乡且合晶片更包含一裝設於薄膜後表面的電橋做電氣連接於 成於夭括Ϊ於導線狀天線部的外端部，此端部係以圈狀形 、級合二=案:f以供高頻用者。 線電路圖$ 外部接觸焊接點經一钻著用膏糊附著於天 而且經—t接點的接觸終端係形成於基板的内外表面 接。 板的洞孔的内表面上之鍍層互相連 依照本發明的另一形 :驟為形成-天線電路心一種IC卡的製造方U的 -令外部接觸焊接i:i:r合晶片的晶片塊的部份斜； 於天線電路圖案上組合：：附著部，附著組合晶片於對： 層於天線電路圖案，來:片的晶片塊之部份，附著一介負 著部之介質層内，及插 孔於對應於天線電路圖案上附 内之孔中以便附固於附著：部接觸焊接點於形成於介質層 第12頁 τ，號 92115637 _年月日 條正_ 五、發明說明（6) 【本發明之實施方式】 參照第3Α圖，有一銅製的覆蓋層31形成於薄膜32上。 覆蓋層31乃一導電層以形成高頻天線圖案及一接觸終端連 接用的一圖案（未圖示）。 參照第3Β圖，覆蓋層31形成於薄膜32上做為預定的天 線電路圖案3 Γ。天線電路圖案3 1，可以典型方法形成。例 如’塗佈光阻材料於覆蓋層3 1上然後覆以光罩。在此情形 下’光阻材料被曝露而顯影，而覆蓋層3 1則被蝕刻。然 後，藉除去光阻材料而形成一天線圖案。天線電路圖案包 含一圈狀的導線狀天線部3 1 a，一對應於組合晶片晶片塊 (未圖示）的部份3 1 b，及一附著一第3K圖所示的外部接觸 焊接點4 5的粘著部3 1 c。 導線狀天線部3 1 a具有一與傳統技術相同的平面形 狀’其中有一天線導線以圈狀延伸於卡片的外周部。亦即 因傳統天線導線係沿卡片外周部延伸，導線狀天線部3 1 a 最好沿卡片外周部延伸成薄而繞成數圈的導線形圖案。 一對應於下一步驟裝設的第3F圖之組合晶片3 5之晶片 凸塊3 5 a的焊接點圖案（未圖示）形成於對應於晶片凸塊日勺 部份31b。又，附著外部接觸焊接點45(如第3K圖）用的枯 著部3 1 c形成於另一側，其乃下一步驟中附著外部接 接點45用的一圖案。 干 參照3C與3 D圖，有一電橋3 3裝設於薄膜32低部表面 一側。電橋3 3連接以圈狀形成的導線狀天線部3丨a的_ 、 部至另一部而形成閉路。亦即電橋3 3電氣上連接配置於導
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92115637 曰 修正 線狀天線部3 1 a的最外部份之導線天線圖案之一端部與配 置於卡片中央部的組合晶片35。 ^ 第5圖為表示如何形成天線部31 a與電橋33的示意圖。 在第5圖中，圖案並非為真正的圖案，所以對應於組合晶 片35的晶片塊與外部接觸焊接點45附著用的枯著部31c的 部份31b並未表示出來。
參照該圖，導線狀天線部3 1 a以圈狀沿卡片表面5 7的 外周邊延伸。兩連接於組合晶片35的部份51與52形成於導 線狀天線部31a的一側。有兩個藉電橋33連接的其他開口 53與54形成一連接天線。由於開口 53與54係以電橋33連接 於薄膜32的另一表面，該處並未形成覆蓋，如第3C圖所 示’形成了一圈狀天線。在未圖示的其他實施例中，電橋 33可配置於薄膜32表面上的導線狀天線部31 a上，而不配 置於薄膜32的其他表面。於此情形，絕緣膏糊或絕緣蟄施 加位於兩個要連接的開口間的天線部之上部表面，然後將 由導電性膏糊或導電性墊片所成的電橋繫固於開口間。
參照第3 E圖，以粘著用的膏糊3 4來裝設組合晶片3 5。 粘著用膏糊3 4可以是導電性或非導電性者。但是為了減小 電阻，以非導電性膏糊為宜。 參照第3 F與3 G圖，組合晶片3 5係裝設於天線電圖案 3 1 ’上。組合晶片3 5的晶片塊3 5 a係以膏糊3 4粘固於在天線 電路圖案31’上的開口 31b。 參照第3H圖，卡片的本體，包含一第一介質層39，其 内在另一步驟中埋入一低頻晶片組36者，一第二介質層
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9纖 —月 曰 _號 92115fi37 •發幻
4〇，及一形成於第二介質層40的低部表而L 以上各元件附固於天線電路圖案31，。有一的保遵層4 1 ’ 35的孔42形成於第一與第二介質層39、 一 f A^組合晶片 同時有一粘著層3 7 a、一印製層3 7b、及一，、呆濩層4 1内。 堆積於卡片本體上表面之上或下方。一 ^覆層3 7(：依次 製層38b、及一上覆層38c依次堆積於卡H =層38a、印 或下方。 、、下片本體下表面之上 換一方式，附著有組合晶片35的 著於該等介質層時，組合晶片35可：電路圖案31’附 下附固。於此情形，不必形成孔於第二顛：薄膜32來面向 40與保護層41 ’代之以形成一孔於房第二介質層39、 及上覆層38c内。以如此的配置 於^層38a、印製層38b 合晶片組35與外部接觸焊接點，配、下—步驟附固的組 31，的相反側，其構造與第3K圖所示者不於门天線電路圖案 晶片35更加分離於接觸 者不同。然後，組合 免受外界影響力的安定爐、i的外部接觸焊接點45而可得 以製造成薄膜形狀。回性 丄 f 外。卩接觸焊接點4 5可 處的介質層厚度可以^」’士於外部接觸焊接點所***之 或事先以打孔或蝕刻 1 時該孔可容易的藉銑削形成 性的設置。 乂 於此’低頻晶片模組3 6可選擇 第31圖表示第311圖 參照第3 J圖，利 、有。卩品組裝的情形。
Η 第15頁 於導線部31a及外部接銑削機43形成一孔44。孔44係對應 參照第3 K圖，外A 、于接點4 5的粘著部3 1 c形成者。 接觸烊接點4 5係***於孔4 4並附著
板4之内、外表面與鍍層48 一同形成以便，法為基 延伸貫穿形成於基板之孔的鍍層4 =，觸終端與 外表面的接觸終端互相電氣上連接。少成於基板47内、 一牛,£j_—， 五、發明說明（Γ) _ ，該广如圖所示之外部接觸焊接點45 … 卜f5接觸纟干接點4 5以粘著膏糊& 6直接附菩 圖案3丨’上的枯著部31c。枯著膏糊“可===天線電路 電的膏糊。假如枯著膏糊46屬於不導電性：導電性或不導 45内表面上形成的接觸終端直接接觸於導妝妾觸焊接點 與接觸終端圖案3 1，。 、、、、狀天線部3 1 β 在圖中未表示的其他實施例中，外 以附著於天線電路圖案31，另一表面上卜卩接觸^接點45可 31，，哕砉而私 衣曲上的天線電路圖幸 务 、’不包含組合晶片3 5。例如，組入曰 f 著於天線電路圖案31，的上表面，另一外ς =片35附 點46則附著於天線圖案31，的下表面。為了 觸焊接 而，來占一 St ΐ 口曰日片35而附著於天線圖案32,的他表 y 貫通薄膜32的一孔於對應於部份31 c上之孔的 的工具如銑刀來施行，而使外部二 接點45的接觸烊接點可接觸於天線電路圖案μ，。 第3L圖表示一全息圖5〇附著於1(：卡上表面一側的情 形。全息圖50之附著乃為了防止Ic卡的被抄襲或辨識“卡 之有否被抄襲。全息圖50以外亦可用其他辨識標誌，是以 全息圖可以選擇性的設置。 第4圖為本發明之完成丨C卡的剖面圖。參照該圖，低 頻晶片模組3 6及組合晶片3 5係埋入於I c卡内。低頻晶片模
第16頁 资. 资. ΐ、發明說明 組3 6的低 4 0之間。 說明，低 如上 與終端口 天線形成 狀天線部 35。同時 終端4 3接 本發 案並直接 故，辨認 頻晶片模 安定性得 用的圖案 優點。 綜上 發明實施 變更與修
I 號 92115637 (10) 頻天線3 6 a係形成一導線狀而埋入於介質層3 g盥 亦即如第2 A圖之依傳統技術之I C晶片製造步驟、 頻天線3 6形成如導線狀而埋入於介質層内。 述情形，組合晶片模組35利用直接接觸於卡片口 間並以高頻RF通訊來運作。接收高頻RF用的高頻 一導線狀天線部3 1 a於天線電路圖案3 1，上。g線 31 a經天線電路圖案3 1，上的圖案連接於曰二 、、、、且α晶片 ’從外部終端（未圖示）開口來的信號經外部接 收後透過天線電路圖案3 1，傳送至組合晶片^ 5。 明的I C卡中，由於高頻天線係用銅質材@ ° 連接至組合晶片模組，因此電阻得以減小。田 高頻信號的範圍得以增到最大。又，由认。= 組，但纽合晶片模組都可包含於卡片内:= 以改進。不僅此也，與外部接觸焊接點桩 可以同時形成於圖案上用來形成高頻天線，、為其 所述’為本發明之較佳實施例，並非 之絡圖 η 水限疋本 圍。即凡依本發明申請專利範圍所做 飾’應皆為本發明專利範圍所涵蓋。 0
第17頁 修正 A_ 曰 :號 92115637 € 'ΈΓ式1單說明 本發明品的上述目的及其他目的、特色及優點，再由 下列附圖的詳細說明，將更為明顯： 第1圖為典型I C卡說明用之剖面圖； 第2Α至2G圖為第1圖所示1C卡製造步驟說明用之剖面 圖； 第3 Α至3 L圖為本發明一實施例中I C卡製造步驟說明用 之别面圖； 第4圖為本發明I C卡說明用之剖面圖；及 第5圖為天線電路圖案的天線部說明用平面圖。 【圖中元件編號與名稱對照表】 21 低 頻 晶 片 模 組 16 ： 組合 晶片 模 組 11 第 一 介 質 層 12 ： 第二 介質 層 13 上 保 護 層 14 ： 下保 護層 15 上 覆 層 23 ： 全息 圖 24 低 頻 天 線 圖 案 21a :薄膜 18 頻 天 線 圖 案 11a 、2Ί ·· 孑L 25 支 持 薄 膜 28 ： 導電 性膏 糊 29 粘 著 部 32 ： 薄膜 31 覆 蓋 層 3Γ 、32, :天 線 電路圖案 31a :導線狀天線部 31b • 晶片 1凸塊的部份 45 、46 ·· 外 部 接 觸焊接點 31c :粘著部 35 : :組 合 晶 片 3 5a • 晶月 丨塊 33 : :電 橋 57 ： 卡片 表面 53 、54 ·· 開 π 34 , 46 ·· 枯著 用 膏糊
第19頁

Claims (1)

  1. 顏 升 α 择號 92115637 A_Μ 曰 修正 六、申請專利範圍 天線部 觸焊接 該 模組的 至 焊接點 於該孔 内表面2. 述組合 路圖案 3. 含一裝 天線電 氣上的 4. 述組合 線電路 5. 述組合 線電路 1. 一種積體電 一形成於絕緣 應於 著的 片附 部份 質層 ，一對 點所附 組合晶 晶片塊 少一介 ***於 ，且有 的終端 如申請 晶片與 之不同 如申請 設於該 路圖案 連接。 如申請 晶片與 圖案之 如申請 晶片與 圖案上 如申請 該介 一形 接觸 專利 外部 表面 專利 絕緣 上之 路（I C )卡，包括： 膜上的天線電路圖案，並具有一導線狀 組合晶片的晶片塊部份，及一為外部接 附著部； 著於對應於該天線電路圖案上晶片組合 附著於該天線電路圖案；及一外部接觸 質層之一部份中形成的孔内，並且附固 成於基板内外表面而互相連接的終端， 於設於該天線電路圖案上的附著部。 範圍第1項之積體電路（1C)卡，其中所 接觸焊接點係附著於該絕緣膜之天線電 上。 範圍第1項之積體電路（1C)卡，其更包 膜後表面上之電橋，藉以將一形成於該 導線狀天線部的外端與該組合晶片做電 專利範圍第1項之積體電路（I C)卡，其中所 外部接觸焊接點係用一粘著膏糊附著於該天 同一表面上。 專利範圍第1項之積體電路（I C)卡，其中所 外部接觸焊接點係用一粘著膏糊附著於該天 互相面對之表面上。 專利範圍第1項之積體電路（I C )卡，其中所
    第20頁 :案:號 92115637 月 曰 修正 六、申請專利範圍 述外部接觸焊接點製備之法為形成於該基板内外表面上之 接觸端子，經一形成於貫穿該基板之打孔内表面之鍍層互 相連接。 7. —種製造積體電路（1C)卡之方法，其包含之步驟為 形 線狀電 令外部 附 片的晶 附 形 層内； 插 以便附 8. 裝設一 線電路 氣上的 成一天線電路圖案於一絕緣膜上，該處形成有一導 線部，形成對應於組合晶片的晶片塊的部份，及一 接觸焊接點附著的附著部； 著該組合晶片於對應於該天線電路圖案上該組合晶 片塊之部份； 著一介質層於該天線電路圖案； 成一孔於對應於該天線電路圖案上附著部之該介質 及 入該外 固於該 如申請 電橋於 圖案上 連接。 部接觸焊接點於形成於該介質層内之該孔中 附著部。 專利範圍第7項之方法，其更包含一步驟為 該絕緣膜之後表面上，藉以將一形成於該天 之導線狀天線部的外端部與該組合晶片做電
    第21頁 「•先92115637 姆靖—‘一 一 撕 ‘‘一.… 月 曰 修正 四 、中文發明摘要（發明名稱：積體電路1(:卡及其製造方法） 五、（一） 本案 代表圖 為：第 4 圖 本案 代表圖 之元件代 表符 號簡單說明： 3Γ :天線電路圖案 32 ： 薄 膜 33 : 電橋 34 ： 粘 著 用 膏 糊 35 : 組合晶 片 36 ： 低 頻 晶 片 模 組 3 6a :低頻天線 37a 、3 8 a : 粘 著 層 37b 、38b : 印製層 37c 、38c : 上 覆 層 3 9 ·· 第一介 質層 4 0 ： 第 mm 介 質 層 41 : 保護層 46 ： 粘 著 用 膏 糊 47 : 基板 48 ： 鍍 層 50 : 全息圖 六、英文發明摘要（發明名稱：ic CARD AND MANUFACTURING METHOD THEREOF) At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the
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