CN1467685A - Ic卡及其制造方法 - Google Patents

Ic卡及其制造方法 Download PDF

Info

Publication number
CN1467685A
CN1467685A CNA031427200A CN03142720A CN1467685A CN 1467685 A CN1467685 A CN 1467685A CN A031427200 A CNA031427200 A CN A031427200A CN 03142720 A CN03142720 A CN 03142720A CN 1467685 A CN1467685 A CN 1467685A
Authority
CN
China
Prior art keywords
circuit pattern
card
antenna circuit
chip
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA031427200A
Other languages
English (en)
Other versions
CN1305004C (zh
Inventor
金德兴
金昌圭
李升燮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Vision Co Ltd
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of CN1467685A publication Critical patent/CN1467685A/zh
Application granted granted Critical
Publication of CN1305004C publication Critical patent/CN1305004C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

本发明涉及一种IC卡，包括形成在绝缘膜上并且具有线形的天线部分、与复合芯片的芯片***相应的部分，和外部触点焊盘附着的附着部分的天线电路图形。复合芯片附着在与天线电路图形上的复合芯片模块的芯片***相应的部分上。至少一个介电层附着在天线电路图形上。外部触点焊盘***在形成于部分介电层中的孔中且附着在该孔上，并具有形成在基片的外表面和内表面上且相互连接的端子。内表面上的端子与设在天线电路图形上的附着部分接触。

Description

IC卡及其制造方法
本申请要求2002年6月11日向韩国知识产权局提交的韩国专利申请2002-32517的优先权，其公开全部在本文中引作参考。
技术领域
本发明涉及IC卡及其制造方法，更具体地，涉及一种IC卡及其制造方法，其中设在IC卡中的复合芯片的天线电路板和触点电路板直接连接，从而降低电阻。
背景技术
IC卡指其上安装IC芯片的卡，并且可以通过向IC芯片输入各种信息用作电子ID卡、执照卡、电子钱币及***。例如，通过在IC芯片中输入诸如地址、姓名、公民登记号(或ID号码)信息、驾照号码、医疗保险号码之类的个人信息，可以把IC卡用作电子ID卡.在另一个例子中，可以通过向芯片输入银行储蓄信息把IC卡用作电子钱币，从而可以不使用现金而只检验银行储蓄信息并且从银行储蓄中扣除购物款额在商店付款。在又一个例子中，把一定量的钱支付成电子钱币，并且从该电子线币数额中扣除地铁费或者电气火车费。
按照IC卡和端子之间的通信方法，IC卡可以分类为接触型和非接触型。接触型的IC卡在IC卡上形成的接触端子与端子上的接触端子接触时完成预定的操作。在非接触型的IC卡中，IC卡和端子之间的通信用射频(RF)进行。非接触型IC卡用高频或低频的RF通信。
同时，复合型的IC卡具有低频RF芯片模块和复合芯片模块。复合芯片模块可以用接触式方法或者用高频RF通信。从而复合型IC卡可以用接触式方法或者使用低或高频RF进行通信。
图1是截面图，示出典型的复合型IC卡。参见该图，复合型IC卡包括低频芯片模块21和复合芯片模块16。低频芯片模块21安排在卡的中心，而复合芯片模块16安排在卡的一面。低频芯片模块21和复合芯片模块16分别嵌入相互连接的第一和第二介电层11和12中。在第一介电层11的上表面上和第二介电层12的下表面上分别设有上和下保护层13和14。覆盖层15附着在下保护层14的表面上。还有可以在上保护层13表面一侧附着全息图片23。
设在低频芯片模块21上的低频天线图形24安排在支承低频芯片模块21的膜21a上并且嵌入在第一和第二介电层11和12中。低频芯片模块21安排在卡的中心。从而，低频天线图形24呈环形安排在卡的中心。
设在复合芯片模块16中的高频天线图形18在复合芯片模块16***第一和第二介电层11和12之前形成。当复合芯片模块16***到铣销工序中在第一和第二介电层11和12中形成的孔(未示出)内时，高频天线图形18经导电膏(未示出)电连接到复合芯片模块16的天线连接焊盘(未示出)上。高频天线图形18安排在卡的周边。
图2A至图2E是截面图，示出图1所示的IC卡的制造步骤。参见图2A，提供第一和第二介电层11和12、嵌入在第一和第二介电层11和12之间的低频芯片模块21，及上和下保护层13和14。事先在第一介电层11中形成低频芯片模块21***其中的孔11a。低频芯片模块21设在一个其中低频天线24支承在支承膜25上的模块中。
还有，可以看出高频天线18安排在上保护膜13与第一介电层11之间。就是说在提供复合模块之前，在卡中提供连接到复合芯片模块上的高频天线18。
参见图2B，可以看到，在图2A所示的所有元件都安装了。低频芯片模块21的芯片(未示出)***在第一介电层11的孔11a中时，低频芯片模块21嵌在第一和第二介电层11和12之间。还有，低频天线24嵌在第一和第二介电层11和12之间。高频天线18嵌在第一介电层11和上保护层13之间。
参见图2C，全息图片23附着在上保护膜13的上表面的一侧。
参见图2D，形成复合芯片模块***其中的孔27。通过铣削上保护层13、第一介电层11和第二介电层12形成孔27。通过形成在上保护层13中孔27的区域大于在第一介电层11和第二介电层12中的孔27的区域露出部分高频天线18。
参见图2E，在高频天线18的被露出的部分上涂覆导电膏28。
图2F示出复合芯片模块16。
参见图2G，通过***孔27内，组装图2F中所示的复合芯片模块16。复合芯片模块16本身经胶合剂部分29附着在卡上。设在复合芯片模块16中的天线触点焊盘(未示出)经导电的焊盘28电连接到高频天线18上。
在上述的IC卡中，由于高频天线18和复合芯片模块16的天线触点焊盘用导电膏电连接，导电膏的电阻加大。就是说，由于导电膏包括导电成分和胶合剂，由于导电成分的密度低所以电阻加大。电阻还随着胶合剂的高分子化合物的反应减少导电成分的体积而进一步增加。还有，由于所述焊盘受的胶合剂的氧化，焊盘电阻增加。结果，识别高频信号的长度缩短。导电膏是呈现高硬度的塑料成分和不呈现胶合性的导电颗粒的混合物，从而导电膏在诸如弯曲等机械形变时脆弱，或者产生断裂或短路。而且，由于在有限厚度的卡中布置芯片或者芯片模块和外部触点焊盘，难于制造超耐用性的触点焊盘和芯片模块。还有，还需要制造以及附着芯片模块的其它步骤。
发明内容
为了解决上述问题和其它问题，本发明提出一种IC卡，其中通过直接连接天线和复合芯片使电阻最小化。
还有本发明提供一种制造其中天线和复合芯片直接连接的IC卡的方法。
根据本发明的一个方面，IC卡包括：形成在绝缘膜上并且具有线形的天线部分、与复合芯片的芯片***相应的部分，和外部触点焊盘附着的附着部分的天线电路图形；附着在与天线电路图形上的复合芯片模块的芯片***相应的部分上的复合芯片；至少一个附着在天线电路图形上的介电层；以及外部触点焊盘，所述外部触点焊盘***在形成于部分介电层中的孔中且附着在该孔上，并具有形成在基片的外表面和内表面上且相互连接的端子，内表面上的端子与设在天线电路图形上的附着部分接触。
复合芯片和外部触点焊盘附着在天线电路图形的不同表面上。
天线电路图形的天线部分呈环形沿IC卡的外周边部分分布。
IC卡还包括安装在所述膜的后表面上的桥接器以把复合芯片电连接到呈环形形成在天线电路图形中的高频用的线形天线部分的外端部。
复合芯片和外部触点焊盘通过附着膏附着在天线电路图形上。
用形成在基片的外和内表面上的接触端子通过穿过基片冲出的孔的内表面中形成的镀层相互连接的方式，制备外部触点焊盘。
根据本发明的另一个方面，制造IC卡的方法包括步骤：在绝缘膜上的线形天线部分、与复合芯片的芯片***对应的部分，和要附着外部触点焊盘的附着部分形成天线电路图形；把复合芯片附着到天线电路图形上的与复合芯片的芯片***对应的部分；把介电层附着到天线电路图形上；在与天线电路图形上的附着部分对应的介电层中形成一个孔；把外部触点焊盘***在形成于介电层中的孔内从而附着在附着部分上。
附图说明
通过参照附图对优选实施例进行的详细说明中可以更加清楚本发明的上述特征，在附图中：
图1是截面图，示出典型的IC卡；
图2A至图2G是截面图，示出图1所示的IC卡的制造步骤；
图3A至图3L是截面图，示出根据本发明的优选实施例的IC卡的制造步骤；
图4是截面图，示出根据本发明的优选实施例的IC卡；
图5是平面图，示出天线图形的天线部分。
具体实施方式
参见图3A，在膜32上形成铜制的覆层31。覆层31设成导电层以形成高频天线图形和用于连接接触端子(未示出)的图形。
参见图3B，在膜32上形成要做成预定的天线电路图形31’的覆层31。可以用典型的方法形成天线电路图形31’。例如在覆层31上涂覆光致抗蚀剂，然后用光掩模覆盖。在此状态下曝光光致抗蚀剂并且显影，然后蚀刻覆层31。然后通过除去光致抗蚀剂形成天线图形。天线电路图形包括呈环形形成的线形天线部分31a、与复合芯片的芯片***(未示出)对应的部分31b，和图3K所示外部触点焊盘45附着的附着部分31c。
线形天线部分31a具有与现有技术形状相似的平面的形状，其中天线的线呈线沿卡的外周边部分分布。就是说，如现有技术的天线，线沿卡的外周边部分分布，优选地把线形天线部分31a分布得使薄而长的线型的图形沿卡的外周边部分绕多圈。
与后续的步骤中安装的图3F的复合芯片35的图3F的芯片***35a对应的焊盘图形(未示出)形成在与芯片***对应的部分31b处。还有，用于附着外部触点焊盘45(见图3K)的附着部分31c形成在另一侧，这是用于在后续的步骤中附着外部触点焊盘45的图形。
参见图3C和3D，桥接器33在膜32的下表面的一侧安装。桥接器33把呈环形形成的线形天线部分31a的一个端部连接在另一个部分上以形成闭合电路。就是说，桥接器33把放置在线形天线部分31a的最外部的线型天线图形的端部与放置在卡的中心部分的复合芯片35电连接。
图5示意地示出怎样形成天线部分31a和桥接器33。在图5中，图形不是实际的图形，所以没有示出与复合芯片35的芯片***对应的部分31b和用于附着外部触点焊盘45的附着部分31c。
参见该图，线形天线部分31a在卡的表面57上沿外周边分布成环状图形。在线形天线部分31a的一侧形成连接到复合芯片35上的两个端口51和52。有通过桥接器33连接从而形成连接的天线的另外两个端口53和54。因为端口53和54由在不形成覆层的膜32的另一表面上的桥接器33连接，如图3C所示，所以形成环式天线。在图中未示的另一个实施中，桥接器33可以安排在膜32的表面上的线形天线部分31a上而不是安排在膜32的另一个表面上。在此情况下，在位于要连接的两个端口之间的天线部分的上表面上施加绝缘膏或者绝缘片，然后把导电膏或导电片制造的桥接器附着在端口之间。
参见图3E，提供用于附着的膏34以安装复合芯片35。用于附着的膏34可以是导电的也可以是不导电的。但是优选用不导电的膏以把电阻做得最小。
参见图3F和3G，复合芯片35安装在天线电路图形31’上。复合芯片35的芯片***35a通过用于附着的膏34安装在天线电路图形31’的部分31b上。
参见图3H，安排了要附着在天线电路图形31’上的卡的主体，所述卡的主体包括在另一个步骤中嵌入低频芯片模块36的第一介电层39、第二介电层40，和形成在第二介电层40的下表面上的保护层41。其中***复合芯片35的孔42形成在第一和第二介电层39和40及保护层41中。还有，依次在卡的主体的上表面上和上方布置附着层37a、印刷层37b，和覆盖层37c。依次在卡的主体的下表面上和下方布置附着层38a、印刷层38b，和覆盖层38c。
另外，当附着复合芯片35的天线电路图形31’附着至介电层时，可以通过颠倒膜32把复合芯片35附着在向下的表面上。在此情况下，不把孔形成在第一和第二介电层39和40及保护层41中，而应当把孔形成在附着层38a、印刷层38b，和覆盖层38c中。以这样的安排，把要在后续工序中附着的复合芯片35和外部触点焊盘布置在天线电路图形31’的对侧，其结构不同于图3K中所示。然后，进一步把复合芯片35与接触外侧的外部触点焊盘45分开，从而可得到对外部干扰稳定的结构。还有，可以用薄膜的形式制造外部触点焊盘45。还有，因为外部触点焊盘***处的介电层的厚度可以降低，可以通过铣削或者事先通过冲制或者在某些情况下蚀刻介电层方便地形成所述孔。这里可以有选择地提供低频芯片模块36。
图3I示出图3H所示的全部部件都安装的状态。
参见图3J，用铣削机43形成孔44。对应于线形部分31a和外部触点焊盘45的附着部分31c形成孔44。
参见图3K，外部触点焊盘45***在孔44内并且附着于其上。如图所示，用形成在基片47的外和内表面上形成要接触端子的镀层48，并且镀层48经过形成在基片47中的孔延伸使得在基片的外和内表面中形成的接触端子相互连接的方式制备外部触点焊盘45。
外部触点焊盘45通过附着膏46直接附着到天线电路图形31’上的附着部分31c上。附着膏46可以是导电的膏也可以是不导电的膏。当附着膏46是不导电的膏时，形成在触点焊盘45上的内表面上的接触端子直接地接触线形天线部分31a和接触端子图形31’。
在附图中未示出的另一个实施中，外部触点焊盘45可以附着在不包括复合芯片35的天线电路图形31’的另一个表面上的天线电路图形31’上。例如复合芯片35附着在天线电路图形31’的上表面上，而外部触点焊盘46附着在天线电路图形31’的下表面上。为了使外部触点焊盘46附着在除复合芯片35的天线图形32’的另一个表面上，借助于适当的工具，譬如铣刀，在与部分31c对应的位置上形成穿过膜32的孔，从而外部触点焊盘45的触点焊盘可以接触天线电路图形31’。
图3L示出全息图片50附着在IC卡的上表面上一侧的状态。附着全息图片50是为了防止复制IC卡或者鉴别IC卡是否已被复制。可以附着其它的鉴别标志取代全息图片50。可以有选择地提供全息图片。
图4是根据本发明的完整的IC卡的截面图。参见该图，在该IC卡中嵌入低频芯片模块36和复合芯片35。低频芯片模块36的低频天线36a形成为线并且嵌在介电层39和40之间。就是说，如示出根据现有技术的IC芯片的制造步骤的图2A所示，形成为线的低频天线36嵌在介电层中。
如上所述，复合芯片模块35的工作通过卡端口与端子的端口的直接接触和用高频RF通信进行。接收高频RF的高频天线在天线电路图形31’上形成为线形天线部分31a。线形天线部分31a通过天线电路图形31’上的图形连接到复合芯片35。还有，通过外部接触端子43从外部端子(未示出)接收信号，并且通过天线电路图形31’输送到复合芯片35上。
在根据本发明的IC卡中，因为用铜材料把高频天线做成图形并且直接连接到复合芯片模块上，可以降低电阻。从而可以把识别高频信号的范围最大化。还有，因为不仅可以把低频芯片模块包括在卡中，还可以把复合芯片模块包括在卡中，可以提高卡的稳定性。而且用于电连接外部触点焊盘的图形可以同时形成在用于形成高频天线的图形上是有利的。
尽管具体地图示并且参照其优选实施例说明了本发明，本领域内普通技术人员应当理解，可以在形式和细节上进行各种改变而不偏离所附权利要求书所定义的本发明的精神和范畴。

Claims (8)

1.一种IC卡，包括：
天线电路图形，形成在绝缘膜上，并且具有线形的天线部分、与复合芯片的芯片***相应的部分，和外部触点焊盘附着的附着部分；
复合芯片，附着在与天线电路图形上的复合芯片模块的芯片***相应的部分上；
至少一个介电层，附着在天线电路图形上；以及
外部触点焊盘，所述外部触点焊盘***在形成于部分介电层中的孔中且附着在该孔上，并具有形成在基片的外表面和内表面上且相互连接的端子，内表面上的端子与设在天线电路图形上的附着部分接触。
2.如权利要求1所述的IC卡，其特征在于，所述复合芯片和所述外部触点焊盘相对于天线电路图形附着在天线电路图形的不同表面上。
3.如权利要求1所述的IC卡，其特征在于，还包括安装在膜的后表面上的桥接器以把形成在天线电路图形上的线形天线部分的外端部电连接到复合芯片上。
4.如权利要求1所述的IC卡，其特征在于，复合芯片和外部触点焊盘通过附着膏附着在同一表面的天线电路图形上。
5.如权利要求1所述的IC卡，其特征在于，复合芯片和外部触点焊盘通过附着膏附着在相对于天线电路图形相互对置的表面。
6.如权利要求1所述的IC卡，其特征在于，用形成在基片的外和内表面上的接触端子通过穿过基片冲出的孔的内表面中形成的镀层相互连接的方式制备外部触点焊盘。
7.一种制造IC卡的方法，包括步骤：
在绝缘膜上的线形天线部分、与复合芯片的芯片***对应的部分，和要附着外部触点焊盘的附着部分形成天线电路图形；
把复合芯片附着到天线电路图形上的与复合芯片的芯片***对应的部分；
把介电层附着到天线电路图形上；
在与天线电路图形上的附着部分对应的介电层中形成一个孔；以及
把外部触点焊盘***在形成于介电层中的孔内从而附着在附着部分上。
8.如权利要求7所述的方法，其特征在于，还包括在所述膜的后表面上安装桥接器以把形成在天线电路图形上的线形天线部分的外端部电连接到复合芯片上的步骤。
CNB031427200A 2002-06-11 2003-06-11 Ic卡及其制造方法 Expired - Fee Related CN1305004C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR32517/2002 2002-06-11
KR1020020032517A KR100910769B1 (ko) 2002-06-11 2002-06-11 Ｉｃ 카드 및, 그것의 제조 방법

Publications (2)

Publication Number Publication Date
CN1467685A true CN1467685A (zh) 2004-01-14
CN1305004C CN1305004C (zh) 2007-03-14

Family

ID=29578241

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031427200A Expired - Fee Related CN1305004C (zh) 2002-06-11 2003-06-11 Ic卡及其制造方法

Country Status (7)

Country Link
US (1) US6910636B2 (zh)
JP (1) JP2004046832A (zh)
KR (1) KR100910769B1 (zh)
CN (1) CN1305004C (zh)
DE (1) DE10325569A1 (zh)
FR (1) FR2840711B1 (zh)
TW (1) TWI257584B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024176A (zh) * 2010-12-09 2011-04-20 武汉天喻信息产业股份有限公司 一种双界面智能卡的制作方法
CN101467164B (zh) * 2006-04-10 2013-08-21 因诺瓦蒂尔公司 用于电子卡和标签的电子嵌入件模块、电子卡和用于制造此类电子嵌入件模块和卡的方法
CN108885709A (zh) * 2016-03-30 2018-11-23 兰克森控股公司 制造芯片卡和芯片卡天线支撑件的方法

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004185208A (ja) * 2002-12-02 2004-07-02 Sony Corp Ｉｃカード
US20040145874A1 (en) * 2003-01-23 2004-07-29 Stephane Pinel Method, system, and apparatus for embedding circuits
EP1603757B1 (de) * 2003-03-12 2014-12-10 Bundesdruckerei GmbH Verfahren zur herstellung einer buchdeckeneinlage und eines buchartigen wertdokumentes sowie eine buchdeckeneinlage und ein buchartiges wertdokument
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
US7274297B2 (en) * 2004-07-01 2007-09-25 Intermec Ip Corp. RFID tag and method of manufacture
US7295161B2 (en) * 2004-08-06 2007-11-13 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR100674926B1 (ko) * 2004-12-08 2007-01-26 삼성전자주식회사 메모리 카드 및 그 제조 방법
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
US7685706B2 (en) * 2005-07-08 2010-03-30 Semiconductor Energy Laboratory Co., Ltd Method of manufacturing a semiconductor device
DE102005054418B4 (de) * 2005-11-15 2013-05-23 Infineon Technologies Ag Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte
US7777317B2 (en) * 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
GB2436164A (en) * 2006-03-16 2007-09-19 Uvasol Ltd Improvements in electrical connections between electronic components and conductive tracks
US20070290048A1 (en) 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US8232621B2 (en) * 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US7982684B2 (en) * 2006-12-06 2011-07-19 The Boeing Company Method and structure for RF antenna module
US7444737B2 (en) * 2006-12-07 2008-11-04 The Boeing Company Method for manufacturing an antenna
US20080237356A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. Step card and method for making a step card
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
JP5346497B2 (ja) * 2007-06-12 2013-11-20 株式会社半導体エネルギー研究所 半導体装置
FR2917534B1 (fr) * 2007-06-15 2009-10-02 Ask Sa Procede de connexion d'une puce electronique sur un dispositif d'identification radiofrequence
TW200905753A (en) * 2007-07-18 2009-02-01 Yuen Foong Yu Paper Mfg Co Ltd Flexible and super-thin smart card and packaging method thereof
EP2034429A1 (en) * 2007-09-05 2009-03-11 Assa Abloy AB Manufacturing method for a card and card obtained by said method
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
US7744005B2 (en) * 2008-01-16 2010-06-29 Taiwan Name Plate Co., Ltd. Induction card with a printed antenna
JP5578775B2 (ja) * 2008-09-02 2014-08-27 富士通株式会社 符号化装置および復号装置
FR2957175B1 (fr) * 2010-03-08 2012-08-17 Sansystems Dispositif electronique a puce et procede de fabrication par bobines.
WO2012045015A1 (en) * 2010-09-30 2012-04-05 Steve Klaas Financial card with embedded circuit lock technology
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
TWM446938U (zh) * 2012-09-28 2013-02-11 Smart Approach Co Ltd 無線射頻識別模組
EP3086208B1 (en) * 2015-04-24 2019-03-06 Nxp B.V. Smart card with touch-based interface
US20200096869A1 (en) * 2018-07-11 2020-03-26 Georgia Tech Research Corporation Ultra-High Resolution Conductive Traces Flexible Biocomposites by Resist Stenciling
US11106961B2 (en) * 2019-10-09 2021-08-31 Beauiiful Card Corporation Mini smart card and method of manufacturing the same
JP2022179866A (ja) * 2021-05-24 2022-12-06 Tdk株式会社 アンテナ装置及びこれを備えるワイヤレス電力伝送デバイス

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
JPH07117385A (ja) * 1993-09-01 1995-05-09 Toshiba Corp 薄型ｉｃカードおよび薄型ｉｃカードの製造方法
DE9401297U1 (de) * 1994-01-26 1995-02-23 Siemens AG, 80333 München Transportables Datenspeicherelement zum berührungsbehafteten und/oder berührungslosen Datenaustausch mit externen, datenverarbeitenden Geräten
JP3141692B2 (ja) * 1994-08-11 2001-03-05 松下電器産業株式会社 ミリ波用検波器
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
JPH10337982A (ja) * 1997-06-06 1998-12-22 Denso Corp 非接触式ｉｃカード
JPH11250214A (ja) * 1998-03-03 1999-09-17 Matsushita Electron Corp 部品の実装方法とｉｃカード及びその製造方法
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
JP3502557B2 (ja) * 1999-01-07 2004-03-02 松下電器産業株式会社 非接触ｉｃカードの製造方法
FR2788646B1 (fr) * 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
US6412702B1 (en) 1999-01-25 2002-07-02 Mitsumi Electric Co., Ltd. Non-contact IC card having an antenna coil formed by a plating method
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
JP3687459B2 (ja) * 1999-06-29 2005-08-24 ソニーケミカル株式会社 Ｉｃカード
KR200170147Y1 (ko) * 1999-09-10 2000-02-15 주식회사쓰리비 시스템 집적회로칩카드
DE10016716A1 (de) * 2000-04-04 2001-08-02 Infineon Technologies Ag Datenträgerkarte für kontaktlose Datenübertragung
JP2002074301A (ja) 2000-08-31 2002-03-15 Shinko Electric Ind Co Ltd 非接触型ｉｃカード用アンテナ、非接触型ｉｃカード用アンテナフレーム、及び非接触型ｉｃカード
JP2002092577A (ja) * 2000-09-20 2002-03-29 Hitachi Maxell Ltd コンビカード及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101467164B (zh) * 2006-04-10 2013-08-21 因诺瓦蒂尔公司 用于电子卡和标签的电子嵌入件模块、电子卡和用于制造此类电子嵌入件模块和卡的方法
CN102024176A (zh) * 2010-12-09 2011-04-20 武汉天喻信息产业股份有限公司 一种双界面智能卡的制作方法
CN108885709A (zh) * 2016-03-30 2018-11-23 兰克森控股公司 制造芯片卡和芯片卡天线支撑件的方法

Also Published As

Publication number Publication date
KR100910769B1 (ko) 2009-08-04
US6910636B2 (en) 2005-06-28
KR20030095015A (ko) 2003-12-18
CN1305004C (zh) 2007-03-14
FR2840711B1 (fr) 2008-05-02
JP2004046832A (ja) 2004-02-12
TWI257584B (en) 2006-07-01
FR2840711A1 (fr) 2003-12-12
DE10325569A1 (de) 2004-01-08
US20030226901A1 (en) 2003-12-11
TW200307886A (en) 2003-12-16

Similar Documents

Publication Publication Date Title
CN1305004C (zh) Ic卡及其制造方法
US10051733B2 (en) Printed circuit board with coextensive electrical connectors and contact pad areas
CN106256174B (zh) 印刷布线板
CN100543767C (zh) 制造用于射频识别标签的天线的方法
CN1622126A (zh) 用于制造ic卡的方法
JP2010522919A (ja) ダブル通信インターフェースｉｃカード
CN1214346C (zh) 无触点芯片卡,无触点支撑体及其制造方法
CN1315056A (zh) 集成电子微组件及制造该微组件的方法
AU2002337402B2 (en) Thin electronic label and method for making same
JPS5856447A (ja) 識別カ−ドおよびその製造方法
AU5778196A (en) Semiconductor assembly
MXPA05000882A (es) Antena capacitiva y metodo para fabricar la misma.
US9142485B2 (en) Contactless object with integrated circuit connected to circuit terminals by capacitive coupling
US20210406636A1 (en) Electronic module for chip card
CN101317187B (zh) 包括具有电触点的基板的器件和发射机应答器
CN103366215B (zh) 用于无接触数据传输的数据载体及其产生方法
US20230196053A1 (en) Method for Electrochemical Metallization of a Double-Sided Electrical Circuit for a Smart Card and Electrical Circuit Produced Using Said Method
US20110171783A1 (en) Method for making contactless portable objects
EP3062266B1 (en) Ic module, ic card, and ic module substrate
CA2490490A1 (en) Wire positioning and mechanical attachment for a radio-frequency identification device
CN1266644C (zh) 便携式电子装置
JPH11213119A (ja) 複合型ｉｃカード
CN107423801A (zh) 智能卡及其制造方法
EP3005243B1 (en) Laser ablating structures for antenna modules for dual interface smartcards
JP7494280B1 (ja) 無線ｉｃモジュール、無線ｉｃカード、及び無線ｉｃモジュールの製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070314

Termination date: 20130611