TW587768U - Heat-dissipating device - Google Patents

Heat-dissipating device

Info

Publication number
TW587768U
TW587768U TW092201963U TW92201963U TW587768U TW 587768 U TW587768 U TW 587768U TW 092201963 U TW092201963 U TW 092201963U TW 92201963 U TW92201963 U TW 92201963U TW 587768 U TW587768 U TW 587768U
Authority
TW
Taiwan
Prior art keywords
heat
dissipating device
dissipating
Prior art date
Application number
TW092201963U
Other languages
English (en)
Inventor
Ji-Hai Tang
Min Jang
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Priority to TW092201963U priority Critical patent/TW587768U/zh
Priority to US10/765,525 priority patent/US6860321B2/en
Priority to JP2004055154A priority patent/JP2004235657A/ja
Publication of TW587768U publication Critical patent/TW587768U/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW092201963U 2003-01-30 2003-01-30 Heat-dissipating device TW587768U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW092201963U TW587768U (en) 2003-01-30 2003-01-30 Heat-dissipating device
US10/765,525 US6860321B2 (en) 2003-01-30 2004-01-27 Heat-dissipating device
JP2004055154A JP2004235657A (ja) 2003-01-30 2004-01-29 熱放出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092201963U TW587768U (en) 2003-01-30 2003-01-30 Heat-dissipating device

Publications (1)

Publication Number Publication Date
TW587768U true TW587768U (en) 2004-05-11

Family

ID=32960815

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092201963U TW587768U (en) 2003-01-30 2003-01-30 Heat-dissipating device

Country Status (3)

Country Link
US (1) US6860321B2 (zh)
JP (1) JP2004235657A (zh)
TW (1) TW587768U (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7124806B1 (en) * 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
TW564971U (en) * 2003-01-10 2003-12-01 Hon Hai Prec Ind Co Ltd A heat dissipating assembly
TWM249411U (en) * 2003-12-26 2004-11-01 Hon Hai Prec Ind Co Ltd Heat dissipation assembly
TWM249082U (en) * 2003-12-26 2004-11-01 Hon Hai Prec Ind Co Ltd Clamping device for heat sink
US7149083B2 (en) * 2004-03-05 2006-12-12 Hul-Chun Hsu Heat dissipation structure
US7040389B2 (en) * 2004-05-12 2006-05-09 Hul-Chun Hsu Integrated heat dissipation apparatus
US20060011329A1 (en) * 2004-07-16 2006-01-19 Jack Wang Heat pipe heat sink with holeless fin module
CN2799931Y (zh) * 2004-12-03 2006-07-26 鸿富锦精密工业（深圳）有限公司 风扇固定装置
TWI311363B (en) * 2005-04-22 2009-06-21 Foxconn Tech Co Ltd Boiling chamber cooling device
JP2007035722A (ja) * 2005-07-22 2007-02-08 Mitsubishi Electric Corp 車載機器の放熱構造
US7256997B2 (en) * 2005-11-01 2007-08-14 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device having a fan duct
US7275587B2 (en) * 2006-01-20 2007-10-02 Hua-Shou Kuo Combination cooler module
KR100790790B1 (ko) 2006-09-14 2008-01-02 (주)셀시아테크놀러지스한국 집적회로용 히트싱크 및 쿨러
JP4579269B2 (ja) * 2007-05-25 2010-11-10 トヨタ自動車株式会社 冷却装置
TWI407294B (zh) * 2007-12-21 2013-09-01 Foxconn Tech Co Ltd 散熱裝置
US20090165998A1 (en) * 2007-12-27 2009-07-02 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20090229790A1 (en) * 2008-03-13 2009-09-17 Asia Vital Components Co., Ltd. Radiating fin assembly for thermal module
US7841388B2 (en) * 2008-03-13 2010-11-30 Asia Vital Components Co., Ltd. Radiating fin assembly for thermal module
CN102271483B (zh) * 2010-06-07 2015-07-08 富瑞精密组件（昆山）有限公司 散热组合结构
TW201207599A (en) * 2010-08-10 2012-02-16 Hon Hai Prec Ind Co Ltd Computer server
CN102638955A (zh) * 2011-02-14 2012-08-15 鸿富锦精密工业（深圳）有限公司 散热装置
US8906532B2 (en) * 2011-06-03 2014-12-09 Johnson Controls Technology Llc Electrochemical cells with improved heat collection and transfer systems
CN103313577A (zh) * 2012-03-12 2013-09-18 鸿富锦精密工业(武汉)有限公司 散热装置
TW201417414A (zh) * 2012-10-16 2014-05-01 Hon Hai Prec Ind Co Ltd 電連接器組合及其壓接裝置
GB201311451D0 (en) * 2013-06-27 2013-08-14 Deregallera Holdings Ltd Vacuum Cleaner
CN105101752A (zh) * 2015-08-10 2015-11-25 深圳市萨伏特电池电源有限公司 充电机散热装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356448B1 (en) * 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
JP3303870B2 (ja) * 2000-01-26 2002-07-22 松下電器産業株式会社 ヒートシンクとその製造方法およびそれを用いた冷却装置
US6377459B1 (en) * 2000-08-04 2002-04-23 Sun Microsystems, Inc. Chip cooling management
US6382306B1 (en) * 2000-08-15 2002-05-07 Hul Chun Hsu Geometrical streamline flow guiding and heat-dissipating structure
US6651732B2 (en) * 2001-08-31 2003-11-25 Cool Shield, Inc. Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit
TW520146U (en) * 2002-06-13 2003-02-01 Hon Hai Prec Ind Co Ltd Heat pipe assembly
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan

Also Published As

Publication number Publication date
US20040250993A1 (en) 2004-12-16
JP2004235657A (ja) 2004-08-19
US6860321B2 (en) 2005-03-01

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees