JP4579269B2 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP4579269B2 JP4579269B2 JP2007139312A JP2007139312A JP4579269B2 JP 4579269 B2 JP4579269 B2 JP 4579269B2 JP 2007139312 A JP2007139312 A JP 2007139312A JP 2007139312 A JP2007139312 A JP 2007139312A JP 4579269 B2 JP4579269 B2 JP 4579269B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling
- region
- storage chamber
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
パワートランジスタQ(Q1〜Q8)からの熱は、薄肉部26を介して冷媒Wに伝達される。ここで、冷媒収容室20aのうち、パワートランジスタQ(Q1〜Q8)に最も近接する部分には、底部20dが位置している。この底部20dは、規定部材32A,32B間に位置しているため、蒸発した気体状の冷媒Wは、領域K1を通って、上方に変位する。ここで、領域K1を規定する規定部材32A,32Bの表面は、上記のように略平坦面状とされており、蒸発した気体状の冷媒Wは、冷却フィン21間に案内される。そして、冷却フィン21間に達すると、冷媒Wは、冷却フィン21に熱を放熱することで冷却される。冷却フィン21に放熱された熱は、冷却管13内を流通する冷却媒体Aに放熱される。なお、冷却管13は、外部からの外気と冷却媒体Aとの間で熱交換をさせる熱交換器(ラジエータ)などに接続されており、冷却媒体Aは、外気によって冷却される。
Claims (7)
- 冷却対象物が装着される装着部を有する筐体と、
前記装着部の上方に位置する前記筐体内に形成され、前記冷却対象物からの熱によって蒸発可能とされた冷媒が収容された冷媒収容室と、
前記筐体に設けられ、気体状の前記冷媒を冷却可能な冷却部と、
前記冷媒収容室内に設けられ、前記冷却対象物からの熱によって蒸発した気体状の前記冷媒を前記冷却部に向けて案内可能な第1領域と、前記第1領域に対して、前記冷媒の流通方向下流側に位置し、前記冷却部にて冷却された前記冷媒を、前記冷媒収容室の底部に向けて案内可能とされた第2領域とを、前記冷媒収容室内に規定可能な規定部材と、
を備え、
前記冷却部は、前記冷媒収容室内に設けられた冷却フィンを含み、
前記規定部材は、前記気体状の冷媒を前記第1領域から前記冷却フィンに向けて案内し、
前記冷却フィンは、第1領域側から前記第2領域に向けて延びるように配置された、冷却装置。 - 前記規定部材は、前記冷媒収容室の底部側から前記冷媒収容室の高さ方向の中央部に達するように延びる壁部と、前記壁部の上端部に設けられ、表面が湾曲面状の膨出部とを含む、請求項1に記載の冷却装置。
- 前記冷媒収容室を規定する前記筐体の内表面は、前記冷却対象物に向けて張り出す底部を有する、請求項1または請求項2に記載の冷却装置。
- 前記規定部材は、間隔を隔てて、複数設けられた、請求項1から請求項3のいずれかに記載の冷却装置。
- 前記規定部材は、前記冷却対象物の幅方向の中央部に対して、前記冷却対象物の幅方向に離れた位置に設けられた、請求項1から請求項4のいずれかに記載の冷却装置。
- 前記冷媒収容室の底部は前記規定部材によって、前記第1領域のうち、気体状の前記冷媒の流通方向の上流に位置し、前記冷却対象物からの熱によって蒸発する前記冷媒が貯留する第1貯留部と、前記第2領域のうち、気体状の前記冷媒の流通方向の下流に位置し、前記冷却部によって凝縮された液体状の前記冷媒が貯留する第2貯留部とに区分され、
前記規定部材は、前記第2貯留部内の前記冷媒を前記第1貯留部に案内可能な流通部を有する、請求項1から請求項5のいずれかに記載の冷却装置。 - 前記冷却部は、前記冷却フィンからの熱を冷却可能な冷却媒体が流通する冷却管を含み、
前記冷却管は、前記冷却フィン内に達する分岐部を有する、請求項1から請求項6のいずれかに記載の冷却装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007139312A JP4579269B2 (ja) | 2007-05-25 | 2007-05-25 | 冷却装置 |
US12/601,940 US20100155027A1 (en) | 2007-05-25 | 2008-05-19 | Cooling device |
PCT/JP2008/059601 WO2008146763A1 (ja) | 2007-05-25 | 2008-05-19 | 冷却装置 |
DE112008001282T DE112008001282B4 (de) | 2007-05-25 | 2008-05-19 | Kühlvorrichtung |
CN2008800174612A CN101683017B (zh) | 2007-05-25 | 2008-05-19 | 冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007139312A JP4579269B2 (ja) | 2007-05-25 | 2007-05-25 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008294294A JP2008294294A (ja) | 2008-12-04 |
JP4579269B2 true JP4579269B2 (ja) | 2010-11-10 |
Family
ID=40075009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007139312A Expired - Fee Related JP4579269B2 (ja) | 2007-05-25 | 2007-05-25 | 冷却装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100155027A1 (ja) |
JP (1) | JP4579269B2 (ja) |
CN (1) | CN101683017B (ja) |
DE (1) | DE112008001282B4 (ja) |
WO (1) | WO2008146763A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017215759A1 (de) * | 2017-09-07 | 2019-03-07 | Robert Bosch Gmbh | Kühlplatte, sowie Vorrichtung mit einer solchen Kühlplatte |
DE102017215952B3 (de) | 2017-09-11 | 2019-02-07 | F & S Prozessautomation GmbH | Kühlkörper mit zwei Hohlkörpern und Kühlanordnung |
CN110014953B (zh) * | 2017-09-30 | 2021-01-19 | 比亚迪股份有限公司 | 第一、第二充电连接件以及充电枪、车辆和充电*** |
CN112460828A (zh) * | 2020-11-23 | 2021-03-09 | 珠海格力电器股份有限公司 | 散热结构、空调器及散热结构的控制方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5092325U (ja) * | 1973-12-25 | 1975-08-04 | ||
US5390077A (en) * | 1994-07-14 | 1995-02-14 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal baffle |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
JPH10256445A (ja) * | 1997-03-07 | 1998-09-25 | Denso Corp | 沸騰冷却装置及びその製造方法 |
US5864466A (en) * | 1994-07-19 | 1999-01-26 | Remsburg; Ralph | Thermosyphon-powered jet-impingement cooling device |
JP2003243867A (ja) * | 2002-02-21 | 2003-08-29 | Denso Corp | 沸騰冷却装置 |
JP2003258475A (ja) * | 2002-02-28 | 2003-09-12 | Denso Corp | 沸騰冷却装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4064409A (en) * | 1976-07-28 | 1977-12-20 | Redman Charles M | Ferrofluidic electrical generator |
JPS5416983A (en) * | 1977-07-07 | 1979-02-07 | Mitsubishi Electric Corp | Vapor cooling device |
JPS5471747U (ja) * | 1977-10-31 | 1979-05-22 | ||
KR860000253B1 (ko) * | 1981-04-07 | 1986-03-21 | 카다야마 히도하지로 | 비등 냉각장치(沸騰冷却裝置) |
JP3210261B2 (ja) * | 1996-12-06 | 2001-09-17 | 株式会社東芝 | 沸騰冷却装置及びその製造方法 |
US20030056940A1 (en) * | 2001-09-27 | 2003-03-27 | International Business Machines Corporation | Transpiration cooled heat sink and a self contained coolant supply for same |
JP2003258417A (ja) * | 2002-03-05 | 2003-09-12 | Imaishi Denki Seisakusho:Kk | 半田付け方法或いは装置 |
JP3757200B2 (ja) * | 2002-09-25 | 2006-03-22 | 株式会社日立製作所 | 冷却機構を備えた電子機器 |
TW587768U (en) * | 2003-01-30 | 2004-05-11 | Molex Inc | Heat-dissipating device |
TWI226846B (en) * | 2003-03-06 | 2005-01-21 | Jiun-Guang Luo | Jet heat-transfer device |
JP3972861B2 (ja) | 2003-05-20 | 2007-09-05 | トヨタ自動車株式会社 | 電子回路の冷却装置 |
TW574839B (en) * | 2003-06-09 | 2004-02-01 | Arro Superconducting Technolog | Temperature conduction heat exchange device of circular-flow channel type |
JP2005011983A (ja) | 2003-06-19 | 2005-01-13 | Matsushita Electric Ind Co Ltd | 冷却装置 |
JP4409976B2 (ja) * | 2004-02-03 | 2010-02-03 | 山洋電気株式会社 | 電子部品冷却装置 |
WO2006106406A1 (en) * | 2005-04-05 | 2006-10-12 | Vetco Gray Scandinavia As | An arrangement and a method for heat transport and use in connection with subsea equipment |
-
2007
- 2007-05-25 JP JP2007139312A patent/JP4579269B2/ja not_active Expired - Fee Related
-
2008
- 2008-05-19 CN CN2008800174612A patent/CN101683017B/zh not_active Expired - Fee Related
- 2008-05-19 US US12/601,940 patent/US20100155027A1/en not_active Abandoned
- 2008-05-19 WO PCT/JP2008/059601 patent/WO2008146763A1/ja active Application Filing
- 2008-05-19 DE DE112008001282T patent/DE112008001282B4/de not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5092325U (ja) * | 1973-12-25 | 1975-08-04 | ||
US5390077A (en) * | 1994-07-14 | 1995-02-14 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal baffle |
US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
US5864466A (en) * | 1994-07-19 | 1999-01-26 | Remsburg; Ralph | Thermosyphon-powered jet-impingement cooling device |
JPH10256445A (ja) * | 1997-03-07 | 1998-09-25 | Denso Corp | 沸騰冷却装置及びその製造方法 |
JP2003243867A (ja) * | 2002-02-21 | 2003-08-29 | Denso Corp | 沸騰冷却装置 |
JP2003258475A (ja) * | 2002-02-28 | 2003-09-12 | Denso Corp | 沸騰冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2008146763A1 (ja) | 2008-12-04 |
JP2008294294A (ja) | 2008-12-04 |
CN101683017B (zh) | 2012-11-07 |
US20100155027A1 (en) | 2010-06-24 |
DE112008001282B4 (de) | 2013-04-18 |
DE112008001282T5 (de) | 2010-04-22 |
CN101683017A (zh) | 2010-03-24 |
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