TW584585B - Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof - Google Patents
Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof Download PDFInfo
- Publication number
- TW584585B TW584585B TW090133373A TW90133373A TW584585B TW 584585 B TW584585 B TW 584585B TW 090133373 A TW090133373 A TW 090133373A TW 90133373 A TW90133373 A TW 90133373A TW 584585 B TW584585 B TW 584585B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- outer periphery
- processing
- core
- wheel
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001031366A JP3434801B2 (ja) | 2001-02-07 | 2001-02-07 | シリコンウエハ外周部加工用ベベリングホイールの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW584585B true TW584585B (en) | 2004-04-21 |
Family
ID=18895461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090133373A TW584585B (en) | 2001-02-07 | 2001-12-31 | Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3434801B2 (ja) |
KR (1) | KR100628018B1 (ja) |
TW (1) | TW584585B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI382894B (zh) * | 2004-12-28 | 2013-01-21 | Shinetsu Handotai Kk | Silicon wafer grinding method and manufacturing method and disc-like work piece grinding device, and silicon wafer |
TWI807870B (zh) * | 2021-06-24 | 2023-07-01 | 片山一郎 | 工件加工裝置、磨石及工件加工方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MXPA03006434A (es) * | 2003-07-18 | 2005-01-21 | Univ Mexico Nacional Autonoma | Herramienta hidrodinamica de flujo radial para el pulido y esmerilado de superficies opticas. |
KR102396166B1 (ko) * | 2015-10-05 | 2022-05-11 | 이화다이아몬드공업 주식회사 | 냉각수 유로를 포함하는 기판의 엣지 연삭용 엣지휠 및 그 엣지휠의 제조방법 |
KR101920901B1 (ko) * | 2017-07-24 | 2018-11-22 | 이화다이아몬드공업 주식회사 | 연삭블록을 활용한 엣지휠 및 그 제조방법 |
-
2001
- 2001-02-07 JP JP2001031366A patent/JP3434801B2/ja not_active Expired - Fee Related
- 2001-12-31 TW TW090133373A patent/TW584585B/zh not_active IP Right Cessation
-
2002
- 2002-01-25 KR KR1020020004463A patent/KR100628018B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI382894B (zh) * | 2004-12-28 | 2013-01-21 | Shinetsu Handotai Kk | Silicon wafer grinding method and manufacturing method and disc-like work piece grinding device, and silicon wafer |
TWI807870B (zh) * | 2021-06-24 | 2023-07-01 | 片山一郎 | 工件加工裝置、磨石及工件加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20020065838A (ko) | 2002-08-14 |
JP3434801B2 (ja) | 2003-08-11 |
KR100628018B1 (ko) | 2006-09-26 |
JP2002239912A (ja) | 2002-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |