TW584585B - Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof - Google Patents

Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof Download PDF

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Publication number
TW584585B
TW584585B TW090133373A TW90133373A TW584585B TW 584585 B TW584585 B TW 584585B TW 090133373 A TW090133373 A TW 090133373A TW 90133373 A TW90133373 A TW 90133373A TW 584585 B TW584585 B TW 584585B
Authority
TW
Taiwan
Prior art keywords
metal
outer periphery
processing
core
wheel
Prior art date
Application number
TW090133373A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshihiro Tanaka
Kazuyoshi Kawasaki
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Application granted granted Critical
Publication of TW584585B publication Critical patent/TW584585B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW090133373A 2001-02-07 2001-12-31 Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof TW584585B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001031366A JP3434801B2 (ja) 2001-02-07 2001-02-07 シリコンウエハ外周部加工用ベベリングホイールの製造方法

Publications (1)

Publication Number Publication Date
TW584585B true TW584585B (en) 2004-04-21

Family

ID=18895461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090133373A TW584585B (en) 2001-02-07 2001-12-31 Beveling wheel for processing silicon wafer outer periphery and the manufacture method thereof

Country Status (3)

Country Link
JP (1) JP3434801B2 (ja)
KR (1) KR100628018B1 (ja)
TW (1) TW584585B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382894B (zh) * 2004-12-28 2013-01-21 Shinetsu Handotai Kk Silicon wafer grinding method and manufacturing method and disc-like work piece grinding device, and silicon wafer
TWI807870B (zh) * 2021-06-24 2023-07-01 片山一郎 工件加工裝置、磨石及工件加工方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA03006434A (es) * 2003-07-18 2005-01-21 Univ Mexico Nacional Autonoma Herramienta hidrodinamica de flujo radial para el pulido y esmerilado de superficies opticas.
KR102396166B1 (ko) * 2015-10-05 2022-05-11 이화다이아몬드공업 주식회사 냉각수 유로를 포함하는 기판의 엣지 연삭용 엣지휠 및 그 엣지휠의 제조방법
KR101920901B1 (ko) * 2017-07-24 2018-11-22 이화다이아몬드공업 주식회사 연삭블록을 활용한 엣지휠 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382894B (zh) * 2004-12-28 2013-01-21 Shinetsu Handotai Kk Silicon wafer grinding method and manufacturing method and disc-like work piece grinding device, and silicon wafer
TWI807870B (zh) * 2021-06-24 2023-07-01 片山一郎 工件加工裝置、磨石及工件加工方法

Also Published As

Publication number Publication date
KR20020065838A (ko) 2002-08-14
JP3434801B2 (ja) 2003-08-11
KR100628018B1 (ko) 2006-09-26
JP2002239912A (ja) 2002-08-28

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MM4A Annulment or lapse of patent due to non-payment of fees