TW579456B - Substrate treatment device - Google Patents

Substrate treatment device Download PDF

Info

Publication number
TW579456B
TW579456B TW092106787A TW92106787A TW579456B TW 579456 B TW579456 B TW 579456B TW 092106787 A TW092106787 A TW 092106787A TW 92106787 A TW92106787 A TW 92106787A TW 579456 B TW579456 B TW 579456B
Authority
TW
Taiwan
Prior art keywords
substrate
aforementioned
coating
processing
photoresist
Prior art date
Application number
TW092106787A
Other languages
English (en)
Chinese (zh)
Other versions
TW200403537A (en
Inventor
Takeshi Fukuchi
Kazuo Kinose
Hiroyuki Kitazawa
Yoshiyuki Nakagawa
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002090347A external-priority patent/JP3853685B2/ja
Priority claimed from JP2002150919A external-priority patent/JP3987378B2/ja
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200403537A publication Critical patent/TW200403537A/zh
Application granted granted Critical
Publication of TW579456B publication Critical patent/TW579456B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67C—CLEANING, FILLING WITH LIQUIDS OR SEMILIQUIDS, OR EMPTYING, OF BOTTLES, JARS, CANS, CASKS, BARRELS, OR SIMILAR CONTAINERS, NOT OTHERWISE PROVIDED FOR; FUNNELS
    • B67C3/00—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus; Filling casks or barrels with liquids or semiliquids
    • B67C3/02—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67C—CLEANING, FILLING WITH LIQUIDS OR SEMILIQUIDS, OR EMPTYING, OF BOTTLES, JARS, CANS, CASKS, BARRELS, OR SIMILAR CONTAINERS, NOT OTHERWISE PROVIDED FOR; FUNNELS
    • B67C3/00—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus; Filling casks or barrels with liquids or semiliquids
    • B67C3/02—Bottling liquids or semiliquids; Filling jars or cans with liquids or semiliquids using bottling or like apparatus
    • B67C3/22—Details
    • B67C3/24—Devices for supporting or handling bottles

Landscapes

  • Coating Apparatus (AREA)
TW092106787A 2002-03-28 2003-03-26 Substrate treatment device TW579456B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002090347A JP3853685B2 (ja) 2002-03-28 2002-03-28 基板処理装置
JP2002150919A JP3987378B2 (ja) 2002-05-24 2002-05-24 基板処理装置

Publications (2)

Publication Number Publication Date
TW200403537A TW200403537A (en) 2004-03-01
TW579456B true TW579456B (en) 2004-03-11

Family

ID=32929612

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092106787A TW579456B (en) 2002-03-28 2003-03-26 Substrate treatment device

Country Status (2)

Country Link
KR (1) KR100567236B1 (ko)
TW (1) TW579456B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100838431B1 (ko) * 2005-12-20 2008-06-16 다이니폰 스크린 세이조우 가부시키가이샤 기판 처리 장치
KR100706570B1 (ko) * 2006-05-17 2007-04-13 주식회사 씨엔디플러스 반도체 제조공정에서의 3축 제어에 의한 코팅액 또는현상액의 스프레이식 분사방법
KR100706569B1 (ko) * 2006-05-17 2007-04-13 주식회사 씨엔디플러스 반도체 제조공정에서의 코팅액 또는 현상액의 스프레이식분사시스템
KR100752237B1 (ko) * 2006-09-20 2007-08-28 주식회사 탑 엔지니어링 페이스트 디스펜서의 노즐과 갭 센서 사이의 거리 측정방법
KR100890758B1 (ko) * 2007-09-21 2009-03-26 주식회사 나래나노텍 노즐 디스펜서의 코팅액 도포 위치의 사용자 오프셋값을자동으로 측정하는 방법 및 이를 이용하여 노즐 디스펜서와배면 글라스 간의 정렬을 자동으로 보정하는 방법
CN108803252B (zh) * 2018-06-27 2020-10-16 合肥泰沃达智能装备有限公司 一种导光板生产加工工艺及其涂布曝光设备

Also Published As

Publication number Publication date
TW200403537A (en) 2004-03-01
KR100567236B1 (ko) 2006-04-03
KR20030078666A (ko) 2003-10-08

Similar Documents

Publication Publication Date Title
KR101453638B1 (ko) 기판검사장치 및 기판검사방법
CN109564853B (zh) 基板检查装置、基板处理装置、基板检查方法以及基板处理方法
JP2003282427A (ja) 基板のアライメント装置
JP4748740B2 (ja) 光学式異物検出装置およびこれを搭載した処理液塗布装置
JP5887895B2 (ja) 検査対象物表面の傷検出装置及び傷検出方法
TW579456B (en) Substrate treatment device
JP3853685B2 (ja) 基板処理装置
JPH11271038A (ja) 塗装欠陥検査装置
JP2014115245A (ja) 基板の欠陥検査方法、基板の欠陥検査装置、プログラム及びコンピュータ記憶媒体
JP7202828B2 (ja) 基板検査方法、基板検査装置および記録媒体
JP3987378B2 (ja) 基板処理装置
JP4002429B2 (ja) 異物検査機能を備えた露光装置及びその装置における異物検査方法
JP2003273003A (ja) 基板処理装置
KR20180037590A (ko) 보조 노광 장치 및 노광량 분포 취득 방법
TW201820043A (zh) 基板角位置特定方法
JP2006228862A (ja) 異物除去装置，処理システム及び異物除去方法
JP2004081983A (ja) 基板処理装置
JP2006162250A (ja) フィルムワークのパターン検査装置
JP2001117064A (ja) 搬送装置の位置合わせ機構および位置合わせ方法、ならびに基板処理装置
JP2003315014A (ja) 検査方法及び検査装置
JP2007266645A (ja) 部品保持部材良否検出装置及び方法、並びに電子部品実装装置及び方法
KR101046566B1 (ko) 기판 검사 장치 및 이를 이용한 기판 검사 방법
JP4015502B2 (ja) 部品保持部材良否検出装置及び方法、並びに電子部品実装装置及び方法
JP2001311693A (ja) 検査装置
JP4170643B2 (ja) 基板処理装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees