TW548395B - The manufacturing method of a heat sink - Google Patents

The manufacturing method of a heat sink Download PDF

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Publication number
TW548395B
TW548395B TW089120049A TW89120049A TW548395B TW 548395 B TW548395 B TW 548395B TW 089120049 A TW089120049 A TW 089120049A TW 89120049 A TW89120049 A TW 89120049A TW 548395 B TW548395 B TW 548395B
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TW
Taiwan
Prior art keywords
heat sink
thick
heat
forming
manufacturing
Prior art date
Application number
TW089120049A
Other languages
English (en)
Inventor
Keiichiro Ohta
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of TW548395B publication Critical patent/TW548395B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21JFORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49377Tube with heat transfer means
    • Y10T29/49378Finned tube
    • Y10T29/49385Made from unitary workpiece, i.e., no assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

548395 A7 B7 五、發明説明( 請 先 閱 讀 背 之 注 意 事 項 位準基準凸條之上端位準同一位準削起以形成多數之舌狀 散熱片,並且,在散熱片下側形成既定厚度之厚壁部,藉 此,可保證厚壁部之既定厚度之正確度β又,削起散熱器 材料之散熱片形成用部時,假如削掉過度超過散熱片形成 用部,連其下側之厚壁部形成用部之一部也削掉,散熱基 板之厚壁部較既定厚度爲薄時,因削起厚壁部位準基準凸 條之上部,所以,將其狀態以目視,就可容易判別不良品 本發明係參照 【理想具體例之 茲參照圖面說 如第1圖所示 ,與在厚壁部形 向延伸之2個溝 厚壁部形成用部 (5 ),與具有 爲與欲形成厚壁 凸條(6 )之鋁 ,通過厚壁部位 下側爲變成厚壁 形成用部(3 ) 如第2圖所示 形成用部(3 ) 經濟部智慧財產局員工消費合作社印製 附圖更詳述如下。 說明】 明本發明之具體例如下。 ,首先,散熱基板厚壁部形成用部(1 ) 成用部(1 )上側設成一體且具向長度方 (2)之散熱片形成用部(3),與設於 (1 )兩側之散熱基板之薄壁部(4 ) 設於一方薄壁部(4 )上面之緣並且上端 部之上面成爲同一位準之厚壁部位準基準 押出形材製散熱器材料(7)。於第1圖 準基準凸條(6 )上端之水平線(Η )之 部形成用部(1 ),該上側將成爲散熱片 〇 ,接著,將於散熱器材料(7 )之散熱片 ,成爲與厚壁部位準基準凸條(6)上端 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 548395 Α7 Β7 五、發明説明(3 ) 同一位準亦即從水平線(Η )削起以形成多數之舌狀散熱 片(8),並且,在散熱片下側形成既定厚度之厚壁部 (9)成爲具有厚壁部(9)與薄壁部(4)(5)之散 熱基板(1 0 ),以得到散熱器(1 1 )製品。削起散熱 片形成用部(3 )形成多數之舌狀散熱片(8 )時,相當 於溝(2 )部分爲將成爲將各散熱片(8 )分爲3個部分 之開縫(12)。 若散熱基板全體爲厚壁部時,雖然散熱器之重量會增加 ’但是由於薄壁部(4) (5)之存在不僅其分量可減少 重量’並且,可設厚壁部位準基準凸條(6)。此凸條 (6)雖然設於一方之薄壁部(4),但是也可以設於兩 方之薄壁部(4)(5)。 如第3圖所示,在散熱器(11)之散熱基板(1〇) 之厚壁部(9 )穿設C P U等電子零件所需之螺絲孔時, 成爲從厚壁部(9 )下面延伸到上面附近之停止孔(1 3 ) β厚壁部(9 )係具有可穿設停止孔(1 3 )之既定厚度 (請先閱讀背面之注意事項再填寫本頁)
經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐)

Claims (1)

  1. 六、申請專利範圍 第89120049號「散熱器之製造方法」專利案 (92年1月2日修正) 六申請專利範圍: 1 . 一種散熱器之製造方法,其係在散熱基板上面設有多 數舌狀散熱片者,其特徵爲; 形成鋁押出形材製散熱器材料,其具有:散熱基板 之厚壁部形成用部,與厚壁部形成用部之上側裝設成 一體之散熱片形成用部,與厚壁部形成用部之兩側方 中之至少一側方所設之散熱基板之薄壁部,與厚壁部 位準基準凸條,其設於薄壁部上面並且與上端所應形 成厚壁部之上面成爲同一位準;將散熱器材料之散熱 片形成用部由與厚壁部位準基準凸條之上端位準同一 位準削起以形成多數之舌狀散熱片,並且,在散熱片 下側形成既定厚度之厚壁部等以上製程所形成。 2 ·如申請專利範圍第1項之散熱器之製造方法,其中厚 壁部位準基準凸條之位置爲薄壁部之邊緣。 3 .如申請專利範圍第1項之散熱器之製造方法,其中在 散熱器材料之散熱片形成用部中設置向長度方向延伸 之至少1個溝,形成將散熱片削起之多數舌狀散熱片 ,將各散熱片區分爲多個部分之開縫形成在相當於溝 之部分。 4 .如申請專利範圍第1項之散熱器之製造方法,其中厚 壁部具有得以穿設停止孔之厚度。 548395
    六、申請專利範圍 5 .如申請專利範圍第4項之散熱器之製造方法,其中停 止孔爲螺絲孔及攻螺絲之旋入孔之任一。
TW089120049A 1999-09-28 2000-09-28 The manufacturing method of a heat sink TW548395B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27354299A JP4174146B2 (ja) 1999-09-28 1999-09-28 ヒートシンクの製造方法

Publications (1)

Publication Number Publication Date
TW548395B true TW548395B (en) 2003-08-21

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Application Number Title Priority Date Filing Date
TW089120049A TW548395B (en) 1999-09-28 2000-09-28 The manufacturing method of a heat sink

Country Status (9)

Country Link
US (1) US6339880B1 (zh)
EP (1) EP1091402B1 (zh)
JP (1) JP4174146B2 (zh)
KR (1) KR100635310B1 (zh)
CN (1) CN1193206C (zh)
AT (1) ATE264548T1 (zh)
CA (1) CA2321371A1 (zh)
DE (1) DE60009822T2 (zh)
TW (1) TW548395B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW493368B (en) * 2001-02-27 2002-07-01 Delta Electronics Inc Manufacturing method for heat sink having high density fin
MY126022A (en) * 2001-06-15 2006-09-29 Wong Chee Tieng Heat sink
KR20010088566A (ko) * 2001-08-07 2001-09-28 유은종 방열판 제조방법
WO2004079838A2 (ja) * 2003-03-05 2004-09-16 Sony Corporation セパレータ、燃料電池装置及び燃料電池装置の温度調整方法
US6792672B1 (en) * 2003-06-02 2004-09-21 Fan Zhen Co., Ltd. Heat sink manufacturing apparatus
JP4793838B2 (ja) 2004-01-28 2011-10-12 中村製作所株式会社 放熱器の製造方法
US7284881B2 (en) * 2004-03-31 2007-10-23 Ledo Co., Ltd. LED fixing device of a pixel module and method for manufacturing the same
JP5162937B2 (ja) 2007-03-29 2013-03-13 ソニー株式会社 燃料電池
CN102404974A (zh) * 2010-09-13 2012-04-04 延锋伟世通汽车电子有限公司 一种新型汽车功放散热器
CN101995185A (zh) * 2010-11-02 2011-03-30 三花丹佛斯(杭州)微通道换热器有限公司 用于换热器的翅片以及具有该翅片的换热器
FR3092901B1 (fr) * 2019-02-20 2022-07-22 Rouge Eng Designs Dissipateur thermique pour système d’éclairage
JP7343166B2 (ja) * 2019-11-13 2023-09-12 ナカムラマジック株式会社 ヒートシンクの製造方法及びヒートシンク

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JPH06232300A (ja) * 1993-02-03 1994-08-19 Showa Alum Corp 放熱器
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Also Published As

Publication number Publication date
CA2321371A1 (en) 2001-03-28
ATE264548T1 (de) 2004-04-15
JP2001102782A (ja) 2001-04-13
JP4174146B2 (ja) 2008-10-29
EP1091402B1 (en) 2004-04-14
EP1091402A2 (en) 2001-04-11
CN1295231A (zh) 2001-05-16
KR20010050663A (ko) 2001-06-15
KR100635310B1 (ko) 2006-10-18
US6339880B1 (en) 2002-01-22
DE60009822T2 (de) 2005-04-28
EP1091402A3 (en) 2001-07-11
CN1193206C (zh) 2005-03-16
DE60009822D1 (de) 2004-05-19

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