TW392074B - Test head for microstructures with interface - Google Patents
Test head for microstructures with interface Download PDFInfo
- Publication number
- TW392074B TW392074B TW087117042A TW87117042A TW392074B TW 392074 B TW392074 B TW 392074B TW 087117042 A TW087117042 A TW 087117042A TW 87117042 A TW87117042 A TW 87117042A TW 392074 B TW392074 B TW 392074B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- test
- points
- contact elements
- test head
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19748823A DE19748823B4 (de) | 1997-11-05 | 1997-11-05 | Servicefreundliche Kontaktiervorrichtung |
DE19749456 | 1997-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW392074B true TW392074B (en) | 2000-06-01 |
Family
ID=26041339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087117042A TW392074B (en) | 1997-11-05 | 1998-10-14 | Test head for microstructures with interface |
Country Status (7)
Country | Link |
---|---|
US (1) | US6417684B1 (zh) |
EP (1) | EP0915342B1 (zh) |
JP (1) | JP3215946B2 (zh) |
CN (1) | CN1143136C (zh) |
AT (1) | ATE261129T1 (zh) |
DE (2) | DE59810893D1 (zh) |
TW (1) | TW392074B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI668448B (zh) * | 2016-09-28 | 2019-08-11 | Kabushiki Kaisha Nihon Micronics | 探針、探針卡及接觸檢查裝置 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100572314B1 (ko) * | 1999-09-20 | 2006-04-19 | 삼성전자주식회사 | 반도체 테스터의 수직결합형 퍼포먼스 보드 |
JP4579361B2 (ja) * | 1999-09-24 | 2010-11-10 | 軍生 木本 | 接触子組立体 |
FR2802346B1 (fr) * | 1999-12-13 | 2002-02-08 | Upsys Probe Technology Sas | Connecteur de test de haute densite d'interconnexion destine notamment a la verification de circuits integres |
US6447328B1 (en) * | 2001-03-13 | 2002-09-10 | 3M Innovative Properties Company | Method and apparatus for retaining a spring probe |
JPWO2004072661A1 (ja) * | 2003-02-17 | 2006-06-01 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN100343968C (zh) * | 2004-04-09 | 2007-10-17 | 矽统科技股份有限公司 | 测试装置的探测头 |
ATE553516T1 (de) * | 2006-01-06 | 2012-04-15 | Framatome Connectors Int | Leiterplattenverbindermodul für mezzanin- leiterplattenbaugruppen |
DE102006005522A1 (de) * | 2006-02-07 | 2007-08-16 | Feinmetall Gmbh | Elektrische Kontaktiervorrichtung sowie elektrisches Kontaktierverfahren |
JP4041831B2 (ja) * | 2006-05-15 | 2008-02-06 | 日本電産リード株式会社 | 基板検査用治具及びこの治具における接続電極部の電極構造 |
US7557303B2 (en) * | 2006-12-18 | 2009-07-07 | Lsi Corporation | Electronic component connection support structures including air as a dielectric |
KR100918683B1 (ko) | 2007-03-29 | 2009-09-22 | 티에스씨멤시스(주) | 연결 구조물 및 이를 포함하는 전기 검사 장치 |
WO2009016746A1 (ja) * | 2007-08-01 | 2009-02-05 | Elia Co., Ltd. | コンタクタ及びインターフェース組立体 |
US8760186B2 (en) * | 2010-02-19 | 2014-06-24 | International Business Machines Corporation | Probe apparatus assembly and method |
DE102012016449A1 (de) * | 2012-08-16 | 2014-03-13 | Feinmetall Gmbh | Prüfkopf für die elektrische Prüfung eines Prüflings |
KR20170032381A (ko) * | 2014-07-14 | 2017-03-22 | 테크노프로브 에스.피.에이. | 테스트 헤드용 콘택 프로브 및 그 제조 방법 |
EP3268752A1 (en) * | 2015-03-13 | 2018-01-17 | Technoprobe S.p.A | Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions |
WO2016158567A1 (ja) * | 2015-03-31 | 2016-10-06 | 株式会社エンプラス | 電気部品用ソケット及びその製造方法 |
TWI713807B (zh) | 2016-12-16 | 2020-12-21 | 義大利商探針科技公司 | 具有增進的頻率性質的測試頭 |
IT201700021397A1 (it) | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura con migliorate proprietà in frequenza |
IT201700021400A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
JP2018179721A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP6872960B2 (ja) * | 2017-04-21 | 2021-05-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP6889067B2 (ja) * | 2017-08-24 | 2021-06-18 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN110346616B (zh) * | 2018-04-03 | 2021-06-15 | 中华精测科技股份有限公司 | 探针卡装置及探针座 |
US12000865B2 (en) * | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
US20220236304A1 (en) * | 2021-01-28 | 2022-07-28 | Formfactor, Inc. | Probe Head Including a Guide Plate with Angled Holes to Determine Probe Flexure Direction |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4027935A (en) * | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
US4423376A (en) * | 1981-03-20 | 1983-12-27 | International Business Machines Corporation | Contact probe assembly having rotatable contacting probe elements |
DE3123627A1 (de) * | 1981-06-15 | 1982-12-30 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum gleichzeitigen kontaktieren mehrerer eng beisammenliegender pruefpunkte, insbesondere von rasterfeldern |
US4506215A (en) * | 1981-06-30 | 1985-03-19 | International Business Machines Corporation | Modular test probe |
US4622514A (en) | 1984-06-15 | 1986-11-11 | Ibm | Multiple mode buckling beam probe assembly |
EP0242542A1 (de) | 1986-03-26 | 1987-10-28 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Prüfadapter |
DE3706652A1 (de) | 1986-03-26 | 1987-10-01 | Feinmetall Gmbh | Pruefadapter |
US4783624A (en) * | 1986-04-14 | 1988-11-08 | Interconnect Devices, Inc. | Contact probe devices and method |
EP0283545B1 (de) | 1987-03-27 | 1991-10-16 | Ibm Deutschland Gmbh | Kontaktsonden-Anordnung zur elektrischen Verbindung einer Prüfeinrichtung mit den kreisförmigen Anschlussflächen eines Prüflings |
JP2539453B2 (ja) | 1987-09-11 | 1996-10-02 | 株式会社日立製作所 | 半導体素子検査装置 |
US4931726A (en) * | 1987-06-22 | 1990-06-05 | Hitachi, Ltd. | Apparatus for testing semiconductor device |
US4963822A (en) * | 1988-06-01 | 1990-10-16 | Manfred Prokopp | Method of testing circuit boards and the like |
DE9004562U1 (de) | 1989-04-26 | 1990-07-19 | atg electronic GmbH i.K., 97877 Wertheim | Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen |
DE4012839B4 (de) | 1989-04-26 | 2004-02-26 | Atg Test Systems Gmbh & Co.Kg | Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen |
JPH0385456A (ja) | 1989-08-30 | 1991-04-10 | Hitachi Electron Eng Co Ltd | プローバ |
US5123848A (en) * | 1990-07-20 | 1992-06-23 | Cray Research, Inc. | Computer signal interconnect apparatus |
JP3442137B2 (ja) | 1993-12-17 | 2003-09-02 | 日本発条株式会社 | 導電性接触子ユニット |
GB2311175A (en) * | 1996-03-15 | 1997-09-17 | Everett Charles Tech | PCB / test circuitry connection interface with short circuiting means |
US5977787A (en) * | 1997-06-16 | 1999-11-02 | International Business Machines Corporation | Large area multiple-chip probe assembly and method of making the same |
-
1998
- 1998-10-14 DE DE59810893T patent/DE59810893D1/de not_active Expired - Lifetime
- 1998-10-14 EP EP98119385A patent/EP0915342B1/de not_active Expired - Lifetime
- 1998-10-14 AT AT98119385T patent/ATE261129T1/de active
- 1998-10-14 TW TW087117042A patent/TW392074B/zh not_active IP Right Cessation
- 1998-10-15 US US09/173,320 patent/US6417684B1/en not_active Expired - Lifetime
- 1998-10-28 DE DE59810835T patent/DE59810835D1/de not_active Expired - Lifetime
- 1998-11-04 CN CNB981241166A patent/CN1143136C/zh not_active Expired - Lifetime
- 1998-11-05 JP JP31451998A patent/JP3215946B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI668448B (zh) * | 2016-09-28 | 2019-08-11 | Kabushiki Kaisha Nihon Micronics | 探針、探針卡及接觸檢查裝置 |
Also Published As
Publication number | Publication date |
---|---|
JP3215946B2 (ja) | 2001-10-09 |
CN1143136C (zh) | 2004-03-24 |
US6417684B1 (en) | 2002-07-09 |
EP0915342B1 (de) | 2004-03-03 |
JPH11248745A (ja) | 1999-09-17 |
EP0915342A2 (de) | 1999-05-12 |
DE59810893D1 (de) | 2004-04-08 |
ATE261129T1 (de) | 2004-03-15 |
DE59810835D1 (de) | 2004-04-01 |
CN1216369A (zh) | 1999-05-12 |
EP0915342A3 (de) | 2001-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MK4A | Expiration of patent term of an invention patent |